Substrate separating device and substrate processing production line

Abstract

The utility model discloses a substrate separating device and a substrate processing production line, the substrate separating device comprises a bearing assembly, a lifting mechanism, a positioning mechanism, a grabbing mechanism, a horizontal moving mechanism, a vertical moving mechanism and a blocking mechanism, the lifting mechanism is connected with the bearing assembly, and is used for enabling the bearing assembly to move in the vertical direction; the grabbing mechanism is connected with the horizontal moving mechanism and the vertical moving mechanism so that the grabbing mechanism can move in the horizontal direction and the vertical direction. The bearing assembly is used for bearing the base plate, the lifting mechanism and the positioning mechanism are used for enabling the base plate to ascend to a specific height, the grabbing mechanism, the horizontal moving mechanism and the vertical moving mechanism are used for grabbing the base plate and enabling the base plate to move, and the blocking mechanism is used for blocking part of the base plate. And separating the unblocked part of the substrate from the blocked part of the substrate.

Description

Technical Field

[0001] The present application relates to the field of semiconductor material processing, and in particular to a substrate separation device. Background Art

[0002] Ceramic substrates, as an important material, are widely used in electronics, optoelectronics, energy, and other fields. Their excellent electrical and stable mechanical properties make them an ideal choice for various electronic and optoelectronic devices. However, during the cleaning, processing, and packaging of plate-shaped materials like ceramic substrates, due to their thinness and high flatness, the gaps between sheets during transportation are very small, resulting in negative pressure that makes separation difficult. This poses significant challenges to automating these cleaning, processing, and packaging operations. Summary of the Invention

[0003] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes a substrate separation device that can separate tightly stacked substrates, is easy to operate, and operates reliably.

[0004] According to an embodiment of the present application, a substrate separation device includes:

[0005] A carrying assembly, the carrying assembly being used to place a substrate;

[0006] A lifting mechanism connected to the carrying assembly and configured to drive the carrying assembly to move in a vertical direction;

[0007] A positioning mechanism, used to position the height of the carrying assembly in the vertical direction;

[0008] A gripping mechanism, the gripping mechanism being used to grip the substrate on the carrying assembly;

[0009] A horizontal moving mechanism, connected to the gripping mechanism, for controlling the horizontal movement of the gripping mechanism;

[0010] A vertical moving mechanism, connected to the gripping mechanism, for controlling the vertical movement of the gripping mechanism;

[0011] A blocking mechanism is provided on one side of the carrying assembly and is used to block the movement of the substrate in the horizontal direction.

[0012] The substrate separation device according to the embodiment of the present application has at least the following beneficial effects:

[0013] The embodiment of the present application provides a carrying assembly, so that the substrate can be placed thereon for subsequent separation work; by providing a lifting mechanism connected to the carrying assembly, the substrate on the carrying assembly can be moved in the vertical direction to facilitate adjustment of the position of the substrate, thereby enabling the separation work to be carried out more smoothly; by providing a positioning mechanism at a fixed height, the substrate can be accurately moved to a predetermined position under the action of the lifting mechanism, thereby ensuring the accuracy of the separation work; by providing a gripping mechanism, the substrate can be gripped, and by providing a horizontal moving mechanism and a vertical moving mechanism, the gripping mechanism can achieve movement in the horizontal and vertical directions; by providing a blocking mechanism, the separation of the substrate is achieved through the cooperation between the blocking mechanism, the gripping mechanism and the horizontal moving mechanism.

[0014] The embodiment of the present application can move the substrate on the supporting assembly to a specific height through the cooperation of the lifting mechanism and the positioning mechanism, so that among the stacked substrates, except for the substrate located on the top layer, the remaining substrates are at the same height as the blocking mechanism. At this time, the grasping mechanism can grasp the top layer of the substrate and move it horizontally toward the direction of the blocking mechanism under the action of the horizontal moving mechanism. Due to the obstruction of the blocking mechanism, the substrates at the same height as the blocking mechanism will not move together with the upper substrate, thereby being able to be separated from the upper substrate.

[0015] According to some embodiments of the present application, the gripping mechanism includes an adsorption device, which is connected to an air source, and the air source is used to generate negative pressure in the adsorption device.

[0016] According to some embodiments of the present application, the adsorption device includes an adsorption rod, and a spring is sleeved on the adsorption rod.

[0017] According to some embodiments of the present application, the gripping mechanism includes a gripping plate, a first adjustment groove is provided on the gripping plate, a connecting strip is provided on the gripping plate, the adsorption device is provided on the connecting strip, a second adjustment groove is provided on the connecting strip, the second adjustment groove at least partially overlaps with the first adjustment groove, an adjustment knob is provided on the connecting strip, the adjustment knob passes through the second adjustment groove and the first adjustment groove to fix the connecting strip on the gripping plate.

[0018] According to some embodiments of the present application, the positioning mechanism includes a sensor and a rangefinder.

[0019] According to some embodiments of the present application, an alignment mechanism is provided on one side of the carrying assembly, the alignment mechanism comprising a first alignment plate provided on one side of the carrying assembly, a third alignment plate is provided on the other side of the carrying assembly opposite to the first alignment plate, and the third alignment plate is connected to a third driving unit;

[0020] A second alignment plate is provided on one side of the bearing assembly adjacent to the first alignment plate. The blocking mechanism is provided on one side of the bearing assembly, opposite to the second alignment plate, and connected to a fourth driving unit.

[0021] According to some embodiments of the present application, the horizontal movement mechanism includes a horizontally arranged first slide rail, a first slider is slidably connected to the first slide rail, the grasping mechanism is connected to the first slider, and the first slider is connected to a first driving unit.

[0022] According to some embodiments of the present application, the lifting mechanism includes a vertically arranged second slide rail, a second slider is slidably connected to the second slide rail, the bearing assembly is connected to the second slider, and the second slider is connected to a second driving unit.

[0023] According to some embodiments of the present application, the vertical moving mechanism includes a fifth drive unit, the fifth drive unit is connected to an output rod, and the output rod can move in the vertical direction under the drive of the fifth drive unit. The output rod is connected to the grasping mechanism, and the fifth drive unit is arranged on the horizontal moving mechanism and can move in the horizontal direction on the horizontal moving mechanism.

[0024] According to the second embodiment of the present application, a substrate processing production line includes the substrate separation device described in the above embodiment.

[0025] The substrate processing production line according to the embodiment of the present application has at least the following beneficial effects:

[0026] The embodiment of the present application adopts the substrate separation device of the embodiment of the first aspect. The substrate separation device can move the substrate on the supporting assembly to a specific height through the cooperation of the lifting mechanism and the positioning mechanism, so that among the stacked substrates, except for the substrate on the top layer, the remaining substrates are at the same height as the blocking mechanism. At this time, the grasping mechanism can grasp the top substrate and move it horizontally in the direction of the blocking mechanism under the action of the horizontal moving mechanism. Due to the obstruction of the blocking mechanism, the substrates at the same height as the blocking mechanism will not move together with the upper substrate, thereby being able to separate from the upper substrate. After the individual substrates are separated, they can be cleaned, processed, packaged, and other processes on the production line.

[0027] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become obvious from the description below, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The accompanying drawings are used to provide a further understanding of the technical solutions disclosed in this application and constitute a part of the specification. Together with the embodiments disclosed in this application, they are used to explain the technical solutions disclosed in this application and do not constitute a limitation on the technical solutions disclosed in this application.

[0029] Figure 1 This is a schematic diagram of the overall structure of the substrate separation device according to an embodiment of the present application;

[0030] Figure 2 This is a schematic structural diagram of a blocking mechanism and an alignment mechanism in a substrate separation device according to an embodiment of the present application;

[0031] Figure 3 This is a schematic structural diagram of a gripping mechanism in a substrate separation device according to an embodiment of the present application;

[0032] Figure 4 Schematic diagram of the relative positions of the substrate and the blocking plate in the substrate separation device according to an embodiment of the present application.

[0033] Reference numerals:

[0034] Carrying assembly 100;

[0035] Lifting mechanism 110, second slide rail 111, second slider 112, second driving unit 113;

[0036] Positioning mechanism 120, sensor 121, rangefinder 122;

[0037] Grabbing mechanism 130, adsorption device 131, adsorption rod 132, spring 133, grabbing plate 134, first adjustment slot 135, connecting strip 136, second adjustment slot 137, adjustment knob 138, suction cup 139;

[0038] Horizontal moving mechanism 140, first slide rail 141, first slider 142, first driving unit 143;

[0039] Vertical movement mechanism 150, fifth driving unit 151, output rod 152;

[0040] Blocking mechanism 160, blocking plate 161, fourth driving unit 162;

[0041] Alignment mechanism 170 , first alignment plate 171 , second alignment plate 172 , third alignment plate 173 , third driving unit 174 ;

[0042] Ceramic substrate 200 , upper ceramic substrate 201 , lower ceramic substrate 202 . DETAILED DESCRIPTION

[0043] The following describes in detail embodiments of the present application. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and are not to be construed as limiting the present application.

[0044] In the description of this application, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on this application.

[0045] In the description of this application, "several" means more than one, "plurality" means more than two, "greater than," "less than," and "exceed" are understood to exclude the number itself, while "above," "below," and "within" are understood to include the number itself. The use of "first" and "second" in the description is solely for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, implicitly specifying the number of the indicated technical features, or implicitly specifying the order of the indicated technical features.

[0046] In the description of this application, unless otherwise clearly defined, terms such as setting, installing, and connecting should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in this application based on the specific content of the technical solution.

[0047] In the description of this application, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of this application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in any appropriate manner in any one or more embodiments or examples.

[0048] Reference Figure 1As shown, the embodiments of the present application disclose a substrate separation device that can be used to separate ceramic substrates or other plate-shaped materials. In the following embodiments, a ceramic substrate is used as an example to illustrate the specific solution of the present application. In the description of the present application, a "substrate" can be a ceramic substrate or other plate-shaped materials. The substrate separation device of the embodiment of the present application includes a supporting assembly 100, a lifting mechanism 110, a positioning mechanism 120, a gripping mechanism 130, a horizontal moving mechanism 140, a vertical moving mechanism 150, and a blocking mechanism 160. The carrying assembly 100 is used to place the ceramic substrate 200. The lifting mechanism 110 is connected to the carrying assembly 100 and is used to drive the vertical movement of the carrying assembly 100; the positioning mechanism 120 is set at a fixed height and is used to locate the height of the lifting and lowering of the carrying assembly 100, so that the lifting mechanism 110 can control the rising or falling height. The height of the positioning mechanism 120 is fixed, which is convenient for sensing whether the carrying assembly 100 and the ceramic substrate 200 placed on the carrying assembly 100 have reached a predetermined height; the grasping mechanism 130 is used to grasp the ceramic substrate 200 placed on the carrying assembly 100; the horizontal moving mechanism 140 is connected to the grasping mechanism 130 and is used to drive the movement of the grasping mechanism 130 in the parallel direction; the vertical moving mechanism 150 is connected to the grasping mechanism 130 and is used to drive the movement of the grasping mechanism 130 in the horizontal direction; the blocking mechanism 160 is set on one side of the carrying assembly 100 and is used to block the horizontal movement of part of the substrate 200 placed on the carrying assembly 100, so that the unblocked part of the substrate is separated from the blocked part of the substrate.

[0049] Specifically, in the embodiment of the present application, when a substrate 200 is placed on the carrier assembly 100 and moves to a predetermined height, the blocking mechanism 160 is located on one side of the ceramic substrate 200. At this point, the top end of the blocking mechanism 160 is at a height difference of one ceramic substrate thickness from the stacked ceramic substrates 200. That is, the topmost ceramic substrate is located above the blocking mechanism 160, and the height of the other ceramic substrates does not exceed the top end of the blocking mechanism 160. At this point, the gripping mechanism 130 grabs the ceramic substrates 200 and moves toward the blocking mechanism 160. Due to the obstruction of the blocking mechanism 160, only the topmost ceramic substrate 200 can move, while the other ceramic substrates 200 remain stationary, thereby separating the topmost ceramic substrate 200. After the gripping mechanism 130 removes the topmost ceramic substrate, the carrier assembly 100 moves upward, causing the stacked ceramic substrates to be higher than the blocking mechanism 160 by the thickness of one individual ceramic substrate, and the above process is repeated.

[0050] Specifically, in the embodiment of the present application, the carrying component is a flat workpiece pallet.

[0051] In order to enable the supporting assembly 100 to move up and down to adjust the height, an embodiment of the present application is provided with a lifting mechanism 110 connected to the supporting assembly 100. In one embodiment of the present application, the lifting mechanism 110 includes a vertically arranged second slide rail 111, and a second slider 112 is slidably connected to the second slide rail 111. The supporting assembly 100 is connected to the second slider 112, and the second slider 112 is connected to a second driving unit 113. The second slider 112 can move up and down on the slide rail 111 under the drive of the second driving unit. Specifically, the second driving unit 113 can be a device such as a cylinder, a motor, a hydraulic cylinder, or a transmission system such as a motor gear rack system. There are many commonly used lifting mechanisms that can achieve lifting in the prior art, which will not be repeated here.

[0052] In order to enable the supporting assembly 100 to move to a predetermined position, a positioning mechanism 120 is provided at a fixed height in an embodiment of the present application. In one embodiment of the present application, the positioning mechanism 120 includes a sensor 121 and a rangefinder 122. Specifically, in this embodiment, the sensor 121 is provided on the second slide rail 111 on the lifting mechanism 110. When the second slider 112 moves to the position of the sensor 121, the sensor 121 is triggered, and the sensor 121 sends information to the control system of the device. At this time, the rangefinder 122 measures the distance between the top layer of the ceramic substrate 200 on the supporting mechanism 100 and the top end of the blocking mechanism 160. At the same time, the control system controls the lifting mechanism 110 to reduce the movement speed and move the corresponding height according to the measured data, so that the ceramic substrate 200 can accurately reach the predetermined position.

[0053] In related technologies, when controlling the height of a device's lift requires control, sensors are typically used to detect the position of the lift mechanism. When the lift mechanism reaches a specific height, the sensor is triggered, causing the device to stop. However, due to signal delays and other factors, the device often fails to stop in time, resulting in inaccurate height positioning. In this embodiment, the sensor 121 and rangefinder 122 work together to eliminate the need for the device to stop immediately upon receiving a signal. Instead, the device slows down and moves a specified distance, resulting in high positioning accuracy and precise stopping position.

[0054] In the related art, stacked ceramic substrates that need to be separated are often not neatly stacked together. To facilitate separation and prevent the ceramic substrates from tipping over, an embodiment of the present application is provided with an alignment mechanism 170 for aligning the stacked ceramic substrates 200. The alignment mechanism 170 includes a first alignment plate 171 and a second alignment plate 172, respectively disposed on two adjacent sides of the carrier assembly 100. A third alignment plate 173 is disposed on the other side of the carrier assembly 100 opposite the first alignment plate 171. The third alignment plate 173 is connected to a third drive unit 174. A blocking mechanism 160 is disposed on the other side of the carrier assembly 100 opposite the second alignment plate 172. The blocking mechanism 160 includes a blocking plate 161, which is connected to a fourth drive unit 162. It is worth noting that the first alignment plate 171, the second alignment plate 172, the third alignment plate 173, and the blocking plate 161 are all disposed perpendicular to the carrier assembly 100.

[0055] When aligning the ceramic substrates 200, the ceramic substrates 200 are first placed on the carrier assembly 100. The third alignment plate 173, driven by the third drive unit, then moves toward the first alignment plate 171, pushing the ceramic substrates 200 toward the first alignment plate 171. The blocking plate 161, driven by the fourth drive unit 162, moves toward the second alignment plate 172. The push of the third alignment plate 173 and blocking plate 161, as well as the blocking of the first and second alignment plates 171 and 172, allow the stacked ceramic substrates 200 to be neatly stacked. Once the ceramic substrates 200 are neatly stacked, the blocking mechanism 160 provides a better blocking effect on the ceramic substrates 200, facilitating the subsequent separation process. This also makes the ceramic stack more stable and less likely to tip over. Furthermore, during the separation process, both the alignment mechanism 170 and the blocking mechanism 160 can prevent the ceramic substrates from tipping over.

[0056] In an embodiment of the present application, the gripping mechanism 130 includes an adsorption device 131, which is connected to an air source. The air source is used to generate negative pressure in the adsorption device 131. The gripping mechanism 130 can use the negative pressure to adsorb the ceramic substrate 200 and move horizontally through the horizontal moving mechanism 140. Under the obstruction of the blocking mechanism 160, the separation of the top ceramic substrate 200 is achieved.

[0057] In the embodiment of the present application, the adsorption device 131 includes an adsorption rod 132 , which is sleeved with a spring 133 . The spring 133 can provide a buffering effect to prevent the grasping mechanism 130 from damaging the ceramic substrate 200 when moving downward. Specifically, the adsorption device includes a suction cup 139 .

[0058] In the related art, ceramic substrates have many specifications of different sizes. In the scenario where the ceramic substrates need to be grasped, different grasping mechanisms are required for ceramic substrates of different sizes, which is costly and troublesome to replace, resulting in low production efficiency.

[0059] In the embodiment of the present application, the gripping mechanism 130 includes a gripping plate 134, which is provided with a first adjustment slot 135, a connecting bar 136, and a suction device 131 disposed on the connecting bar 136. The connecting bar 136 is provided with a second adjustment slot 137, which at least partially overlaps with the first adjustment slot 135. The connecting bar 136 is provided with an adjustment knob 138, which passes through the second adjustment slot 137 and the first adjustment slot 135 to secure the connecting bar 136 to the gripping plate 134. Specifically, the adjustment knob 138 includes a knob head and a screw connected below the knob head. The screw passes through the first adjustment slot 135 and the second adjustment slot 137 and secures the connecting bar 136 through threaded engagement.

[0060] By providing a first adjustment slot 135 on the gripping plate 134 and a second adjustment slot 137 on the connecting bar 136, the first adjustment slot 135 and the second adjustment slot 136 partially overlap, and providing an adjustment knob on the connecting bar 136. The adjustment knob is inserted through the overlapping portion of the first and second adjustment slots and locked, thereby securing the connecting bar to the gripping plate 134, and thus securing the adsorption device 131 to the gripping plate 134. By adjusting the overlapping portion of the first and second adjustment slots 135 and 137, the position of the connecting bar 136 on the gripping plate 134 can be adjusted, and thus the position of the adsorption device 131 can be adjusted, thereby enabling the adsorption device 131 to adapt to ceramic substrates of different sizes.

[0061] For example, if there is one adsorption device 131, the position of the adsorption device 131 can be adjusted according to the size of the ceramic substrate so that the adsorption device 131 is located at the center of the ceramic substrate for easy adsorption and grasping. If two adsorption devices 131 are provided, the position of the adsorption device 131 can be adjusted according to the size of the ceramic substrate so that the two adsorption devices 131 are respectively located at both ends of the central axis of the ceramic substrate for easy adsorption and grasping. If three or more adsorption devices 131 are provided, the position of the adsorption device 131 can be adjusted according to the size of the ceramic substrate so that multiple adsorption devices 131 are evenly distributed on the outer edge of the ceramic substrate for easy adsorption and grasping. In the embodiment of the present application, four adsorption devices 131 are provided, which are respectively provided at the four corners of the ceramic substrate. The adsorption effect is stable and reliable and not easy to fall off. At the same time, the position of the adsorption device can be adjusted according to the size of the ceramic substrate to achieve a better adsorption effect.

[0062] In the embodiment of the present application, the horizontal movement mechanism 140 includes a vertically arranged first slide rail 141, to which a first slider 142 is slidably connected. The carrier assembly 100 is connected to the first slider 142, and the first slider 142 is connected to a first drive unit 143. The first slider 142 can move up and down on the slide rail 111 under the drive of the first drive unit 143. Specifically, the first drive unit 143 can be a device such as a cylinder, a motor, a hydraulic cylinder, or a transmission system such as a motor and gear rack system. There are many horizontal movement mechanisms in the prior art that can achieve horizontal movement, and they will not be described in detail here.

[0063] In the embodiment of the present application, the vertical movement mechanism 150 includes a fifth drive unit 151, which is provided with an output rod 152. The output rod 152 can move in the vertical direction under the drive of the fifth drive unit 151. The output rod 152 is connected to the gripping mechanism 140. The fifth drive unit 151 is provided on the horizontal movement mechanism 140 and can move horizontally on the horizontal movement mechanism 140. Specifically, the fifth drive unit 151 is fixedly connected to the first slider 141 and can move horizontally with the first slider 141.

[0064] In one embodiment of the present application, the third driving unit, the fourth driving unit, and the fifth driving unit are all cylinders.

[0065] like Figure 4 As shown, the ceramic substrate 200 includes an upper ceramic substrate 201 located at the top, and other ceramic substrates below the upper ceramic substrate 201 are lower ceramic substrates 202 .

[0066] When using the embodiment of this application, follow the steps below:

[0067] First, place the ceramic substrate workpiece on the carrier assembly 100, start the alignment mechanism 170 to align the ceramic substrate, and then the carrier assembly 100 starts to move upward from the zero position under the action of the lifting mechanism 110 until the sensor 121 is triggered. At this time, the lifting mechanism 110 starts to move slowly until it reaches the specified height measured by the rangefinder 122. At this time, if Figure 4 As shown, the upper ceramic substrate 201 is located above the blocking plate 161, and the lower ceramic substrate 202 is flush with the blocking plate 161. In this way, the upper and lower adjacent ceramic substrates 200 and the blocking plate 161 are in a misaligned state. When the upper ceramic substrate 201 moves laterally, the lower ceramic substrate 202 will be separated from the upper ceramic substrate 201 due to the obstruction of the blocking plate 161, thereby achieving the purpose of slicing.

[0068] Second, the gripping mechanism 130 is started. After the gripping mechanism 130 moves downward to a designated position, the suction cup is in contact with the upper ceramic substrate 201. After negative pressure is turned on, the gripping mechanism reliably holds the upper ceramic substrate 201 and maintains the current height.

[0069] Third, the horizontal movement mechanism 140 is activated, driving the gripping mechanism 130 and the upper ceramic substrate 201 to move laterally. At this point, because the blocking plate 161 blocks the lower ceramic substrate 202, and because the ceramic substrates themselves have high rigidity and are not easily deformed, the upper ceramic substrate 201 can be separated from the lower ceramic substrate 202, thereby achieving the purpose of separating the ceramic substrates.

[0070] The substrate separation device in the embodiment of the present application can effectively separate ceramic substrates without damaging them. It has the advantages of simple structure and reliable operation, and has achieved good results in actual production applications. It effectively reduces the labor intensity of operators and improves production efficiency.

[0071] The various components of the embodiment of the present application are connected to the device body. In order to make the drawings more clear, the device body is not shown in the drawings.

[0072] A substrate processing production line according to an embodiment of the present application includes a substrate separation device according to the above embodiment, wherein the substrate separation device includes a supporting component 100, a lifting mechanism 110, a positioning mechanism 120, a gripping mechanism 130, a horizontal moving mechanism 140, a vertical moving mechanism 150, and a blocking mechanism 160. The carrying assembly 100 is used to place the ceramic substrate 200. The lifting mechanism 110 is connected to the carrying assembly 100 and is used to control the vertical movement of the carrying assembly 100; the positioning mechanism 120 is set at a fixed height and is used to locate the height of the lifting and lowering of the carrying assembly 100, so that the lifting mechanism 110 can control the rising or falling height. The height of the positioning mechanism 120 is fixed, which is convenient for sensing whether the carrying assembly 100 and the ceramic substrate 200 placed on the carrying assembly 100 have reached a predetermined height; the grasping mechanism 130 is used to grasp the ceramic substrate 200 placed on the carrying assembly 100; the horizontal moving mechanism 140 is connected to the grasping mechanism 130 and is used to control the movement of the grasping mechanism 130 in the parallel direction; the vertical moving mechanism 150 is connected to the grasping mechanism 130 and is used to control the horizontal movement of the grasping mechanism 130; the blocking mechanism 160 is set above one side of the carrying assembly 100 and is used to block the movement of the substrate 200 placed on the carrying assembly 100.

[0073] The embodiment of the present application adopts the substrate separation device of the first embodiment. The substrate separation device can move the substrate on the carrier assembly 100 to a specific height through the cooperation of the lifting mechanism 110 and the positioning mechanism 120, so that among the stacked substrates 200, except for the substrate on the top layer, the remaining substrates are at the same height as the blocking mechanism 160. At this time, the grasping mechanism 130 can grasp the top substrate and move it horizontally toward the blocking mechanism 160 under the action of the horizontal moving mechanism 140. Due to the obstruction of the blocking mechanism 160, the substrates at the same height as the blocking mechanism 160 will not move together with the upper substrate, thereby being able to separate from the upper substrate. After the individual substrates are separated, they can be cleaned, processed, packaged, and other processes on the production line.

[0074] In some optional embodiments, the functions / operations mentioned in the block diagram may not occur in the order mentioned in the operation diagram. For example, depending on the functions / operations involved, the two boxes shown in succession may actually be executed substantially simultaneously or the boxes can sometimes be executed in reverse order. In addition, the embodiments presented and described in the flow chart of the present application are provided in an exemplary manner for the purpose of providing a more comprehensive understanding of the technology. The disclosed method is not limited to the operations and logic flows presented herein. Optional embodiments are contemplated in which the order of the various operations is changed and the sub-operations described as a part of a larger operation are performed independently.

[0075] The embodiments of the present application have been described in detail above with reference to the accompanying drawings. However, the present application is not limited to the above embodiments. Various modifications can be made within the scope of knowledge possessed by ordinary technicians in the relevant technical field without departing from the purpose of the present application. In addition, the embodiments of the present application and the features of the embodiments can be combined with each other unless there is a conflict.

Claims

1. A substrate separation device, characterized in that: include: A carrying assembly, the carrying assembly being used to place a substrate; A lifting mechanism connected to the carrying assembly and configured to drive the carrying assembly to move in a vertical direction; A positioning mechanism, the positioning mechanism is used to position the height of the carrying assembly in the vertical direction; A gripping mechanism, the gripping mechanism being used to grip the substrate on the carrying assembly; A horizontal moving mechanism, connected to the gripping mechanism, for driving the gripping mechanism to move in a horizontal direction; A vertical moving mechanism, connected to the gripping mechanism, for driving the gripping mechanism to move in a vertical direction; A blocking mechanism is provided on one side of the carrying assembly and is used to block the movement of the substrate in the horizontal direction.

2. The substrate separation device according to claim 1, wherein: The grabbing mechanism includes a grabbing plate, a first adjustment groove is provided on the grabbing plate, a connecting strip is provided on the grabbing plate, an adsorption device is provided on the connecting strip, a second adjustment groove is provided on the connecting strip, the second adjustment groove at least partially overlaps with the first adjustment groove, and an adjustment knob is provided on the connecting strip, the adjustment knob passes through the second adjustment groove and the first adjustment groove to fix the connecting strip on the grabbing plate.

3. The substrate separation device according to claim 2, wherein: The adsorption device is connected to an air source, and the air source is used to generate negative pressure in the adsorption device.

4. The substrate separation device according to claim 2, wherein: The adsorption device comprises an adsorption rod, and a spring is sleeved on the adsorption rod.

5. The substrate separation device according to claim 1, wherein: The positioning mechanism includes a sensor and a rangefinder.

6. The substrate separation device according to claim 1, wherein: An alignment mechanism is provided on one side of the bearing assembly, the alignment mechanism includes a first alignment plate provided on one side of the bearing assembly, a third alignment plate is provided on the other side of the bearing assembly opposite to the first alignment plate, and the third alignment plate is connected to a third driving unit; A second alignment plate is provided on one side of the bearing assembly adjacent to the first alignment plate. The blocking mechanism is provided on one side of the bearing assembly, opposite to the second alignment plate, and connected to a fourth driving unit.

7. The substrate separation device according to claim 1, wherein: The horizontal movement mechanism includes a first slide rail arranged horizontally, a first slider is slidably connected to the first slide rail, the grasping mechanism is connected to the first slider, and the first slider is connected to a first driving unit.

8. The substrate separation device according to claim 1, wherein: The lifting mechanism includes a second vertically arranged slide rail, a second slider is slidably connected to the second slide rail, the bearing assembly is connected to the second slider, and the second slider is connected to a second driving unit.

9. The substrate separation device according to claim 1, wherein: The vertical moving mechanism includes a fifth driving unit, which is connected to an output rod. The output rod can move in the vertical direction under the drive of the fifth driving unit. The output rod is connected to the grasping mechanism. The fifth driving unit is arranged on the horizontal moving mechanism and can move in the horizontal direction on the horizontal moving mechanism.

10. A substrate processing production line, characterized in that: The substrate separation device comprises the substrate separation device according to any one of claims 1 to 9.

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