Semiconductor refrigeration type fresh-keeping container

Abstract

The utility model belongs to the technical field of refrigeration, and discloses a semiconductor refrigeration type fresh-keeping container which comprises a frame shell, a semiconductor refrigeration module, a field space module, an in-cabin fluid adjusting device and a multifunctional integrated circuit board. The semiconductor refrigeration module comprises a semiconductor refrigeration sheet, a heat dissipation device, a cold expansion body and a heat dissipation fan, the heating surface of the semiconductor refrigeration sheet is attached to the heat dissipation device, the refrigeration surface of the semiconductor refrigeration sheet is attached to the cold expansion body, and the other surface of the cold expansion body is matched with the side frame shell to form the inner wall of the cold storage cavity; or one part of the cold expansion body is arranged in the cold storage cavity formed by the side frame shell; a ventilation and heat dissipation cavity channel is formed between the air inlet and the air outlet; the field space module comprises at least one of an electromagnetic field generator, a space electrostatic field generator and an ultrasonic generator, and the in-cabin fluid adjusting device comprises at least one of an ultrasonic atomization system, a fluid pump injection system, a convection air blowing system and a liquid vibration vessel. The semiconductor refrigeration type fresh-keeping container is high in cooling efficiency and rich in function.

Description

Technical Field

[0001] The utility model relates to the technical field of refrigeration, in particular to a semiconductor refrigeration type fresh-keeping container. Background Art

[0002] Semiconductor cooling devices, also known as thermoelectric coolers (TECs), are advanced cooling technology products based on the thermoelectric effect. They utilize the heat transfer generated by the thermoelectric effect when an electric current flows through semiconductor materials to achieve both cooling and heating functions. They eliminate the need for refrigerants or mechanical moving parts, such as compressors and condensers, found in traditional refrigeration systems. Consequently, they offer advantages such as compact design, quiet operation, pollution-free operation, and ease of control and maintenance.

[0003] Semiconductor refrigeration equipment is highly efficient, energy-saving, and environmentally friendly. Compact and simple in structure, it is suitable for various small refrigeration systems or personal electronic products, including car refrigerators, wine cabinets, and thermostatic cabinets. Furthermore, semiconductor refrigeration equipment operates without vibration or noise, enhancing the user experience.

[0004] Currently, semiconductor refrigeration equipment on the market generally has problems such as severe heat generation, poor heat dissipation performance, and single functions.

[0005] Therefore, a semiconductor refrigeration type fresh-keeping container is urgently needed to solve the above-mentioned technical problems. Utility Model Content

[0006] The purpose of the utility model is to provide a semiconductor refrigeration type fresh-keeping container with higher cooling efficiency and rich functions.

[0007] To achieve this purpose, the present invention adopts the following technical solutions:

[0008] Provided is a semiconductor refrigeration fresh-keeping container, comprising a frame shell, a semiconductor refrigeration module, a field space module, a cabin fluid regulating device, a multifunctional integrated circuit board, and a power supply component electrically connected to the multifunctional integrated circuit board;

[0009] The semiconductor refrigeration module includes a semiconductor refrigeration sheet, a heat dissipation device, a cooling body and a heat dissipation fan. The semiconductor refrigeration sheet and the heat dissipation fan are both electrically connected to the multifunctional integrated circuit board.

[0010] The semiconductor refrigeration module is arranged on the frame housing, the heating surface of the semiconductor refrigeration sheet is in contact with the heat dissipation device, the cooling surface of the semiconductor refrigeration sheet is in contact with the cooling expansion body, and the other surface of the cooling expansion body cooperates with the frame housing on this side to form the inner wall of the cold storage cavity, or a part of the cooling expansion body is extended and arranged in the cold storage cavity formed by the frame housing on this side;

[0011] The cooling fan is arranged on the frame housing near the side of the heat dissipation device and is located at the side of the heat dissipation device. An air inlet is arranged on the frame housing near the heat dissipation fan. An air outlet is arranged on the frame housing opposite to the air inlet and spaced apart from the heat dissipation fan and the heat dissipation device. A through area in the frame housing between the air inlet and the air outlet and isolated from the cold storage cavity is a ventilation and heat dissipation cavity.

[0012] The field space module includes at least one of an electromagnetic field generator, a space electrostatic field generator, and an ultrasonic generator, and the field space module is arranged on the frame housing;

[0013] The in-cabin fluid regulating device includes at least one of an ultrasonic atomization system, a fluid pump injection system, a convection blowing system, and a liquid vibrating dish, and the in-cabin fluid regulating device is arranged on the frame shell.

[0014] Specifically, a semiconductor refrigeration fresh-keeping container holds items in a cold storage cavity. The semiconductor refrigeration module includes a semiconductor refrigeration plate, a heat sink, and a cooling expansion body. The heating surface of the semiconductor refrigeration plate is in contact with the heat sink, and the cooling surface of the semiconductor refrigeration plate is in contact with the cooling expansion body. The cooling expansion body exchanges heat with the items in the cold storage cavity to cool the items. A cooling fan is located to the side of the heat sink and is positioned near the air inlet to draw in cold air. A continuous ventilation and heat dissipation cavity is formed in the frame between the air inlet and the air outlet, which is isolated from the refrigeration container, allowing for smoother and faster air flow. The output end of the in-cabin fluid regulating device is positioned toward the ventilation and heat dissipation cavity to accelerate heat dissipation. The field space module is used to accelerate the movement of liquid molecules in the alcoholic beverage stored in the cold storage cavity, thereby accelerating the oxidation reaction between the alcoholic beverage and the air, achieving a rapid sobering effect. Compared with existing semiconductor refrigeration equipment, the semiconductor refrigeration plate is directly attached to the heat dissipation device and the cooling expansion body, with higher cooling efficiency. The fluid regulating device in the cabin introduces fluid into the ventilation and heat dissipation channel, which can further accelerate the dissipation of heat. The setting of the field space module makes the conductor refrigeration type fresh-keeping container more functional.

[0015] Preferably, the electromagnetic field generator includes an electromagnetic coil and an electromagnetic field generating circuit, the electromagnetic coil is connected to the electromagnetic field generating circuit, the electromagnetic field generating circuit is electrically connected to the multifunctional integrated circuit board, and the electromagnetic coil is arranged on the frame shell near the cold storage cavity, and can generate an electromagnetic field when it is working to act on the cold storage cavity.

[0016] Preferably, the spatial electrostatic field generator comprises a module consisting of a positive terminal, a negative terminal and a potential difference generating circuit;

[0017] The positive terminal and the negative terminal are respectively electrically connected to a potential difference generating circuit, which is electrically connected to the multifunctional integrated circuit board. The positive terminal and the negative terminal are respectively arranged on opposite sides of the cold storage cavity where the cold expansion body is located, and can enable the electrostatic field generated during operation to act on the cold storage cavity.

[0018] Preferably, the space electrostatic field generator is a DENBA electrostatic field system;

[0019] The water molecule resonance area of ​​the DENBA electrostatic field system is set in the cold storage cavity where the cold expansion body is located, and the circuit of the DENBA electrostatic field system is electrically connected to the multifunctional integrated circuit board. The DENBA electrostatic field system is mainly based on the principles of electrostatic field and resonance. By generating a specific low-frequency electric field, the electric field resonates with the water molecules inside the food, activating the water molecules inside the food cells, inhibiting bacterial reproduction, and extending the shelf life of the food. At the same time, this technology can also protect the cell structure of the food, reduce blood loss after thawing, and improve the quality of the food.

[0020] Preferably, the ultrasonic generator includes an ultrasonic transducer and an ultrasonic circuit, the ultrasonic circuit is electrically connected to the multifunctional integrated circuit board, the ultrasonic emitting surface of the ultrasonic transducer is arranged close to the liquid vibrating dish or the cooling body, and the liquid vibrating dish is a stainless steel container that can hold water.

[0021] Preferably, the liquid vibrating dish is a water-holding container that is arranged in the cold storage cavity and in the action space of the field space module.

[0022] The water container is provided with one or a combination of two or more of a vibration frequency measuring instrument probe, a light refraction liquid level detector probe, an air quality detector probe, a temperature sensor probe, a humidity sensor probe, a pressure sensor probe, an electronic scale module, a camera probe, an electronic timer module, and a wireless communication module.

[0023] The water-holding vessel is electrically connected to the multifunctional integrated circuit board through contact terminals, wireless charging transmitting and receiving modules, power strips, or flexible cables.

[0024] Preferably, the ultrasonic atomization system includes an ultrasonic microporous atomization sheet and an ultrasonic atomization circuit, and the ultrasonic atomization circuit is electrically connected to the multifunctional integrated circuit board;

[0025] A water storage cavity is provided on the frame shell near the cold storage cavity, and a water permeable hole is provided at the bottom of the water storage cavity.

[0026] The water absorption surface of the ultrasonic microporous atomizing sheet is arranged toward the water permeable hole, and the atomizing emission surface thereof is arranged toward the inner side of the cold storage cavity; or

[0027] A pipeline connecting the water storage chamber and the cold storage chamber is provided on the frame shell, and the ultrasonic microporous atomizing sheet is provided at one end of the pipeline leading to the cold storage chamber. The water absorption surface of the ultrasonic microporous atomizing sheet is arranged toward the pipeline, and the atomization emission surface thereof is arranged toward the inner side of the cold storage chamber. The other end of the pipeline is connected to the water permeable hole of the water storage chamber.

[0028] Preferably, the fluid pump spray system comprises a single-fluid nozzle, a water pipe, and a water pump electrically connected to a multifunctional integrated circuit board;

[0029] A water storage cavity is provided on the frame shell, and a water permeable hole is provided on the water storage cavity. The water pump is located in the water storage cavity or the water injection port of the water pump is connected to the water permeable hole provided on the water storage cavity through the water pipe;

[0030] The single-fluid nozzle is connected to the water outlet of the water pump through the water pipe, and the nozzle on the single-fluid nozzle is arranged toward the inner side of the cold storage cavity.

[0031] Preferably, the convection blowing system is an internal circulation fan which is fixed in the cold storage chamber and close to the cold expansion body, and the internal circulation fan is electrically connected to the multifunctional integrated circuit board.

[0032] Preferably, a detachable connection kit is provided on the inner wall of the cold storage chamber.

[0033] The cabin fluid regulating device is fixed on the detachable connection kit,

[0034] The cabin fluid regulating device is electrically connected to the multifunctional integrated circuit board through contact terminals, wireless charging transmitting and receiving modules, or a power strip.

[0035] Alternatively, the cabin fluid regulating device together with its matching water storage chamber is fixed on the detachable connection kit.

[0036] Preferably, a heat dissipation enhancement device is further included, and a fluid output end of the device acts on the ventilation and heat dissipation cavity.

[0037] Preferably, the heat dissipation enhancement device includes the ultrasonic microporous atomization sheet and the ultrasonic atomization circuit, and the ultrasonic atomization circuit is electrically connected to the multifunctional integrated circuit board;

[0038] A water storage chamber with a water permeable hole is provided on the frame shell near the ventilation and heat dissipation cavity, the water permeable hole is provided through the adjacent frame shell, the water absorption surface of the ultrasonic microporous atomizing sheet faces the water permeable hole, and the atomization emission surface thereof faces the ventilation and heat dissipation cavity; or

[0039] There is a water accumulation channel on the frame shell, the water inlet of the water accumulation channel is arranged through the bottom position of the cold storage cavity, and the water outlet is arranged on the inner wall of the ventilation and heat dissipation cavity. The water absorption surface of the ultrasonic microporous atomization sheet faces the water outlet of the water accumulation channel, and the atomization emission surface faces the ventilation and heat dissipation cavity.

[0040] Preferably, the heat dissipation enhancement device comprises a two-fluid nozzle, a water pipe, an air pipe and an air pump electrically connected to the multifunctional integrated circuit board;

[0041] The frame shell is provided with a water storage cavity, and the water storage cavity is provided with a water cavity water permeable hole, a water cavity air inlet hole and a water cavity air outlet hole;

[0042] The water inlet of the two-fluid nozzle is connected to the water permeable hole of the water cavity through the water pipe, the air inlet of the two-fluid nozzle is connected to the air outlet of the water cavity through the air pipe, and the air inlet of the water cavity is connected to the air outlet of the air pump through another air pipe;

[0043] The nozzle of the two-fluid nozzle is arranged toward the ventilation and heat dissipation cavity.

[0044] Preferably, the heat dissipation enhancement device comprises a mixed fluid nozzle, a three-way sleeve, an air pipe and an air pump electrically connected to the multifunctional integrated circuit board;

[0045] A water storage cavity is provided on the frame shell, and a water cavity water permeable hole is provided on the water storage cavity;

[0046] The air pump is connected to the mixed fluid nozzle through the air pipe, the middle part of the air pipe is connected to the first interface and the second interface of the three-way sleeve, the third interface of the three-way sleeve is connected to the water permeable hole of the water cavity, and the nozzle of the mixed fluid nozzle is arranged toward the ventilation and heat dissipation cavity.

[0047] Preferably, the heat dissipation enhancement device is an exhaust fan arranged at the air outlet position of the frame shell and electrically connected to the multifunctional integrated circuit board, the air duct of the exhaust fan is connected to the ventilation and heat dissipation cavity, and the gas flow direction driven by the exhaust fan is the same as the gas flow direction driven by the heat dissipation fan.

[0048] Preferably, the heat dissipation device is composed of a heat preservation kit consisting of a fixed split body, a movable split body, a heat preservation control motor and a heat preservation transmission component, and the heat preservation control motor is electrically connected to the multifunctional integrated circuit board;

[0049] The fixed split body is in contact with the heating surface of the semiconductor refrigeration plate, the movable split body is connected to the heat preservation transmission component, the heat preservation transmission component is connected to the rotor of the heat preservation control motor, and can perform reciprocating motion under the drive of the heat preservation control motor and the heat preservation transmission component; or

[0050] The heat dissipation device is a heat preservation kit composed of a fixed split body, a movable split body, a phase-changing solenoid valve and a permanent magnet, and the phase-changing solenoid valve is electrically connected to the multifunctional integrated circuit board;

[0051] The fixed split body is in contact with the heating surface of the semiconductor refrigeration plate, the phase-changing solenoid valve or the permanent magnet is arranged facing each other, and the two are respectively arranged on the inner wall of the ventilation and heat dissipation cavity and the movable split body. The movable split body is slidably connected to the frame shell through a slide rail, and the movable split body can reciprocate under the drive of the phase-changing solenoid valve;

[0052] The first stroke of the reciprocating motion can cause the movable part to be separated from the fixed part, and the second stroke of the reciprocating motion can cause the movable part to be re-attached to the fixed part.

[0053] Preferably, the heat preservation transmission assembly is a crankshaft connecting rod mechanism, a gear rack mechanism, or a turbine worm mechanism.

[0054] Preferably, the heat preservation transmission assembly is further connected to a cold locking cover plate, the surface of which can completely cover the contact surface between the fixed part and the movable part;

[0055] When the movable part moves away from the fixed part, the cold lock cover plate is synchronously linked and covers the side of the fixed part that originally faces the movable part.

[0056] When the movable split body moves to fit the fixed split body again, the cold-locking cover plate is synchronously linked to expose the side of the fixed split body that was originally facing the movable split body.

[0057] Preferably, the cooling body is made of one or more materials selected from copper, aluminum, iron, stainless steel, and graphite. In this embodiment, as shown in the figure and the figure, the cooling body is configured as a split double-layer structure, including a first cooling layer and a second cooling layer attached to each other, the first cooling layer being configured as a plate-like structure, attached and fixed to the cooling surface of the semiconductor refrigeration plate, and the second cooling layer being configured as a U-shaped tube structure with a built-in coolant, specifically water or an aqueous solution, and the second cooling layer being arranged around the outer periphery of the cold storage cavity to increase the heat conduction area, thereby improving the cooling efficiency.

[0058] Preferably, at least two cold storage cavities are formed within the housing, and at least two semiconductor refrigeration modules are provided, with each module servicing several of the cold storage cavities. In this embodiment, two cold storage cavities are spaced apart vertically, each with a door sealing its opening. The door is filled with insulating material such as aerogel, foam, or cotton. Each cold storage cavity is equipped with multiple upper and lower storage panels to partition the space within the cold storage cavity, thereby improving space utilization. A retractable drawer is also provided at the bottom of the housing, spaced below the cold storage cavity, for storing items that do not require refrigeration. Three semiconductor refrigeration modules are provided for each cold storage cavity.

[0059] Beneficial effects of the utility model:

[0060] The semiconductor refrigeration fresh-keeping container provided by the utility model accommodates items through a cold storage cavity. The semiconductor refrigeration module includes a semiconductor refrigeration plate, a heat sink, and a cooling expansion body. The heating surface of the semiconductor refrigeration plate is in contact with the heat sink, and the cooling surface of the semiconductor refrigeration plate is in contact with the cooling expansion body. The cooling expansion body exchanges heat with the items in the cold storage cavity to cool the items. The cooling fan is located to the side of the heat sink and is arranged near the air inlet to draw in cold air. A continuous ventilation and heat dissipation cavity is formed in the area between the air inlet and the air outlet of the shell body and is isolated from the refrigeration container, making the air flow smoother and faster. The output end of the fluid regulating device in the cabin is arranged toward the ventilation and heat dissipation cavity to accelerate heat dissipation. The field space module is used to accelerate the movement of liquid molecules in the alcoholic beverage stored in the cold storage cavity, thereby accelerating the oxidation reaction between the liquid molecules and the air, and achieving the function of quickly sobering up. Compared with existing semiconductor refrigeration equipment, the semiconductor refrigeration plate is directly attached to the heat dissipation device and the cooling expansion body, with higher cooling efficiency. The fluid regulating device in the cabin introduces fluid into the ventilation and heat dissipation channel, which can further accelerate the dissipation of heat. The setting of the field space module makes the conductor refrigeration type fresh-keeping container more functional. BRIEF DESCRIPTION OF THE DRAWINGS

[0061] Figure 1 This is a schematic diagram of the structure of the semiconductor refrigeration fresh-keeping container provided in the first embodiment of the present invention. Figure 1 ;

[0062] Figure 2 This is a schematic diagram of the structure of the semiconductor refrigeration fresh-keeping container provided in the first embodiment of the present invention. Figure 2 ;

[0063] Figure 3 This is a schematic diagram of the internal structure of the semiconductor refrigeration fresh-keeping container provided in Example 1 of the present utility model;

[0064] Figure 4This is a partial structural diagram of the semiconductor refrigeration type fresh-keeping container provided in Example 1 of the present utility model. Figure 1 ;

[0065] Figure 5 This is a partial structural diagram of the semiconductor refrigeration type fresh-keeping container provided in Example 1 of the present utility model. Figure 2 ;

[0066] Figure 6 This is a schematic structural diagram of a semiconductor refrigeration fresh-keeping container provided in the second embodiment of the present invention;

[0067] Figure 7 This is a schematic diagram of the internal structure of a semiconductor refrigeration fresh-keeping container provided in Example 2 of the present utility model.

[0068] In the picture:

[0069] 100, cold storage chamber; 200, ventilation and heat dissipation cavity;

[0070] 10. Frame; 11. Air inlet; 12. Air outlet;

[0071] 1. Semiconductor refrigeration chip; 2. Cooling expansion body; 21. First cooling expansion layer; 22. Second cooling expansion layer; 3. Heat dissipation device; 4. Cooling fan; 5. Water pump; 6. Single-fluid nozzle; 7. Drawer; 8. Cabinet door; 9. Storage board. DETAILED DESCRIPTION

[0072] The present invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are intended only to illustrate the present invention and are not intended to limit the present invention. It should also be noted that, for ease of description, the accompanying drawings only illustrate portions relevant to the present invention, not all of its components.

[0073] In the description of this utility model, unless otherwise specified or limited, the terms "connected," "connect," and "fixed" should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0074] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0075] In the description of this embodiment, the terms "upper," "lower," "right," and other orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely for ease of description and simplified operation. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first" and "second" are used solely for descriptive purposes and have no special meaning.

[0076] Example 1:

[0077] like Figure 1-Figure 5 As shown, this embodiment provides a semiconductor refrigeration type fresh-keeping container, which includes a frame shell 10, a semiconductor refrigeration module, a field space module, an in-cabin fluid regulating device, a multifunctional integrated circuit board, and a power supply component electrically connected to the multifunctional integrated circuit board.

[0078] Furthermore, the semiconductor refrigeration module includes a semiconductor refrigeration sheet 1, a heat dissipation device 3, a cooling expansion body 2 and a cooling fan 4. The semiconductor refrigeration sheet 1 and the cooling fan 4 are electrically connected to the multifunctional integrated circuit board. The semiconductor refrigeration module is arranged on the frame shell 10. The heating surface of the semiconductor refrigeration sheet 1 is attached to the heat dissipation device 3, and the cooling surface of the semiconductor refrigeration sheet 1 is attached to the cooling expansion body 2. The other side of the cooling expansion body 2 is matched with the side frame shell 10 to form the inner wall of the cold storage cavity 100, or a part of the cooling expansion body 2 is extended and arranged on the side frame shell The cooling fan 4 is arranged on the frame shell 10 near the side of the heat sink 3 and is located on the side of the heat sink 3. An air inlet 11 is arranged on the frame shell 10 near the heat sink 4. An air outlet 12 is arranged on the frame shell 10 opposite to the air inlet 11 and spaced apart from the heat sink 4 and the heat sink 3. A through area between the air inlet 11 and the air outlet 12 in the frame shell 10 and isolated from the cold storage cavity 100 is a ventilation and heat dissipation cavity 200.

[0079] The field space module includes at least one of an electromagnetic field generator, a space electrostatic field generator, and an ultrasonic generator, and the field space module is arranged on the frame shell 10; the in-cabin fluid regulating device includes at least one of an ultrasonic atomization system, a fluid pump injection system, a convection blowing system, and a liquid vibrating dish, and the in-cabin fluid regulating device is arranged on the frame shell 10.

[0080] Specifically, the semiconductor refrigeration fresh-keeping container provided in this embodiment contains items via a cold storage cavity 100. The semiconductor refrigeration module includes a semiconductor cooling chip 1, a heat sink 3, and a cooling body 2. The heating surface of the semiconductor cooling chip 1 is in contact with the heat sink 3, while the cooling surface of the semiconductor cooling chip 1 is in contact with the cooling body 2. The cooling body 2 exchanges heat with the items in the cold storage cavity 100, cooling the items. A cooling fan 4 is located to the side of the heat sink 3 and is positioned near the air inlet 11 to draw in cool air. Within the housing, a continuous ventilation and heat dissipation channel 200 is formed between the air inlet 11 and the air outlet 12, isolated from the refrigerated container, ensuring smoother and faster air flow. The output end of the in-cabin fluid regulating device is positioned toward the ventilation and heat dissipation channel 200 to accelerate heat dissipation. The field space module is used to accelerate the movement of liquid molecules in the alcoholic beverage stored in the cold storage cavity 100, thereby speeding up the oxidation reaction between the alcoholic beverage and the air, thereby achieving a rapid sobering effect. Compared with existing semiconductor refrigeration equipment, the semiconductor refrigeration sheet 1 is directly attached to the heat dissipation device 3 and the cooling expansion body 2, with higher cooling efficiency. In addition, the fluid regulating device in the cabin introduces fluid into the ventilation and heat dissipation channel, which can further accelerate heat dissipation. The setting of the field space module makes the conductor refrigeration type fresh-keeping container more functional.

[0081] Exemplarily, the electromagnetic field generator includes an electromagnetic coil and an electromagnetic field generating circuit. The electromagnetic coil is connected to the electromagnetic field generating circuit, and the electromagnetic field generating circuit is electrically connected to the multi-functional integrated circuit board. The electromagnetic coil is arranged on the frame shell 10 near the cold storage cavity 100, and can generate an electromagnetic field when it is working to act on the cold storage cavity 100.

[0082] Exemplarily, the space electrostatic field generator includes a module consisting of a positive terminal, a negative terminal and a potential difference generating circuit; the positive terminal and the negative terminal are respectively electrically connected to the potential difference generating circuit, the potential difference generating circuit is electrically connected to the multi-functional integrated circuit board, and the positive terminal and the negative terminal are respectively arranged on opposite sides of the cold storage cavity 100 where the cold expansion body 2 is located, and can enable the electrostatic field generated during operation to act on the cold storage cavity 100.

[0083] Exemplarily, the spatial electrostatic field generator is a DENBA electrostatic field system; the water molecule resonance area of ​​the DENBA electrostatic field system is set in the cold storage chamber 100 where the cold expansion body 2 is located, and the circuit of the DENBA electrostatic field system is electrically connected to the multifunctional integrated circuit board. The DENBA electrostatic field system is mainly based on the principles of electrostatic field and resonance. By generating a specific low-frequency electric field, the electric field resonates with the water molecules inside the food, activating the water molecules inside the food cells, inhibiting bacterial reproduction, and extending the shelf life of the food. At the same time, this technology can also protect the cell structure of the food, reduce blood loss after thawing, and improve the quality of the food.

[0084] Exemplarily, the ultrasonic generator includes an ultrasonic transducer and an ultrasonic circuit electrically connected to a multifunctional integrated circuit board. The ultrasonic transducer's ultrasonic emitting surface is positioned in close proximity to the liquid vibrating dish or cooling body 2, which is a stainless steel container capable of holding water. The ultrasonic transducer is capable of emitting ultrasonic waves with a frequency of 35 to 48 kHz into the cold storage chamber 100. This ultrasonic transducer is used to accelerate the movement of liquid molecules in the alcoholic beverage stored in the cold storage chamber 100, thereby speeding up the oxidation reaction between the liquid molecules and air, thereby achieving a rapid sobering effect.

[0085] Exemplarily, a liquid vibrating dish is provided in the cold storage chamber 100, and the liquid vibrating dish is located in the active space of the field space module. The liquid vibrating dish is a water-holding container. The water-holding container is provided with a vibration frequency measuring instrument probe, a light refraction liquid level detector probe, an air quality detector probe, a temperature sensor probe, a humidity sensor probe, a pressure sensor probe, an electronic scale module, a camera probe, an electronic timer module, and a wireless communication module, or a combination of two or more thereof, for monitoring the internal environment of the water-holding container and various parameters of the liquid contained therein. The water-holding container is electrically connected to the multifunctional integrated circuit board via contact terminals, a wireless charging transmitter and receiver module, a power strip, or a flexible cable. The provision of the liquid vibrating dish forms an independent active space of the field space module within the semiconductor refrigeration fresh-keeping container, thereby improving the effects of fresh-keeping and sobering up.

[0086] Exemplarily, the ultrasonic atomization system includes an ultrasonic microporous atomizer and an ultrasonic atomization circuit, which is electrically connected to a multifunctional integrated circuit board. A water storage chamber is provided on the housing 10 near the cold storage chamber 100, with a water permeable hole provided at the bottom of the water storage chamber. The water absorption surface of the ultrasonic microporous atomizer is disposed toward the water permeable hole, and its atomization emission surface is disposed toward the inside of the cold storage chamber 100. Alternatively, a pipeline connecting the water storage chamber and the cold storage chamber 100 is provided on the housing 10, and the ultrasonic microporous atomizer is disposed at one end of the pipeline leading to the cold storage chamber 100, with the water absorption surface of the ultrasonic microporous atomizer facing the pipeline, and its atomization emission surface facing the inside of the cold storage chamber 100, with the other end of the pipeline connected to the water permeable hole of the water storage chamber. After absorbing water in the water storage chamber, the ultrasonic microporous atomizer sprays atomized water mist into the inside of the cold storage chamber 100, thereby hydrating and preserving fruits, vegetables, and other foods in the cold storage chamber 100.

[0087] Exemplarily, the fluid pump injection system includes a single-fluid nozzle 6, a water pipe and a water pump 5 electrically connected to a multifunctional integrated circuit board; a water storage chamber is provided on the frame shell 10, a water permeable hole is provided on the water storage chamber, the water pump 5 is located in the water storage chamber or the water inlet of the water pump 5 is connected to the water permeable hole provided on the water storage chamber through a water pipe; the single-fluid nozzle 6 is connected to the water outlet of the water pump 5 through a water pipe, and the nozzle on the single-fluid nozzle 6 is set toward the inside of the cold storage chamber 100, so that the cooling rate of the cold storage chamber 100 is accelerated by liquid heat exchange.

[0088] Exemplarily, the convection air blowing system is an internal circulation fan fixedly positioned within the cold storage chamber 100 near the cooling expansion body 2. The internal circulation fan is electrically connected to the multifunctional integrated circuit board. The convection air blowing system accelerates air circulation within the cold storage chamber 100, allowing the low-temperature air after heat exchange to circulate rapidly within the cold storage chamber 100, thereby improving cooling uniformity.

[0089] Exemplarily, a detachable connection kit is also provided on the inner wall of the cold storage cavity 100, and the in-cabin fluid regulating device is fixed on the detachable connection kit. The in-cabin fluid regulating device is electrically connected to the multi-functional integrated circuit board through contact terminals, or through wireless charging transmitting and receiving modules, or through a power strip, or the in-cabin fluid regulating device is fixed on the detachable connection kit together with the water storage cavity corresponding thereto to achieve a modular installation effect.

[0090] Exemplarily, the semiconductor refrigeration type fresh-keeping container also includes a heat dissipation enhancement device, the fluid output end of the heat dissipation enhancement device acts on the ventilation and heat dissipation cavity 200, and is used to introduce fluids such as water mist into the ventilation and heat dissipation cavity 200 to improve the heat exchange and cooling efficiency.

[0091] Exemplarily, the heat dissipation enhancement device includes another ultrasonic microporous atomizer and an ultrasonic atomizer circuit, which is electrically connected to the multifunctional integrated circuit board. A water storage chamber with a water permeable hole is provided on the housing 10 near the ventilation and heat dissipation cavity 200. The water permeable hole is provided adjacent to the housing 10. The water absorption surface of the ultrasonic microporous atomizer faces the water permeable hole, and its atomization emission surface faces the ventilation and heat dissipation cavity 200. After absorbing water in the water storage chamber, the ultrasonic microporous atomizer sprays the atomized water mist into the ventilation and heat dissipation cavity 200, thereby increasing the heat dissipation rate of the heat dissipation device 3.

[0092] In some embodiments, the frame 10 is provided with a water channel. The water inlet of the water channel is arranged through the bottom of the cold storage chamber 100, and the water outlet is arranged on the inner wall of the ventilation and heat dissipation channel 200. The water absorption surface of the ultrasonic microporous atomizer is oriented toward the water outlet of the water channel, and the atomization emission surface is oriented toward the ventilation and heat dissipation channel 200. In this configuration, the ultrasonic microporous atomizer can utilize the accumulated water flowing out of the cold storage chamber 100 for atomization and cooling, thus achieving a recycling function.

[0093] In other embodiments, the heat dissipation enhancement device includes a two-fluid nozzle, a water pipe, an air pipe, and an air pump electrically connected to the multifunctional integrated circuit board. The frame housing 10 is provided with a water storage chamber, which is provided with a water cavity permeable hole, a water cavity air inlet, and a water cavity air outlet. The water inlet of the two-fluid nozzle is connected to the water cavity permeable hole through the water pipe, the air inlet of the two-fluid nozzle is connected to the water cavity air outlet through the air pipe, and the water cavity air inlet is connected to the air outlet of the air pump through another air pipe. The nozzle of the two-fluid nozzle is positioned toward the ventilation and heat dissipation cavity 200. During operation, the air pump drives air into the air inlet of the two-fluid nozzle, and water in the water storage chamber flows through the permeable hole and the water pipe into the water inlet of the two-fluid nozzle. The two-fluid nozzle then introduces a mixture of liquid water and air into the ventilation and heat dissipation cavity 200, forming a flowing water mist, thereby increasing the heat dissipation rate of the heat dissipation device 3.

[0094] In other embodiments, the heat dissipation enhancement device includes a mixed fluid nozzle, a three-way sleeve, an air pipe, and an air pump electrically connected to the multifunctional integrated circuit board; a water storage chamber is provided in the frame housing 10, and the water storage chamber is provided with a water cavity permeable hole; the air pump is connected to the mixed fluid nozzle via the air pipe, the middle portion of the air pipe is connected to the first and second interfaces of the three-way sleeve, and the third interface of the three-way sleeve is connected to the water cavity permeable hole, and the nozzle of the mixed fluid nozzle is positioned toward the ventilation and heat dissipation cavity 200. During operation, the air pump drives air along the air pipe, driving liquid water into the mixed fluid nozzle, which then introduces a mixed fluid of water mist and air into the ventilation and heat dissipation cavity 200, thereby increasing the heat dissipation rate of the heat dissipation device 3.

[0095] In other embodiments, the heat dissipation enhancement device is an exhaust fan disposed at the air outlet 12 of the frame housing 10 and electrically connected to the multifunctional integrated circuit board. The exhaust fan's air duct communicates with the ventilation and heat dissipation cavity 200, and the air flow direction driven by the exhaust fan is the same as the air flow direction driven by the heat dissipation fan 4. The exhaust fan cooperates with the heat dissipation fan 4 to accelerate the air flow rate in the ventilation and heat dissipation cavity 200, thereby improving heat dissipation efficiency.

[0096] Exemplarily, the power supply component can be a rechargeable battery or a dry cell battery.

[0097] Exemplarily, the heat dissipation device 3 is composed of an insulation kit consisting of a fixed split, a movable split, an insulation control motor and an insulation transmission assembly. The insulation control motor is electrically connected to the multi-functional integrated circuit board; the fixed split is in contact with the heating surface of the semiconductor refrigeration plate 1, the movable split is connected to the insulation transmission assembly, and the insulation transmission assembly is connected to the rotor of the insulation control motor, and can perform reciprocating motion under the drive of the insulation control motor and the insulation transmission assembly.

[0098] Exemplarily, the heat dissipation device 3 is an insulation kit consisting of a fixed split, a movable split, a phase-changing solenoid valve and a permanent magnet, and the phase-changing solenoid valve is electrically connected to the multifunctional integrated circuit board; the fixed split is in contact with the heating surface of the semiconductor refrigeration plate 1, and the phase-changing solenoid valve or the permanent magnet is arranged facing each other, and the two are respectively arranged on the inner wall of the ventilation and heat dissipation cavity 200 and on the movable split, and the movable split is slidably connected to the frame shell 10 through a slide rail, and the movable split can perform reciprocating motion under the drive of the phase-changing solenoid valve.

[0099] Specifically, the first stroke of the reciprocating motion can cause the movable part to be separated from the fixed part, and the second stroke of the reciprocating motion can cause the movable part to be re-attached to the fixed part.

[0100] Exemplarily, the heat preservation transmission assembly is a crankshaft connecting rod mechanism, a gear rack mechanism, or a turbine worm mechanism.

[0101] Exemplarily, the heat preservation transmission assembly is also connected to a cold locking cover plate, the surface of which can completely cover the contact surface between the fixed split and the movable split; when the movable split moves away from the fixed split, the cold locking cover plate is synchronously linked and covers the side of the fixed split that was originally facing the movable split; when the movable split moves again to fit the fixed split, the cold locking cover plate is synchronously linked and exposes the side of the fixed split that was originally facing the movable split.

[0102] Exemplarily, the heat dissipation device 3 may be a metal heat sink or a non-metallic structural component; or, the heat dissipation device 3 may be a combination of a metal heat sink and a condenser; or, the heat dissipation device 3 may be a combination of a non-metallic structural component and a condenser.

[0103] For example, the cooling body 2 is made of one or more materials selected from copper, aluminum, iron, stainless steel, and graphite. Figure 4 and Figure 5 As shown, the cooling body 2 is configured as a split double-layer structure, including a first cooling expansion layer plate 21 and a second cooling expansion layer plate 22 attached to each other. The first cooling expansion layer plate 21 is configured as a plate-like structure, and the first cooling expansion layer plate 21 is attached and fixed to the cooling surface of the semiconductor refrigeration plate 1. The second cooling expansion layer plate 22 is configured as a U-shaped tube structure with built-in coolant, and the coolant is specifically water or an aqueous solution. The second cooling expansion layer plate 22 is arranged around the outer periphery of the cold storage cavity 100 to increase the heat conduction area, thereby improving the cooling efficiency.

[0104] Exemplarily, at least two cold storage cavities 100 are formed within the housing 10, and at least two semiconductor refrigeration modules are provided, with each refrigeration module acting on several cold storage cavities 100. In this embodiment, two cold storage cavities 100 are spaced apart vertically, each having a cabinet door 8 for sealing its opening. The cabinet door 8 is filled with thermal insulation material such as aerogel, foam, or foam. Furthermore, each cold storage cavity 100 is provided with multiple upper and lower spacers 9 to partition the space within the cold storage cavity 100, thereby improving space utilization. The bottom of the housing 10 is also provided with a retractable drawer 7, spaced below the cold storage cavity 100, which can be used to store items that do not require refrigeration. Three semiconductor refrigeration modules are provided for each cold storage cavity 100.

[0105] Example 2:

[0106] like Figure 6 and Figure 7 As shown, based on the first embodiment, this embodiment provides another semiconductor refrigeration type fresh-keeping container, which differs from the first embodiment in that:

[0107] Three cold storage cavities 100 are arranged at intervals along the vertical direction. Each of the three cold storage cavities 100 is provided with a pull-out drawer 7 , and each cold storage cavity 100 is provided with a semiconductor refrigeration module.

[0108] Obviously, the above-described embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention and are not intended to limit the manner in which the present invention is to be implemented. A person skilled in the art would be able to make various obvious changes, readjustments, and substitutions without departing from the scope of protection of the present invention. It is not necessary and impossible to enumerate all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the claims of the present invention.

Claims

1. A semiconductor refrigeration fresh-keeping container, characterized in that: It comprises a frame housing (10), a semiconductor refrigeration module, a field space module, a cabin fluid regulating device, a multifunctional integrated circuit board, and a power supply component electrically connected to the multifunctional integrated circuit board; The semiconductor refrigeration module comprises a semiconductor refrigeration sheet (1), a heat dissipation device (3), a cooling expansion body (2) and a heat dissipation fan (4), wherein the semiconductor refrigeration sheet (1) and the heat dissipation fan (4) are both electrically connected to the multifunctional integrated circuit board. The semiconductor refrigeration module is arranged on the frame shell (10), the heating surface of the semiconductor refrigeration sheet (1) is in contact with the heat dissipation device (3), the cooling surface of the semiconductor refrigeration sheet (1) is in contact with the cooling expansion body (2), the other surface of the cooling expansion body (2) is matched with the frame shell (10) on this side to form the inner wall of the cold storage cavity (100), or a part of the cooling expansion body (2) is extended and arranged in the cold storage cavity (100) formed by the frame shell (10) on this side; The heat dissipation fan (4) is arranged on the frame housing (10) on a side close to the heat dissipation device (3) and is located at the side of the heat dissipation device (3); an air inlet (11) is arranged on the frame housing (10) at a position close to the heat dissipation fan (4); an air outlet (12) is arranged on the frame housing (10) at a position opposite to the air inlet (11) and spaced apart from the heat dissipation fan (4) and the heat dissipation device (3); and a through area between the air inlet (11) and the air outlet (12) in the frame housing (10) and isolated from the cold storage chamber (100) is a ventilation and heat dissipation cavity (200); The field space module comprises at least one of an electromagnetic field generator, a space electrostatic field generator, and an ultrasonic generator, and the field space module is arranged on the frame housing (10); The in-cabin fluid regulating device comprises at least one of an ultrasonic atomization system, a fluid pump injection system, a convection blowing system, and a liquid vibrating dish, and the in-cabin fluid regulating device is arranged on the frame housing (10).

2. The semiconductor refrigeration fresh-keeping container according to claim 1, characterized in that: The electromagnetic field generator comprises an electromagnetic coil and an electromagnetic field generating circuit, the electromagnetic coil is in communication with the electromagnetic field generating circuit, the electromagnetic field generating circuit is electrically connected to the multifunctional integrated circuit board, the electromagnetic coil is arranged on the frame housing (10) at a position close to the cold storage cavity (100), and can generate an electromagnetic field when in operation that acts on the cold storage cavity (100).

3. The semiconductor refrigeration fresh-keeping container according to claim 1, characterized in that: The spatial electrostatic field generator includes a module consisting of a positive terminal, a negative terminal and a potential difference generating circuit; The positive terminal and the negative terminal are both electrically connected to a potential difference generating circuit, which is electrically connected to the multifunctional integrated circuit board. The positive terminal and the negative terminal are respectively arranged on opposite sides of the cold storage cavity (100) where the cold expansion body (2) is located, and can generate an electrostatic field during operation that acts on the cold storage cavity (100).

4. The semiconductor refrigeration fresh-keeping container according to claim 1, characterized in that: The space electrostatic field generator is a DENBA electrostatic field system; The water molecule resonance region of the DENBA electrostatic field system is arranged in the cold storage cavity (100) where the cold expansion body (2) is located, and the circuit of the DENBA electrostatic field system is electrically connected to the multifunctional integrated circuit board.

5. The semiconductor refrigeration fresh-keeping container according to claim 1, characterized in that: The ultrasonic generator includes an ultrasonic transducer and an ultrasonic circuit, the ultrasonic circuit is electrically connected to the multifunctional integrated circuit board, the ultrasonic emitting surface of the ultrasonic transducer is arranged in close contact with the liquid vibrating dish or the cooling expansion body (2), and the liquid vibrating dish is a stainless steel container that can hold water.

6. The semiconductor refrigeration fresh-keeping container according to claim 1, characterized in that: The liquid vibrating dish is a water-holding vessel arranged in the cold storage cavity (100) and in the action space of the field space module. The water container is provided with one or a combination of two or more of a vibration frequency measuring instrument probe, a light refraction liquid level detector probe, an air quality detector probe, a temperature sensor probe, a humidity sensor probe, a pressure sensor probe, an electronic scale module, a camera probe, an electronic timer module, and a wireless communication module. The water-holding vessel is electrically connected to the multifunctional integrated circuit board through contact terminals, wireless charging transmitting and receiving modules, power strips, or flexible cables.

7. The semiconductor refrigeration fresh-keeping container according to claim 1, characterized in that: The ultrasonic atomization system includes an ultrasonic microporous atomization sheet and an ultrasonic atomization circuit, and the ultrasonic atomization circuit is electrically connected to the multifunctional integrated circuit board; A water storage cavity is provided on the frame shell (10) at a position close to the cold storage cavity (100), and a water permeable hole is provided at the bottom of the water storage cavity. The water absorption surface of the ultrasonic microporous atomizing sheet is arranged toward the water permeable hole, and the atomizing emission surface thereof is arranged toward the inside of the cold storage cavity (100); or The frame shell (10) is provided with a pipeline connecting the water storage chamber and the cold storage chamber (100), and the ultrasonic microporous atomizing sheet is arranged at one end of the pipeline leading to the cold storage chamber (100), the water absorption surface of the ultrasonic microporous atomizing sheet is arranged toward the pipeline, and the atomization emission surface thereof is arranged toward the inside of the cold storage chamber (100), and the other end of the pipeline is connected to the water permeable hole of the water storage chamber.

8. The semiconductor refrigeration fresh-keeping container according to claim 1, characterized in that: The fluid pump injection system comprises a single fluid nozzle (6), a water pipe, and a water pump (5) electrically connected to a multifunctional integrated circuit board; A water storage cavity is provided on the frame shell (10), a water permeable hole is provided on the water storage cavity, and the water pump (5) is located in the water storage cavity or the water injection port of the water pump (5) is connected to the water permeable hole provided on the water storage cavity through the water pipe; The single-fluid nozzle (6) is connected to the water outlet of the water pump (5) through the water pipe, and the nozzle on the single-fluid nozzle (6) is arranged toward the inside of the cold storage cavity (100).

9. The semiconductor refrigeration fresh-keeping container according to claim 1, characterized in that: The convection blowing system is an internal circulation fan that is fixed in the cold storage cavity (100) and close to the cold expansion body (2), and the internal circulation fan is electrically connected to the multifunctional integrated circuit board.

10. The semiconductor refrigeration fresh-keeping container according to claim 1, characterized in that: A detachable connection kit is also provided on the inner wall of the cold storage cavity (100). The cabin fluid regulating device is fixed on the detachable connection kit, The cabin fluid regulating device is electrically connected to the multifunctional integrated circuit board through contact terminals, wireless charging transmitting and receiving modules, or a power strip. Alternatively, the cabin fluid regulating device together with its matching water storage chamber is fixed on the detachable connection kit.

11. The semiconductor refrigeration fresh-keeping container according to claim 1, characterized in that: It also includes a heat dissipation enhancement device, the fluid output end of which acts on the ventilation and heat dissipation cavity (200).

12. The semiconductor refrigeration fresh-keeping container according to claim 11, characterized in that: The heat dissipation enhancement device includes an ultrasonic microporous atomizing sheet and an ultrasonic atomizing circuit, and the ultrasonic atomizing circuit is electrically connected to the multifunctional integrated circuit board; A water storage chamber with a water permeable hole is provided on the frame shell (10) near the ventilation and heat dissipation cavity (200), the water permeable hole is provided through the adjacent frame shell (10), the water absorption surface of the ultrasonic microporous atomizing sheet faces the water permeable hole, and the atomizing emission surface thereof faces the ventilation and heat dissipation cavity (200); or A water accumulation channel is provided on the frame shell (10), a water inlet of the water accumulation channel is provided through the bottom of the cold storage cavity (100), and a water outlet is provided on the inner wall of the ventilation and heat dissipation cavity (200), a water absorption surface of the ultrasonic microporous atomizing sheet faces the water outlet of the water accumulation channel, and an atomizing emission surface faces the ventilation and heat dissipation cavity (200).

13. The semiconductor refrigeration fresh-keeping container according to claim 11, characterized in that: The heat dissipation enhancement device includes a two-fluid nozzle, a water pipe, an air pipe and an air pump electrically connected to the multifunctional integrated circuit board; The frame shell (10) is provided with a water storage cavity, and the water storage cavity is provided with a water cavity water permeable hole, a water cavity air inlet hole and a water cavity air outlet hole; The water inlet of the two-fluid nozzle is connected to the water permeable hole of the water cavity through the water pipe, the air inlet of the two-fluid nozzle is connected to the air outlet of the water cavity through the air pipe, and the air inlet of the water cavity is connected to the air outlet of the air pump through another air pipe; The nozzle of the two-fluid nozzle is arranged toward the ventilation and heat dissipation cavity (200).

14. The semiconductor refrigeration fresh-keeping container according to claim 11, characterized in that: The heat dissipation enhancement device includes a mixed fluid nozzle, a three-way sleeve, an air pipe and an air pump electrically connected to the multifunctional integrated circuit board; A water storage cavity is provided on the frame shell (10), and a water cavity water permeable hole is provided on the water storage cavity; The air pump is connected to the mixed fluid nozzle via the air pipe, the middle portion of the air pipe is connected to the first and second interfaces of the three-way sleeve, the third interface of the three-way sleeve is connected to the water permeable hole of the water cavity, and the nozzle of the mixed fluid nozzle is arranged toward the ventilation and heat dissipation cavity (200).

15. The semiconductor refrigeration fresh-keeping container according to claim 11, characterized in that: The heat dissipation enhancement device is an exhaust fan arranged at the air outlet (12) of the frame housing (10) and electrically connected to the multifunctional integrated circuit board. The air duct of the exhaust fan is connected to the ventilation and heat dissipation cavity (200). The direction of gas flow driven by the exhaust fan is the same as the direction of gas flow driven by the heat dissipation fan (4).

16. The semiconductor refrigeration fresh-keeping container according to claim 1, characterized in that: The heat dissipation device (3) is composed of a heat preservation kit consisting of a fixed split body, a movable split body, a heat preservation control motor and a heat preservation transmission component, and the heat preservation control motor is electrically connected to the multifunctional integrated circuit board; The fixed split body is in contact with the heating surface of the semiconductor refrigeration plate (1), the movable split body is connected to the heat preservation transmission component, the heat preservation transmission component is connected to the rotor of the heat preservation control motor, and can perform reciprocating motion under the drive of the heat preservation control motor and the heat preservation transmission component; or, The heat dissipation device (3) is a heat preservation kit consisting of a fixed split body, a movable split body, a phase-changing solenoid valve and a permanent magnet, and the phase-changing solenoid valve is electrically connected to the multifunctional integrated circuit board; The fixed split body is fitted with the heating surface of the semiconductor refrigeration plate (1), the phase-changing solenoid valve or the permanent magnet is arranged facing each other, and the two are respectively arranged on the inner wall of the ventilation and heat dissipation cavity (200) and on the movable split body, the movable split body is slidably connected to the frame shell (10) through a slide rail, and the movable split body can perform reciprocating motion under the drive of the phase-changing solenoid valve; The first stroke of the reciprocating motion can cause the movable part to be separated from the fixed part, and the second stroke of the reciprocating motion can cause the movable part to be re-attached to the fixed part.

17. The semiconductor refrigeration fresh-keeping container according to claim 16, characterized in that: The heat preservation transmission component is either a crankshaft connecting rod mechanism, a gear rack mechanism, or a turbine worm mechanism.

18. The semiconductor refrigeration fresh-keeping container according to claim 16, characterized in that: The heat preservation transmission assembly is further connected to a cold locking cover plate, the surface of which can completely cover the contact surface between the fixed part and the movable part; When the movable part moves away from the fixed part, the cold lock cover plate is synchronously linked and covers the side of the fixed part that originally faces the movable part. When the movable split body moves again in contact with the fixed split body, the cold-locking cover plate is synchronously linked to expose the side of the fixed split body that was originally facing the movable split body.

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