Adsorption device

Abstract

The utility model relates to an adsorption device. The adsorption device comprises vacuum suction nozzles, each vacuum suction nozzle comprises a suction nozzle head and a connecting end, the suction nozzle heads and the connecting ends are oppositely distributed in the first direction, the suction nozzle heads are used for adsorbing components, the multiple vacuum suction nozzles are arranged at intervals in the second direction, and the first direction perpendicularly intersects with the second direction; and the plurality of elastic adjusting structures correspond to the plurality of vacuum suction nozzles respectively, each elastic adjusting structure is connected with the connecting end of the corresponding vacuum suction nozzle in the first direction, and the elastic adjusting structures can drive the vacuum suction nozzles to move in the first direction. According to the utility model, the adsorption device can adsorb components with different heights at the same time, so that the adsorption stability and reliability of the adsorption device on the components with different heights are improved, and the problem of material falling or improper discharging in the adsorption process is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to an adsorption device. Background Art

[0002] The ECP (Embedded Chip Package) structure adopts the form of surface-mounted inductors without packaging. In order to improve the performance of the ECP structure, multiple inductors and other components are usually mounted on top of the chip at the same time. However, on the one hand, there are height differences between inductors with different structures or functions; on the other hand, even for inductors with the same structure, the height tolerance of the inductor itself is ±0.1, which leads to the height difference between two inductors in the same ECP structure may reach 0.2. When mounting the inductor on top of the chip, it is necessary to use an adsorption device to adsorb multiple inductors at the same time. However, due to the height difference between different inductors and the suction nozzle of the adsorption device is a hard nozzle, on the one hand, there may be a problem of vacuum leakage during adsorption; on the other hand, it may cause the adsorption device to fail to contact the inductor with a lower height, resulting in problems such as material falling during the adsorption process or deviation during the discharge process, affecting the yield and efficiency of semiconductor manufacturing.

[0003] Therefore, how to achieve simultaneous adsorption of components of different heights, improve the stability and reliability of adsorption, avoid problems of material falling or incorrect material discharge during the adsorption process, and thus improve the yield and efficiency of semiconductor manufacturing, is a technical problem that needs to be solved urgently. Summary of the Invention

[0004] The utility model provides an adsorption device for achieving simultaneous adsorption of components of different heights, improving the stability and reliability of adsorption, avoiding the problems of material falling or incorrect material discharge during the adsorption process, and thus improving the yield and efficiency of semiconductor manufacturing.

[0005] According to some embodiments, the present invention provides an adsorption device, comprising:

[0006] A vacuum suction nozzle, comprising a suction nozzle head and a connection end relatively distributed along a first direction, wherein the suction nozzle head is used to absorb components, and a plurality of the vacuum suction nozzles are arranged at intervals along a second direction, wherein the first direction intersects the second direction perpendicularly;

[0007] An elastic adjustment structure, wherein the plurality of elastic adjustment structures correspond to the plurality of vacuum suction nozzles respectively, and each elastic adjustment structure is connected to the connection end of the corresponding vacuum suction nozzle along the first direction, and the elastic adjustment structure can drive the vacuum suction nozzle to move along the first direction.

[0008] In some embodiments, it further includes:

[0009] A first shell surrounds and forms a first cavity;

[0010] The elastic adjustment structure includes an elastic member located in the first cavity and a connecting member at least partially located in the first cavity, one end of the connecting member is connected to the elastic member, and the other end is connected to the connecting end of the vacuum nozzle.

[0011] In some embodiments, the plurality of elastic adjustment structures are symmetrically distributed about the center of the first cavity, and the plurality of elastic adjustment structures are correspondingly connected to the plurality of vacuum nozzles one by one.

[0012] In some embodiments, it further includes:

[0013] An isolation plate is located in the first cavity, and the isolation plate divides the first cavity into a plurality of accommodating cavities. The plurality of elastic adjustment structures are respectively located in the plurality of accommodating cavities.

[0014] In some embodiments, a width of the accommodating cavity along the second direction is equal to a width of the elastic member along the second direction, and an end of the elastic member facing away from the vacuum nozzle abuts against a top of the accommodating cavity.

[0015] In some embodiments, it further includes:

[0016] A raised portion is connected to an end portion of the first shell facing the vacuum nozzle along the first direction, and the raised portion is used to isolate adjacent vacuum nozzles.

[0017] In some embodiments, it further includes:

[0018] A second shell is formed around a second cavity, wherein the first shell is located in the second cavity;

[0019] A vacuum channel is located between the first shell and the second shell, and a side wall of the vacuum nozzle has an opening communicating with the vacuum channel.

[0020] In some embodiments, the width of the opening is greater than or equal to the inner diameter of the vacuum channel.

[0021] In some embodiments, the plurality of vacuum channels are connected to the openings on the side walls of the plurality of vacuum nozzles in a one-to-one correspondence.

[0022] In some embodiments, the vacuum nozzle penetrates the second housing along the first direction;

[0023] The first shell includes a top surface and a bottom surface relatively distributed along the first direction. The vacuum channel includes a first vacuum channel located between the side wall of the first shell and the second shell, and a second vacuum channel located between the bottom surface of the first shell and the second shell. The second vacuum channel is connected to the opening on the side wall of the vacuum nozzle.

[0024] The adsorption device provided by the present invention is provided with multiple elastic adjustment structures respectively connected to multiple vacuum suction nozzles, each of the elastic adjustment structures is connected to the connecting end of the corresponding vacuum suction nozzle along the first direction, and the elastic adjustment structure can drive the vacuum suction nozzle to move along the first direction. On the one hand, the elastic adjustment structure can drive the vacuum suction nozzle to move along the first direction to adjust the relative heights between different vacuum suction nozzles, so that the adsorption device can adsorb components of different heights at the same time, thereby improving the stability and reliability of the adsorption device for adsorbing components of different heights, avoiding the problem of material falling or incorrect material discharge during the adsorption process, and improving the yield and efficiency of semiconductor manufacturing; on the other hand, the elastic adjustment structure can drive the vacuum suction nozzle to move along the first direction to balance the adsorption force between different vacuum suction nozzles, thereby avoiding uneven force on the adsorption device when adsorbing one component, thereby further improving the stability and reliability of adsorption. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a structural diagram of the adsorption device in a specific embodiment of the present utility model;

[0026] Figure 2 It is a schematic diagram of the structure to be adsorbed in a specific embodiment of the present utility model;

[0027] Figure 3 It is a schematic diagram of the adsorption device in a specific embodiment of the present invention adsorbing the structure to be adsorbed. DETAILED DESCRIPTION

[0028] The specific implementation of the adsorption device provided by the utility model is described in detail below with reference to the accompanying drawings.

[0029] This specific embodiment provides an adsorption device, Figure 1 This is a schematic diagram of the structure of the adsorption device in a specific embodiment of the present invention. Figure 1 As shown, the adsorption device includes:

[0030] A vacuum nozzle 10 includes nozzle heads 101 and a connection end that are relatively distributed along a first direction D1. The nozzle heads are used to absorb components. A plurality of vacuum nozzles 10 are spaced apart along a second direction D2. The first direction D1 and the second direction D2 intersect perpendicularly.

[0031] An elastic adjustment structure, wherein the plurality of elastic adjustment structures correspond to the plurality of vacuum nozzles 10 respectively, and each elastic adjustment structure is connected to the connection end of the corresponding vacuum nozzle 10 along the first direction D1, and the elastic adjustment structure can drive the vacuum nozzle 10 to move along the first direction D1.

[0032] For example, the first direction D1 can be a vertical direction, and the second direction D2 can be a horizontal direction perpendicular to the vertical direction. The plurality of vacuum nozzles 10 are arranged at intervals along the second direction D2, so that the plurality of vacuum nozzles 10 can simultaneously vacuum adsorb multiple components, or the plurality of vacuum nozzles can simultaneously adsorb multiple areas of a component. The plurality of elastic adjustment structures are respectively connected to the connection ends of the plurality of vacuum nozzles 10, so that the plurality of vacuum nozzles 10 can be driven to move along the first direction D1 (for example, to move up and down in the vertical direction) by the plurality of elastic adjustment structures. The plurality mentioned in this specific embodiment refers to more than two.

[0033] Figure 2 This is a schematic diagram of the structure to be adsorbed in a specific embodiment of the present invention. Figure 3 This is a schematic diagram of the adsorption device in a specific embodiment of the present invention adsorbing the structure to be adsorbed. Figure 2As shown, the structure to be adsorbed includes a mounting layer 20 and a first component 21 and a second component 22 located on the mounting layer 20, with the first component 21 being higher than the second component 22 along the first direction D1. For example, when the adsorption device includes two vacuum nozzles 10 spaced apart along the second direction D2, in the initial state, the two vacuum nozzles 10 are at the same height. When the adsorption device adsorbs the first component 21 and the second component 22 on the mounting layer 20, the two vacuum nozzles 10 descend simultaneously along the first direction D1. When one of the vacuum nozzles 10 adsorbs the higher first component 21, the other vacuum nozzle 10 has not yet made contact with the lower second component 22. At this time, when pressure is continuously applied downwards to the two vacuum nozzles 10 (for example, downwards in the first direction D1), the elastic adjustment structure connected to the vacuum nozzle 10 that has vacuum-adsorbed the first component 21 undergoes compression deformation and drives the vacuum nozzle 10 to move upwards in the first direction D1, thereby creating a height difference between the two vacuum nozzles 10. When the other vacuum nozzle 10, under the action of the downward pressure, descends to contact with the second component 22 and adsorbs the second component 22, the vacuum nozzle 10 that has vacuum-adsorbed the first component 21 also stops moving accordingly, so that the two vacuum nozzles 10 maintain a certain height difference, as shown in FIG. Figure 3 The adsorption device can simultaneously adsorb components of different heights, thereby improving the stability and reliability of the adsorption device in adsorbing components of different heights, avoiding the problem of material dropping or incorrect material discharge during the adsorption process, and improving the yield and efficiency of semiconductor manufacturing.

[0034] For another example, when the suction device includes two vacuum nozzles 10 spaced apart along the second direction D2, in the initial state, the two vacuum nozzles 10 are at the same height. When the suction device is sucking a third component, due to process steps, there is a height difference between the suction surfaces of the third component. After one of the two vacuum nozzles 10 contacts the higher area of ​​the suction surface of the third component, downward pressure is continued on both vacuum nozzles 10. At this time, the elastic adjustment structure connected to the vacuum nozzle 10 that has vacuum-sucked the first component 21 undergoes compression deformation and drives the vacuum nozzle 10 upward along the first direction D1 until the other vacuum nozzle 10 vacuum-sucks the lower area of ​​the suction surface of the third component. When the suction device sucks the same component using multiple vacuum nozzles 10, the suction forces between the different vacuum nozzles can be balanced, avoiding uneven force on the suction device when sucking a single component, thereby further improving the stability and reliability of suction.

[0035] In some embodiments, the adsorption device further comprises:

[0036] The first shell 13 surrounds and forms a first cavity;

[0037] The elastic adjustment structure includes an elastic member 111 located in the first cavity and a connecting member 112 at least partially located in the first cavity, one end of the connecting member 112 is connected to the elastic member 111, and the other end is connected to the connecting end of the vacuum nozzle 10.

[0038] For example, if Figure 1 and Figure 3 As shown, the first shell 13 surrounds and forms the first cavity. The elastic adjustment structure includes the elastic member 111 formed of an elastic material such as high elastic rubber and the connecting member 112 for connecting the elastic member 111 and the vacuum nozzle 10. For example, Figure 3 As shown, by applying pressure to the first housing 13, all of the vacuum nozzles 10 connected to the first housing 13 move downward in the first direction D1. When one of the vacuum nozzles 10 is sucking the higher first component 21, the other vacuum nozzle 10 has not yet made contact with the lower second component 22. When pressure continues to be applied to the first housing 13, the elastic member 111 in the elastic adjustment structure connected to the vacuum nozzle 10 that has already vacuum-sucked the first component 21 undergoes compression deformation under the reaction force of the pressure, driving the vacuum nozzle 10 to automatically move upward in the first direction D1. This allows the two vacuum nozzles 10 to adaptively adjust their height difference without the need for an additional drive structure, allowing the suction device to flexibly and conveniently suck components of various height differences. When the other vacuum nozzle 10, under the action of pressure, descends until it contacts and sucks the second component 22, the vacuum nozzle 10 that has vacuum-sucked the first component 21 also stops moving accordingly. The elastic member 111 described in this specific embodiment refers to a structural member that can undergo elastic deformation under the action of external force.

[0039] In one example, the connecting member 112 includes a first contact portion and a second contact portion that are vertically connected, the top end of the first contact portion is connected to the elastic member 111, and the bottom end is connected to the top end of the second contact portion, the bottom end of the second contact portion is connected to the vacuum nozzle 10, and the width of the first contact portion (for example, the width along the second direction D2) is greater than the width of the second contact portion (for example, the width along the second direction D2), so that the cross-section of the connecting member is T-shaped, so as to increase the contact area between the connecting member 112 and the elastic member 111, and balance the force on the elastic member 111 and the vacuum nozzle 10.

[0040] In some embodiments, the plurality of elastic adjustment structures are symmetrically distributed about the center of the first cavity, and the plurality of elastic adjustment structures are correspondingly connected to the plurality of vacuum nozzles 10 one by one.

[0041] Specifically, the multiple elastic adjustment structures are symmetrically distributed about the center of the first cavity, further balancing the suction force of the suction device when adsorbing components, preventing damage to the components due to uneven pressure. By connecting the multiple elastic adjustment structures one by one to the multiple vacuum nozzles 10, the height of each vacuum nozzle 10 (e.g., the height along the first direction D1) can be independently adjusted, further enhancing the application range and adsorption stability of the suction device.

[0042] In some embodiments, the adsorption device further comprises:

[0043] The isolation plate 15 is located in the first cavity. The isolation plate 15 divides the first cavity into a plurality of accommodating cavities. The plurality of elastic adjustment structures are respectively located in the plurality of accommodating cavities.

[0044] Specifically, by arranging the isolation plate 15 in the first cavity, on the one hand, the adjacent elastic adjustment structures can be isolated to avoid mutual influence between the adjacent elastic adjustment structures; on the other hand, it also helps to limit the position of each elastic adjustment structure in the first cavity to ensure the performance stability of the adsorption device.

[0045] In some embodiments, the width of the accommodating cavity along the second direction D2 is equal to the width of the elastic member 111 along the second direction D2, and the end of the elastic member 111 facing away from the vacuum nozzle 10 abuts against the top of the accommodating cavity to limit the path of elastic deformation of the elastic member 111 and prevent the elastic member 111 from being displaced as a whole.

[0046] In some embodiments, the adsorption device further comprises:

[0047] The raised portion 16 is connected to the end of the first shell 13 facing the vacuum nozzle 10 along the first direction D1 . The raised portion 16 is used to isolate adjacent vacuum nozzles 10 .

[0048] Specifically, the raised portion 16 is aligned with the isolation plate 15 along the first direction D1. Providing the raised portion 16 below the first housing 13 along the first direction D1 not only isolates adjacent vacuum nozzles 10 from each other, but also helps define the position of each vacuum nozzle 10.

[0049] In some embodiments, the adsorption device further comprises:

[0050] The second shell 17 surrounds and forms a second cavity, and the first shell 13 is located in the second cavity;

[0051] The vacuum channel 18 is located between the first shell 13 and the second shell 17 . The side wall of the vacuum nozzle 10 has an opening communicating with the vacuum channel 18 .

[0052] Specifically, in this specific embodiment, the side wall of the vacuum nozzle 10 refers to the portion located between the nozzle head 101 and the connecting end. In one example, the vacuum nozzle includes the nozzle head 101 and the connecting end relatively distributed along the first direction D1, and a nozzle rod located between the nozzle head 101 and the connecting end, and the two ends of the nozzle rod are respectively connected to the nozzle head 101 and the connecting end. The opening 19 is located on the side wall of the nozzle rod. The vacuum channel 18 includes a first port 181 and a second port 182 relatively distributed, the first port 181 is connected to the opening 19 on the side wall of the vacuum nozzle 10, and the second port 182 is used to connect to a vacuum pump, so that the vacuum channel 18 and the vacuum nozzle 10 can be vacuumed by the vacuum pump. By providing the opening 19 for vacuuming on the side wall of the vacuum suction nozzle 10, the problem of vacuum leakage when the vacuum suction nozzle 10 moves up and down along the first direction D1 can be effectively avoided, thereby ensuring that the vacuum suction nozzle 10 can maintain stable adsorption of components when moving along the first direction D1 driven by the elastic adjustment structure.

[0053] In some embodiments, the width of the opening 19 is greater than or equal to the inner diameter of the vacuum channel 18 .

[0054] For example, the width of the opening 19 along the first direction D1 is greater than or equal to the inner diameter of the vacuum channel 18 to ensure that the vacuum nozzle 10 remains connected to the vacuum channel 18 when moving along the first direction D1 driven by the elastic adjustment structure.

[0055] In some embodiments, the plurality of vacuum channels 18 are connected to the openings 19 on the side walls of the plurality of vacuum nozzles 10 in a one-to-one correspondence, so as to flexibly control the vacuum suction force of each vacuum nozzle 10 .

[0056] In some embodiments, the vacuum nozzle 10 passes through the second housing 17 along the first direction D1;

[0057] The first shell 13 includes a top surface and a bottom surface relatively distributed along the first direction D1. The vacuum channel 18 includes a first vacuum channel located between the side wall of the first shell 13 and the second shell 17, and a second vacuum channel located between the bottom surface of the first shell 13 and the second shell 17. The second vacuum channel is connected to the opening 19 on the side wall of the vacuum nozzle 10.

[0058] For example, the vacuum channel 18 is L-shaped, that is, the vacuum channel 18 includes the first vacuum channel and the second vacuum channel that are vertically connected. The first vacuum channel is located between the side wall of the first shell 13 and the second shell 17 and extends along the first direction D1. The second vacuum channel is located between the bottom surface of the first shell 13 and the second shell 17 and extends along the second direction D2, so as not only to fully utilize the space in the adsorption device, but also to facilitate the connection of the vacuum pump.

[0059] The adsorption device provided in this specific embodiment is provided with a plurality of elastic adjustment structures respectively connected to a plurality of vacuum suction nozzles, each of the elastic adjustment structures is connected to the connection end of the corresponding vacuum suction nozzle along the first direction, and the elastic adjustment structure can drive the vacuum suction nozzle to move along the first direction. On the one hand, the elastic adjustment structure can drive the vacuum suction nozzle to move along the first direction to adjust the relative heights between different vacuum suction nozzles, so that the adsorption device can adsorb components of different heights at the same time, thereby improving the stability and reliability of the adsorption device for adsorbing components of different heights, avoiding the problem of material falling or incorrect material discharge during the adsorption process, and improving the yield and efficiency of semiconductor manufacturing; on the other hand, the elastic adjustment structure can drive the vacuum suction nozzle to move along the first direction to balance the adsorption force between different vacuum suction nozzles, thereby avoiding uneven force on the adsorption device when adsorbing one component, thereby further improving the stability and reliability of adsorption.

[0060] The above is only a preferred embodiment of the present invention. It should be pointed out that ordinary technicians in this technical field can make several improvements and modifications without departing from the principles of the present invention. These improvements and modifications should also be regarded as within the scope of protection of the present invention.

Claims

1. An adsorption device, characterized in that: include: A vacuum suction nozzle, comprising a suction nozzle head and a connection end relatively distributed along a first direction, wherein the suction nozzle head is used to absorb components, and a plurality of the vacuum suction nozzles are arranged at intervals along a second direction, wherein the first direction intersects the second direction perpendicularly; An elastic adjustment structure, wherein the plurality of elastic adjustment structures correspond to the plurality of vacuum suction nozzles respectively, and each elastic adjustment structure is connected to the connection end of the corresponding vacuum suction nozzle along the first direction, and the elastic adjustment structure can drive the vacuum suction nozzle to move along the first direction.

2. The adsorption device according to claim 1, characterized in that Also includes: A first shell surrounds and forms a first cavity; The elastic adjustment structure includes an elastic member located in the first cavity and a connecting member at least partially located in the first cavity, one end of the connecting member is connected to the elastic member, and the other end is connected to the connecting end of the vacuum nozzle.

3. The adsorption device according to claim 2, characterized in that: The plurality of elastic adjustment structures are symmetrically distributed about the center of the first cavity, and the plurality of elastic adjustment structures are correspondingly connected to the plurality of vacuum nozzles one by one.

4. The adsorption device according to claim 2, characterized in that Also includes: An isolation plate is located in the first cavity, and the isolation plate divides the first cavity into a plurality of accommodating cavities. The plurality of elastic adjustment structures are respectively located in the plurality of accommodating cavities.

5. The adsorption device according to claim 4, characterized in that: The width of the accommodating cavity along the second direction is equal to the width of the elastic member along the second direction, and the end of the elastic member facing away from the vacuum nozzle abuts against the top of the accommodating cavity.

6. The adsorption device according to claim 4, characterized in that: Also includes: A raised portion is connected to an end portion of the first shell facing the vacuum nozzle along the first direction, and the raised portion is used to isolate adjacent vacuum nozzles.

7. The adsorption device according to claim 2, characterized in that: Also includes: A second shell is formed around a second cavity, wherein the first shell is located in the second cavity; A vacuum channel is located between the first shell and the second shell, and a side wall of the vacuum nozzle has an opening communicating with the vacuum channel.

8. The adsorption device according to claim 7, characterized in that: The width of the opening is greater than or equal to the inner diameter of the vacuum channel.

9. The adsorption device according to claim 7, characterized in that: The plurality of vacuum channels are in one-to-one communication with the openings on the side walls of the plurality of vacuum nozzles.

10. The adsorption device according to claim 7, characterized in that: The vacuum nozzle penetrates the second shell along the first direction; The first shell includes a top surface and a bottom surface relatively distributed along the first direction. The vacuum channel includes a first vacuum channel located between the side wall of the first shell and the second shell, and a second vacuum channel located between the bottom surface of the first shell and the second shell. The second vacuum channel is connected to the opening on the side wall of the vacuum nozzle.

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