Extensible compressed solid-state storage hard disk module

Abstract

The utility model discloses an extensible compressed solid-state storage hard disk module, and relates to the technical field of memory chip modules. The extensible compressed solid-state storage hard disk module comprises a PCB main board, a hard disk drive module and a hard disk drive module, wherein the PCB main board comprises a surface A and a surface B; the flash memory chips are welded on the A surface and the B surface of the PCB main board, at least two flash memory chips are welded on each of the A surface and the B surface, and the arrangement number of the flash memory chips is matched with the width of a flash memory chip welding area of the PCB main board; the control chip is welded on the A surface of the PCB mainboard and is close to the flash memory chip; and the circular bonding pad matrix is distributed at the edge position of the B surface of the PCB mainboard. The beneficial effects of the utility model are that: can be applicable to desktop computer, workstation server, network terminal, notebook computer and other conventional mainstream application scenarios, and have large capacity and extensibility.

Description

Technical Field

[0001] The utility model relates to the technical field of memory chip modules, and more particularly to an expandable compressed solid-state storage hard disk module. Background Art

[0002] There are three common module connection and assembly methods: embedded soldering, connector slots, and board-to-board pin connections. Embedded soldering refers to assembly onto devices via soldering, such as eMMC and UFS. Its advantages are compactness and lightness, but its disadvantage is inconvenient for upgrades and replacements. Connector slots use spring-loaded connectors and are secured with screws and other structures, such as conventional memory modules and M.2 SSDs. While upgrades and replacements are simple, the limitations of the spring-loaded pin structure and materials, such as conductivity, length equivalence, impedance, and shielding protection, make them unsuitable for higher-frequency applications. Furthermore, the connector structure takes up space, limiting lightweight applications. With the push of a button, compact solid-state storage modules with high density in a small form factor also tend to suffer from weaker seismic stability, failing to meet the demands of next-generation technologies. Board-to-board pin connections were first used in CPUs, using high-precision, tiny board-to-board spring pins. Because the pins are extremely short and highly consistent, they are more suitable for high-frequency applications. Memory modules were the first to adopt board-to-board pin connections, giving rise to the LPCAMM2 (Low Power DDRV CAMM2 module) and CAMM2 (Compressed Attached Memory Module). le) two types of compressed additional memory modules, but there is no standardized board-to-board pin connection module in the flash memory storage field.

[0003] To this end, the present invention provides an expandable compressed solid-state storage hard disk module, which can be applied to conventional mainstream application scenarios such as desktop computers, workstation servers, network terminals and notebook computers, and has large capacity and is expandable. Utility Model Content

[0004] In order to overcome the shortcomings of the existing technology, the utility model provides an expandable compressed solid-state storage hard disk module, which can be applied to conventional mainstream application scenarios such as desktop computers, workstation servers, network terminals and notebook computers, and has large capacity and is expandable.

[0005] The technical solution adopted by the present invention to solve the technical problem is: an expandable compressed solid-state storage hard disk module, the improvement of which is that the expandable compressed solid-state storage hard disk module includes:

[0006] PCB main board, including side A and side B;

[0007] Flash memory chips are soldered to both sides A and B of the PCB, with at least two flash memory chips soldered to each side. The number of flash memory chips is adapted to the width of the area on the PCB for soldering the flash memory chips.

[0008] The control chip is soldered to the A side of the PCB motherboard and is close to the flash memory chip;

[0009] The circular pad matrix is ​​distributed at the edge of the B side of the PCB motherboard.

[0010] In the above structure, a first mounting hole, a second mounting hole and a third mounting hole are provided on the PCB main board; the first mounting hole and the second mounting hole are respectively located at the two ends of the circular pad matrix; the third mounting hole is located in the middle position of the side of the PCB main board away from the circular pad matrix.

[0011] In the above structure, a first positioning hole and a second positioning hole are further provided on the PCB main board. The first positioning hole is close to the first mounting hole; the second positioning hole is close to the second mounting hole.

[0012] In the above structure, the size of the first positioning hole is larger than the size of the second positioning hole / the size of the first positioning hole is smaller than the size of the second positioning hole.

[0013] In the above structure, a first positioning groove and a second positioning groove are further provided on the PCB main board, and the first positioning groove and the second positioning groove are respectively located on both sides of the third mounting hole.

[0014] In the above structure, the size of the first positioning groove is larger than that of the second positioning groove.

[0015] In the above structure, the welding positions of the flash memory chip on the A side are symmetrical with the welding positions on the B side, and the number of weldings on the flash memory chip on the A side is the same as the number of weldings on the B side.

[0016] In the above structure, the expandable compressed solid-state storage hard disk module further includes exposed copper foil, and the exposed copper foil is arranged around the edge of the PCB mainboard.

[0017] The beneficial effects of the present invention are as follows: the present solution realizes board-to-board pin connection with the application-end PCB circuit board through a circular pad matrix, and the number of flash memory chips provided is adapted to the width of the area where the flash memory chips are soldered on the PCB mainboard, thereby enabling expansion of the installation of the flash memory chips and expanding the capacity of the compressed solid-state storage hard disk module; thus, the present solution can be applied to conventional mainstream application scenarios such as desktop computers, workstation servers, network terminals and notebook computers, and has large capacity and is expandable. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1This is a schematic diagram of the overall structure of an expandable compressed solid-state storage hard disk module of the utility model Figure 1 ;

[0019] Figure 2 This is a schematic diagram of the overall structure of an expandable compressed solid-state storage hard disk module of the utility model Figure 2 ;

[0020] Figure 3 This is a schematic diagram of the overall structure of an expandable compressed solid-state storage hard disk module of the utility model Figure 3 ;

[0021] Figure 4 This is a schematic diagram of the overall structure of an expandable compressed solid-state storage hard disk module of the utility model Figure 4 ;

[0022] Figure 5 This is a schematic diagram of the overall structure of an expandable compressed solid-state storage hard disk module of the utility model Figure 5 . DETAILED DESCRIPTION

[0023] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0024] The following will clearly and completely describe the concept, specific structure and technical effects of the present invention in combination with the embodiments and drawings, so as to fully understand the purpose, characteristics and effects of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, other embodiments obtained by technical personnel in this field without creative work are within the scope of protection of the present invention. In addition, all the connection / connection relationships involved in the patent do not refer to the direct connection of components, but refer to the fact that a better connection structure can be formed by adding or reducing connection accessories according to the specific implementation situation. The various technical features in the creation of the present invention can be combined interactively without conflicting with each other.

[0025] Reference Figure 1-5 As shown, the present invention discloses an expandable compressed solid-state storage hard disk module, the expandable compressed solid-state storage hard disk module comprising:

[0026] PCB main board 1, including side A and side B;

[0027] Flash memory chips 2 are soldered to surfaces A and B of the PCB mainboard 1, with at least two flash memory chips 2 soldered to each surface. The number of flash memory chips 2 provided matches the width of the area on the PCB mainboard 1 where the flash memory chips 2 are soldered. The soldering positions of the flash memory chips 2 on surface A are symmetrical with the soldering positions on surface B, and the number of flash memory chips 2 soldered on surface A is the same as the number of flash memory chips soldered on surface B.

[0028] The control chip 3 is soldered to the A side of the PCB mainboard 1 and is close to the flash memory chip 2;

[0029] The circular pad matrix 4 is distributed at the edge of the B surface of the PCB main board 1 .

[0030] It should be noted that, in this embodiment, the PCB motherboard 1 is the basic structure of the entire expandable compressed solid-state storage hard disk module, which is used to provide circuit connection and mechanical support; the flash memory chip 2 is used for data storage and reading, and this embodiment adopts the high-speed packaging specification BGA154 Ball to improve the transmission frequency; the control chip 3 is responsible for managing the data transmission and access operations of the flash memory chip 2, and can perform basic operations such as data reading, writing and erasing, and also undertakes functions such as error detection and correction, and data encryption; the circular pad matrix 4 is used to provide connection points to realize the board-to-board connection between the PCB motherboard 1 and the application-end PCB circuit board; when implementing the utility model, after determining the number of flash memory chips 2 required for the application scenario, the PCB motherboard 1 is designed and expanded, and the number of flash memory chips 2 is adapted to the width of the area of ​​the PCB motherboard 1 where the flash memory chips 2 are soldered, so as to expand the installation of the flash memory chips 2 and expand the capacity of the compressed solid-state storage hard disk module; thus, it can be applied to conventional mainstream application scenarios such as desktop computers, workstation servers, network terminals and laptops, and has large capacity and is expandable; specifically, through By increasing the width of the area where the flash memory chip 2 is soldered to the PCB mainboard 1, the flash memory chip 2 is expanded from two on each side A and side B (a total of 4 chips) to 4 on each side (a total of 8 chips), the capacity is doubled, and the performance is greatly improved; in addition, personalized expansion is supported, such as extending toward the tail, it can also be expanded to 4 on each side (a total of 8 chips), and extending both sides plus the tail can even expand to 8 on each side (a total of 16 chips) and 16 on each side (a total of 32 chips); in addition, this embodiment also realizes a board-to-board pin connection between the PCB mainboard 1 and the application-end PCB circuit board through a circular solder pad, without reserving space for the connector, and the space occupied is smaller than the space occupied by the traditional connector connection method; by installing the flash memory chip 2 on both sides of the PCB mainboard 1, the heat can be dispersed. Compared with the traditional solution where the heat of a single flash memory chip 2 is concentrated, the heat dissipation effect of this embodiment is better.

[0031] Reference Figure 2-5As shown, the PCB main board 1 is provided with a first mounting hole 7, a second mounting hole 8 and a third mounting hole 9; the first mounting hole 7 and the second mounting hole 8 are respectively located at the two ends of the circular pad matrix 4; the third mounting hole 9 is located in the middle position of the side of the PCB main board 1 away from the circular pad matrix 4.

[0032] It should be noted that, in this embodiment, the first mounting holes 7, the second mounting holes 8, and the third mounting holes 9 are designed to fix the PCB mainboard 1 to the application-end PCB circuit board; and the first mounting holes 7, the second mounting holes 8, and the third mounting holes 9 are distributed in a triangular shape. The design here utilizes the stability characteristics of the triangle to ensure that the PCB mainboard 1 can be firmly fixed on the application-end PCB circuit board.

[0033] Continue to refer to Figure 2-5 As shown, the PCB main board 1 is also provided with a first positioning hole 5 and a second positioning hole 6, the first positioning hole 5 is close to the first mounting hole 7; the second positioning hole 6 is close to the second mounting hole 8; the size of the first positioning hole 5 is larger than the size of the second positioning hole 6 / the size of the first positioning hole 5 is smaller than the size of the second positioning hole 6.

[0034] It should be noted that, in this embodiment, the first positioning hole 5 and the second positioning hole 6 are designed to be able to identify the interface type adapted by the circular pad matrix 4. Specifically, taking PC I e x4 and SATA as examples, if the size of the first positioning hole 5 is larger than the size of the second positioning hole 6, the interface adapted by the circular pad matrix 4 is SATA; if the size of the first positioning hole 5 is smaller than the size of the second positioning hole 6, the interface adapted by the circular pad matrix 4 is PC I e x4.

[0035] Continue to refer to Figure 2-5 As shown, the PCB main board 1 is also provided with a first positioning groove 10 and a second positioning groove 11, and the first positioning groove 10 and the second positioning groove 11 are respectively located on both sides of the third mounting hole 9; the size of the first positioning groove 10 is larger than that of the second positioning groove 11.

[0036] It should be noted that, in this embodiment, the design of the first positioning groove 10 and the second positioning groove 11 can accurately position the expandable compressed solid-state storage hard disk module during the installation process, ensuring the accuracy of the installation of the expandable compressed solid-state storage hard disk module.

[0037] Continue to refer to Figure 2-5 As shown, the expandable compressed solid-state storage hard disk module further includes a bare copper foil 12 , and the bare copper foil 12 is arranged around the edge of the PCB mainboard 1 .

[0038] It should be noted that in this embodiment, the exposed copper foil 12 is subjected to anti-oxidation treatment such as gold plating to maintain good electrical conductivity and thermal conduction. The exposed copper foil 12 is grounded and connected to the bottom metal heat sink and the application end PCB circuit board via screws, thereby achieving the functions of shielding electromagnetic interference, protecting against static electricity, and dissipating heat. The above is a specific description of the preferred implementation of the utility model, but the invention is not limited to the embodiments described. Those skilled in the art can make various equivalent modifications or substitutions without violating the spirit of the utility model. These equivalent modifications or substitutions are all included in the scope defined by the claims of this application.

Claims

1. An expandable compressed solid-state storage hard disk module, characterized in that: The scalable compressed solid-state storage hard disk module includes: PCB main board, including side A and side B; Flash memory chips are soldered to both sides A and B of the PCB, with at least two flash memory chips soldered to each side. The number of flash memory chips is adapted to the width of the area on the PCB where the flash memory chips are soldered. The control chip is soldered to the A side of the PCB motherboard and is close to the flash memory chip; The circular pad matrix is ​​distributed at the edge of the B side of the PCB motherboard.

2. The expandable compressed solid-state storage hard disk module according to claim 1, characterized in that: The PCB main board is provided with a first mounting hole, a second mounting hole and a third mounting hole; the first mounting hole and the second mounting hole are respectively located at the two ends of the circular pad matrix; the third mounting hole is located in the middle position of the side of the PCB main board away from the circular pad matrix.

3. The expandable compressed solid-state storage hard disk module according to claim 2, characterized in that: The PCB main board is further provided with a first positioning hole and a second positioning hole. The first positioning hole is close to the first mounting hole; the second positioning hole is close to the second mounting hole.

4. The expandable compressed solid-state storage hard disk module according to claim 3, characterized in that: The size of the first positioning hole is larger than that of the second positioning hole / the size of the first positioning hole is smaller than that of the second positioning hole.

5. The expandable compressed solid-state storage hard disk module according to claim 2, characterized in that: The PCB main board is further provided with a first positioning groove and a second positioning groove, and the first positioning groove and the second positioning groove are respectively located on both sides of the third mounting hole.

6. The expandable compressed solid-state storage hard disk module according to claim 5, characterized in that: The size of the first positioning groove is larger than that of the second positioning groove.

7. The expandable compressed solid-state storage hard disk module according to claim 1, characterized in that: The welding positions of the flash memory chip on the A side are symmetrical to the welding positions on the B side, and the number of weldings on the flash memory chip on the A side is the same as the number of weldings on the B side.

8. The expandable compressed solid-state storage hard disk module according to claim 1, characterized in that: The expandable compressed solid-state storage hard disk module further includes exposed copper foil, which is arranged around the edge of the PCB mainboard.

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