Memory chip testing device based on memory module
By soldering the second and third circuit boards on the memory module circuit board and using test pins to connect the top and bottom memory chips, the problem of inconsistent matching between memory chips was solved, and high-frequency testing and performance optimization of the memory module were achieved.
Patent Information
- Application Number
- CN202422146505.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-02
- Publication Date
- 2025-09-30
- Estimated Expiration
- 2034-09-02
AI Technical Summary
During the memory module manufacturing process, matching issues between memory chips lead to inconsistent performance, affecting the performance of the entire memory module. Existing technology makes it difficult to effectively ensure the compatibility between DRAM particles.
A memory chip testing device based on a memory module is designed. By soldering a second and a third circuit board on the top and bottom of the memory module circuit board, and using top and bottom test pins to connect the top and bottom memory chips respectively, double-sided high-frequency testing is achieved to ensure the adaptability of the memory chip.
It achieves double-sided high-frequency testing of memory chips in memory modules, ensures the compatibility between DRAM particles, and improves the overall performance and value of memory modules.
Smart Images
Figure CN223401390U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of chip testing equipment, and more particularly to a memory chip testing device based on a memory module. Background Art
[0002] Memory modules are essential components of computers, allowing the CPU to address memory through the data bus. Initially, computer memory was packaged as individual chips soldered to the motherboard. If a chip failed, it had to be removed and replaced. Later, modular memory modules were invented. Each module contained multiple memory chips (commonly known as DRAM chips), and corresponding memory slots were designed on the motherboard. This made memory modules removable and easy to install, making memory maintenance and expansion much more convenient.
[0003] Memory module specifications have evolved through the SDRAM and DDR eras, with DDR4 and DDR5 currently the mainstream. Currently, 6400MHz has become the mainstream DDR5 frequency, with the highest frequency exceeding 10000MHz. As frequencies continue to rise, the high-frequency requirements for testing memory chips (DRAM chips) are becoming increasingly stringent.
[0004] A memory module consists of 8 or 16 memory chips (DRAM particles), 8 on one side and 8 on the other. A memory module with 16 memory chips (DRAM particles) must meet high-frequency requirements. If one chip doesn't meet the required frequency, not only will it fail to form a high-frequency, high-capacity memory module, but even if the remaining 15 chips can operate at high frequency, they won't deliver optimal value. Therefore, testing the frequency, electrical performance, and other aspects of the memory chips (DRAM particles) before assembling them into a memory module, along with sorting them, is a key approach to maximizing value.
[0005] During the memory module manufacturing process, eight memory chips (DRAM particles) are typically assembled, screened, and graded before being fabricated into a memory module containing 16 memory chips. During this process, mismatching issues between chips can occur, meaning that performance or parameter inconsistencies between different chips can affect the performance of the entire memory module.
[0006] To this end, the utility model provides a memory chip testing device based on a memory module, which ensures the compatibility between DRAM particles in the memory module by performing double-sided high-frequency testing on the memory chip. Utility Model Content
[0007] In order to overcome the deficiencies of the prior art, the utility model provides a memory chip testing device based on a memory module, which ensures the adaptability between DRAM particles in the memory module.
[0008] The technical solution adopted by the utility model to solve its technical problems is: a memory chip testing device based on a memory module, and its improvement lies in that the memory chip testing device based on the memory module includes a memory module circuit board, a second circuit board, a third circuit board, a top test pin, and a bottom test pin; one side of the second circuit board is welded to the top of the memory module circuit board, and the other side is in contact with the bottom of the top test pin; one side of the second circuit board is welded to the bottom of the memory module, and the other side is in contact with the top of the bottom test pin; the top of the top test pin is used to connect to the top surface memory chip; the bottom of the bottom test pin is used to connect to the bottom surface memory chip.
[0009] In the above structure, the memory chip testing device based on the memory module also includes a shell and a memory module circuit board fixing part; fixing piles are arranged inside the shell, and the fixing piles are distributed at the top and bottom positions on both sides of the shell; the memory module circuit board fixing part is fixedly installed between the fixing piles.
[0010] In the above structure, the memory chip testing device based on the memory module also includes a first top test needle fixing plate, a second top test needle fixing plate, a first bottom test needle fixing plate, a second bottom test needle fixing plate, a limit screw, a first spring and a fixing bolt; the first top test needle fixing plate and the second top test needle fixing plate and the first bottom test needle fixing plate are fixedly connected by the first spring, and the first top test needle fixing plate is sleeved on the top of the top test needle, and the second top test needle fixing plate is sleeved on the bottom of the top test needle; the first bottom test needle fixing plate is sleeved on the top of the bottom test needle, and the second bottom test needle fixing plate is sleeved on the bottom of the bottom test needle; the limit screw is clamped in the first spring; the fixing bolt passes through the second top test needle fixing plate, the second circuit board, the memory module circuit board fixing part, the third circuit board and the first bottom test needle fixing plate at the same time.
[0011] In the above structure, the memory chip testing device based on the memory module also includes a top tray clamp, a bottom tray clamp, a top tray, a bottom tray and a second spring; the top tray clamp and the top of the memory module circuit board fixing part and the bottom tray clamp and the bottom of the memory module circuit board fixing part are connected by the second spring, and the top tray clamp and the second spring connected to the top tray are both passed through the fixed pile at the top position of the shell, and the bottom tray clamp and the second spring connected to the bottom tray are both passed through the fixed pile at the bottom position of the shell; the top tray is slidably connected to the top tray clamp, and the top tray is used to install the top surface memory chip; the bottom tray is slidably connected to the bottom tray clamp, and the bottom tray is used to install the bottom memory chip.
[0012] In the above structure, the memory chip testing device based on the memory module also includes a pressure handle, a top pressure plate, a bottom pressure plate and a third spring; the top pressure plate and the top tray clamp, as well as the bottom pressure plate and the bottom tray clamp are connected through the third spring, and the top pressure plate and the third spring connected to the top pressure plate are both passed through the fixed pile at the top position of the shell, and the bottom pressure plate and the third spring connected to the bottom pressure plate are both passed through the fixed pile at the bottom position of the shell; the pressure handle is rotatably installed on one side of the outside of the shell, and is transmission-connected to the top pressure plate and the bottom pressure plate.
[0013] In the above structure, a slot is provided at the bottom of the shell, and the slot is located on the same straight line as an edge of one side of the memory module circuit board.
[0014] In the above structure, a reserved serial interface is provided on both the second circuit board and the third circuit board, and the reserved serial interface is located on the side of the second circuit board away from the top of the memory module circuit board and on the side of the third circuit board away from the bottom of the memory module circuit board.
[0015] The beneficial effect of the present invention is as follows: this solution realizes double-sided high-frequency testing of the memory chips at the same time by welding a second circuit board on the top of the memory module circuit board, welding a third circuit board on the bottom of the memory module circuit board, and connecting the second circuit board and the top memory chip through the top test pin, and connecting the third circuit board and the bottom memory chip through the bottom test pin, thereby ensuring the compatibility between the memory chips of the memory module. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 This is an overall structural diagram of a memory chip based on a memory module of the present invention;
[0017] Figure 2 for Figure 1 A partial enlarged view of point A in the middle;
[0018] Figure 3 This is a test connection diagram of a memory chip based on a memory module of the present invention. DETAILED DESCRIPTION
[0019] The present invention will be further described below with reference to the accompanying drawings and embodiments.
[0020] The following will clearly and completely describe the concept, specific structure and technical effects of the present invention in combination with the embodiments and drawings, so as to fully understand the purpose, characteristics and effects of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, other embodiments obtained by technical personnel in this field without creative work are within the scope of protection of the present invention. In addition, all the connection / connection relationships involved in the patent do not refer to the direct connection of components, but refer to the fact that a better connection structure can be formed by adding or reducing connection accessories according to the specific implementation situation. The various technical features in the creation of the present invention can be combined interactively without conflicting with each other.
[0021] Reference Figure 1-Figure 3 As shown, the utility model discloses a memory chip testing device based on a memory module, and the memory chip testing device based on the memory module includes a memory module circuit board 1, a second circuit board 2, a third circuit board 3, a top test pin 4, and a bottom test pin 5; one side of the second circuit board 2 is welded to the top of the memory module circuit board 1, and the other side is in contact with the bottom of the top test pin 4; one side of the second circuit board 2 is welded to the bottom of the memory module, and the other side is in contact with the top of the bottom test pin 5; the top of the top test pin 4 is used to connect to the top surface memory chip 19; the bottom of the bottom test pin 5 is used to connect to the bottom surface memory chip 20.
[0022] It should be noted that, in this embodiment, the memory module circuit board 1 includes circuit connections for the top memory chip 19 and the bottom memory chip 20 of the memory module, serving as the main component for memory chip performance testing; the top test pin 4 and the second circuit board 2 constitute a connection channel between the top memory chip 19 and the top of the memory module circuit board 1; the bottom test pin 5 and the third circuit board 3 constitute a connection channel between the bottom memory chip 20 and the bottom of the memory module circuit board 1. Specifically, power detection channels are provided between the VPP pin of the memory module circuit board 1 and the VPP pin of the memory chip, between the VDD pin of the memory module circuit board 1 and the VDD pin of the memory chip, and between the VDDQ pin of the memory module circuit board 1 and the VDDQ pin of the memory chip; specifically, the top and bottom surfaces of the memory module circuit board 1 are soldered to the second circuit board 2 and the third circuit board 3 through solder balls, respectively, to lead out the memory chip (DRAM particle) circuit, wherein the non-power IO circuit adopts a direct connection method, and the power circuit is disconnected to lead out the serial interface. The flash memory chips on the top and bottom surfaces are connected to the memory module circuit board 1 through the test pins, the second circuit board 2 and the third circuit board 3 to achieve high-frequency and ultra-short-distance connection, so as to achieve double-sided high-frequency testing of the memory chips at the same time, thereby ensuring the compatibility between the memory chips of the memory module.
[0023] Reference Figure 1 As shown, the memory chip testing device based on the memory module also includes a shell 6 and a memory module circuit board fixing part 7; the shell 6 is provided with fixing piles 25, and the fixing piles 25 are distributed at the top and bottom positions on both sides of the shell 6; the memory module circuit board fixing part 7 is fixedly installed between the fixing piles 25.
[0024] It should be noted that, in this embodiment, the shell 6 is the external protective structure of the test device, which provides physical protection and stability for the internal components; the fixing piles 25 are arranged at the top and bottom of both sides of the shell 6, for fixing and supporting the memory module circuit board fixing parts 7, which ensure the stability of the position of the fixing parts to prevent movement or vibration during the test; the memory module circuit board fixing parts 7 are installed between the fixing piles 25 to ensure that the memory module circuit board 1 can be firmly fixed inside the test device to prevent the memory module from shifting in position during the test, thereby maintaining the accuracy and consistency of the test.
[0025] Reference Figure 1 As shown, the memory chip testing device based on the memory module also includes a first top test needle fixing plate 8, a second top test needle fixing plate 9, a first bottom test needle fixing plate 10, a second bottom test needle fixing plate 11, a limit screw 13, a first spring 12 and a fixing bolt 24; the first top test needle fixing plate 8 and the second top test needle fixing plate 9 and the first bottom test needle fixing plate 10 and the second bottom test needle fixing plate 11 are fixedly connected by the first spring 12, and the first top test needle fixing plate 8 is sleeved on the top of the top test needle 4, and the second top test needle fixing plate 9 is sleeved on the bottom of the top test needle 4; the first bottom test needle fixing plate 10 is sleeved on the top of the bottom test needle 5, and the second bottom test needle fixing plate 11 is sleeved on the bottom of the bottom test needle 5; the limit screw 13 is clamped in the first spring 12; the fixing bolt 24 simultaneously passes through the second top test needle fixing plate 9, the second circuit board 2, the memory module circuit board fixing part 7, the third circuit board 3 and the first bottom test needle fixing plate 10.
[0026] It should be noted that, in this embodiment, the first top test needle fixing plate 8 and the second top test needle fixing plate 9 are respectively sleeved on the top and bottom of the top test needle 4, so as to protect the two ends of the top test needle 4 during the process of completing the test or stopping the test; and the first top test needle fixing plate 8 and the second top test needle fixing plate 9 are connected by a first spring 12, which allows a certain elastic displacement to ensure that during the test, the end of the top test needle 4 can be exposed from the first top test needle fixing plate 8 and the second top test needle 4 to connect with the top surface memory chip 19 and the second circuit board 2; similarly, the first bottom test needle fixing plate 10 and the second bottom test needle fixing plate 11 are respectively sleeved on the top and bottom of the bottom test needle 5, so as to protect the bottom test needle 5 during the process of completing the test or stopping the test two ends; and the first bottom test needle fixing plate 10 and the second bottom test needle fixing plate 11 are connected by a first spring 12, allowing a certain elastic displacement to ensure that during the test, the end of the bottom test needle 5 can be exposed from the first bottom test needle fixing plate 10 and the second bottom test needle 5 to connect with the top surface memory chip 19 and the second circuit board 2; the limit screw 13 is used to limit the compression range of the spring, thereby controlling the movement range of the test needle to prevent it from exceeding the range and stabbing the memory chip, the second circuit board 2 and the third circuit board 3; the fixing bolt 24 tightly fixes the second top test needle fixing plate 9, the second circuit board 2, the memory module circuit board fixing part 7, the third circuit board 3 and the first bottom test needle fixing plate 10 together to ensure the stability of the memory module circuit board 1 in the test device.
[0027] Reference Figure 1 and Figure 2 As shown, the memory chip testing device based on the memory module also includes a top tray clamp 14, a bottom tray clamp 15, a top tray 17, a bottom tray 18 and a second spring 16; the top tray clamp 14 and the top of the memory module circuit board fixing member 7 and the bottom tray clamp 15 and the bottom of the memory module circuit board fixing member 7 are connected by the second spring 16, and the top tray clamp 14 and the second spring 16 connected to the top tray 17 are both passed through the fixed pile 25 at the top position of the shell 6, and the bottom tray clamp 15 and the second spring 16 connected to the bottom tray 18 are both passed through the fixed pile 25 at the bottom position of the shell 6; the top tray 17 is slidably connected to the top tray clamp 14, and the top tray 17 is used to install the top surface memory chip 19; the bottom tray 18 is slidably connected to the bottom tray clamp 15, and the bottom tray 18 is used to install the bottom memory chip.
[0028] It should be noted that, in this embodiment, the top tray clamp 14 and the bottom tray clamp 15 are designed to support the top tray 17 and the bottom tray 18 respectively; the top tray 17 is used to install the top memory chip 19, and the bottom tray 18 is used to install the bottom memory chip 20, and the solder ball of the top memory chip 19 is close to the top of the top test pin 4, and the solder ball of the bottom memory chip 20 is close to the bottom of the bottom test pin 5; the second spring 16 provides an elastic connection between the top tray clamp 14 and the top of the memory module circuit board fixture 7 and between the bottom tray clamp 15 and the bottom of the memory module circuit board fixture 7, so that the top tray 17 and the bottom tray 18 can both move toward the direction close to the memory module circuit board 1 to ensure normal electrical connection between the top memory chip 19 and the top of the top test pin 4 and between the bottom memory chip 20 and the bottom of the bottom test pin 5, thereby ensuring the stability of the test; in addition, the sliding connection between the top tray 17 and the top tray clamp 14 and the sliding connection between the bottom tray 18 and the bottom tray clamp 15 are to facilitate the replacement of the next group of memory chips after the test is completed.
[0029] Reference Figure 1 and Figure 2 As shown, the memory chip testing device based on the memory module also includes a pressing handle 26, a top pressing plate 21, a bottom pressing plate 22 and a third spring 23; the top pressing plate 21 and the top tray clamp 14, as well as the bottom pressing plate 22 and the bottom tray clamp 15 are connected by the third spring 23, and the top pressing plate 21 and the third spring 23 connected to the top pressing plate 21 are both passed through the fixed pile 25 at the top position of the shell 6, and the bottom pressing plate 22 and the third spring 23 connected to the bottom pressing plate 22 are both passed through the fixed pile 25 at the bottom position of the shell 6; the pressing handle 26 is rotatably installed on one side of the outside of the shell 6, and is transmission-connected to the top pressing plate 21 and the bottom pressing plate 22.
[0030] It should be noted that, in this embodiment, the pressing handle 26 is transmission-connected with the top pressure plate 21 and the bottom pressure plate 22, so that the pressing handle 26 can be rotated to cause the top pressure plate 21 and the bottom pressure plate 22 to apply pressure through the transmission mechanism; and the third spring 23 is connected between the top pressure plate 21 and the top tray clamp 14 and between the bottom pressure plate 22 and the bottom tray clamp 15 to provide an elastic force, so that the top pressure plate 21 can apply appropriate pressure to the top tray clamp 14 and the bottom pressure plate 22 can apply appropriate pressure to the bottom tray clamp 15 when needed, ensuring good contact between the memory chip and the test device, thereby further ensuring the stability of the test.
[0031] Reference Figure 1 and Figure 2As shown, a slot is provided at the bottom of the housing 6 , and the slot is aligned with an edge of one side of the memory module circuit board 1 .
[0032] It should be noted that, in this embodiment, the memory module circuit board 1 also needs to be connected to the computer motherboard 28 to ensure that the memory module can correctly perform data transmission and functional testing; the design of the slot and the edge of one side of the memory module circuit board 1 being on the same straight line is to facilitate the insertion of the extension board 27 connected between the computer motherboard 28 and the memory module circuit board 1 to test the data transmission and function of the memory module circuit board 1.
[0033] Reference Figure 3 As shown, a reserved serial interface 29 is provided on both the second circuit board 2 and the third circuit board 3. The reserved serial interface 29 is located on the side of the second circuit board 2 away from the top of the memory module circuit board 1 and on the side of the third circuit board 3 away from the bottom of the memory module circuit board 1.
[0034] It should be noted that, in this embodiment, a reserved serial interface 29 is provided on the second circuit board 2 and the third circuit board 3 for performing a series connection between the circuit boards, for expanding functions, increasing connection flexibility or realizing specific electrical connection requirements.
[0035] The above is a specific description of the preferred implementation of the present invention, but the invention of the present invention is not limited to the embodiments. Those skilled in the art can make various equivalent modifications or substitutions without violating the spirit of the present invention. These equivalent modifications or substitutions are all included in the scope defined by the claims of this application.
Claims
1. A memory chip testing device based on a memory module, characterized in that: The memory chip testing device based on the memory module includes a memory module circuit board, a second circuit board, a third circuit board, a top test pin, and a bottom test pin; one side of the second circuit board is welded to the top of the memory module circuit board, and the other side is in contact with the bottom of the top test pin; one side of the second circuit board is welded to the bottom of the memory module, and the other side is in contact with the top of the bottom test pin; the top of the top test pin is used to connect to the top surface memory chip; the bottom of the bottom test pin is used to connect to the bottom surface memory chip.
2. The memory chip testing device based on the memory module according to claim 1, characterized in that: The memory chip testing device based on the memory module also includes a shell and a memory module circuit board fixing part; fixing piles are arranged inside the shell, and the fixing piles are distributed at the top and bottom positions on both sides of the shell; the memory module circuit board fixing part is fixedly installed between the fixing piles.
3. The memory chip testing device based on the memory module according to claim 2, characterized in that: The memory chip testing device based on the memory module also includes a first top test needle fixing plate, a second top test needle fixing plate, a first bottom test needle fixing plate, a second bottom test needle fixing plate, a limit screw, a first spring and a fixing bolt; the first top test needle fixing plate and the second top test needle fixing plate and the first bottom test needle fixing plate are fixedly connected by the first spring, and the first top test needle fixing plate is sleeved on the top of the top test needle, and the second top test needle fixing plate is sleeved on the bottom of the top test needle; the first bottom test needle fixing plate is sleeved on the top of the bottom test needle, and the second bottom test needle fixing plate is sleeved on the bottom of the bottom test needle; the limit screw is clamped in the first spring; the fixing bolt passes through the second top test needle fixing plate, the second circuit board, the memory module circuit board fixing part, the third circuit board and the first bottom test needle fixing plate at the same time.
4. The memory chip testing device based on the memory module according to claim 3, characterized in that: The memory chip testing device based on the memory module also includes a top tray clamp, a bottom tray clamp, a top tray, a bottom tray and a second spring; the top tray clamp and the top of the memory module circuit board fixing part, as well as the bottom tray clamp and the bottom of the memory module circuit board fixing part are connected by the second spring, and the top tray clamp and the second spring connected to the top tray are both passed through the fixed pile at the top position of the shell, and the bottom tray clamp and the second spring connected to the bottom tray are both passed through the fixed pile at the bottom position of the shell; the top tray is slidably connected to the top tray clamp, and the top tray is used to install the top surface memory chip; the bottom tray is slidably connected to the bottom tray clamp, and the bottom tray is used to install the bottom memory chip.
5. The memory chip testing device based on the memory module according to claim 4, characterized in that: The memory chip testing device based on the memory module also includes a pressing handle, a top pressing plate, a bottom pressing plate and a third spring; the top pressing plate and the top tray clamp, as well as the bottom pressing plate and the bottom tray clamp, are connected via the third spring, and the top pressing plate and the third spring connected to the top pressing plate are both passed through the fixed pile at the top position of the shell, and the bottom pressing plate and the third spring connected to the bottom pressing plate are both passed through the fixed pile at the bottom position of the shell; the pressing handle is rotatably installed on one side of the outside of the shell, and is transmission-connected to the top pressing plate and the bottom pressing plate.
6. The memory chip testing device based on a memory module according to claim 2, characterized in that: A slot is provided at the bottom of the shell, and the slot is in the same straight line as an edge of one side of the memory module circuit board.
7. The memory chip testing device based on a memory module according to claim 1, characterized in that: The second circuit board and the third circuit board are both provided with a reserved serial interface, which is located on the side of the second circuit board away from the top of the memory module circuit board and on the side of the third circuit board away from the bottom of the memory module circuit board.