Chip mounting device

Abstract

The utility model relates to a chip mounting device. An angle control assembly is arranged on one side, close to a base, of a mounting table; the angle control assembly comprises a first driving motor, a first transmission mechanism and a second transmission mechanism; an output shaft of the first driving motor is connected with the first transmission mechanism; the first transmission mechanism is connected with the second transmission mechanism; the first transmission mechanism is fixedly connected with the base through a connecting shaft; the second transmission mechanism is fixedly connected with the mounting table; the first driving motor is used for driving the first transmission mechanism to rotate, the first transmission mechanism drives the second transmission mechanism to rotate, the second transmission mechanism drives the mounting table to rotate, and the angle of the chip on the mounting table is adjusted. According to the invention, the angle control assembly is arranged on one side of the mounting table, and the angle adjustment precision is improved through the transmission mechanism in the angle control assembly, so that the mounting requirements of different types of chips are met.

Description

Technical Field

[0001] The present disclosure relates to the field of semiconductor packaging technology, and in particular to a chip mounting device. Background Art

[0002] With the rapid development of integrated circuit packaging technology, the requirements for packaging equipment are becoming increasingly higher. During the chip packaging process, a placement step is required, which involves transferring the chip to the corresponding placement station to complete the chip placement.

[0003] Typically, this operation is performed using a placement machine. The placement head of the placement machine picks up the chip and can adjust the angle and rotate to allow the chip to be placed at various angles. However, in existing placement machines, the angle adjustment mechanism is located inside the placement head, which is small and heavy, resulting in poor placement accuracy. When processing smaller chips, angle control can be used to meet production requirements and complete chip placement. However, placing long chips or entire rows of chips requires high-precision placement angle accuracy, which existing placement machines cannot meet. Utility Model Content

[0004] In order to solve the above technical problems, the present disclosure provides a chip mounting device.

[0005] The present disclosure provides a chip mounting device, comprising: a base, a mounting platform, and an angle control component;

[0006] The mounting platform is provided on one side of the base; the mounting platform is used to place the chip;

[0007] The angle control assembly is arranged on a side of the mounting platform close to the base; the angle control assembly includes a first drive motor and a first transmission mechanism and a second transmission mechanism;

[0008] The output shaft of the first drive motor is connected to the first transmission mechanism; the first transmission mechanism is connected to the second transmission mechanism; the first transmission mechanism is fixedly connected to the base through a connecting shaft; the second transmission mechanism is fixedly connected to the mounting platform; the first drive motor is used to drive the first transmission mechanism to rotate, the first transmission mechanism drives the second transmission mechanism to rotate, and the second transmission mechanism drives the mounting platform to rotate, thereby adjusting the angle of the chip on the mounting platform.

[0009] In some embodiments, the first transmission mechanism includes a first gear and at least one second gear; the second transmission mechanism includes a third gear;

[0010] The first gear is connected to the output shaft of the first drive motor; the second gear is arranged around the first gear, and the first gear is meshed with the second gear; the second gear is fixedly connected to the base via a connecting shaft; the first gear and the second gear are located inside the third gear, and the third gear is meshed with the second gear; the third gear is fixedly connected to the mounting platform;

[0011] Among them, the first gear has the least number of meshing teeth, and the third gear has the largest number of meshing teeth.

[0012] In some embodiments, the first gear is a worm gear mechanism;

[0013] The worm of the worm gear mechanism is connected to the output shaft of the first drive motor, and the worm wheel of the worm gear mechanism is meshed with the second gear.

[0014] In some embodiments, further comprising a bracket;

[0015] The bracket is located between the first transmission mechanism and the first drive motor; the bracket is provided with a first opening and at least one second opening, the output shaft of the first drive motor is connected to the first gear through the first opening; the connecting shafts of each second gear are fixed to the base through the second opening;

[0016] The number of the second openings is the same as the number of the second gears.

[0017] In some embodiments, the second transmission mechanism is fixedly connected to the edge of the mounting platform by bolts.

[0018] In some embodiments, further comprising a second drive motor, a placement head mechanism, and a suction nozzle;

[0019] The second drive motor is electrically connected to the placement head mechanism; the placement head mechanism is connected to the suction nozzle through the placement head mechanism; the second drive motor is used to control the placement head to move along the first direction; the placement head mechanism controls the placement force through air pressure; the suction nozzle is used to suck the chip;

[0020] Wherein, the first direction is perpendicular to the plane where the mounting platform is located.

[0021] In some embodiments, the placement head mechanism includes: a pressure control mechanism and a connecting rod;

[0022] The pressure control mechanism includes a pressure chamber; the first end of the connecting rod is connected to the pressure chamber, and the second end of the connecting rod is connected to the suction nozzle;

[0023] The pressure control mechanism is used to control the pressure value in the pressure chamber and the pressure value applied to the connecting rod.

[0024] In some embodiments, the connecting rod includes a first supporting portion and a first connecting body; a third opening is provided at the bottom of the pressure chamber;

[0025] The first supporting portion is located inside the pressure chamber; the first connecting body is connected to the first supporting portion via the third opening, and an area of ​​the first supporting portion is larger than an area of ​​the third opening.

[0026] In some embodiments, a first slider is fixedly provided on the outer peripheral wall of the first connecting body; the connecting rod is connected to the first guide rail via the first slider;

[0027] Wherein, the first guide rail is arranged in the mounting head structure; the extension direction of the first guide rail is the same as the extension direction of the connecting rod.

[0028] In some embodiments, a vacuum suction cup is further included; the vacuum suction cup is detachably connected to the mounting platform; and the vacuum suction cup is provided with at least one vacuum adsorption hole for adsorbing the chip.

[0029] The technical solution provided by the present disclosure has the following advantages compared with the existing technology:

[0030] In the chip placement device provided herein, an angle control assembly is positioned on the side of the mounting platform near the base, driving the platform's rotation. The angle control assembly includes a first transmission mechanism and a second transmission mechanism, which work together to precisely adjust the chip's angle. In this embodiment, the angle control assembly is positioned on one side of the mounting platform, and the transmission mechanism within the angle control assembly improves the accuracy of angle adjustment to accommodate the placement requirements of different chip types. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0032] In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0033] Figure 1 A schematic structural diagram of a chip mounting device provided in an embodiment of the present disclosure;

[0034] Figure 2A schematic top view of a partial structure of a chip mounting device provided by an embodiment of the present disclosure;

[0035] Figure 3 A schematic structural diagram of another chip mounting device provided in an embodiment of the present disclosure;

[0036] Figure 4 A schematic structural diagram of another chip mounting device provided in an embodiment of the present disclosure;

[0037] Figure 5 A schematic structural diagram of a placement head mechanism provided in an embodiment of the present disclosure;

[0038] Figure 6 A structural schematic diagram of another mounting head mechanism provided in an embodiment of the present disclosure;

[0039] Figure 7 A schematic structural diagram of another chip mounting device provided in an embodiment of the present disclosure. DETAILED DESCRIPTION

[0040] In order to more clearly understand the above-mentioned objectives, features and advantages of the present disclosure, the scheme of the present disclosure will be further described below. It should be noted that the embodiments of the present disclosure and the features therein can be combined with each other in the absence of conflict.

[0041] In the following description, many specific details are set forth to facilitate a full understanding of the present disclosure, but the present disclosure may also be implemented in other ways different from those described herein; it is obvious that the embodiments in the specification are only part of the embodiments of the present disclosure, rather than all of the embodiments.

[0042] In the prior art, the angle control component of a chip placement device is located within the placement structure, for example, within the placement head. The chip is attached to the placement head's nozzle, and the angle control component controls the rotation of the nozzle to adjust the chip's angle for placement. When placing small chips, placement requirements can be met even with poor angle accuracy. However, when placing long chips, higher angle accuracy is required, and deviations can have a significant impact. Therefore, existing chip placement devices cannot meet the placement requirements of such chips. Due to the small size of the placement structure of the chip placement device and the limited space required to accommodate at least two drive motors, additional components cannot be added to achieve high-precision angle control. Therefore, the angle adjustment accuracy of the prior art chip placement device is poor. Furthermore, adding components to this placement structure to improve the accuracy of angle adjustment would increase the size and weight of the placement structure, thereby affecting the accuracy of its horizontal movement and reducing the operating speed of the device. Therefore, how to achieve high-precision placement angle control without affecting the operation of the placement structure is a pressing issue.

[0043] The present disclosure provides a chip mounting device. Figure 1 A schematic diagram of the structure of a chip mounting device provided by an embodiment of the present disclosure is shown in FIG. Figure 1 The chip mounting device 1 includes: a base 2, a mounting platform 3 and an angle control component 4.

[0044] A mounting platform 3 is provided on one side of the base 2; the mounting platform 3 is used to place the chip 5. An angle control assembly 4 is provided on the side of the mounting platform 3 near the base 2. The angle control assembly 4 includes a first drive motor 41, a first transmission mechanism 42, and a second transmission mechanism 43. The output shaft of the first drive motor 41 is connected to the first transmission mechanism 42, which is connected to the second transmission mechanism 43. The first transmission mechanism 42 is fixedly connected to the base 2 via a connecting shaft; the second transmission mechanism 43 is fixedly connected to the mounting platform 3. The first drive motor 41 is used to drive the first transmission mechanism 42 to rotate, which in turn drives the second transmission mechanism 43 to rotate, which in turn drives the mounting platform 3 to rotate, thereby adjusting the angle of the chip 5 on the mounting platform 3.

[0045] For example, a mounting platform 3 is provided on one side of the base 2, and the mounting platform 3 can rotate in place. The mounting platform 3 is used to place the chip. An angle control component 4 is provided on the side of the mounting platform 3 close to the base 2. The angle control component 4 includes a first drive motor 41, a first transmission mechanism 42 and a second transmission mechanism 43. Among them, the output shaft of the first drive motor 41 is connected to the first transmission mechanism 42, and the first transmission mechanism 42 is connected to the second transmission mechanism 43. Thus, after the first drive motor 41 is started, the power generated by the first drive motor 41 is transmitted to the first transmission mechanism 42 through the drive shaft. The first transmission mechanism 42 is fixedly connected to the base 2 through the connecting shaft, so the first transmission mechanism 42 rotates in place and drives the second transmission mechanism 43 connected thereto to rotate. Furthermore, the second transmission mechanism 43 is fixedly connected to the mounting platform 3, and the second transmission mechanism 43 rotates and drives the mounting platform 3 to rotate, thereby achieving the purpose of adjusting the angle of the chip 5 on the mounting platform 3 to meet the angle requirements when the chip is mounted.

[0046] Compared with the prior art, the embodiment of the present disclosure sets the angle control component 4 on one side of the mounting table 3 to reduce the weight of the mounting head mechanism. During the chip mounting process, the chip mounting device 1 will pick up the chip 5 and transfer it to the mounting table 3. When the chip 5 is transferred to the mounting table 3, the relative angle between the chip 5 and the mounting table 3 needs to be adjusted to meet the mounting angle requirement. In the embodiment of the present disclosure, the angle of the mounting head mechanism remains unchanged when adsorbing the chip, and the relative angle is adjusted by adjusting the angle of the mounting table 3. The operation of adjusting the chip angle is achieved by the first drive motor 41 driving the first transmission mechanism 42 and the second transmission mechanism 43 to drive the mounting table 3 to rotate. It is not limited by weight or space, and the angle can be adjusted more finely, thereby improving the adjustment accuracy of the chip angle.

[0047] In this disclosed embodiment, an angle control assembly is positioned on the side of the mounting platform near the base, driving the platform's rotation. The angle control assembly includes a first transmission mechanism and a second transmission mechanism, which work together to precisely adjust the chip's angle. This disclosed embodiment positions the angle control assembly on one side of the mounting platform, utilizing transmission mechanisms within the assembly to enhance angle adjustment accuracy to accommodate the placement requirements of different chip types.

[0048] Optionally, the base 2 is further connected to a guide rail extending in the X direction via a slider (not shown in the figure), so that the base 2 can move in the X direction, thereby driving the mounting platform 2 and the angle control assembly 4 to move in the X direction, thereby adjusting the X-direction position of the chip 5 on the mounting platform 2. The X direction and the Y direction intersect and are both parallel to the plane of the mounting platform 3, and the Z direction is perpendicular to the plane of the mounting platform 3.

[0049] In some embodiments, Figure 2 This is a schematic top view of a partial structure of a chip mounting device provided by an embodiment of the present disclosure, with reference to Figure 2 Combined with Figure 1 The first transmission mechanism 42 includes a first gear 421 and at least one second gear 422 ; the second transmission mechanism 43 includes a third gear 431 .

[0050] The first gear 421 is connected to the output shaft of the first drive motor 41; the second gear 422 is disposed around the first gear 421, meshing with the first gear 421 and the second gear 422; the second gear 422 is fixedly connected to the base 2 via a connecting shaft; the first gear 421 and the second gear 422 are located inside the third gear 431, meshing with the second gear 422; the third gear 431 is fixedly connected to the mounting platform 3. The first gear 421 has the fewest meshing teeth, while the third gear 431 has the most meshing teeth.

[0051] For example, Figure 2The top view of the first transmission mechanism 42 and the second transmission mechanism 43 is shown. The first transmission mechanism 42 includes a first gear 421 and three second gears 422.

[0052] The second gear 422 is arranged around the first gear 421, and the first gear 421 meshes with the second gear 422. The number of meshing teeth of the second gear 422 is greater than the number of meshing teeth of the first gear 421 to achieve the purpose of increasing the accuracy of angle adjustment. Providing three second gears 422 can improve the stability of the first transmission mechanism 42 and avoid the problem of too few second gears 422 causing positional offset or excessive loss during long-term use. The third gear 431 is located at the outermost periphery and has the largest number of meshing teeth. The first gear 421 and the second gear 422 are located inside the third gear 431, and the third gear 431 meshes with the second gear 422. The third gear 431 is fixedly connected to the mounting table 3, driving the chip 5 to rotate, further increasing the accuracy of angle adjustment. The more meshing teeth there are, the finer the angle of rotation of each gear, the smaller the angle that can be rotated each time, and thus the smaller the angle of rotation of the mounting table 3 and the chip 5. Therefore, by setting the first gear 421 , the second gear 422 and the third gear 431 , the angle between the mounting platform 3 and the chip 5 can be adjusted more precisely, the accuracy of the angle adjustment is increased, and it is suitable for mounting different types of chips 5 .

[0053] It should be noted that the drawings in the embodiments of this disclosure are for reference only and do not illustrate the actual shape of the meshing teeth, which can be configured according to actual needs. Furthermore, the embodiments of this disclosure do not limit the number of meshing teeth on each gear, as long as it meets the above requirements.

[0054] In some embodiments, Figure 3 A schematic diagram of the structure of another chip mounting device provided in the embodiment of the present disclosure is shown in FIG. Figure 3 , the first gear 421 is a worm gear mechanism.

[0055] The worm of the worm gear mechanism is connected to the output shaft of the first drive motor 41 , and the worm wheel of the worm gear mechanism is meshed with the second gear 422 .

[0056] Exemplarily, the first gear 421 is a worm gear mechanism, and the worm of the worm gear mechanism is connected to the output shaft of the first drive motor 41. After the first drive motor 41 is running, the worm wheel of the worm gear mechanism rotates, and the worm wheel of the worm gear mechanism engages with the second gear 422, driving the second gear 422 to rotate. The second gear 422 then drives the second transmission mechanism 43 to rotate, and drives the mounting platform 3 to rotate, thereby achieving the purpose of adjusting the angle. The worm gear mechanism has a compact structure, low noise, and smooth transmission, which is conducive to transmitting the power of the first drive motor 41 outward. In addition, by providing a worm gear mechanism, the position and orientation of the first drive motor 41 can be adjusted, and the existing space can be fully utilized for installation.

[0057] It should be noted that the embodiment of the present disclosure is only a feasible implementation method, and the specific structure can be set according to actual needs.

[0058] In some embodiments, continue to refer to Figure 1 The chip mounting device 1 further includes a bracket 61 .

[0059] The bracket 61 is located between the first transmission mechanism 42 and the first drive motor 41; a first opening and at least one second opening are provided on the bracket 61, and the output shaft of the first drive motor 41 is connected to the first gear 421 through the first opening; the connecting shaft of each second gear 422 is fixed to the base 2 through the second opening; wherein, the number of the second openings is the same as the number of the second gears 422.

[0060] Exemplarily, the chip mounting device 1 is further provided with a bracket 61, which plays a supporting and fixing role. A first opening is provided on the bracket, and the output shaft of the first drive motor 41 is connected to the first gear 421 through the first opening, and the output shaft of the first drive motor 41 is embedded in the first opening. The bracket is also provided with at least one second opening, and the number of the second openings is the same as the number of the second gears 422. The connecting shaft of each second gear 422 is fixed to the base 2 through the corresponding second opening to ensure that the position of the second gear 422 does not change and can be rotated in place. The position of the first opening and each second opening on the bracket 61 is fixed, so the first drive motor 41 can also maintain a fixed position and will not move. This improves the stability of the angle control component 4 and avoids the offset of some structures, which affects the accuracy of adjusting the chip angle.

[0061] It should be noted that the embodiment of the present disclosure does not limit the specific structural shape of the bracket, and other feasible structures can also be used to fix and support the first drive motor and the first transmission mechanism. The above is only an example.

[0062] In some embodiments, continue to refer to Figure 1 The second transmission mechanism 43 is fixedly connected to the edge of the mounting platform 3 by bolts 62.

[0063] The second transmission mechanism 43 is used to rotate the mounting platform 3, thereby adjusting the chip angle. Therefore, the second transmission mechanism 43 is fixedly connected to the mounting platform 3, for example, by bolts 62. Other connection methods, such as welding, may also be used, and are not limited in this embodiment.

[0064] In some embodiments, Figure 4 A schematic diagram of the structure of another chip mounting device provided in the embodiment of the present disclosure, referring to Figure 4 The chip mounting device 1 further includes a second driving motor 71 , a mounting head mechanism 72 and a suction nozzle 73 .

[0065] The second drive motor 71 is electrically connected to the placement head mechanism 72; the placement head mechanism 72 is connected to the suction nozzle 73; the second drive motor 71 is used to control the placement head mechanism 72 to move along the first direction; the placement head mechanism 72 controls the placement force through air pressure; the suction nozzle 73 is used to suck the chip;

[0066] The first direction is perpendicular to the plane where the mounting platform 3 is located.

[0067] Exemplarily, the chip placement device 1 includes a second drive motor 71, which is connected to one end of a placement head mechanism 72 via a connecting rod. The other end of the placement head mechanism 72 is connected to a suction nozzle 73, which is used to absorb and place the desired chip 5. The second drive motor 71 can control the placement head mechanism 72 to move in a first direction, which is perpendicular to the plane of the mounting table 3, for example, the Z direction. The movement of the placement head mechanism 72 can drive the suction nozzle 73 to move in the first direction, thereby adjusting the position of the suction nozzle 73 in the first direction, thereby adjusting the position of the chip 5, and facilitating the alignment of the chip 5.

[0068] Optionally, the chip placement device 1 further includes a third drive motor (not shown), which is used to control the movement of the placement head mechanism 72 in the Y direction. For example, the placement head mechanism 72 is connected to a guide rail extending in the Y direction via a slider and other mechanical components. By controlling the placement head mechanism 72 to move in the Y direction, the position of the chip 5 during placement is adjusted. The Y direction is parallel to the plane of the mounting table 3. In addition, the X direction is also parallel to the plane of the mounting table 3, and the X direction and the Y direction intersect.

[0069] As can be seen, the disclosed embodiment can adjust the position of the chip in the X direction by controlling the position of the mounting table, and the angle control component can control the rotation of the chip to adjust its angle. By controlling the position of the placement head structure, the position of the chip in the Y and Z directions can be controlled, thereby achieving adjustment of the chip in different directions and angles. Compared with the prior art, the disclosed embodiment separates the control devices for adjusting the different directions and angles of the chip. For example, the device for adjusting the X direction and angle is set on one side of the mounting table, while the device for adjusting the Y and Z directions is located on the side of the placement head. This greatly reduces the volume and weight of the control device on the placement head side, so that the accuracy of the adjustment process is not affected by the volume and weight of the device, thereby improving the accuracy of the adjustment.

[0070] It should be noted that the chip mounting structure also includes a variety of structures to absorb the chip and control the position of the chip. This disclosure only illustrates some structures, and the specific structures are not described in detail here. They can be set according to actual needs.

[0071] In some embodiments, Figure 5 A schematic diagram of the structure of a placement head mechanism provided in an embodiment of the present disclosure, with reference to Figure 5 The placement head mechanism 72 includes: a pressure control mechanism and a connecting rod 721.

[0072] The pressure control mechanism includes a pressure chamber 722 ; a first end of a connecting rod 721 is connected to the pressure chamber 722 , and a second end of the connecting rod 721 is connected to the suction nozzle 73 . The pressure control mechanism is used to control the pressure value in the pressure chamber 722 and adjust the pressure value applied to the connecting rod 721 .

[0073] The pressure control mechanism includes a pressure chamber 722, which is provided with a pressure inlet and outlet ( Figure 5 (not shown) The pressure in pressure chamber 722 can be controlled via the pressure inlet and outlet. Pressure chamber 722 is connected to suction nozzle 73 via connecting rod 721. When the pressure in pressure chamber 722 changes, the pressure applied to connecting rod 721 also changes. Thus, by adjusting the pressure in pressure chamber 722, varying degrees of force can be applied to connecting rod 721, which in turn acts on suction nozzle 73, adjusting the chip placement force to complete the desired placement operation and avoid chip damage.

[0074] Optional, continue to refer to Figure 5 A vacuum tube is also provided inside the connecting rod 721, and the vacuum tube is connected to the suction nozzle so that the suction nozzle can complete the adsorption and release of the chip.

[0075] In some embodiments, continue to refer to Figure 5 The connecting rod 721 includes a first supporting portion 741 and a first connecting body 742 ; a third opening is provided at the bottom of the pressure chamber 722 .

[0076] The first support portion 741 is located inside the pressure chamber 722 ; the first connecting body 742 is connected to the first support portion 741 via the third opening, and the area of ​​the first support portion 741 is larger than the area of ​​the third opening.

[0077] For example, the first support portion 741 is located within the pressure chamber 722, and the area of ​​the first support portion 741 is larger than the area of ​​the third opening. Therefore, changes in the pressure value within the pressure chamber 722 will directly act on the first support portion 741 within the pressure chamber 722, allowing the first connecting body 742 to move along its own extension direction. For example, if the pressure value within the pressure chamber increases, the force along the bottom of the pressure chamber applied to the first support portion 741 will also increase, thereby causing the first connecting body 742 connected to the first support portion 741 to move downward. Therefore, by controlling the pressure value within the pressure chamber 722, the movement direction of the connecting rod 721 can be controlled, thereby achieving the purpose of adjusting the chip placement force.

[0078] The third opening provided at the bottom of the pressure chamber 722 may be a circular opening or an opening of other shapes, and may also match the shape of the first connecting body 742 to reduce pressure leakage in the pressure chamber 722 .

[0079] Optionally, in order to improve the sealing of the pressure chamber 722, a sealing structure may be provided at the third opening, such as an oil seal to prevent air leakage, thereby avoiding pressure leakage and improving the accuracy of the control process.

[0080] In some embodiments, Figure 6 A schematic diagram of another mounting head mechanism provided in the embodiment of the present disclosure is provided. Figure 6 A first slider 751 is fixedly provided on the outer peripheral wall of the first connecting body 742 ; the connecting rod is connected to the first guide rail 752 through the first slider 751 .

[0081] The first guide rail 752 is provided in the mounting head mechanism; the extension direction of the first guide rail 752 is the same as the extension direction of the connecting rod.

[0082] Exemplarily, a first slider 751 is fixedly provided on the outer peripheral wall of the first connecting body 742 and is connected to the first guide rail 752, which is equivalent to fixing the moving direction of the first connecting body 742. That is, the connecting rod can only move along the extension direction of the first guide rail 752 and cannot rotate in other directions. Among them, the extension direction of the first guide rail 752 is the same as the extension direction of the connecting rod (the same as the extension direction of the first connecting body), so it can avoid the connecting rod rotating in other directions when mounting the chip, which affects the accuracy of the mounting. The first guide rail 752 is set in the mounting head mechanism, and the specific position can be set according to actual needs.

[0083] In some embodiments, Figure 7 A schematic diagram of the structure of another chip mounting device provided in the embodiment of the present disclosure, referring to Figure 7 , further comprising a vacuum suction cup 31 ; the vacuum suction cup 31 is detachably connected to the mounting table 3 ; the vacuum suction cup 31 is provided with at least one vacuum adsorption hole 32 for adsorbing the chip 5 .

[0084] Exemplarily, the chip mounting device 1 also includes a vacuum suction cup 31, and a vacuum adsorption hole 32 for adsorbing the chip 5 is provided on the vacuum suction cup 31. The size of the chip 5 is different, and the matching vacuum suction cup 31 is also different. Therefore, the vacuum suction cup 31 is detachably connected to the mounting table 3, and the appropriate vacuum suction cup 31 is replaced according to the size of the chip 5, which can not only meet the mounting requirements of chips of different sizes, but also save costs and time. In addition, the vacuum suction cup 31 needs to be in frequent contact with the mounted chip 5 and is prone to wear, so the life of the vacuum suction cup 31 is relatively short. When the vacuum suction cup 31 is severely worn and needs to be replaced, it can also be directly disassembled and replaced with a new vacuum suction cup 31. The detachable connection will not affect other parts of the device, thereby increasing the service life of the entire device and reducing costs.

[0085] It should be noted that the chip mounting device also includes a vacuum system connected to the vacuum adsorption hole for controlling the air content in the hole. This structure is not shown in the embodiment of the present disclosure and is only used for illustrative purposes.

[0086] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or device comprising the element.

[0087] The foregoing description is intended only to provide specific embodiments of the present disclosure, intended to enable those skilled in the art to understand and implement the present disclosure. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present disclosure. Therefore, the present disclosure is not intended to be limited to the embodiments described herein, but rather to be construed in the broadest manner consistent with the principles and novel features disclosed herein.

Claims

1. A chip mounting device, characterized in that: include: Base, mounting platform and angle control assembly; The mounting platform is provided on one side of the base; the mounting platform is used to place the chip; The angle control assembly is arranged on a side of the mounting platform close to the base; the angle control assembly includes a first drive motor and a first transmission mechanism and a second transmission mechanism; The output shaft of the first drive motor is connected to the first transmission mechanism; the first transmission mechanism is connected to the second transmission mechanism; the first transmission mechanism is fixedly connected to the base through a connecting shaft; the second transmission mechanism is fixedly connected to the mounting platform; the first drive motor is used to drive the first transmission mechanism to rotate, the first transmission mechanism drives the second transmission mechanism to rotate, and the second transmission mechanism drives the mounting platform to rotate, thereby adjusting the angle of the chip on the mounting platform.

2. The chip mounting device according to claim 1, wherein: The first transmission mechanism includes a first gear and at least one second gear; the second transmission mechanism includes a third gear; The first gear is connected to the output shaft of the first drive motor; the second gear is arranged around the first gear, and the first gear is meshed with the second gear; The second gear is fixedly connected to the base via a connecting shaft; the first gear and the second gear are located inside the third gear, and the third gear is meshed with the second gear; the third gear is fixedly connected to the mounting platform; Among them, the first gear has the least number of meshing teeth, and the third gear has the largest number of meshing teeth.

3. The chip mounting device according to claim 2, wherein: The first gear is a worm gear mechanism; The worm of the worm gear mechanism is connected to the output shaft of the first drive motor, and the worm wheel of the worm gear mechanism is meshed with the second gear.

4. The chip mounting device according to claim 2, wherein: Also includes a stand; The bracket is located between the first transmission mechanism and the first drive motor; a first opening and at least one second opening are provided on the bracket, and the output shaft of the first drive motor is connected to the first gear through the first opening; The connecting shaft of each second gear is fixed to the base through the second opening; The number of the second openings is the same as the number of the second gears.

5. The chip mounting device according to claim 1, wherein: The second transmission mechanism is fixedly connected to the edge of the mounting platform by bolts.

6. The chip mounting device according to claim 1, wherein: Also includes a second drive motor, a placement head mechanism and a suction nozzle; The second drive motor is electrically connected to the placement head mechanism; the placement head mechanism is connected to the suction nozzle; the second drive motor is used to control the placement head to move along the first direction; the placement head mechanism controls the placement force through air pressure; the suction nozzle is used to suck the chip; Wherein, the first direction is perpendicular to the plane where the mounting platform is located.

7. The chip mounting device according to claim 6, wherein: The placement head mechanism includes: a pressure control mechanism and a connecting rod; The pressure control mechanism includes a pressure chamber; the first end of the connecting rod is connected to the pressure chamber, and the second end of the connecting rod is connected to the suction nozzle; The pressure control mechanism is used to control the pressure value in the pressure chamber and the pressure value applied to the connecting rod.

8. The chip mounting device according to claim 7, wherein: The connecting rod includes a first supporting portion and a first connecting body; a third opening is provided at the bottom of the pressure chamber; The first supporting portion is located inside the pressure chamber; the first connecting body is connected to the first supporting portion via the third opening, and an area of ​​the first supporting portion is larger than an area of ​​the third opening.

9. The chip mounting device according to claim 8, wherein: A first slider is fixedly provided on the outer peripheral wall of the first connecting body; the connecting rod is connected to the first guide rail via the first slider; Wherein, the first guide rail is arranged in the mounting head structure; the extension direction of the first guide rail is the same as the extension direction of the connecting rod.

10. The chip mounting device according to claim 1, wherein: It also includes a vacuum suction cup; the vacuum suction cup is detachably connected to the mounting platform; and the vacuum suction cup is provided with at least one vacuum adsorption hole for adsorbing the chip.

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