Laser heating module and laser heating device

Abstract

The utility model relates to the technical field of laser heating, and discloses a laser heating module and a laser heating device.The laser heating module comprises a heat exchange part, a circuit driver, a heat conduction part and a plurality of chips, the heat exchange part is provided with a first containing cavity and at least two openings, and the two openings are communicated with the first containing cavity; the two openings are used for leading in and discharging cooling liquid respectively, the circuit driver is arranged on one side of the heat exchange part, the heat conduction part is arranged on the side, away from the circuit driver, of the heat exchange part, and the chips are arranged on the side, away from the heat exchange part, of the heat conduction part and electrically connected to the circuit driver. According to the laser heating module and the laser heating device, heat generated by the chip can be conducted to the heat exchange piece through the heat conduction piece and dissipated through the heat exchanger, and the situation that normal operation of the laser heating module is affected by heat accumulation is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of laser heating, in particular to a laser heating module and a laser heating device. Background Art

[0002] Vertical-cavity surface-emitting lasers (VCSELs) are widely used in various fields, particularly in laser heating. Laser heaters typically consist of multiple chips connected in series to form an array. However, as the number of chips increases, the laser's operating current increases, generating significant heat.

[0003] Therefore, the heat dissipation problem of the laser heater needs to be solved urgently to avoid the accumulation of heat due to the inability to dissipate heat in time, which affects the normal operation of the laser heating device. Utility Model Content

[0004] The embodiments of the present utility model disclose a laser heating module and a laser heating device, which can utilize a heat conducting member to conduct the heat generated by a chip to a heat exchange member, and dissipate the heat through a heat exchanger, thereby preventing heat accumulation from affecting the normal operation of the laser heating module.

[0005] In the first aspect, an embodiment of the present utility model discloses a laser heating module, comprising a heat exchange element, a circuit driver, a heat conductive element and a plurality of chips, wherein the heat exchange element has a first accommodating cavity and at least two openings, the two openings being connected to the first accommodating cavity, one of the two openings being used to introduce cooling liquid into the first accommodating cavity, and the other being used to discharge the cooling liquid in the first accommodating cavity, the circuit driver being arranged on one side of the heat exchange element, the heat conductive element being arranged on a side of the heat exchange element away from the circuit driver, the plurality of chips being arranged on a side of the heat conductive element away from the heat exchange element, and the plurality of chips being electrically connected to the circuit driver.

[0006] The laser heating module of the first aspect is disposed on one side of a heat exchanger via a circuit driver, and a heat conductor is disposed on a side of the heat exchanger facing away from the circuit driver. Multiple chips are disposed on the side of the heat conductor facing away from the heat exchanger, electrically connecting the multiple chips to the circuit driver, thereby driving the chips via the circuit driver. Simultaneously, coolant is introduced into the first accommodating chamber via one opening of the heat exchanger, while the coolant is discharged from the other opening. This allows the coolant to exchange heat with the circuit driver, removing heat generated by the circuit driver. Heat generated by the multiple chips is then conducted to the heat conductor, whereupon the coolant can exchange heat with the heat conductor, removing heat generated by the multiple chips. This dissipates heat from the laser heating module and prevents heat accumulation from affecting normal operation of the laser heating module.

[0007] As an optional embodiment, in an embodiment of the present invention, the heat conducting member has a second accommodating cavity, which is connected to the first accommodating cavity. In this way, through the communication between the second accommodating cavity of the heat conducting member and the first accommodating cavity, the second accommodating cavity of the heat conducting member can receive the coolant in the first accommodating cavity and discharge the coolant to the first accommodating cavity. Therefore, while the heat conducting member directly conducts the chip module to the heat exchange element, it can also directly conduct heat to the coolant in the second accommodating cavity of the heat conducting member, forming multiple heat conduction paths, improving the conduction efficiency, and achieving higher heat dissipation efficiency of the laser heating module.

[0008] As an optional embodiment, in an embodiment of the present invention, a plurality of heat sink fins are provided within the second accommodating cavity, and the plurality of heat sink fins are evenly spaced. Thus, by providing multiple heat sink fins, the heat generated by the chip is transferred to the heat conducting element and then conducted through the plurality of heat sink fins to the coolant within the second accommodating cavity. This increases the heat conduction area, improves the heat dissipation efficiency of the heat sink, and improves the heat dissipation effect of the laser heating module.

[0009] As an optional embodiment, in an embodiment of the present invention, the heat exchange element has two first accommodating chambers, and the two first accommodating chambers are separated. The heat exchange element is provided with a first through hole and a second through hole on the side facing the heat conductive element. The first through hole and the second through hole are respectively connected to the two first accommodating chambers. The heat conductive element is provided with a third through hole and a fourth through hole on the side facing the heat exchange element. The third through hole and the fourth through hole are both connected to the second accommodating chamber. The third through hole is connected to the first through hole, and the fourth through hole is connected to the second through hole. In this way, through the first through hole and the third through hole being connected, and the second through hole and the fourth through hole being connected, the coolant enters one first accommodating chamber from one opening and can flow to the second accommodating chamber through the first through hole and the third through hole, while the coolant in the second accommodating chamber can flow to the other first accommodating chamber through the fourth through hole and the second through hole, and flow out from the other opening. When the heat conductive element and the heat exchange element perform heat exchange, the coolant always fills the second accommodating chamber, thereby improving the efficiency of heat exchange and achieving better heat dissipation effect of the laser heating module.

[0010] As an optional embodiment, in this embodiment of the present invention, the thermal conductor is made of materials including copper, copper alloy, aluminum, aluminum alloy, graphene, and stainless steel. This allows the thermal conductor to have excellent thermal conductivity, efficiently transferring heat generated by the chip to the heat exchange element, thereby improving the heat dissipation efficiency of the laser heating module. Furthermore, a variety of thermal conductors made of different materials are provided, and the material can be selected based on actual needs, and this embodiment does not impose any specific limitations on this.

[0011] As an optional embodiment, in an embodiment of the present invention, the heat exchange element has a first side and a second side, the first side facing the circuit driver, the second side adjacent to the first side, and both openings located on the second side of the heat exchange element. The laser heating module also includes at least two connectors, each of which is connected to the two openings. Thus, on the one hand, by providing two openings on the same side of the heat exchange element, it is convenient to connect external pipes or components (e.g., a pump or coolant collection tank) at the same end, making the overall structure more compact. On the other hand, the position of the opening for connecting to the external pipes or components is adjacent to the first side. When connecting to the external pipes or components, it will not affect the circuit driver and the heat exchange element. The circuit driver can be in close contact with the heat exchange element to ensure effective heat dissipation, and the overall structure of the laser heating module is more compact. Furthermore, the connection with the external pipes or components through the connectors reduces the assembly difficulty of connecting or discharging the coolant.

[0012] In a second aspect, embodiments of the present invention disclose a laser heating device comprising a housing and the laser heating module of the first aspect, wherein the heat exchange element, the heat conduction element, the circuit driver, and the chip are disposed within the housing. The laser heating device of the second aspect has the beneficial effects of the laser heating module of the first aspect.

[0013] As an optional embodiment, in an embodiment of the present invention, the housing is provided with a relief window, and the power plug of the circuit driver is located in the relief window and protrudes from the housing. In this way, the power plug of the circuit driver protrudes from the housing through the relief window, and is electrically connected to the external circuit to power the driver, thereby simplifying the circuit and ensuring reliability.

[0014] As an optional embodiment, in an embodiment of the present invention, the housing includes a base and a top cover that are connected in a covering manner. The circuit driver, the heat exchange component, the heat conductive component, and the chip are sequentially arranged between the top cover and the base. The base has a light-transmitting portion, and the light-emitting surface of the chip is arranged toward the light-transmitting portion. In this way, by the base and the top cover being connected in a covering manner, the components located within the housing (the circuit driver, the heat exchange component, the heat conductive component, the chip, etc.) can be protected, and the difficulty of assembly and disassembly is relatively low, facilitating the inspection and maintenance of the laser heating device. Furthermore, by utilizing a single light-transmitting portion to transmit light from multiple chips, the chips are separated within the housing, while reducing the number of components and extending the service life of the laser heating device.

[0015] As an optional embodiment, in the embodiment of the present invention, the light-transmitting portion is a light-transmitting window communicating between the base and the top cover, or the light-transmitting portion is made of a light-transmitting material. This provides multiple different ways to achieve light transmission through the light-transmitting portion, which can be selected according to actual circumstances and are not specifically limited in this embodiment.

[0016] Compared with the prior art, the embodiments of the present invention have at least the following beneficial effects:

[0017] In an embodiment of the present invention, a circuit driver is disposed on one side of a heat exchanger, a heat conductor is disposed on a side of the heat exchanger away from the circuit driver, and a plurality of chips are disposed on the side of the heat conductor away from the heat exchanger, electrically connecting the plurality of chips to the circuit driver, thereby driving the chips through the circuit driver. Simultaneously, a cooling liquid is introduced into the first accommodating chamber through one opening of the heat exchanger, while the cooling liquid is discharged through the other opening, so that the cooling liquid can exchange heat with the circuit driver, thereby removing the heat generated by the circuit driver. Furthermore, the heat generated by the plurality of chips can be conducted to the heat conductor, whereupon the cooling liquid can exchange heat with the heat conductor, thereby removing the heat generated by the plurality of chips, thereby achieving heat dissipation of the laser heating module and preventing heat accumulation from affecting the normal operation of the laser heating module. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this technical field, other drawings can be obtained based on these drawings without creative work.

[0019] Figure 1 This is a schematic structural diagram of a laser heating module disclosed in Example 1 of the present utility model;

[0020] Figure 2 This is a schematic diagram of the exploded structure of a laser heating module disclosed in Example 1 of the present utility model;

[0021] Figure 3 This is a schematic diagram of the exploded structure of a laser heating module disclosed in the first embodiment of the present utility model from another perspective;

[0022] Figure 4 This is a schematic cross-sectional view of the heat exchange element and the heat conducting element disclosed in the first embodiment of the present utility model;

[0023] Figure 5 This is a schematic structural diagram of the laser heating device disclosed in Example 2 of the present utility model;

[0024] Figure 6 This is a schematic diagram of the exploded structure of the laser heating device disclosed in Example 2 of the present utility model.

[0025] Description of main reference numerals

[0026] 100, laser heating module; 10, heat exchange element; 10a, first accommodating cavity; 10b, opening; 10c, first through hole; 10d, second through hole; 11, circuit driver; 11a, power plug; 12, heat conductor; 12a, second accommodating cavity; 12b, third through hole; 12c, fourth through hole; 121, heat sink; 13, chip; 14, connector; 200, laser heating device; 20, housing; 20a, avoidance window; 201, base; 201a, light-transmitting portion; 202, top cover. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0028] In this utility model, terms such as "upper," "lower," "left," "right," "front," "back," "top," "bottom," "inner," "outer," "center," "vertical," "horizontal," "transverse," and "longitudinal" indicate positions or locations based on the positions or locations shown in the accompanying drawings. These terms are primarily intended to better describe the utility model and its embodiments and are not intended to limit the devices, elements, or components indicated to having a specific orientation, or to being constructed or operated in a specific orientation.

[0029] Furthermore, some of the above terms may be used to express other meanings besides indicating a position or location. For example, the term "on" may also be used to indicate a dependency or connection in certain circumstances. Those skilled in the art will understand the specific meanings of these terms in this utility model based on the specific circumstances.

[0030] Furthermore, the terms "installed," "disposed," "provided with," "connected," and "connected" should be interpreted broadly. For example, they can refer to fixed connections, removable connections, or integral structures; mechanical connections or electrical connections; direct connections, indirect connections through an intermediary, or internal communication between two devices, elements, or components. Those skilled in the art will understand the specific meanings of these terms in this utility model based on the specific circumstances.

[0031] Furthermore, the terms "first," "second," and the like are primarily used to distinguish different devices, elements, or components (which may or may not be the same in type and configuration) and are not intended to indicate or imply the relative importance or quantity of the devices, elements, or components indicated. Unless otherwise specified, "plurality" means two or more.

[0032] The utility model discloses a laser heating module and a laser heating device, which can use a heat conducting member to conduct the heat generated by a chip to a heat exchange member, and dissipate the heat through the heat exchanger, thereby preventing heat accumulation from affecting the normal operation of the laser heating module. Example 1

[0033] Please also refer to Figures 1 to 4 , is a structural schematic diagram of a laser heating module 100 provided in Example 1 of the present utility model, the laser heating module 100 includes a heat exchange element 10, a circuit driver 11, a heat conductor 12 and a plurality of chips 13, the heat exchange element 10 has a first accommodating cavity 10a and at least two openings 10b, the two openings 10b are connected to the first accommodating cavity 10a, one of the two openings 10b is used to pass coolant into the first accommodating cavity 10a, and the other is used to discharge the coolant in the first accommodating cavity 10a, the circuit driver 11 is arranged on one side of the heat exchange element 10, the heat conductor 12 is arranged on the side of the heat exchange element 10 away from the circuit driver 11, the plurality of chips 13 are arranged on the side of the heat conductor 12 away from the heat exchange element 10, and the plurality of chips 13 are electrically connected to the circuit driver 11.

[0034] In this embodiment, a circuit driver 11 is disposed on one side of a heat exchanger 10, and a heat conductor 12 is disposed on the side of the heat exchanger away from the circuit driver. A plurality of chips 13 are disposed on the side of the heat conductor 12 away from the heat exchanger, and the plurality of chips 13 are electrically connected to the circuit driver 11, thereby driving the chips 13 through the circuit driver 11. Simultaneously, a coolant is introduced into the first accommodating chamber 10a through one opening 10b of the heat exchanger 10, while the coolant is discharged through the other opening 10b. This allows the coolant to exchange heat with the circuit driver 11, thereby removing the heat generated by the circuit driver 11. Furthermore, the heat generated by the plurality of chips 13 can be conducted to the heat conductor 12, whereupon the coolant can exchange heat with the heat conductor 12, thereby removing the heat generated by the plurality of chips 13. This achieves heat dissipation of the laser heating module 100 and prevents heat accumulation from affecting the normal operation of the laser heating module 100.

[0035] Exemplarily, the materials of the heat conductor 12 include copper, copper alloy, aluminum, aluminum alloy, graphene, and stainless steel. Thus, the heat conductor 12 has excellent thermal conductivity, efficiently transferring heat generated by the chip 13 to the heat exchange element 10, thereby improving the heat dissipation efficiency of the laser heating module 100. Furthermore, a plurality of different materials for the heat conductor 12 are provided, and the material can be selected based on actual conditions, and this embodiment does not impose any specific limitations thereon.

[0036] In some embodiments, the heat conducting member 12 has a second accommodating cavity 12a, which is in communication with the first accommodating cavity 10a. Thus, through the communication between the second accommodating cavity 12a and the first accommodating cavity 10a of the heat conducting member 12, the second accommodating cavity 12a of the heat conducting member 12 can receive coolant from the first accommodating cavity 10a and discharge the coolant to the first accommodating cavity 10a. Thus, while the heat conducting member 12 directly conducts the chip 13 to the heat exchange member 10, it can also directly conduct heat to the coolant within the second accommodating cavity 12a of the heat conducting member 12, forming multiple heat conduction paths, improving conduction efficiency, and achieving higher heat dissipation efficiency for the laser heating module 100.

[0037] For example, multiple heat sink fins 121 are provided in the second accommodating cavity 12a, and the multiple heat sink fins 121 are evenly spaced. Thus, by providing multiple heat sink fins 121, the heat generated by the chip 13 is transferred to the heat conducting member 12, and then transferred to the coolant in the second accommodating cavity 12a through the multiple heat sink fins 121. This can increase the heat conduction area, improve the heat conduction efficiency of the heat conducting member 12, and achieve better heat dissipation effect of the laser heating module 100.

[0038] In some embodiments, the heat exchange element 10 has two first accommodating cavities 10a, and the two first accommodating cavities 10a are separated and arranged. The heat exchange element 10 is provided with a first through hole 10c and a second through hole 10d on the side facing the heat conductor 12. The first through hole 10c and the second through hole 10d are respectively connected to the two first accommodating cavities 10a. The heat conductor 12 is provided with a third through hole 12b and a fourth through hole 12c on the side facing the heat exchange element 10. The third through hole 12b and the fourth through hole 12c are both connected to the second accommodating cavity 12a. The third through hole 12b is connected to the first through hole 10c, and the fourth through hole 12c is connected to the second through hole 10d. In this way, the first through hole 10c is connected with the third through hole 12b, and the second through hole 10d is connected with the fourth through hole 12c. After the coolant enters a first accommodating chamber 10a from an opening 10b, it can flow to the second accommodating chamber 12a through the first through hole 10c and the third through hole 12b, and the coolant in the second accommodating chamber 12a can flow to another first accommodating chamber 10a through the fourth through hole 12c and the second through hole 10d, and flow out from another opening 10b, so that when the heat conductive element 12 and the heat exchange element 10 perform heat exchange, the coolant always fills the second accommodating chamber 12a, thereby improving the efficiency of heat exchange and achieving better heat dissipation effect of the laser heating module 100.

[0039] Optionally, the heat exchange element 10 has a first side 101 and a second side 102. The first side 101 faces the circuit driver 11, and the second side 102 is adjacent to the first side 101. Both openings 10b are located on the second side 102 of the heat exchange element 10. The laser heating module 100 also includes at least two connectors 14, each of which is connected to the two openings 10b. This facilitates connection of external pipes or components (e.g., a pump or coolant collection tank) at the same end, resulting in a more compact overall structure. Furthermore, the position of the openings 10b for connecting external pipes or components is adjacent to the first side 101. This connection does not affect the circuit driver 11 and the heat exchange element 10. The circuit driver 11 maintains a close fit with the heat exchange element 10, ensuring effective heat dissipation. This results in a more compact overall structure for the laser heating module 100. Furthermore, the connection to external pipes or components via the connectors 14 reduces the assembly complexity of connecting and discharging coolant.

[0040] In some other embodiments, the two openings 10b are located on different sides of the heat exchange element 10. For example, one opening 10b is located on the second side 102, and the other opening 10b is located on the side opposite to the second side 102. The selection can be made according to actual conditions, and this embodiment does not make any specific limitations on this.

[0041] The first embodiment of the present invention provides a laser heating module 100, wherein a circuit driver 11 is disposed on one side of a heat exchanger 10, a heat conductor 12 is disposed on the side of the heat exchanger away from the circuit driver, and a chip 13 is disposed on the side of the heat conductor 12 away from the heat exchanger. Multiple chips 13 are electrically connected to the circuit driver 11 via a flexible circuit board 131, thereby driving the chip 13 configuration via the circuit driver 11. Simultaneously, a coolant is introduced into the first accommodating chamber 10a through one opening 10b of the heat exchanger 10, while the coolant is discharged through the other opening 10b. This allows the coolant to exchange heat with the circuit driver 11, removing heat generated by the circuit driver 11. Furthermore, the heat generated by the chip 13 can be conducted to the heat conductor 12, whereupon the coolant can exchange heat with the heat conductor 12, removing heat generated by the chip 13. This achieves heat dissipation of the laser heating module 100 and prevents heat accumulation from affecting the normal operation of the laser heating module 100. Example 2

[0042] Please also refer to Figure 5 and Figure 6, which is a structural schematic diagram of a laser heating device 200 provided in Example 2 of the present utility model. The laser heating device 200 includes a shell 20 and the laser heating module 100 of Example 1. The heat exchange component 10, the heat conductor 12, the circuit driver 11 and the chip 13 are arranged in the shell 20.

[0043] In some embodiments, the housing 20 is provided with an escape window 20a, and the power plug 11a of the circuit driver 11 is located in the escape window 20a and protrudes from the housing 20. In this way, the power plug 11a of the circuit driver 11 protrudes from the housing 20 through the escape window 20a and is electrically connected to an external circuit to power the circuit driver 11, thereby simplifying the circuit and ensuring reliability.

[0044] Exemplarily, the housing 20 includes a base 201 and a top cover 202 that are joined together. The circuit driver 11, heat exchange element 10, thermal conductor 12, and chip 13 are sequentially arranged between the top cover 202 and the base 201. The base 201 has a light-transmitting portion 201a, and the light-emitting surface of the chip 13 faces the light-transmitting portion 201a. Thus, the jointed connection between the base 201 and the top cover 202 protects the components within the housing 20 (such as the circuit driver, heat exchange element 10, thermal conductor 12, and chip 13). Disassembly and assembly are also simplified, facilitating maintenance of the laser heating device 200. Furthermore, by utilizing a single light-transmitting portion 201a to transmit light from multiple chips 13, the chips 13 are separated within the housing 20, while reducing the number of components and extending the service life of the laser heating device 200.

[0045] Optionally, the light-transmitting portion 201a is a light-transmitting window communicating with the base 201 and the top cover 202, or the light-transmitting portion 201a is made of a light-transmitting material. Thus, multiple different ways of achieving light transmission through the light-transmitting portion 201a are provided, which can be selected according to actual circumstances and are not specifically limited in this embodiment.

[0046] The second embodiment of the present invention provides a laser heating device 200 , which has good heat dissipation efficiency.

[0047] The above is a detailed introduction to a laser heating module and a laser heating device disclosed in the embodiments of the present invention. This article uses individual examples to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the laser heating module and laser heating device of the present invention and its core ideas. At the same time, for general technical personnel in this field, according to the ideas of the present invention, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. A laser heating module, characterized in that: include: a heat exchange element, the heat exchange element having a first accommodating cavity and at least two openings, the two openings being connected to the first accommodating cavity, one of the two openings being used to introduce coolant into the first accommodating cavity, and the other being used to discharge the coolant in the first accommodating cavity; a circuit driver, the circuit driver being disposed on one side of the heat exchange element; a heat conducting member, the heat conducting member being arranged on a side of the heat exchange member facing away from the circuit driver; as well as A plurality of chips are arranged on a side of the heat conducting member facing away from the heat exchanging member, and the plurality of chips are electrically connected to the circuit driver.

2. The laser heating module according to claim 1, characterized in that: The heat conducting member has a second accommodating cavity, and the second accommodating cavity is communicated with the first accommodating cavity.

3. The laser heating module according to claim 2, characterized in that: A plurality of heat dissipation fins are arranged in the second accommodation cavity, and the plurality of heat dissipation fins are evenly spaced and arranged.

4. The laser heating module according to claim 2, characterized in that: The heat exchange element has two first accommodating cavities, and the two first accommodating cavities are separated. The heat exchange element is provided with a first through hole and a second through hole on the side facing the heat conductive element. The first through hole and the second through hole are respectively connected to the two first accommodating cavities. The heat conductive element is provided with a third through hole and a fourth through hole on the side facing the heat exchange element. The third through hole and the fourth through hole are both connected to the second accommodating cavity. The third through hole is connected to the first through hole, and the fourth through hole is connected to the second through hole.

5. The laser heating module according to any one of claims 1 to 4, characterized in that: The material of the heat conducting member includes copper, copper alloy, aluminum, aluminum alloy, graphene, and stainless steel.

6. The laser heating module according to any one of claims 1 to 4, characterized in that: The heat exchange element has a first side and a second side, the first side faces the circuit driver, and the second side is adjacent to the first side. The two openings are both located on the second side of the heat exchange element. The laser heating module also includes at least two connectors, and the two connectors are respectively connected to the two openings.

7. A laser heating device, characterized in that: It comprises a shell and the laser heating module according to any one of claims 1 to 6, wherein the heat exchange component, the heat conducting component, the circuit driver and the chip are arranged in the shell.

8. The laser heating device according to claim 7, characterized in that: The shell is provided with an escape window, and the power supply plug of the circuit driver is located in the escape window and protrudes out of the shell.

9. The laser heating device according to claim 7, characterized in that: The shell includes a base and a top cover that are covered and connected together. The circuit driver, the heat exchange component, the heat conductive component, and the chip are arranged in sequence between the top cover and the base. The base has a light-transmitting portion, and the light-emitting surface of the chip is arranged toward the light-transmitting portion.

10. The laser heating device according to claim 9, characterized in that: The light-transmitting portion is a light-transmitting window communicating with the base and the top cover, or the light-transmitting portion is made of a light-transmitting material.

Images