Flexible circuit board bending test device

Abstract

A flexible circuit board bending test device comprises a first bending device and a second bending device, the first bending device and the second bending device each comprise a side plate and a bending frame arranged on the inner surface of the side plate, and the bending frames of the first bending device and the second bending device are oppositely arranged. The ends of the bending frames on the first bending device and the second bending device are arranged in a crossed and stacked mode, a gap exists between the upper bending frame and the lower bending frame, and the gap is larger than the thickness of the flexible circuit board. According to the utility model, bending processing of specific parts of the circuit board can be realized, multi-position bending can be carried out on the circuit board, detection is more comprehensive, and during bending, the bending angle range is wide, and detection can be carried out at various angles. The practicability is high, and the popularization significance is high.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a bending test device for a flexible circuit board. Background Art

[0002] Flexible Printed Circuit (FPC), abbreviated as FPC, is a highly reliable and extremely flexible printed circuit board made of polyimide or polyester film as a substrate. It has the characteristics of high wiring density, light weight, thin thickness, and good bendability. The electrical connection between the display module of a mobile phone and the mobile phone host is completed through FPC. During the assembly process, the FPC will be bent at a large angle. In order to examine the bending resistance of the FPC, it is usually necessary to perform a bending test on it. After the bending test, the damage to the copper traces and each layer is observed using a secondary device. However, the bending angle range of current test jigs is limited. For example, the FPC bending test jig disclosed in Chinese Patent 202321166999.8 can only be bent 180° and can only achieve bending processing of specific parts of the circuit board. It is impossible to bend the circuit board in multiple positions. As a result, during the bending process of the circuit board, the detection is not comprehensive, which affects the detection effect. Utility Model Content

[0003] Based on this, it is necessary to provide a flexible circuit board bending test device to address the deficiencies in the prior art.

[0004] A flexible circuit board bending test device includes a first bending device and a second bending device. The first bending device and the second bending device both include side panels and bending frames arranged on the inner surfaces of the side panels. The bending frames of the first bending device and the second bending device are arranged opposite to each other. The ends of the bending frames on the first bending device and the second bending device are cross-stacked, and there is a gap between the upper and lower bending frames. The gap is greater than the thickness of the flexible circuit board.

[0005] Furthermore, the two side panels are both vertically extended, and the bending frames are arranged on two opposite inner surfaces of the side panels.

[0006] Furthermore, it also includes a base, and a plurality of rotating shafts are provided on the inner side surfaces of the side plates. The bending frame is provided on the rotating shafts, and the rotating shafts drive the bending frame to rotate to the horizontal or vertical direction.

[0007] Furthermore, the bending frame is arranged in a U-shaped configuration, comprising two mounting rods and a bending rod arranged between the two mounting rods. The rotation axes on the same side are arranged upward and outward from bottom to top.

[0008] Furthermore, thick foam is provided on the outer surface of the bending rod, and the circuit board is in contact with the outer surface of the thick foam.

[0009] Furthermore, the first bending device and the second bending device are arranged correspondingly up and down, and a driving device is provided on the first bending device, and the driving device drives the first bending device to close downward on the second bending device or move away from the second bending device.

[0010] In summary, the flexible circuit board bending test device of this invention not only can bend specific parts of a circuit board, but also can bend the circuit board at multiple locations for more comprehensive testing. Furthermore, the device can be bent at a wide range of angles, allowing testing at various angles. This device is highly practical and has great potential for widespread adoption. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 This is a first embodiment of a structural schematic diagram of a flexible circuit board bending test device according to the present invention;

[0012] Figure 2 for Figure 1 Schematic diagram of the use status of the test device;

[0013] Figure 3 for Figure 1 Schematic diagram of the structure of the middle bending rod after the buffer is installed;

[0014] Figure 4 and Figure 5 for Figure 3 Diagram of the use of the middle bending rod at two different bending angles;

[0015] Figure 6 This is a third embodiment of the structural schematic diagram of a flexible circuit board bending test device of the present invention. DETAILED DESCRIPTION

[0016] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0017] like Figures 1 to 2As shown in the figure, the present utility model provides a flexible circuit board bending test device. The flexible circuit board bending test device includes a base 10 and a bending device 20 disposed on the base 10. A test platform is provided on the top surface of the base 10. The bending device 20 includes a first bending device 21 and a second bending device 22, and the first bending device 21 and the second bending device 22 are respectively disposed on the left and right sides of the test platform. Further, a slide rail (not shown in the figure) is provided on the top surface of the test platform, and the first bending device 21 and the second bending device 22 can move left and right along the slide rail to approach or move away from each other, so as to adjust the distance between the first bending device 21 and the second bending device 22.

[0018] Both the first bending device 21 and the second bending device 22 include side plates 221 and bending frames 222 disposed on the inner surfaces of the side plates 221. The bending rods on the first bending device 21 and the second bending device 22 are arranged in a staggered manner in the horizontal direction, so as to form a staggered stacked structure after rotating towards the middle. More specifically, a plurality of rotating shafts 223 are provided on the inner side surface of the side plate 221, and the bending frame 222 is disposed on the rotating shafts 223. In this embodiment, the bending frame 222 is arranged in a U shape, and includes two mounting rods and a bending rod disposed between the two mounting rods. The rotating shafts 223 on the same side are arranged in a direction from bottom to top and obliquely upward to the outside, so that there is no interference between the bending frames 222 when they rotate.

[0019] During use, rotate the bending frame 222 to the vertical position, place the flexible circuit board on the test platform, then rotate the lowermost bending frame 222 to the horizontal position to fix the circuit board, straighten the other end of the flexible circuit board upward, and then sequentially rotate the rotating frames on both sides towards the middle to bend the circuit board. During the bending process, the upper end of the flexible circuit board gradually moves downward and relaxes, so as to have enough length for bending. After bending for a specific time, the first bending device 21 and the second bending device 22 move away from each other in the reverse direction and then close, and this is repeated multiple times.

[0020] As Figures 3 to 5 shown in the figure, it is the second embodiment of the present utility model. The structure of this embodiment is basically the same as that of the first embodiment, and the difference is that in this embodiment, a thick foam 30 can be adhered to the outer surface of the bending rod to increase the outer diameter according to requirements, so as to be applicable to bending at different angles.

[0021] As Figure 6The third embodiment of the present invention is shown in FIG. This embodiment is essentially the same as the first embodiment, differing in that the side panels 221 are positioned vertically opposite each other, and the bending frame 222 is fixedly mounted. During use, the flexible printed circuit board is placed on the top surface of the lower bending mechanism, and the upper bending mechanism moves downward and closes, bending the flexible printed circuit board forward and backward into multiple folds. This structure is relatively simple to operate.

[0022] In summary, the flexible circuit board bending test device of this invention not only can bend specific parts of a circuit board, but also can bend the circuit board at multiple locations for more comprehensive testing. Furthermore, the device can be bent at a wide range of angles, allowing testing at various angles. This device is highly practical and has great potential for widespread adoption.

[0023] The above-described embodiments represent only three implementation methods of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art would be able to make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. A flexible circuit board bending test device, characterized by: It includes a first bending device and a second bending device, each of which includes a side plate and a bending frame arranged on the inner surface of the side plate. The bending frames of the first bending device and the second bending device are arranged opposite to each other, and the ends of the bending frames on the first bending device and the second bending device are cross-stacked, and there is a gap between the upper and lower bending frames, which is greater than the thickness of the flexible circuit board.

2. The flexible circuit board bending test device according to claim 1, characterized in that: The two side plates are both vertically extended, and the bending frames are arranged on two opposite inner surfaces of the side plates.

3. The flexible circuit board bending test device according to claim 2, wherein: It also includes a base, and a plurality of rotating shafts are arranged on the inner side surfaces of the side plates. The bending frame is arranged on the rotating shafts, and the rotating shafts drive the bending frame to rotate to the horizontal or vertical direction.

4. A flexible circuit board bending test device according to claim 3, characterized in that: The bending frame is arranged in a U-shape, and includes two mounting rods and a bending rod arranged between the two mounting rods; the rotating shafts on the same side are arranged outward and upward from bottom to top.

5. The flexible circuit board bending test device according to claim 4, characterized in that: Thick foam is provided on the outer surface of the bending rod, and the circuit board is in contact with the outer surface of the thick foam.

6. The flexible circuit board bending test device according to claim 1, wherein: The first bending device and the second bending device are arranged in correspondence with each other up and down. The first bending device is provided with a driving device, and the driving device drives the first bending device to close downward on the second bending device or move away from the second bending device.

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