Socket assembly and substrate

Abstract

The utility model provides a socket assembly and a substrate obtained by researching inner layer wiring arrangement. A plurality of wires among the plurality of first inner layer wires (134) are led out toward the second electrode row (L2) when viewed from the depth direction (Dd), and a plurality of wires among the plurality of second inner layer wires (134) are led out toward the first electrode row (L1) when viewed from the depth direction (Dd).

Description

Technical Field

[0001] The utility model relates to a socket component and a base plate. Background Art

[0002] For example, US Pat. No. 11177596B1 discloses a board end connector.

[0003] The board-side connector is fixed to the circuit board by inserting the plurality of plugging members of the housing into a jack of the circuit board.

[0004] When a hole (opening) such as a socket is formed in a circuit substrate as in US Pat. No. 11177596B1, it is necessary to consider the layout of inner layer wiring (pattern) formed in the inner layer of the circuit substrate.

[0005] Therefore, an object of the present invention is to provide a socket assembly and a substrate obtained by studying the inner layer wiring layout. Utility Model Content

[0006] In order to solve the above problems, the socket assembly and substrate of the present invention adopt the following methods.

[0007] 4. The socket assembly of claim 1, wherein the socket assembly comprises a substrate comprising a first surface and a second surface serving as the back surface of the first surface; and a connector mounted on the substrate and allowing an external module to be inserted along a first direction substantially perpendicular to the first surface, wherein the direction perpendicular to the first direction is set as a second direction, and the direction perpendicular to the first direction and the second direction is set as a third direction, wherein the connector comprises a plurality of contact pins in contact with the external module; and a shell holding the plurality of contact pins, wherein the plurality of contact pins constitute a first pin group arranged in a row along the second direction; and a second pin group arranged in a row along the second direction and spaced apart from the first pin group in the third direction, wherein the substrate comprises a plurality of electrodes arranged on the first surface for mounting each of the contact pins; and a plurality of inner layer wirings formed on the shell. The inner layer between the first surface and the second surface is connected to each of the electrodes via a via hole, and the plurality of electrodes constitute: a first electrode column, which is arranged in a column along the second direction and is used to install the contact pins included in the first pin group; and a second electrode column, which is arranged in a column along the second direction and is configured at a distance from the first electrode column in the third direction, and is used to install the contact pins included in the second pin group. The plurality of inner layer wirings include: a plurality of first inner layer wirings, which are connected to the plurality of electrodes included in the first electrode column; and a plurality of second inner layer wirings, which are connected to the plurality of electrodes included in the second electrode column. When viewed from the first direction, some of the plurality of first inner layer wirings are led out toward the second electrode column, and when viewed from the first direction, some of the plurality of second inner layer wirings are led out toward the first electrode column.

[0008] According to the socket assembly of this embodiment, by intentionally leading the inner wiring to the area between the first and second electrode arrays, the number of inner wirings that must be led to the outer area can be reduced, thereby ensuring an area for providing openings, etc. in the outer area.

[0009] The second embodiment of the present invention relates to a socket assembly, in which, in the first embodiment, the plurality of contact pins constitute: a third pin group, which is arranged in a row along the second direction; and a fourth pin group, which is arranged in a row along the second direction and is arranged at a distance from the third pin group in the third direction, and the plurality of electrodes constitute: a third electrode column, which is arranged in a row along the second direction and is used to install the contact pins included in the third pin group; and a fourth electrode column, which is arranged in a row along the second direction and is arranged at a distance from the third electrode column in the third direction and is used to install the contact pins included in the fourth pin group, and the first electrode column and the second electrode column are arranged between the third electrode column and the fourth electrode column in the third direction.

[0010] According to the socket assembly according to this aspect, the third electrode array and the fourth electrode array can be provided in the outer region.

[0011] The third embodiment of the present invention relates to a socket assembly. In the first embodiment, the connector has a plurality of protrusions, which are fixed to the shell and protrude along the first direction. The substrate has a plurality of through holes, which are formed in a manner of passing through from the first surface to the second surface for the protrusions to be inserted. The through holes are arranged on the extension line of the first electrode column and / or the second electrode column along the second direction.

[0012] According to the socket assembly according to this aspect, the inner layer wiring can be led out without interfering with the through hole.

[0013] The fourth embodiment of the present invention relates to a socket assembly, in which, in the second embodiment, the connector has a plurality of protrusions, which are fixed to the shell and protrude along the first direction; the substrate has a plurality of through holes, which are formed in a manner of passing through from the first surface to the second surface for the protrusions to be inserted; and the through holes are arranged on extension lines of the first electrode column or the third electrode column and the second electrode column or the fourth electrode column along the second direction.

[0014] According to the socket assembly according to this aspect, the inner layer wiring can be led out without interfering with the through hole.

[0015] The socket assembly according to a fifth aspect of the present invention, in any one of the first to fourth aspects, the first inner layer wiring is led out according to each electrode pair of the electrodes adjacent in the second direction, and the second inner layer wiring is led out according to each electrode pair of the electrodes adjacent in the second direction.

[0016] According to the socket assembly of this aspect, inner-layer wiring can be led out for each of the adjacent electrode pads corresponding to the high-speed signal pair (differential pair).

[0017] The socket assembly involved in the sixth embodiment of the present invention, in any one of the first to fifth embodiments, on the substrate, the distance along the first direction from the electrode to the first inner layer wiring is a distance at which the electrode and the first inner layer wiring are not electrically coupled, and the distance along the first direction from the electrode to the second inner layer wiring is a distance at which the electrode and the second inner layer wiring are not electrically coupled.

[0018] According to the socket assembly according to this aspect, it is possible to suppress the generation of stubs at the overlapping portions of the electrodes and the inner-layer wiring, thereby improving transmission characteristics.

[0019] A seventh aspect of the present invention relates to the socket assembly according to the sixth aspect, wherein a distance from the electrode to the first inner layer wiring along the first direction is greater than or equal to 0.5 mm, and a distance from the electrode to the second inner layer wiring along the first direction is greater than or equal to 0.5 mm.

[0020] According to the socket assembly of this aspect, it is possible to suppress the generation of stubs at overlapping portions of the electrodes and the inner-layer wiring, thereby improving transmission characteristics.

[0021] The eighth aspect of the present invention involves a socket assembly. In any one of the first to seventh aspects, the substrate has a through opening, which is formed in a manner of passing through from the first surface to the second surface, and the through opening extends along the second direction in a manner parallel to the first electrode column and / or the second electrode column in an area where the inner layer wiring is not formed.

[0022] According to the socket assembly of this aspect, a large opening area of ​​the through opening can be ensured, and the air passing through the heat sink can be smoothly guided to the outside space.

[0023] The ninth aspect of the present invention relates to a socket assembly in which, in the eighth aspect, the through opening is formed in a region farther away from the second electrode column than the first electrode column in the third direction and / or is formed in a region farther away from the first electrode column than the second electrode column in the third direction.

[0024] According to the socket assembly of this aspect, a large opening area of ​​the through opening can be ensured, and the air passing through the heat sink can be smoothly guided to the outside space.

[0025] The tenth aspect of the present invention involves a socket assembly, in any one of the first to ninth aspects, the shell of the connector has a convex portion protruding along the first direction, the substrate has a concave portion for the convex portion to be embedded, the through hole of the substrate is arranged on the side of the first electrode column and the side of the second electrode column along the second direction, and the concave portion of the substrate is arranged in the third direction between the through hole arranged on the side of the first electrode column and the through hole arranged on the side of the second electrode column.

[0026] According to the receptacle assembly of this aspect, the connector can be positioned at a predetermined position by fitting the convex portion of the housing into the concave portion of the substrate.

[0027] The eleventh embodiment of the present invention relates to a socket assembly, in any one of the first to tenth embodiments, wherein the connector has a metal shell covering the shell, a plurality of protrusions are formed on the shell, and are fixed by welding in a state of being inserted into the through hole, the shell has a step portion on the outer peripheral surface, and the edge of the shell facing the substrate abuts against the step portion of the shell.

[0028] According to the socket assembly of this embodiment, the housing is pressed into the shell, and its movement in the first direction away from the substrate is restricted. This improves the resistance of the connector to insertion and removal from the external module.

[0029] The socket assembly involved in the twelfth embodiment of the present invention, in any one of the first to eleventh embodiments, includes a plurality of cages, each of which is defined with at least one port for accommodating the external module, and each of the cages is fixed to the substrate in a state of accommodating the connector mounted on the substrate, and is arranged in a manner spaced apart from each other in at least any one of the second direction and the third direction.

[0030] According to the socket assembly of this embodiment, by providing spacing between cages, the substrates located between the cages, where the cages and their associated connectors are not mounted, can be used for internal wiring. This shortens the internal wiring from the cage-attached connectors to the ASIC, improving transmission characteristics.

[0031] The thirteenth embodiment of the present invention relates to a substrate for installing an external connector, wherein the external connector is for inserting an external module along a first direction and has a plurality of contact pins, a direction perpendicular to the first direction is set as a second direction, and a direction perpendicular to the first direction and the second direction is set as a third direction, the substrate includes: a plurality of electrodes, which are arranged on a first surface for installing each of the contact pins; and a plurality of inner layer wirings, which are formed in an inner layer between the first surface and a second surface which is the back surface of the first surface, and are connected to each of the electrodes via vias, the plurality of electrodes constituting: a first electrode column, which is arranged along the second surface direction; and a second electrode column, which is arranged in a column along the second direction and is configured at a distance from the first electrode column in the third direction, the plurality of inner layer wirings include: a plurality of first inner layer wirings, which are connected to the plurality of electrodes included in the first electrode column; and a plurality of second inner layer wirings, which are connected to the plurality of electrodes included in the second electrode column, when viewed from the first direction, some of the plurality of first inner layer wirings are led out toward the second electrode column, when viewed from the first direction, some of the plurality of second inner layer wirings are led out toward the first electrode column. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 This is a perspective view of the receptacle assembly and the optical module according to the first embodiment (when the optical module is removed).

[0033] Figure 2 This is a perspective view of the receptacle assembly and the optical module according to the first embodiment (when the optical module is inserted).

[0034] Figure 3 This is a perspective view of the receptacle assembly (cage omitted) and the optical module according to the first embodiment.

[0035] Figure 4 This is an exploded perspective view of the socket assembly (cage omitted) according to the first embodiment.

[0036] Figure 5 It is a perspective view of the connector according to the first embodiment.

[0037] Figure 6 It is an exploded perspective view of the connector according to the first embodiment.

[0038] Figure 7 It is a plan view of the surface layer of the substrate according to the first embodiment.

[0039] Figure 8 yes Figure 3 A partial enlarged view of part A.

[0040] Figure 9It is a plan view of the inner layer of the substrate according to the first embodiment.

[0041] Figure 10 It is a partial cross-sectional view of the socket assembly according to the first embodiment (a plane perpendicular to the width direction is regarded as a cross section).

[0042] Figure 11 This is a front view showing the cage configuration.

[0043] Figure 12 It is an exploded perspective view showing the arrangement of the cage.

[0044] Figure 13 It is a front view showing the arrangement of a cage as a comparative example.

[0045] Figure 14 It is a perspective view of a connector according to a second embodiment.

[0046] Figure 15 It is an exploded perspective view of a connector according to a second embodiment.

[0047] Figure 16 It is a plan view of the surface layer of the substrate according to the second embodiment.

[0048] Figure 17 It is a plan view of the inner layer of the substrate according to the second embodiment.

[0049] Description of Reference Numerals

[0050] 10 Optical module (external module) 11 Module substrate (external module substrate)

[0051] 12 Radiator 100 Socket Assembly

[0052] 110, 110', 110" cage 111 cylinder

[0053] 112 flange portion 120 connector

[0054] 121 housing 121a convex portion

[0055] 121b step portion 121c step portion

[0056] 122 contact pin 122a mounting portion

[0057] 123 housing 123a protruding terminal (protruding portion)

[0058] 130 substrate 130a first surface

[0059] 130b Second surface 131 Electrode pad

[0060] 132 through hole 133 via hole

[0061] 134 pattern (inner layer wiring) 135 through opening

[0062] 136 recess 138ASIC

[0063] 220 connector 221 housing

[0064] 221X outer shell 221Y inner shell

[0065] 221b step portion 221c step portion

[0066] 222 contact pin 223 housing

[0067] 223a protruding terminal (protruding portion) 230 substrate

[0068] 231 electrode pad 232 through hole

[0069] 234 pattern (inner layer wiring) 235 through opening

[0070] 236 concave G1 first stitch group

[0071] G2 second pin group G3 third pin group

[0072] G4 fourth pin group L1 first electrode row

[0073] L2 second electrode row L3 third electrode row

[0074] L4 fourth electrode column DETAILED DESCRIPTION

[0075] A socket assembly according to a first embodiment and a second embodiment of the present invention will be described with reference to the drawings.

[0076] In addition, when the direction of inserting / removing the optical module is set as the insertion / removal direction Die, the depth direction Dd (first direction) is consistent with the insertion / removal direction Die, the width direction Dw (second direction) is orthogonal to the depth direction Dd, and the height direction Dh (third direction) is orthogonal to the depth direction Dd and the width direction Dw.

[0077] However, the insertion and removal direction Die, the depth direction Dd, the width direction Dw, and the height direction Dh are for facilitating understanding of the description and do not limit the actual posture.

[0078] In addition, in the cage assembly and the various components or elements that constitute these cage assemblies, the part, end, edge or surface close to the substrate is referred to as the "rear", "rear end", "rear edge", or "back", and the part, end, edge or surface away from the substrate is referred to as the "front", "front end", "front edge", or "front".

[0079] (First embodiment)

[0080] (About the basic structure)

[0081] like Figure 1 and Figure 2 As shown, the receptacle assembly 100 is a device for connecting an optical module 10 (external module). The optical module 10 is a module based on a form factor such as QSFP-DD, OSFP, or OSFP-XD.

[0082] like Figure 1 、 Figure 2 and Figure 3 As shown, the receptacle assembly 100 includes a cage 110 , a connector 120 , and a substrate 130 .

[0083] like Figure 2 As shown, the cage 110 is a component for accommodating the connector 120 and the optical module 10 , and is fixed to the first surface 130 a of the substrate 130 , which is the front surface.

[0084] In addition, the back surface of the substrate 130 is set as the second surface 130b (see Figure 10 ).

[0085] like Figure 1 and Figure 2 As shown, the cage 110 includes a cylindrical portion 111 and a flange portion 112. The cylindrical portion 111 is a square cylindrical portion including four walls, defining a space (port Sp) for accommodating the connector 120 and the optical module 10.

[0086] Flanges 112 are provided at the base ends of two of the four walls of the cylindrical portion 111 that face each other in the width direction Dw. Fastening members such as screws or bolts are inserted into the flanges 112. These fastening members are secured in threaded holes formed in a back plate (not shown) provided on the second surface 130b of the base plate 130, or through through-holes formed in the back plate, thereby securing the base plate 130 and the back plate with a nut (not shown). This secures the cage 110 to the base plate 130.

[0087] like Figure 3 and Figure 4 As shown, the connector 120 is a component into which the module substrate 11 included in the optical module 10 is inserted, and is fixed to the first surface 130 a of the substrate 130 .

[0088] The connector 120 is electrically connected to the substrate 130 and has a function of relaying between the module substrate 11 and the substrate 130 .

[0089] like Figure 5 and Figure 6As shown, the connector 120 includes a housing 121 , a plurality of contact pins 122 and a shell 123 .

[0090] The housing 121 is a substantially rectangular parallelepiped member that holds the plurality of contact pins 122 and has insulating properties.

[0091] The plurality of contact pins 122 are elongated, electrically conductive components. The plurality of contact pins 122 constitute a first pin group G1 and a second pin group G2. The first pin group G1 is a group (collection) of several contact pins 122 arranged in a row at regular intervals along the width direction Dw. Meanwhile, the second pin group G2 is a group (collection) of the remaining contact pins 122 arranged in a row at regular intervals along the width direction Dw. These pins are spaced apart from the first pin group G1 in the height direction Dh.

[0092] The housing 123 is a metal component that fits into the housing 121, covering its periphery. For example, the housing 123 is formed by bending a thin plate of a predetermined shape into a rectangular tube. Multiple protruding terminals 123a (protrusions) are provided at the rear end of the housing 123. Each protruding terminal 123a is an elongated portion that protrudes along the depth direction Dd toward the substrate 130.

[0093] like Figure 4 and Figure 7 As shown, the substrate 130 is a component on which the connector 120 is mounted, and an ASIC is disposed on the second surface 130 b of the substrate 130 .

[0094] like Figure 7 As shown, the substrate 130 has a plurality of electrode pads 131 . In addition, a plurality of through holes 132 are formed in the substrate 130 .

[0095] The electrode pad 131 is a portion connected to the mounting portion 122 a of the contact pin 122 included in the connector 120 .

[0096] The electrode pads 131 correspond one-to-one to the contact pins 122. Therefore, the plurality of electrode pads 131 constitute a first electrode column L1 corresponding to the first stitch group G1 and a second electrode column L2 corresponding to the second stitch group G2.

[0097] The first electrode array L1 is a group (collection) of several electrode pads 131 arranged in a row at a constant pitch along the width direction Dw. Meanwhile, the second electrode array L2 is a group (collection) of the remaining electrode pads 131 arranged in a row at a constant pitch along the width direction Dw, and is spaced apart in the height direction Dh from the first electrode array L1.

[0098] The through hole 132 is a hole into which the protruding terminal 123a of the housing 123 of the connector 120 is inserted (see Figure 8 ).

[0099] The inner peripheral surface of the through hole 132 is plated.

[0100] The number of through holes 132 corresponds to the number of protruding terminals 123a. Figure 7 As shown, in the case of this embodiment, the number of through holes 132 is four.

[0101] Two of the four through-holes 132 are disposed on both sides of the first electrode array L1 in the width direction Dw. In other words, the two through-holes 132 are disposed on an extension line of the first electrode array L1 along the width direction Dw.

[0102] The remaining two through-holes 132 are disposed on both sides of the second electrode array L2 in the width direction Dw. In other words, the two through-holes 132 are disposed on an extension line of the second electrode array L2 along the width direction Dw.

[0103] When the connector 120 is mounted on the substrate 130, solder paste is printed on the lands of the through-holes 132. With the protruding terminals 123a of the connector 120 inserted into the through-holes 132, the target component is heated using a heating device such as a reflow oven, causing the solder paste to flow into the through-holes 132. The target component is then cooled, and the protruding terminals 123a are soldered to the through-holes 132.

[0104] In addition, when the connector 120 is installed on the substrate 130, solder paste is printed on the electrode pad 131, and the target component is heated using a heating device such as a reflow furnace while the mounting portion 122a of the contact pin 122 is placed on the electrode pad 131. The target component is then cooled, whereby the mounting portion 122a (contact pin 122) is soldered to the electrode pad 131.

[0105] In this way, the connector 120 is mounted on the substrate 130 .

[0106] like Figure 9 As shown, the substrate 130 further has a pattern 134 (inner layer wiring).

[0107] The pattern 134 is provided in a layer (inner layer) between the first surface 130a and the second surface 130b, such as Figure 10 As shown, the substrate 130 is connected to the electrode pad 131 via a via hole 133 extending in the thickness direction of the substrate 130. In addition, the thickness direction of the substrate 130 coincides with the depth direction Dd.

[0108] like Figure 9 As shown, the pattern 134 is drawn out, for example, to the adjacent electrode pads 131 corresponding to the high-speed signal pair (differential pair).

[0109] In the patterns 134 (first inner layer wiring) connected to the first electrode array L1, some of the pairs of patterns 134 drawn out according to the respective differential pairs are drawn out toward the second electrode array L2 when viewed in the depth direction Dd, then turn approximately 90 degrees and extend along the width direction Dw. On the other hand, the remaining pairs of the pairs of patterns 134 drawn out according to the respective differential pairs are drawn out toward the side opposite to the side where the second electrode array L2 is located when viewed in the depth direction Dd, then turn approximately 90 degrees and extend along the width direction Dw.

[0110] In the patterns 134 (second inner layer wiring) connected to the second electrode array L2, some of the pairs of patterns 134 drawn out according to the respective differential pairs are drawn out toward the first electrode array L1 when viewed in the depth direction Dd, then turn approximately 90 degrees and extend along the width direction Dw. On the other hand, the remaining pairs of the pairs of patterns 134 drawn out according to the respective differential pairs are drawn out toward the side opposite to the side where the first electrode array L1 is located when viewed in the depth direction Dd, then turn approximately 90 degrees and extend along the width direction Dw.

[0111] By leading the pattern 134 as described above, the pattern 134 does not interfere with the through-holes 132 located substantially on the same straight line as the first electrode column L1 and the second electrode column L2 .

[0112] Furthermore, by intentionally extending some patterns 134 to the area between the first electrode array L1 and the second electrode array L2 (hereinafter referred to as the "inner area"), the number of patterns 134 that must be extended to the outer area can be reduced. This ensures sufficient area in the outer area for providing openings, etc. Here, the outer area refers to an area farther from the second electrode array L2 than the first electrode array L1 in the height direction Dh, and an area farther from the first electrode array L1 than the second electrode array L2 in the height direction Dh. In short, the outer area refers to an area located outside the inner area in the height direction Dh.

[0113] For example, a through opening 135 is formed in the outer region of the substrate 130 .

[0114] The through opening 135 is a quadrilateral opening extending in the width direction Dw in parallel with the first electrode array L1 and the second electrode array L2 , and penetrates from the first surface 130 a to the second surface 130 b of the substrate 130 .

[0115] The through opening 135 is for passing the heat sink 12 (see FIG. Figure 2 ) of the air is directed to the external space adjacent to the second surface 130b.

[0116] As described above, by designing the leading method of the pattern 134 to ensure a larger area of ​​the outer region, the opening area of ​​the through opening 135 can be ensured to be larger, and the air passing through the heat sink 12 can be smoothly guided to the external space.

[0117] like Figure 10 As shown, the pattern 134 is connected to the electrode pad 131 via the via 133 .

[0118] In this case, the distance d along the thickness direction of substrate 130 from the lower surface of electrode pad 131 to the upper surface of pattern 134 is the distance at which electrode pad 131 and pattern 134 are not electrically coupled without via 133 (the distance at which electrode pad 131 and pattern 134 are not directly electrically coupled). As a specific example, distance d is 0.5 mm or greater, preferably 0.7 mm or greater.

[0119] By ensuring that the distance d is equal to or greater than a certain length in this manner, the generation of a stub can be prevented.

[0120] Here, the stub will be described.

[0121] exist Figure 10 In FIG. 1 , the solid arrows represent the normal flow of electrical signals, and the dashed arrows represent the flow of electrical signals when the electrode pad 131 is electrically coupled to the pattern 134 without vias 133 .

[0122] First of all, Figure 9 The B part shown corresponds to Figure 10 The combination of the mounting portion 122a, electrode pad 131, via 133, and pattern 134 of the contact pin 122 on the left is described. Via 133 is connected to a portion of the electrode pad 131 located near the end of the mounting portion 122a extending toward the outer area. In addition, pattern 134 extends in the same direction as the extension direction of the mounting portion 122a. Therefore, the direction of the current flowing through the mounting portion 122a or electrode pad 131 is the same as the direction of the electrical signal flowing through the pattern 134 (strictly speaking, the portion near the beginning of the pattern 134).

[0123] Then, for Figure 9 The C part shown corresponds to Figure 101. The combination of the mounting portion 122a, the electrode pad 131, the via 133 and the pattern 134 of the contact pin 122 on the right side is described. The via 133 is connected to a portion of the electrode pad 131 located near the end of the mounting portion 122a extending toward the outer area. In addition, the pattern 134 extends in a direction opposite to the extension direction of the mounting portion 122a. Therefore, the direction of the current flowing through the mounting portion 122a or the electrode pad 131 is opposite to the direction of the electrical signal flowing through the pattern 134 (strictly speaking, the portion near the starting end of the pattern 134), and the mounting portion 122a or the electrode pad 131 overlaps with the pattern 134 when viewed from the depth direction Dd.

[0124] Here, assuming that the electrode pad 131 is electrically coupled with the pattern 134 without passing through the via 133 (see the dotted arrow), the mounting portion 122a, the electrode pad 131, the via 133, a portion of the pattern 134 overlapping with the mounting portion 122a, or a portion of the pattern 134 overlapping with the electrode pad 131 becomes a short line.

[0125] (Regarding connector positioning)

[0126] like Figure 6 As shown, the housing 121 is provided with a plurality of protrusions 121 a.

[0127] The protrusions 121 a are portions that protrude toward the substrate 130 , and are provided at the lower portion of the housing 121 and on both sides in the width direction Dw.

[0128] exist Figure 6 In the case of , the shape of the convex portion 121a is cylindrical. However, the shape of the convex portion 121a is not limited to cylindrical, and may be other shapes (for example, prism).

[0129] On the other hand, Figure 4 and Figure 7 As shown, a plurality of recesses 136 are provided on the substrate 130 .

[0130] The recessed portion 136 is a depression for fitting the convex portion 121a provided on the housing 121. Therefore, the shape of the recessed portion 136 matches the shape of the convex portion 121a.

[0131] The depth of the recess 136 is such that it does not reach the pattern 134 .

[0132] Each recess 136 is arranged between each through-hole 132 located on the side of the first electrode column L1 and each through-hole 132 located on the side of the second electrode column L2 in the height direction Dh.

[0133] like Figure 8As shown, when the connector 120 is placed on the first surface 130 a of the substrate 130 , the convex portion 121 a of the housing 121 is fitted into the concave portion 136 of the substrate 130 , whereby the connector 120 is positioned at a predetermined position.

[0134] The “predetermined position” mentioned here refers to a position where the protruding terminals 123 a of the housing 123 are inserted into the through holes 132 of the substrate 130 and the mounting portions 122 a of the contact pins 122 are in contact with the electrode pads 131 of the substrate 130 .

[0135] (Regarding the step portion of the connector)

[0136] like Figure 6 As shown, a step portion 121 b and a step portion 121 c are provided on the side surface of the housing 121 of the connector 120 .

[0137] The step portion 121 b is a portion of both side surfaces of the housing 121 perpendicular to the height direction Dh that protrudes outward or is enlarged, and has an upward surface perpendicular to the depth direction Dd.

[0138] The step portion 121 c is a portion of both side surfaces of the housing 121 perpendicular to the width direction Dw that protrudes outward or expands, and has an upward surface perpendicular to the depth direction Dd.

[0139] like Figure 5 As shown, a portion of the edge of the housing 123 facing the substrate 130 abuts against the surface of the step portion 121 b and the surface of the step portion 121 c .

[0140] like Figure 8 As shown, the housing 123 is fixed to the through-hole 132 of the substrate 130 via the protruding terminal 123a. Therefore, the casing 121 is pressed into the housing 123 and its movement in the depth direction Dd away from the substrate 130 is restricted. This improves the resistance of the connector 120 to insertion and removal from the optical module 10.

[0141] (About cage configuration)

[0142] Figure 1 The cage 110 is defined with one port Sp.

[0143] However, the form of the cage 110 is not limited thereto, and may be, for example, Figure 11 The upper and lower parts of the cage 110 ′ are demarcated with 2×2 ports Sp, or the upper and lower parts of the cage 110 ″ are demarcated with 2×1 port Sp.

[0144] exist Figure 11In this case, the cage 110 ′ and the cage 110 ″ fixed to the first surface 130 a of the substrate 130 are arranged along the width direction Dw above and below the ASIC 138 arranged on the second surface 130 b of the substrate 130 when the substrate 130 is viewed from the front.

[0145] Specifically, if Figure 11 and Figure 12 As shown, a plurality of cages 110 ′ are arranged in a spaced-apart manner along the width direction Dw, and two cages 110 ″ are arranged in a spaced-apart manner relative to the cages 110 ′ on both sides of the combination including the plurality of cages 110 ′.

[0146] The reason for spacing the cages 110 ′ and 110 ′ or the cages 110 ′ and 110 ″ along the width direction Dw is as follows.

[0147] Specifically, for example, if a space is placed between cages 110' and 110', the areas of substrate 130 where cages 110' and connectors 120 attached to these cages 110' are not mounted are located between cages 110' and 110'. Consequently, these areas of substrate 130 can be used for arranging patterns 134. This shortens the pattern 134 connecting the connectors 120 attached to each cage 110' to the ASIC 138, improving transmission characteristics. The same applies to the space between cages 110' and 110".

[0148] If there is no spacing between the cages 110' and 110' or between the cages 110' and 110", then as in the comparative example Figure 13 As shown, it is necessary to use the area of ​​the substrate 130 located on the periphery of the integrated cage 110"' to arrange the pattern 134. Figure 11 The pattern 134 will become longer compared with the shape of the same.

[0149] Alternatively, the same intervals may be provided in the height direction Dh.

[0150] The number of ports defined by the cage is not limited thereto. For example, a cage defining 2×2 ports or another cage defining 2×4 ports may be used. In this case, the cages defining 2×2 ports are arranged on both sides of the cage defining 2×4 ports, spaced apart from the cage.

[0151] (Second embodiment)

[0152] In this embodiment, the shapes of the connector 120 and the substrate 130 are different from those in the first embodiment, but the other structures are the same.

[0153] Therefore, the same structure is denoted by a different reference numeral in the hundreds digit, and the description thereof is omitted.

[0154] like Figure 14 and Figure 15 As shown, the connector 220 includes a housing 221 , a plurality of contact pins 222 and a shell 223 .

[0155] The housing 221 includes an outer housing 221X and an inner housing 221Y, and holds a plurality of contact pins 222. Furthermore, stepped portions 221b and 221c are provided on the side surfaces of the outer housing 221X.

[0156] In addition to the first and second pin groups G1 and G2 held in the inner housing 221Y, the plurality of contact pins 222 also constitute a third and fourth pin groups G3 and G4 held in the outer housing 221X. The third pin group G3 is a group (set) of contact pins 222 arranged in a row at regular intervals along the width direction Dw. Meanwhile, the fourth pin group G4 is a group (set) of contact pins 222 arranged in a row at regular intervals along the width direction Dw.

[0157] The third stitch group G3 and the fourth stitch group G4 are arranged outside the first stitch group G1 and the second stitch group G2.

[0158] In other words, the first and second pin groups G1 and G2 are arranged so as to be sandwiched between the third and fourth pin groups G3 and G4 in the height direction Dh.

[0159] like Figure 16 and Figure 17 As shown, in addition to the first electrode column L1 corresponding to the first stitch group G1 and the second electrode column L2 corresponding to the second stitch group G2, the plurality of electrode pads 231 further constitute a third electrode column L3 corresponding to the third stitch group G3 and a fourth electrode column L4 corresponding to the fourth stitch group G4.

[0160] The third electrode array L3 is a group (aggregate) of electrode pads 231 arranged in a row at a constant pitch along the width direction Dw. The fourth electrode array L4 is a group (aggregate) of electrode pads 231 arranged in a row at a constant pitch along the width direction Dw.

[0161] The third electrode array L3 and the fourth electrode array L4 are disposed in the outer region of the first electrode array L1 and the second electrode array L2.

[0162] In other words, the first electrode array L1 and the second electrode array L2 are disposed in the inner region of the third electrode array L3 and the fourth electrode array L4.

[0163] Two through holes 232 of the four through holes are arranged on both sides of the first electrode array L1 or the third electrode array L3 in the width direction Dw. In other words, the two through holes 232 are arranged on the extension line of the first electrode array L1 or the third electrode array L3 along the width direction Dw. Figure 16 and Figure 17 In the embodiment, the two through holes 232 are arranged on the extension line of the third electrode column L3.

[0164] The remaining two through holes 232 are arranged on both sides of the second electrode array L2 or the fourth electrode array L4 in the width direction Dw. In other words, the two through holes 232 are arranged on the extension line of the second electrode array L2 or the fourth electrode array L4 along the width direction Dw. Figure 16 and Figure 17 In FIG. 2 , the two through holes 232 are arranged on the extension line of the fourth electrode column L4.

[0165] Among the patterns 234 connected to the first electrode array L1 , the pairs of patterns 234 drawn out for each differential pair are drawn out toward the second electrode array L2 when viewed from the depth direction Dd, and then turn their directions approximately 90 degrees to extend along the width direction Dw.

[0166] Among the patterns 234 connected to the second electrode array L2 , the pairs of patterns 234 drawn out for each differential pair are drawn out toward the first electrode array L1 when viewed from the depth direction Dd, and then turn their directions approximately 90 degrees to extend along the width direction Dw.

[0167] Thus, by intentionally extending the pattern 234 to the inner region between the first electrode array L1 and the second electrode array L2 , it is possible to ensure an area in the outer region for providing the through opening 235 or the third electrode array L3 and the fourth electrode array L4 .

Claims

1. A socket assembly, characterized in that: include: a substrate comprising a first surface and a second surface serving as a back surface of the first surface; as well as a connector mounted on the substrate and allowing an external module to be inserted along a first direction substantially perpendicular to the first surface, A direction perpendicular to the first direction is set as a second direction, and a direction perpendicular to the first direction and the second direction is set as a third direction, The connector comprises: a plurality of contact pins that make contact with the external module; and a housing which holds the plurality of contact pins, The plurality of contact pins are composed of: a first pin group arranged in a row along the second direction; and a second pin group arranged in a row along the second direction and spaced apart from the first pin group in the third direction. The substrate comprises: a plurality of electrodes disposed on the first surface for mounting the contact pins; and a plurality of inner layer wirings formed in an inner layer between the first surface and the second surface and connected to the electrodes via via holes; The plurality of electrodes are composed of: a first electrode column arranged in a row along the second direction, for mounting the contact pins included in the first pin group; and a second electrode column arranged in a row along the second direction and spaced apart from the first electrode column in the third direction, for mounting the contact pins included in the second pin group. The plurality of inner layer wirings include: a plurality of first inner layer wirings connected to the plurality of electrodes included in the first electrode column; and a plurality of second inner layer wirings connected to the plurality of electrodes included in the second electrode column. When viewed from the first direction, some of the plurality of first inner layer wirings are led out toward the second electrode array. When viewed from the first direction, some of the plurality of second inner layer wirings are led out toward the first electrode column.

2. The socket assembly according to claim 1, wherein: The plurality of contact pins are composed of: a third pin group arranged in a row along the second direction; and a fourth pin group arranged in a row along the second direction and spaced apart from the third pin group in the third direction. The plurality of electrodes are composed of: a third electrode column arranged in a row along the second direction, for mounting the contact pins included in the third pin group; and a fourth electrode column arranged in a row along the second direction and spaced apart from the third electrode column in the third direction, for mounting the contact pins included in the fourth pin group. The first electrode column and the second electrode column are arranged between the third electrode column and the fourth electrode column in the third direction.

3. The socket assembly according to claim 1, wherein: The connector has a plurality of protrusions fixed to the housing and protruding along the first direction. The substrate has a plurality of through holes formed so as to penetrate from the first surface to the second surface, into which the protrusions are inserted. The through holes are arranged on extension lines of the first electrode columns and the second electrode columns along the second direction.

4. The socket assembly according to claim 2, wherein: The connector has a plurality of protrusions fixed to the housing and protruding along the first direction. The substrate has a plurality of through holes formed so as to penetrate from the first surface to the second surface, into which the protrusions are inserted. The through holes are arranged on extension lines of the first electrode column or the third electrode column and the second electrode column or the fourth electrode column along the second direction.

5. The socket assembly according to claim 1, wherein: The first inner layer wiring is led out for each electrode pair of the electrodes adjacent to each other in the second direction. The second inner layer wiring is led out for each electrode pair of the electrodes adjacent to each other in the second direction.

6. The socket assembly according to claim 1, wherein: In the substrate, The distance from the electrode to the first inner layer wiring along the first direction is a distance at which the electrode and the first inner layer wiring are not electrically coupled. A distance from the electrode to the second inner layer wiring along the first direction is a distance at which the electrode and the second inner layer wiring are not electrically coupled.

7. The socket assembly according to claim 6, wherein: The distance from the electrode to the first inner layer wiring along the first direction is 0.5 mm or more, A distance from the electrode to the second inner layer wiring along the first direction is 0.5 mm or more.

8. The socket assembly according to claim 1, wherein: The substrate has a through opening formed so as to penetrate from the first surface to the second surface. The through-openings extend in parallel with the first electrode columns and / or the second electrode columns along the second direction in a region where the inner layer wiring is not formed.

9. The socket assembly according to claim 8, wherein: The through-opening is formed in a region farther from the second electrode column than the first electrode column in the third direction and / or is formed in a region farther from the first electrode column than the second electrode column in the third direction.

10. The socket assembly according to claim 3, wherein: The housing of the connector has a convex portion protruding along the first direction, The substrate has a recessed portion into which the convex portion is embedded, The through holes of the substrate are arranged on the sides of the first electrode column and the second electrode column along the second direction. The recessed portion of the substrate is arranged between the through-holes arranged on the side of the first electrode array and the through-holes arranged on the side of the second electrode array in the third direction.

11. The socket assembly according to claim 3 or 4, characterized in that: The connector has a metal shell covering the housing. A plurality of protrusions are formed on the housing, The housing has a stepped portion on its outer peripheral surface. An edge of the housing facing the substrate abuts against the step portion of the case.

12. The socket assembly according to claim 1, wherein: comprising a plurality of cages, each of which is defined with at least one port for accommodating the external module, Each of the cages is fixed to the substrate in a state of accommodating the connector mounted on the substrate. The cages are arranged to be spaced apart from each other in at least one of the second direction and the third direction.

13. A substrate, characterized in that: The substrate is used to mount an external connector, the external connector being used to insert an external module along a first direction and having a plurality of contact pins. A direction perpendicular to the first direction is set as a second direction, and a direction perpendicular to the first direction and the second direction is set as a third direction, The substrate comprises: a plurality of electrodes disposed on the first surface for mounting the contact pins; and a plurality of inner layer wirings formed in an inner layer between the first surface and a second surface which is a back surface of the first surface, and connected to the electrodes via via holes; The plurality of electrodes constitute: a first electrode column arranged in a column along the second direction; and a second electrode column arranged in a column along the second direction and spaced apart from the first electrode column in the third direction. The plurality of inner layer wirings include: a plurality of first inner layer wirings connected to the plurality of electrodes included in the first electrode column; and a plurality of second inner layer wirings connected to the plurality of electrodes included in the second electrode column. When viewed from the first direction, some of the plurality of first inner layer wirings are led out toward the second electrode array. When viewed from the first direction, some of the plurality of second inner layer wirings are led out toward the first electrode column.

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