Optical sensor and electronic device

Abstract

The utility model relates to a divisional application of a patent of a utility model with the name of optical sensor and electronic equipment and the application number of 202323134016.5. The utility model discloses an optical sensor and an electronic device, the optical sensor comprises a first substrate, an optical sensing chip, a processing chip and a shading conductive housing, the processing chip is installed on the first substrate and is electrically connected with the first substrate; the optical sensing chip is installed on the processing chip and is electrically connected with the processing chip or installed on the first substrate and is electrically connected with the first substrate, one or more grounding pads are arranged on the first substrate, the shading conductive shell is fixed on the first substrate and is electrically connected with the grounding pads, the shading conductive shell and the first substrate define a containing cavity, and the containing cavity is communicated with the processing chip. The optical sensing chip and the processing chip are located in the containing cavity, and a first opening is formed in the position, corresponding to the optical sensing chip, of the shading conductive shell. Noise interference of the external environment on optical sensor signals is effectively reduced, the signal-to-noise ratio is improved, and the performance of the optical sensor is improved.

Description

[0001] This application is a divisional application of the utility model patent with the utility model name “Optical sensor and electronic device” and application number 202323134016.5. Technical Field

[0002] The utility model relates to the field of electronic technology, and more specifically, to an optical sensor and electronic equipment. Background Art

[0003] With the development of the consumer electronics industry, especially the shift toward full-screen displays for mobile communication devices, screen transmittance is decreasing, necessitating continuous upgrades and performance improvements for optical sensors. To further enhance the performance of optical sensor chips, noise reduction can be used to improve the signal-to-noise ratio. Testing has found that in indoor environments, the interference frequency is close to the ambient power frequency, and the interference frequency in under-display scenarios is strongly correlated with the screen driver refresh rate. Existing packaging methods fail to provide electromagnetic shielding protection for internal components, making them susceptible to interference from electromagnetic radiation, which can affect the performance of optical sensors. Utility Model Content

[0004] In response to the shortcomings of the existing technology, the utility model innovatively provides an optical sensor and electronic device, in which a light-transmitting conductive plate is arranged at the first opening of the light-shielding conductive shell to shield the electromagnetic interference generated by the screen drive refresh, reduce noise interference to the optical sensor signal, ensure the transmittance of ambient light while reducing signal loss, improve the signal-to-noise ratio, and further enhance the performance of the optical sensor.

[0005] To achieve the above technical objectives, the first aspect of the present invention discloses an optical sensor, comprising a first substrate, an optical sensor chip, a processing chip, a light-shielding conductive housing, and a light-transmitting conductive plate.

[0006] The processing chip is mounted on the first substrate and electrically connected to the first substrate, the optical sensor chip is mounted on the processing chip and electrically connected to the processing chip, or the optical sensor chip is mounted on the first substrate and electrically connected to the first substrate,

[0007] One or more ground pads are provided on the first substrate.

[0008] The light-shielding conductive housing is fixed on the first substrate and electrically connected to the ground pad. The light-shielding conductive housing and the first substrate form a receiving cavity. The optical sensor chip and the processing chip are located in the receiving cavity. A first opening is provided on the light-shielding conductive housing at a position corresponding to the optical sensor chip so that the optical sensor chip can receive external light.

[0009] The light-transmitting conductive plate closes the first opening and is electrically connected to the light-shielding conductive housing.

[0010] The light-shielding conductive housing includes a metal housing or a non-metal housing and a metal coating plated on the surface of the non-metal housing.

[0011] Furthermore, the light-shielding conductive housing is electrically connected to the ground pad via a conductive adhesive layer, and the light-shielding conductive housing is bonded and fixed to the first substrate via a structural adhesive layer.

[0012] Furthermore, the optical sensor chip is encapsulated with a first transparent packaging layer.

[0013] Furthermore, it also includes a light-emitting chip, which is mounted on the first substrate and electrically connected to the first substrate, and the light-emitting chip is electrically connected to the processing chip; a light-shielding conductive partition is provided in the light-shielding conductive shell, and the light-shielding conductive partition divides the accommodating cavity into two cavities that are not connected to each other, and the optical sensor chip and the light-emitting chip are in different cavities. The light-shielding conductive shell is provided with a second opening corresponding to the position of the light-emitting chip for the light emitted by the light-emitting chip to pass through.

[0014] Furthermore, the light-shielding conductive spacer is electrically connected to the ground pad through a conductive adhesive layer.

[0015] Furthermore, the light-emitting chip is encapsulated with a second transparent encapsulation layer.

[0016] To achieve the above technical objectives, the second aspect of the present invention discloses an electronic device, comprising the optical sensor described in the first aspect.

[0017] The beneficial effects of the utility model are:

[0018] The optical sensor of the utility model is provided with a light-transmitting conductive plate at the first opening of the light-shielding conductive shell to shield the electromagnetic interference generated by the screen drive refresh, reduce the noise interference to the optical sensor signal, ensure the transmittance of ambient light while reducing signal loss, improve the signal-to-noise ratio, and further enhance the performance of the optical sensor. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a longitudinal cross-sectional view of the optical sensor according to the first embodiment of the present invention.

[0020] Figure 2 It is a longitudinal cross-sectional view of an optical sensor according to the second embodiment of the present invention.

[0021] Figure 3 It is a longitudinal cross-sectional view of an optical sensor according to a third embodiment of the present invention.

[0022] Figure 4 It is a longitudinal sectional view of an optical sensor according to a fourth embodiment of the present invention.

[0023] Figure 5 It is a longitudinal sectional view of an optical sensor according to a fifth embodiment of the present invention.

[0024] Figure 6 yes Figure 4 and Figure 5 A top view of the optical sensor (excluding the light-transmitting conductive plate) of the illustrated embodiment.

[0025] In the figure,

[0026] 1. First substrate; 11. Ground pad; 2. Optical sensor chip; 3. Processing chip; 4. Light-emitting chip; 5. Light-shielding conductive shell; 51. First opening; 52. Second opening; 6. Light-transmitting conductive plate; 61. Transparent plate; 62. Transparent conductive layer; 7. Conductive adhesive layer; 8. First transparent encapsulation layer; 9. Second transparent encapsulation layer; 10. Second substrate; 20. Silver paste or DAF film; 30. Structural adhesive layer; 40. Welding wire; 50. Light-shielding conductive spacer; 60. Solder or silver paste. DETAILED DESCRIPTION

[0027] The optical sensor and electronic device provided by the present invention are explained and illustrated in detail below with reference to the accompanying drawings.

[0028] This embodiment specifically discloses an optical sensor, such as Figure 1-3 As shown, it includes a first substrate 1, an optical sensor chip 2, a processing chip 3, a light-shielding conductive shell 5 and a light-transmitting conductive plate 6. The processing chip 3 is mounted on the first substrate 1 and electrically connected to the first substrate 1. Specifically, the processing chip 3 is fixed to the upper surface of the first substrate 1. The processing chip 3 is bonded and fixed to the first substrate 1 through silver paste or DAF film (Die Attach Film) 20. The processing chip 3 is electrically connected to the first substrate 1 through welding wires 40. A circuit is provided inside the first substrate 1, which serves as a carrier for packaging and can be interconnected with external signals. Figure 1 and 2 As shown, the optical sensor chip 2 is mounted on the processing chip 3 and is electrically connected to the processing chip 3. Specifically, the optical sensor chip 2 is fixed to the upper surface of the processing chip 3, and the optical sensor chip 2 is bonded and fixed to the processing chip 3 through silver paste or DAF film 20. The optical sensor chip 2 is electrically connected to the processing chip 3 through bonding wires 40. In another embodiment, as shown in FIG. Figure 3As shown, optical sensor chip 2 is mounted on and electrically connected to first substrate 1. Specifically, optical sensor chip 2 is fixed to the upper surface of first substrate 1 and bonded to first substrate 1 via silver paste or DAF film 20. Optical sensor chip 2 is electrically connected to first substrate 1 via bonding wires 40. Optical sensor chip 2 and processing chip 3 are electrically connected via circuitry within first substrate 1. Optical sensor chip 2 can receive external light signals and convert them into electrical signals. Processing chip 3 can process the electrical signals transmitted by optical sensor chip 2 and transmit the processed results.

[0029] like Figure 1-3 As shown, one or more ground pads 11 are provided on the first substrate 1. The number and position of the ground pads 11 are not limited and can be arranged according to actual needs. A light-shielding conductive housing 5 is fixed to the first substrate 1 and electrically connected to the ground pads 11. The light-shielding conductive housing 5 and the first substrate 1 form a receiving cavity, and the optical sensor chip 2 and the processing chip 3 are located in the receiving cavity. The light-shielding conductive housing 5 has a first opening 51 at the position corresponding to the optical sensor chip 2, which allows the optical sensor chip 2 to receive external light.

[0030] Specifically, the light-shielding conductive shell 5 includes a top plate and side plates extending downward from the four sides of the top plate. The opening formed by the side plates is snap-fitted and fixed on the first substrate 1, so that the light-shielding conductive shell 5 and the first substrate 1 form a accommodating cavity. The light-shielding conductive shell 5 provides protection for the optical sensor chip 2 and the processing chip 3 to prevent physical damage to them by external forces, and at the same time provides electromagnetic shielding to isolate external electromagnetic signals and reduce electromagnetic interference.

[0031] Specifically, the first opening 51 is opened on the top plate of the light-shielding conductive shell 5. The first opening 51 is located directly above the optical sensor chip 2 and its size corresponds to the size of the optical receiving area of ​​the optical sensor chip 2, thereby improving the light transmission rate and ensuring the sensitivity of the optical sensor.

[0032] Optionally, the light-shielding conductive shell 5 includes a metal shell or a non-metal shell and a metal coating plated on the surface of the non-metal shell, which has a good electromagnetic shielding effect and is easy to produce.

[0033] Optional, such as Figure 1-3As shown, the light-shielding conductive housing 5 is electrically connected to the ground pad 11 via a conductive adhesive layer 7, and the light-shielding conductive housing 5 is bonded and fixed to the first substrate 1 via a structural adhesive layer 30. Specifically, a conductive adhesive layer 7 is applied between the bottom of the side panel of the light-shielding conductive housing 5 and the ground pad 11 to achieve electrical connection between the light-shielding conductive housing 5 and the ground pad 11, and a structural adhesive layer 30 is applied between the bottom of the side panel of the light-shielding conductive housing 5 and the upper surface of the first substrate 1 to achieve bonding and fixation. The thermal expansion coefficients of the conductive adhesive and the structural adhesive are similar, and preferably the same, to ensure the stability of the optical sensor.

[0034] In this embodiment, the light-transmitting conductive plate 6 closes the first opening 51 and is electrically connected to the light-shielding conductive housing 5 , allowing external light to pass through while shielding electromagnetic interference, thereby reducing signal loss.

[0035] In some embodiments, the light-transmitting conductive plate 6 is embedded in the first opening 51 or the light-transmitting conductive plate 6 is disposed above the light-shielding conductive housing 5 and covers the first opening 51. Figure 1 and 3 As shown, the first opening 51 is a stepped opening, and the light-transmitting conductive plate 6 is embedded in the first opening 51 and placed on the stepped surface of the first opening 51. Figure 2 As shown, the light-transmitting conductive plate 6 is disposed above the top plate of the light-shielding conductive housing 5 and covers the first opening 51 .

[0036] In some embodiments, the light-transmitting conductive plate 6 includes a transparent plate 61 and a transparent conductive layer 62 plated on the transparent plate 61. Preferably, the light transmittance of the transparent conductive layer 62 is ≥75% to ensure the transmittance of light. The transparent conductive layer 62 is arranged on the surface of the transparent plate 61 close to the optical sensor chip 2, that is, on the lower surface of the transparent plate 62 shown in the figure.

[0037] Optionally, the transparent plate 61 is a glass plate or a transparent optical resin plate, and the transparent conductive layer 62 includes at least one of indium tin oxide, indium zinc oxide, or nanosilver, and is electrically connected to the light-shielding conductive housing 5. The transparent optical resin plate can be a phenolic resin plate, a PETG (polyethylene terephthalate-1,4-cyclohexanedimethanol) resin plate, or a PMMA (polymethyl methacrylate) resin plate.

[0038] Optionally, the light-transmitting conductive plate 6 and the light-shielding conductive housing 5 are electrically connected via a conductive adhesive layer 7. Figure 1 and Figure 3 In the embodiment, a conductive adhesive layer 7 is provided between the transparent conductive layer 62 of the light-transmitting conductive plate 6 and the stepped surface of the first opening 51. The transparent plate 61 and the light-shielding conductive housing 5 are bonded and fixed by a structural adhesive layer 30 to improve the fixing strength. Figure 2 In the embodiment, a conductive adhesive layer 7 is provided between the transparent conductive layer 62 of the light-transmitting conductive plate 6 and the upper surface of the top plate of the light-shielding conductive housing 5 .

[0039] Optionally, the optical sensor chip 2 is encapsulated with a first transparent encapsulation layer 8, which seals and protects the optical sensor chip 2. Preferably, the first transparent encapsulation layer 8 is an EMC (Epoxy Molding Compound) layer. Figure 1 and Figure 2 The first transparent encapsulation layer 8 encapsulates the optical sensor chip 2 and the processing chip 3 together; Figure 3 The optical sensor chip 2 and the processing chip 3 may be encapsulated by the same first transparent encapsulation layer 8 , or may be encapsulated by separate first transparent encapsulation layers 8 .

[0040] In some embodiments, as Figure 4 and 5 As shown, the optical sensor also includes a light-emitting chip 4, which is mounted on the first substrate 1 and electrically connected to the first substrate 1, and the light-emitting chip 4 is electrically connected to the processing chip 3; in this embodiment, the light-emitting chip 4 can be a light source capable of emitting light, such as an LED chip, a photodiode, an edge-emitting laser chip, etc., and the processing chip 3 can control the lighting and extinguishing of the light-emitting chip 4. The light-emitting chip 4 is fixed on the upper surface of the first substrate 1, and the light-emitting chip 4 and the processing chip 3 are electrically connected through the circuit inside the first substrate 1.

[0041] like Figure 4-6 As shown, a light-shielding conductive partition 50 is provided in the light-shielding conductive shell 5. The light-shielding conductive shell 5 and the light-shielding conductive partition 50 are integrally formed. The light-shielding conductive partition 50 divides the accommodating cavity into two mutually incommunicative cavities. The optical sensor chip 2 and the light-emitting chip 4 are in different cavities. The light-shielding conductive partition 50 can prevent the light signal emitted by the light-emitting chip 4 from directly propagating to the surface of the optical sensor chip 2 and affecting the performance of the product. When the optical sensor chip 2 is fixed on the upper surface of the first substrate 1, the processing chip 3 can be in the same cavity as the optical sensor chip 2, or in the same cavity as the light-emitting chip 4. A second opening 52 for the light emitted by the light-emitting chip 4 to pass through is provided in the light-shielding conductive shell 5 at the position corresponding to the light-emitting chip 4, so that the light emitted by the light-emitting chip 4 can pass through the second opening 52 and enter the outside world.

[0042] Optionally, a second opening 52 is provided on the top plate of the light-shielding conductive housing 5. The second opening 52 is located directly above the light-emitting chip 4 and has a size corresponding to the light-emitting area of ​​the light-emitting chip 4, thereby increasing the light transmission rate and ensuring the sensitivity of the optical sensor. The light-transmitting conductive plate 6 may also seal the second opening 52 to improve the electromagnetic shielding effect. Figure 5 As shown, the light-transmitting conductive plate 6 is fixed on the top surface of the light-shielding conductive housing 5 , and simultaneously closes the first opening 51 and the second opening 52 .

[0043] Optional, such as Figure 6As shown, a ground pad 11 may be provided in the middle of the first substrate 1 , and the light-shielding conductive spacer 50 is electrically connected to the ground pad 11 through the conductive adhesive layer 7 .

[0044] Optionally, the light emitting chip 4 is encapsulated with a second transparent encapsulation layer 9, which seals and protects the light emitting chip 4, thereby protecting the chip and allowing light to pass through. Preferably, the second transparent encapsulation layer 9 is an EMC (Epoxy Molding Compound) layer.

[0045] In some embodiments, the light-emitting chip 4 is an edge-emitting laser chip, which is used to provide a light source for sideways emission. The edge-emitting laser chip is fixed to the first substrate 1 through the second substrate 10. The second substrate 10 is fixed vertically to the first substrate 1 and is electrically connected to the first substrate 1 through solder or silver paste 60. The edge-emitting laser chip is mounted on the surface of the second substrate 10 adjacent to the first substrate 1 (the right side shown in the figure) through silver paste or DAF film 20 and is electrically connected to the second substrate 10 through welding wires 40. One end of the light source of the edge-emitting laser chip faces upward. The edge-emitting laser chip is packaged together with the second substrate 10 and fixed vertically on the first substrate 1. The edge-emitting laser chip is turned 90 degrees as a whole, and the side light it emits is converted into vertical light. The second transparent encapsulation layer 10 is arranged above the first substrate 1, encapsulating the light-emitting chip 4 and the welding wires 40 connecting the light-emitting chip 4 and the second substrate 10, sealing and protecting the edge-emitting laser chip and the welding wires 40.

[0046] The optical sensor disclosed in this application can effectively reduce the noise interference of the external environment on the optical sensor signal, improve the signal-to-noise ratio of the optical sensor, optimize the performance of the optical sensor chip, and can be applied to low-transmittance screens.

[0047] The optical sensor disclosed in this application can be applied to all products involving optical sensors, such as under-screen proximity sensors, color temperature sensors and other optical sensor products.

[0048] The present application also discloses an electronic device including the optical sensor described in the above embodiment. The electronic device is an electronic device with a display screen, and can be a laptop, mobile phone, tablet computer, desktop computer, gaming device, in-vehicle electronic device, wearable smart device, etc.

[0049] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation to the present invention.

[0050] In this utility model, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, or indirect connection through an intermediate medium; internal communication between two components, or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0051] In the description of this specification, the description with reference to the terms "this embodiment", "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in an appropriate manner in any at least one embodiment or example. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and the features of different embodiments or examples, unless they are contradictory.

[0052] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of this utility model, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0053] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements, and simple improvements made to the essential contents of the present invention shall be included in the scope of protection of the present invention.

Claims

1. An optical sensor, characterized in that: It comprises a first substrate (1), an optical sensor chip (2), a processing chip (3), a light-shielding conductive housing (5), and a light-transmitting conductive plate (6). The processing chip (3) is mounted on the first substrate (1) and electrically connected to the first substrate (1), the optical sensor chip (2) is mounted on the processing chip (3) and electrically connected to the processing chip (3), or the optical sensor chip (2) is mounted on the first substrate (1) and electrically connected to the first substrate (1), One or more ground pads (11) are provided on the first substrate (1). The light-shielding conductive shell (5) is fixed on the first substrate (1) and electrically connected to the ground pad (11); the light-shielding conductive shell (5) and the first substrate (1) form a receiving cavity; the optical sensor chip (2) and the processing chip (3) are located in the receiving cavity; a first opening (51) is provided on the light-shielding conductive shell (5) at a position corresponding to the optical sensor chip (2) so that the optical sensor chip (2) can receive external light. The light-transmitting conductive plate (6) closes the first opening (51) and is electrically connected to the light-shielding conductive housing (5). The light-shielding conductive housing (5) comprises a metal housing or a non-metal housing and a metal coating plated on the surface of the non-metal housing. The optical sensor chip (2) is encapsulated with a first transparent encapsulation layer (8).

2. The optical sensor according to claim 1, wherein The light-shielding conductive housing (5) and the ground pad (11) are electrically connected via a conductive adhesive layer (7), and the light-shielding conductive housing (5) and the first substrate (1) are bonded and fixed via a structural adhesive layer (30).

3. The optical sensor according to claim 1, wherein The light-emitting chip (4) is also included. The light-emitting chip (4) is mounted on the first substrate (1) and electrically connected to the first substrate (1). The light-emitting chip (4) is electrically connected to the processing chip (3). A light-shielding conductive partition (50) is provided in the light-shielding conductive shell (5). The light-shielding conductive partition (50) divides the accommodating cavity into two cavities that are not connected to each other. The optical sensor chip (2) and the light-emitting chip (4) are located in different cavities. The light-shielding conductive shell (5) is provided with a second opening (52) at a position corresponding to the light-emitting chip (4) for light emitted by the light-emitting chip (4) to pass through.

4. The optical sensor according to claim 3, wherein The light-shielding conductive partition (50) is electrically connected to the ground pad (11) via a conductive adhesive layer (7).

5. The optical sensor according to claim 3, wherein The light-emitting chip (4) is encapsulated with a second transparent encapsulation layer (9).

6. An electronic device, characterized in that: The optical sensor comprises the optical sensor according to any one of claims 1 to 5.

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