Chip upside-down mounting chip mounting equipment

Abstract

The utility model, which relates to the technical field of chip processing, provides a chip normal-installation chip mounting device comprising a mounting rack, a suction part, a transfer mechanism, a conveyor belt, a bottom plate, a first motor, a placing groove, a separator plate, and a material disc. The upper end of the separator plate is provided with a baffle plate, and a holding groove is formed among the baffle plate, the separator plate, and the placing groove. A containing groove is formed in the material tray, a partition plate is arranged in the containing groove, a transverse plate is slidably connected into the containing groove, two V-shaped springs are symmetrically arranged between the transverse plate and the partition plate, and notches are formed in the two ends of the containing groove respectively. After the chips in the previous material tray are all used, the rotation of the placing groove is rapidly controlled through the first motor, so that the new material tray with the chips is rapidly moved to a preset position, the sucking part can normally suck and transfer the chips in the material tray, and the chip mounting efficiency is guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of chip processing, in particular to a chip mounting device. Background Art

[0002] In the process of installing chips on PCB, SMT equipment is needed. The SMT equipment includes a movable suction cup and a material tray. Chips are neatly placed on the material tray. The chips in the material tray are transferred to the PCB in a certain order through the movement of the suction cup. Since a single PCB board needs to be installed with more chips, the chips on the material tray are consumed at a faster rate. Therefore, the material tray with chips needs to be replaced more frequently. When the material tray is replaced, the SMT work needs to be suspended for a period of time. The SMT work can only be restarted after the replacement is completed, which affects the SMT efficiency. Utility Model Content

[0003] The purpose of the present invention is to provide a chip mounting device, aiming to solve the problems mentioned in the above background technology.

[0004] To achieve the above-mentioned purpose, the utility model adopts the following technical scheme: the chip mounting device includes a mounting frame and a suction part, the suction part is used to grab and place the chip, the mounting frame is provided with a transfer mechanism for controlling the movement of the suction part, the mounting frame is provided with a conveyor belt for transporting the circuit board, the mounting frame is also provided with a base plate, the base plate is provided with a motor 1, the output end of the motor 1 is provided with a placement groove, the middle of the placement groove is provided with a partition, the interior of the placement groove and the two sides of the partition are respectively used to place the material tray, the upper end of the partition is provided with a baffle, the baffle, the partition and the placement groove form a receiving groove, the interior of the receiving groove is slidably connected with a cross plate, two V-shaped springs are symmetrically provided between the cross plate and the partition, and the two ends of the placement groove are respectively provided with a notch.

[0005] Preferably, the transfer mechanism includes two fixed rods symmetrically arranged on the mounting frame, and also includes a base slidably connected to the two fixed rods, the mounting frame is provided with a screw 1 threadedly connected to the base, the mounting frame is provided with a motor 2 for driving the screw 1 to rotate, the lower end of the base is slidably connected to a slide, the lower end of the base is provided with a screw 2 threadedly connected to the slide, the base is provided with a motor 3 for driving the screw 2 to rotate, the lower end of the slide is provided with a vertical frame, the interior of the vertical frame is provided with a cylinder, and the suction part is provided at the output end of the cylinder.

[0006] Preferably, protrusions are respectively provided at both ends of the transverse plate, and sliding grooves matching with the protrusions are respectively provided on both sides of the placement groove.

[0007] Preferably, chamfers are provided on both sides of the interior of the placement groove and on both sides of the lower end of the tray.

[0008] Preferably, a cover is provided on the mounting frame.

[0009] The beneficial effects of the utility model are:

[0010] When the device is in use, the tray containing chips can be placed in the placement slot in advance before all the chips in the previous tray are used. After all the chips in the previous tray are used, the motor quickly controls the rotation of the placement slot to quickly move the new tray containing chips to the predetermined position, so that the suction part can normally absorb and transfer the chips in the tray, thereby ensuring the patch efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a structural schematic diagram of a specific embodiment of the utility model.

[0012] Figure 2 It is a structural diagram of the mounting frame.

[0013] Figure 3 yes Figure 2 Side view of the state.

[0014] Figure 4 It is a structural diagram of the base.

[0015] Figure 5 yes Figure 4 Side view of the state.

[0016] Figure 6 It is a structural diagram of the placement slot.

[0017] In the figure: 1. Mounting frame; 2. Suction part; 3. Conveyor belt; 4. Bottom plate; 5. Motor 1; 6. Placement groove; 7. Partition; 8. Material tray; 9. Baffle; 10. Cross plate; 11. V-shaped spring; 12. Slot; 13. Fixing rod; 14. Base; 15. Screw 1; 16. Motor 2; 17. Slide; 18. Screw 2; 19. Motor 3; 20. Vertical frame; 21. Cylinder; 22. Protrusion; 23. Slide; 24. Cover. DETAILED DESCRIPTION

[0018] The specific embodiments of the present invention will be further described below with reference to the accompanying drawings.

[0019] like Figure 1-6As shown, a chip mounting device includes a mounting frame 1 and a suction part 2, the suction part 2 is used to grab and place the chip, the mounting frame 1 is provided with a transfer mechanism for controlling the movement of the suction part 2, the mounting frame 1 is provided with a conveyor belt 3 for transporting the circuit board, the mounting frame 1 is also provided with a base plate 4, the base plate 4 is provided with a motor 5, the output end of the motor 5 is provided with a placement groove 6, the middle of the placement groove 6 is provided with a partition 7, the interior of the placement groove 6 and the two sides of the partition 7 are respectively used to place a material tray 8, the upper end of the partition 7 is provided with a baffle 9, a receiving groove is formed between the baffle 9, the partition 7 and the placement groove 6, the interior of the receiving groove is slidably connected with a cross plate 10, two V-shaped springs 11 are symmetrically provided between the cross plate 10 and the partition 7, and the two ends of the placement groove 6 are respectively provided with a notch 12.

[0020] The suction part 2 is connected to the external suction equipment. The interior of the material tray 8 has a plurality of card slots for placing chips. The transfer mechanism can drive the suction part 2 to move up and down, front and back, left and right, so that the transfer mechanism can drive the suction part 2 to move to a predetermined position on the material tray 8. After the suction part 2 completes the suction of the chip in the card slot, the suction part 2 is continued to be moved to the position above the circuit board and used for chip unloading through the transfer mechanism to realize the chip patch operation. When the chips on the material tray 8 are sucked and transferred out by the suction part 2 in turn, there are no chips available on the material tray 8. At this time, the material tray 8 with chips can be placed in the placement slot 6 in advance. Specifically, one end of the material tray 8 is abutted against the cross plate 10, and the V-shaped spring 11 is squeezed by the cross plate 10 to make the material tray 8 It can be placed in the placement slot 6. When the material tray 8 enters the placement slot 6, the reaction force of the V-shaped spring 11 pushes the cross plate 10 to move in the direction away from the partition 7, thereby stably fixing the material tray 8 in the placement slot 6. When the chips in another material tray 8 in the placement slot 6 are used up, by controlling the motor 15 to start, the motor 15 controls the placement slot 6 to rotate 180°, so that the material tray 8 with chips moves to the working position, so that the chips in the material tray 8 can be used. Through the missing slot 12 on the placement slot 6, the empty material tray 8 can be quickly taken out of the placement slot 6, and a new material tray 8 with chips can be placed in the placement slot 6, so that the new material tray 8 with chips can be quickly moved to the working position after the chips in the material tray 8 are used up.

[0021] Furthermore, the transfer mechanism includes two fixed rods 13 symmetrically arranged on the mounting frame 1, and also includes a base 14 slidably connected to the two fixed rods 13, a screw rod 15 threadedly connected to the base 14 is provided on the mounting frame 1, a motor 2 16 for driving the screw rod 15 to rotate is provided on the mounting frame 1, a slide 17 is slidably connected to the lower end of the base 14, a screw 2 18 threadedly connected to the slide 17 is provided at the lower end of the base 14, a motor 3 19 for driving the screw 2 18 to rotate is provided on the base 14, a vertical frame 20 is provided at the lower end of the slide 17, a cylinder 21 is provided inside the vertical frame 20, the suction part 2 is provided at the output end of the cylinder 21, the motor 2 16 drives the screw rod 15 to rotate, and through the threaded connection between the base 14 and the screw rod 1, and the sliding connection between the base 14 and the fixed rod 13, it can bring The movable base 14 moves along the screw rod 15, and by controlling the forward and reverse rotation of the motor 2 16, the base 14 can be driven to move back and forth along the screw rod 2 18. A guide rail is provided on the slide 17, and a guide groove is provided on the lower surface of the base 14. The slide 17 can move along the guide groove under the base 14 through the guide rail. At the same time, the guide rail and the guide groove are engaged with each other, so that the slide 17 can move stably on the lower surface of the base 14. At the same time, by controlling the motor 3 19 to drive the screw rod 2 18 to rotate, the slide 17 is driven to perform reciprocating linear motion along the base 14. At the same time, the screw rod 15 and the screw rod 2 18 are perpendicular to each other. At the same time, by controlling the extension and contraction of the output end of the cylinder 21, the suction part 2 can be driven to move up and down. Through the cooperation of the motor 2 16, the motor 3 19 and the cylinder 21, the movement of the suction part 2 in three coordinates can be controlled.

[0022] Furthermore, protrusions 22 are respectively provided at both ends of the transverse plate 10 , and sliding grooves 23 matching with the protrusions 22 are respectively provided on both sides of the placement groove 6 to improve the stability of the transverse plate 10 when moving in the placement groove 6 .

[0023] Furthermore, chamfers are provided on both sides of the interior of the placement groove 6 and on both sides of the lower end of the material tray 8 to facilitate placement of the material tray 8 into the placement groove 6.

[0024] Furthermore, a cover shell 24 is provided on the mounting frame 1 to protect the material tray 8 and the circuit board and prevent foreign objects from directly colliding with the placement slot 6. At the same time, one side of the cover shell 24 has an opening, which is used to place the material tray 8 into the placement slot 6.

[0025] When the device is in use, the tray 8 containing chips can be placed in the placement slot 6 in advance before all the chips in the previous tray 8 are used. After all the chips in the previous tray 8 are used, the motor 5 quickly controls the rotation of the placement slot 6 to quickly move the new tray 8 containing chips to the predetermined position, so that the suction part 2 can normally absorb and transfer the chips in the tray 8, thereby ensuring the patch efficiency.

[0026] In the description of this utility model, unless otherwise specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of these terms in this utility model based on the specific circumstances.

Claims

1. A chip mounting device, characterized in that: The utility model comprises a mounting frame and a suction part, wherein the suction part is used to grab and place the chip, the mounting frame is provided with a transfer mechanism for controlling the movement of the suction part, the mounting frame is provided with a conveyor belt for transporting the circuit board, the mounting frame is also provided with a bottom plate, the bottom plate is provided with a motor 1, the output end of the motor 1 is provided with a placement groove, the middle part of the placement groove is provided with a partition, the interior of the placement groove and the two sides of the partition are respectively used to place the material tray, the upper end of the partition is provided with a baffle, and a receiving groove is formed between the baffle, the partition and the placement groove, the interior of the receiving groove is slidably connected with a cross plate, two V-shaped springs are symmetrically provided between the cross plate and the partition, and the two ends of the placement groove are respectively provided with a notch.

2. The chip mounting device according to claim 1, characterized in that: The transfer mechanism includes two fixed rods symmetrically arranged on the mounting frame, and also includes a base slidably connected to the two fixed rods, the mounting frame is provided with a screw 1 threadedly connected to the base, the mounting frame is provided with a motor 2 for driving the screw 1 to rotate, the lower end of the base is slidably connected to a slide, the lower end of the base is provided with a screw 2 threadedly connected to the slide, the base is provided with a motor 3 for driving the screw 2 to rotate, the lower end of the slide is provided with a vertical frame, the interior of the vertical frame is provided with a cylinder, and the suction part is provided at the output end of the cylinder.

3. The chip mounting device according to claim 1, characterized in that: Both ends of the transverse plate are respectively provided with protrusions, and both sides of the placement groove are respectively provided with sliding grooves matched with the protrusions.

4. The chip mounting device according to claim 1, characterized in that: Chamfers are respectively provided on both sides of the interior of the placement groove and on both sides of the lower end of the material tray.

5. The chip mounting device according to any one of claims 1 to 4, characterized in that: A cover shell is provided on the mounting frame.

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