Packaging structure of integrated circuit
By introducing a sealing gasket and aluminum plate fin design into the integrated circuit packaging structure, the sealing problem of the packaging structure is solved, and better sealing and thermal conductivity and heat dissipation effects are achieved.
Patent Information
- Application Number
- CN202422587986.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-25
- Publication Date
- 2025-09-30
- Estimated Expiration
- 2034-10-25
AI Technical Summary
The existing integrated circuit packaging structure has poor sealing performance, and the joints are easily penetrated by water vapor.
The design of base plate, space groove, sealing gasket, top cover, pins and chamfer is adopted. The sealing gasket is used to fill the gap between the space groove and the top cover. Combined with the setting of aluminum plate, fins and disassembly screws, the sealing and thermal conductivity of the packaging structure are enhanced.
The sealing of the packaging structure is improved, ensuring accurate pin insertion, and the thermal conductivity and heat dissipation performance are improved through the setting of aluminum plates and fins.
Smart Images
Figure CN223401597U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of integrated circuit packaging, in particular to a packaging structure of an integrated circuit. Background Art
[0002] Integrated circuit testing is a key means of ensuring integrated circuit performance and quality. IC testing technology is one of the three key enabling technologies for the development of the integrated circuit industry. Consequently, IC testers, as a testing category, are highly valued in many countries. Over the past 40 years, as integrated circuits have advanced to their fourth generation, IC testers have evolved from initially testing small-scale integrated circuits to testing medium-scale, large-scale, and very large-scale integrated circuits. Existing integrated circuit packaging structures lack sealing, making connections susceptible to moisture intrusion.
[0003] Therefore, in view of this, research and improvement are conducted to address the shortcomings of the existing structure, and a packaging structure for an integrated circuit is proposed. Utility Model Content
[0004] The purpose of the present invention is to provide a packaging structure for an integrated circuit to solve the problems raised in the above background technology.
[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solution: a packaging structure for an integrated circuit, comprising a base plate and a space groove opened on the inner surface of the base plate, the inner surface of the space groove is provided with a sealing gasket, the upper surface of the base plate is bonded with a top cover, the surface of the base plate is provided with pins, and the lower surface of the pins is provided with chamfers.
[0006] Preferably, the upper surface of the top cover is provided with four screw holes.
[0007] Preferably, an aluminum plate is provided on the upper surface of the top cover, and the material of the top cover is aluminum.
[0008] Preferably, a plurality of fins are fixedly connected to the upper surface of the aluminum plate, and the plurality of fins are evenly distributed on the upper surface of the aluminum plate, and the fins are made of aluminum.
[0009] Preferably, disassembly screws are provided on the upper surface of the aluminum plate extending to the inside of the screw hole, and the number of the disassembly screws is four.
[0010] Compared with the prior art, the beneficial effects of the present invention are:
[0011] 1. The present invention is provided with a bottom plate, a space groove, a sealing gasket, a top cover, pins, and chamfers. In this packaging structure, a sealing gasket is used to fill the space groove and the top cover, thereby enhancing the sealing of the packaging structure. The surface of the pins is provided with chamfers to facilitate the pins to be inserted in the appropriate position.
[0012] 2. The utility model is provided with screw holes, aluminum plates, fins and disassembly screws. The aluminum plates can be fixed on the top cover by using the screw holes and disassembly screws, and the fins can play a better thermal conductivity and heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Figure 1 This is a schematic diagram of the overall three-dimensional structure of the utility model;
[0014] Figure 2 For this utility model Figure 1 Schematic diagram of the local three-dimensional structure;
[0015] Figure 3 For this utility model Figure 2 Schematic diagram of the local three-dimensional structure.
[0016] In the figure: 1. Bottom plate; 2. Space groove; 3. Sealing gasket; 4. Top cover; 5. Pins; 6. Chamfer; 7. Screw hole; 8. Aluminum plate; 9. Fins; 10. Remove screws. DETAILED DESCRIPTION
[0017] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0018] like Figure 2-Figure 3 As shown, a packaging structure of an integrated circuit includes a base plate 1 and a space groove 2 opened on the inner surface of the base plate 1, a sealing gasket 3 is provided on the inner surface of the space groove 2, a top cover 4 is bonded to the upper surface of the base plate 1, a pin 5 is provided on the surface of the base plate 1, and a chamfer 6 is provided on the lower surface of the pin 5.
[0019] By adopting the above technical solution, in this packaging structure, a sealing gasket 3 is used to fill the space groove 2 and the top cover 4, thereby enhancing the sealing of the packaging structure. The surface of the pin 5 is provided with a chamfer 6 to facilitate the insertion of the pin 5 in the appropriate position.
[0020] like Figure 1-Figure 2 As shown, screw holes 7 are provided on the upper surface of the top cover 4, and the number of screw holes 7 is four. An aluminum plate 8 is provided on the upper surface of the top cover 4, and the material of the top cover 4 is aluminum. A plurality of fins 9 are fixedly connected to the upper surface of the aluminum plate 8, and the plurality of fins 9 are evenly distributed on the upper surface of the aluminum plate 8. The fins 9 are made of aluminum. The upper surface of the aluminum plate 8 extends to the inside of the screw holes 7 and is provided with disassembly screws 10, and the number of disassembly screws 10 is four.
[0021] Working principle: When using the packaging structure of the integrated circuit, first, in this packaging structure, a sealing gasket 3 is used to fill the space groove 2 and the top cover 4 to enhance the sealing of the packaging structure. The surface of the pin 5 is provided with a chamfer 6 to facilitate the insertion of the pin 5 in the appropriate position. The aluminum plate 8 can be fixed to the top cover 4 using the screw hole 7 and the removal screw 10. The fin 9 can exert good thermal conductivity and heat dissipation. This is the working principle of the packaging structure of the integrated circuit.
Claims
1. A packaging structure for an integrated circuit, comprising a base plate (1) and a space groove (2) provided on the inner surface of the base plate (1), characterized in that: The inner surface of the spatial groove (2) is provided with a sealing gasket (3), the upper surface of the bottom plate (1) is bonded with a top cover (4), the surface of the bottom plate (1) is provided with a plug pin (5), and the lower surface of the plug pin (5) is provided with a chamfer (6).
2. The integrated circuit packaging structure according to claim 1, wherein: The upper surface of the top cover (4) is provided with screw holes (7), and the number of the screw holes (7) is four.
3. The integrated circuit packaging structure according to claim 1, wherein: An aluminum plate (8) is provided on the upper surface of the top cover (4), and the material of the top cover (4) is aluminum.
4. The integrated circuit packaging structure according to claim 3, wherein: A plurality of fins (9) are fixedly connected to the upper surface of the aluminum plate (8), and the plurality of fins (9) are evenly distributed on the upper surface of the aluminum plate (8), and the fins (9) are made of aluminum.
5. The integrated circuit packaging structure according to claim 4, characterized in that: The upper surface of the aluminum plate (8) extends to the inside of the screw hole (7) and is provided with disassembly screws (10), and the number of the disassembly screws (10) is four.