Optical module test equipment

Abstract

The embodiment of the utility model provides optical module testing equipment. The optical module testing equipment comprises a testing box body, a tested equipment board and a clamp, an error rate test board group is arranged in the test box body; the bit error rate test board group comprises high-speed signal boards and low-speed signal boards which are oppositely arranged at intervals, and the low-speed signal boards are detachably and electrically connected with the high-speed signal boards; the clamp is detachably connected with the test box body, and the clamp is provided with an insertion cavity and a mounting cavity corresponding to the insertion cavity; the insertion cavity is used for inserting a to-be-tested optical module, and the to-be-tested equipment plate is arranged in the mounting cavity; the first end of the tested equipment board is provided with a jack used for being connected with a to-be-tested optical module in a matched mode, and the second end of the tested equipment board is detachably and electrically connected with the low-speed signal board and the high-speed signal board.

Description

Technical Field

[0001] The embodiments of the present disclosure belong to the technical field of optical module testing equipment, and particularly relate to an optical module testing equipment. Background Art

[0002] Optical module test equipment is a key tool for evaluating and verifying the performance of optical modules. It is usually used to verify the bit error rate of optical modules, that is, to evaluate the bit error rate of optical modules when transmitting data, and to verify the reliability and accuracy of optical modules at specific data rates.

[0003] Existing optical module testing equipment consists of a test box, a device under test (DUT) board, and a bit error rate tester (BERT) board housed within the box. The BERT board is the core component of the bit error test, responsible for generating test signals and receiving return signals from the DUT. However, the current integrated design of the DUT and BERT boards results in excessive size, reducing space utilization within the test box. Furthermore, the high replacement cost of the integrated DUT and BERT boards hinders subsequent equipment maintenance and impacts the user experience.

[0004] Therefore, how to solve the above problems has become a technical problem that needs to be solved urgently by those skilled in the art. Utility Model Content

[0005] The embodiments of the present disclosure aim to solve at least one of the technical problems existing in the prior art and provide an optical module testing device.

[0006] According to a first aspect of the embodiments of the present disclosure, there is provided an optical module testing device, comprising a test box, a test board, and a fixture; a bit error rate test board group is disposed within the test box, the bit error rate test board group comprising a high-speed signal board disposed relatively spaced apart and a low-speed signal board detachably electrically connected to the high-speed signal board;

[0007] The fixture is detachably connected to the test box, and is provided with an insertion cavity and a mounting cavity corresponding to the insertion cavity; the insertion cavity is used to insert the optical module to be tested, and the test board is arranged in the mounting cavity;

[0008] The first end of the test board is provided with a socket for matching and connecting with the optical module to be tested, and the second end of the test board is detachably electrically connected to the low-speed signal board and the high-speed signal board respectively.

[0009] The beneficial effects of the embodiments of the present disclosure include:

[0010] In the present disclosure, the detachable connection between the test board and the bit error rate test board group enables the test board and the bit error rate test board group to be replaced separately without having to replace the bit error rate test board group and the test board as a whole. The replaceable test board can adapt to optical modules of different packaging types / sizes, thereby improving the versatility of the test. In addition, the cost of the bit error rate test board group is relatively high, and since there is no need to replace the bit error rate test board group and the test board as a whole, the cost can be significantly reduced. Furthermore, the bit error rate test board group adopts a dual-board design, which can significantly improve the space utilization rate in the test box, and the detachable low-speed signal board and high-speed signal board design are also conducive to the later equipment maintenance. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 This is a structural schematic diagram of a fixture for optical module testing according to an embodiment of the present disclosure;

[0012] Figure 2 This is a schematic structural diagram of a fixture for optical module testing according to an embodiment of the present disclosure, which illustrates the positional relationship between the first temperature control component, the limiting structure, and the second temperature control component;

[0013] Figure 3 for Figure 2 A partial structural enlarged schematic diagram of FIG; wherein the positional relationship between the first limiting boss, the second limiting boss and the insertion cavity is schematically shown;

[0014] Figure 4 This is a structural schematic diagram of a fixture for optical module testing according to another embodiment of the present disclosure;

[0015] Figure 5 for Figure 4 Schematic diagram of the explosion structure;

[0016] Figure 6 for Figure 5 A partial structural enlarged schematic diagram is shown, wherein the positional relationship between the limiting through hole and the insertion cavity is shown;

[0017] Figure 7 Schematic diagram of the explosion structure of the first heat sink module and the second heat sink module;

[0018] Figure 8 This is a structural schematic diagram of a fixture for optical module testing according to an embodiment of the present disclosure;

[0019] The positional relationship between the second temperature detection element and the second heat sink is schematically shown;

[0020] Figure 9 for Figure 8 A partial structural enlarged schematic diagram;

[0021] Figure 10This is a structural schematic diagram of a fixture for optical module testing according to another embodiment of the present disclosure; it illustrates the positional relationship between the first temperature detection element and the first heat sink;

[0022] Figure 11 for Figure 10 A partial structural enlarged schematic diagram;

[0023] Figure 12 This is a structural schematic diagram of a fixture for optical module testing according to an embodiment of the present disclosure; it illustrates the positional relationship between the third sub-side panel and the fourth sub-side panel in the second side panel;

[0024] Figure 13 This is a structural schematic diagram of a fixture for optical module testing according to another embodiment of the present disclosure; it illustrates the positional relationship between the third sub-side panel and the fourth sub-side panel in the second side panel;

[0025] Figure 14 This is a partial exploded schematic diagram of the structure of a fixture for optical module testing according to an embodiment of the present disclosure; it illustrates the positional relationship between the first sub-side plate and the bottom plate in the first side plate;

[0026] Figure 15 This is a partial exploded schematic diagram of a fixture for optical module testing according to another embodiment of the present disclosure;

[0027] Figure 16 This is a clean cross-sectional view of a fixture for optical module testing according to an embodiment of the present disclosure, wherein a cross-sectional view of the top plate along a direction perpendicular to the top plate is schematically shown;

[0028] Figure 17 This is a structural diagram of an optical module testing device according to an embodiment of the present disclosure;

[0029] Figure 18 This is a schematic diagram of the exploded structure of an optical module testing device according to an embodiment of the present disclosure;

[0030] Figure 19 for Figure 18 A partial structural enlarged schematic diagram;

[0031] Figure 20 This is a structural diagram of an optical module testing device according to another embodiment of the present disclosure;

[0032] Figure 21 for Figure 20 A partial structural enlarged schematic diagram;

[0033] Figure 22 This is a structural diagram of a bit error rate test board set according to an embodiment of the present disclosure;

[0034] Figure 23 This is a structural schematic diagram of a fixture for optical module testing according to another embodiment of the present disclosure;

[0035] Figure 24 This is a schematic diagram of the gas path principle of an optical module testing device according to an embodiment of the present disclosure, wherein the gas supply path of the air flow channel and the air vent are illustrated;

[0036] Figure 25 This is a schematic diagram of the gas circuit principle of an optical module testing device according to an embodiment of the present disclosure; wherein, the gas supply circuit of the telescopic cylinder is illustrated;

[0037] Figure 26 This is a schematic diagram of the air circuit principle of an optical module testing device according to an embodiment of the present disclosure, wherein the air supply circuit of the crimping cylinder of the driving mechanism is illustrated.

[0038] In the figure, 1, optical module test equipment; 10, fixture; 11, housing; 12, first temperature control component;

[0039] 121. First water-cooling module; 122. First semiconductor refrigeration module; 123. First heat sink module; 1211. First water-cooling seat; 1212. First water-cooling head; 12111. First limiting groove; 1231. First heat sink; 1232. First heat sink cover; 1233. First temperature detection element; 12311. First protrusion; 12321. First avoidance through hole; 12322. First mounting groove; 13. Second temperature control assembly; 131. Second water-cooling module; 132. Second semiconductor refrigeration module; 133. Second heat sink module; 1311. Second water-cooling seat; 1312. Second Water cooling head; 1331, second heat sink; 1332, second heat sink cover; 1333, second temperature detection element; 13311, second protrusion; 13321, second avoidance through hole; 14, limiting structure; 141, limiting through hole; 142, first limiting boss; 143, second limiting boss; 144, insertion cavity; 145, first limiting block; 146, second limiting block; 15, first cylinder; 16, second cylinder; 17, first guide member; 18, second guide member; 19, first limiting member; 20, first elastic member; 21, second limiting member; 22, second elastic member; 23, third Limiting member; 24, fourth limiting member; 25, fixing member; 26, gasket; 30, top plate; 40, bottom plate; 50, side plate; 60, first avoidance opening; 70, second avoidance opening; 80, first air path assembly; 90, second air path assembly; 100, water path assembly; 31, air flow channel; 32, air outlet; 51, first side plate; 52, second side plate; 53, third side plate; 54, fourth side plate; 511, first sub-side plate; 512, second sub-side plate; 521, third sub-side plate; 522, fourth sub-side plate; 523, first through-slot; 524, second through-slot; 531, fifth sub-side plate; 532. Sixth sub-side panel; 300. Test board; 210. Test box; 220. Bit error rate test board group; 221. High-speed signal board; 222. Low-speed signal board; 223. First connector; 224. Second connector; 225. First RF connector; 226. Second RF connector; 227. Support member; 228. Partition; 211. First receiving space; 212. Second receiving space; 213. Inspection opening; 214. Inspection cover; 215. Buckle; 216. Upper shell; 217. Lower shell; 2281. Communication opening; 2282. Connection port; 301. Vent. DETAILED DESCRIPTION

[0040] In order to enable those skilled in the art to better understand the technical solutions of the present disclosure, the present disclosure is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0041] like Figure 17-22As shown, an optical module testing device includes a test box 210, a test board 300, and a fixture 10. A bit error rate test board set 220 is disposed within the test box 210. The bit error rate test board set 220 includes a high-speed signal board 221 spaced apart from each other and a low-speed signal board 222 detachably electrically connected to the high-speed signal board 221.

[0042] The fixture is detachably connected to the test box 210 and is provided with an insertion cavity 144 and a mounting cavity corresponding to the insertion cavity 144. The insertion cavity 144 is used to insert the optical module to be tested, and the mounting cavity is provided with a test board 300. The fixture 10 and the partition 228 together form the mounting cavity.

[0043] The first end of the test board 300 is provided with a socket for matching and connecting with the optical module to be tested, and the second end of the test board 300 is detachably electrically connected to the low-speed signal board 222 and the high-speed signal board 221 .

[0044] The bit error rate test board assembly 220, also known as the BERT (Bit Error Rate Tester) board assembly, is a circuit board that generates known data sequences and produces high-quality, highly stable test signals. These signals are used to drive the test board 300 (DUT, Device Under Test).

[0045] In the present disclosure, the detachable connection between the test board 300 and the bit error rate test board group 220 enables the test board 300 and the bit error rate test board group 220 to be replaced separately without having to replace the bit error rate test board group 220 and the test board 300 as a whole, wherein the replaceability of the test board 300 can adapt to optical modules of different packaging types / sizes, thereby improving the versatility of the test. In addition, the cost of the bit error rate test board group 220 is relatively high, and since there is no need to replace the bit error rate test board group 220 and the test board 300 as a whole, the cost can be significantly reduced. Furthermore, the bit error rate test board group 220 adopts a dual-board design, which can significantly improve the space utilization within the test box 210, and the detachable low-speed signal board 222 and high-speed signal board 221 design are also conducive to later equipment maintenance.

[0046] In some embodiments, the optical module testing device further includes a first connector 223 , and the high-speed signal board 221 and the low-speed signal board 222 are detachably electrically connected via the first connector 223 .

[0047] In the present disclosure, on the one hand, since the high-speed signal board 221 and the low-speed signal board 222 are connected by connectors, they can be easily replaced or upgraded. When a part fails, the problematic board can be directly replaced, reducing maintenance time and costs. On the other hand, users can choose different combinations of high-speed signal boards 221 or low-speed signal boards 222 as needed to meet the application requirements of flexible configuration. On the other hand, the relative spacing of the high-speed signal board 221 and the low-speed signal board 222 through connectors can improve air circulation and help dissipate heat, thereby improving the stability and life of the equipment. On the other hand, appropriate spacing can help reduce electromagnetic interference between the high-speed signal board 221 and the low-speed signal board 222, and improve the signal integrity of the system.

[0048] In some embodiments, the optical module testing equipment further includes a second connector 224 , and the second end of the test board 300 and the low-speed signal board 222 are detachably electrically connected via the second connector 224 .

[0049] In the present disclosure, by using the second connector 224, the test board 300 and low-speed signal board 222 can be easily removed and replaced without damaging other system components. This not only facilitates maintenance but also makes equipment upgrades easier. The detachable connection allows for quick replacement of different test boards 300 or low-speed signal boards 222 based on different testing requirements, thus adapting to diverse testing scenarios.

[0050] In some embodiments, the second connector 224 includes a gold finger and a slot, one of which is disposed at the second end of the test board 300 , and the other of which is disposed at the low-speed signal board 222 , and the gold finger is used to connect with the slot.

[0051] In some embodiments, a gold finger is provided at the second end of the test board 300, and a slot is provided in the low-speed signal board 222. The gold finger is plugged into the slot to connect the test board 300 and the low-speed signal board 222. The design of the gold finger and the slot makes the connection a simple plug-in and pull-out operation, making replacement or maintenance of the test board 300 more convenient and easy, without the need for complex tools or skills.

[0052] In some embodiments, a first RF connector 225 is provided at the first end of the test board 300 , and a second RF connector 226 is provided on the high-speed signal board 221 . The test board 300 is electrically connected to the high-speed signal board 221 through the first RF connector 225 and the second RF connector 226 .

[0053] In the present disclosure, on the one hand, the communication connection between the RF connectors corresponding to the test board 300 and the high-speed signal board 221 helps to maintain the integrity and stability of the signal and avoids signal attenuation or distortion caused by long-distance wiring or too many adapters.

[0054] Secondly, the high-speed signal board 221 and the test board 300 are directly connected via a radio frequency connector, which can simplify the system architecture and significantly improve communication speed and efficiency, making each module easy to independently develop, test and maintain, and also facilitating future technology upgrades.

[0055] In some embodiments, the high-speed signal board 221 and the low-speed signal board 222 are spaced apart along the height direction of the test box 210 . The test box 210 further includes a support member 227 supported between the high-speed signal board 221 and the low-speed signal board 222 .

[0056] In the present disclosure, on the one hand, the support member 227 can physically support the high-speed signal board 221 so that it remains stable when subjected to external vibration or impact, reducing the possibility of deformation or displacement. On the other hand, by designing the support member 227, vibration energy can be absorbed or dispersed, reducing the impact of vibration on the high-speed signal board 221 and enhancing the system's vibration resistance. On the third hand, the support member 227 can ensure that the connectors between the high-speed signal board 221 and the low-speed signal board 222 maintain good contact, reducing problems caused by poor contact. On the fourth hand, by physically supporting the high-speed signal board 221, wear or deformation caused by long-term use can be reduced, extending the overall service life of the equipment.

[0057] In some embodiments, multiple support members 227 are provided, arranged in an array between the high-speed signal board 221 and the low-speed signal board 222. Multiple support members 227 can more evenly distribute the weight and any additional loads on the high-speed signal board 221, preventing deformation or damage caused by localized stress concentration. Furthermore, the more support points provided by multiple support members 227, the greater the overall rigidity of the high-speed signal board 221, reducing the likelihood of bending and twisting.

[0058] In some embodiments, the low-speed signal board 222 is provided with a first mounting hole (not shown in the figure), and the test box 210 is provided with a second mounting hole (not shown in the figure) at a position corresponding to the first mounting hole, so that the low-speed signal board 222 is fixed to the test box 210 by fasteners (not shown in the figure) passing through the first mounting hole and the second mounting hole.

[0059] The design of the fasteners and mounting holes in this disclosure allows the low-speed signal board 222 to be easily replaced or repaired without damaging other components, simplifying maintenance. During transportation, the low-speed signal board 222 can be separated from the test box 210, reducing the weight of each component and facilitating handling.

[0060] In some embodiments, the fasteners include bolts, and the first mounting hole and the second mounting hole are both threaded holes. Specifically, threaded holes are provided at corresponding locations on the low-speed signal board 222 and the test box 210, wherein bolts are threadedly connected to the two corresponding threaded holes to secure the low-speed signal board 222 to the test box 210. It is understood that the detachable connection between the low-speed signal board 222 and the test box 210 includes, but is not limited to, a threaded connection, and may also be a snap-on connection or other connection methods.

[0061] In the present disclosure, the combination of bolts and threaded holes provides a robust mechanical connection, ensuring that the low-speed signal board 222 does not loosen or fall off during operation. Adjusting the torque applied to the bolts controls the tightness of the connection, ensuring that the low-speed signal board 222 remains stable under various operating conditions. Furthermore, this design supports modularity, enabling rapid replacement of the low-speed signal board 222 and improving maintenance efficiency. The bolt and threaded hole connection provides excellent repeatability, maintaining high precision even after multiple disassembly and assembly.

[0062] In some embodiments, the optical module testing equipment further includes a partition 228 disposed within the test box 210 , which separates the test box 210 into a first receiving space 211 and a second receiving space 212 . The fixture and test board 300 are both disposed in the first receiving space 211 , and the bit error rate test board set 220 is disposed in the second receiving space 212 .

[0063] In this disclosure, the interior of the test chamber 210 is divided into different storage areas by partitions 228, allowing different components to be categorized and arranged according to their functions and uses, improving management and maintenance convenience. Components within each storage area have fixed locations, making it easy to quickly find the required parts and perform related operations.

[0064] In some embodiments, when the test board 300 is provided with a first RF connector 225 and the high-speed signal board 221 is provided with a second RF connector 226, the partition 228 is further provided with a communication opening 2281, and the first RF connector 225 is communicatively connected to the second RF connector 226 through the communication opening 2281. By providing the communication opening 2281 on the partition 228, the connection between the test board 300 and the high-speed signal board 221 can be made more compact, external wiring can be reduced, and the integration of the overall system can be improved. Since the RF connector can be connected directly through the communication opening 2281, the complex wiring work is reduced, making the installation of the equipment easier, and also facilitating subsequent maintenance and upgrades. A properly designed communication opening 2281 can effectively control electromagnetic interference (EMI), prevent external electromagnetic interference from affecting the transmission quality of the RF signal, and can also reduce the electromagnetic radiation of the equipment to the outside world.

[0065] In some embodiments, the partition 228 is further provided with a connection port 2282, and a second connector 224 is provided at the connection port 2282, wherein the second end of the test board 300 and the low-speed signal board 222 are detachably connected via the second connector 224. The design of the partition 228 can reduce electromagnetic interference between the test board 300 or the low-speed signal board 222, and different test boards 300 or low-speed signal boards 222 can be quickly replaced by quick plugging and unplugging, thereby speeding up the test process and improving test efficiency. Compared with traditional welding or cable connections, connectors can reduce the complexity of internal wiring, making the internal layout of the equipment neater, and also reducing the risk of failure caused by improper wiring. In some embodiments, the test box 210 is provided with an inspection opening 213 at the position corresponding to the fixture, and the test box 210 also includes an inspection cover 214 rotatably provided on the inspection opening 213.

[0066] In this disclosure, the design of the access cover 214 allows maintenance personnel to easily perform maintenance work on the fixtures within the test box 210 and also facilitates cleaning of the interior space. The design of the removable fixtures allows users to expand or upgrade the internal configuration at any time according to needs without having to replace the entire test box 210.

[0067] In some embodiments, the fixture includes a TEC cooling module, and the bit error tester 200 also includes a TEC controller and an MCU control board arranged in the test box 210. The MCU control board is electrically connected to the TEC controller and the bit error rate test board group 220 respectively, and the TEC controller is electrically connected to the TEC cooling module.

[0068] In some embodiments, a radiator and a fan are further provided in the test box. The radiator is provided corresponding to the position of the error code test chip, and the fan is provided corresponding to the position of the radiator.

[0069] In this disclosure, by placing a heat sink directly in alignment with the error-correcting test chip, heat generated by the chip can be more effectively dissipated. The placement of a fan in alignment with the heat sink further accelerates air circulation, removing more heat and thus maintaining the error-correcting test chip within a relatively ideal operating temperature range. Furthermore, improved heat dissipation ensures a more stable operating environment for the error-correcting test chip, reducing the risk of performance degradation or failure due to overheating.

[0070] In some embodiments, the test board 300 , the bit error rate test board set 220 , the TEC controller, and the MCU control board are sequentially arranged along the depth direction of the insertion cavity 144 .

[0071] In some embodiments, the optical module testing device further includes a buckle 215 , and the fixture 10 is detachably connected to the test box 210 via the buckle 215 .

[0072] In the present disclosure, on one hand, the design of the buckle 215 allows the fixture 10 to be quickly installed on the test box 210 and also easily removed, which is very useful for occasions where the fixture needs to be frequently replaced to adapt to different types of optical module tests.

[0073] like Figure 1-2 6 and 12-16 illustrate a fixture 10 for testing optical modules. The fixture 10 includes a housing 11, a temperature control assembly, a retaining structure 14, and a drive mechanism. The housing 11 includes a top plate 30, a bottom plate 40, and side plates 50 connected to the top plate 30 and the bottom plate 40, respectively. The side plates 50, the top plate 30, and the bottom plate 40 define a storage space. The temperature control assembly is disposed within the storage space.

[0074] The limiting structure 14 is provided with a limiting through hole 141, which is provided corresponding to the temperature control component. The limiting through hole 141 is provided with a limiting boss corresponding to the temperature control component, and an insertion cavity 144 corresponding to the limiting boss. The insertion cavity 144 is used to insert the optical module to be tested.

[0075] The driving mechanism is disposed in the accommodating space and is in transmission connection with the temperature control component to drive the temperature control component to move toward the limiting structure 14 so as to abut against the optical module.

[0076] In the present disclosure, the shell 11 is composed of a top plate 30, a bottom plate 40 and a side plate 50 respectively connected to the top plate 30 and the bottom plate 40, and the side plate 50 and the top plate 30 and the bottom plate 40 form a relatively closed accommodation space, thereby improving the airtightness of the shell 11, reducing the gas exchange between the shell 11 and the outside world, and ensuring the normal progress of the optical module test.

[0077] In some embodiments, the housing 11 has a short axis and a long axis. It is understood that the long axis refers to the direction of the longest side of the housing 11, and the short axis refers to the direction of a side shorter than the long axis.

[0078] The side panels 50 include a first side panel 51 and a second side panel 52 spaced apart along the minor axis, and a third side panel 53 and a fourth side panel 54 spaced apart along the major axis. The first, second, third, and fourth side panels 51, 52, 53, and 54 surround the top panel 30 and bottom panel 40. The first and second side panels 51, 52 are connected to the first and second ends of the retaining structure 14, respectively. The first and second side panels 51, 52 are provided with a first and second clearance openings 60, 70, respectively, at locations corresponding to the insertion cavity 144. During optical module testing, one end of the optical module is inserted into the insertion cavity 144 through the first clearance opening 60 of the first side panel 51 and connected to the device under test (DUT) board through the second clearance opening 70 of the second side panel 52. A DUT (Device Under Test) board refers to the device or circuit board being tested during testing. In the testing environment of optical module testing equipment, the DUT board is typically connected to the device under test (DUT) to evaluate whether its performance meets expected standards.

[0079] In the present disclosure, by opening a first avoidance opening 60 on the first side panel 51 and a second avoidance opening 70 on the second side panel 52 for plugging in the optical module, the structural integrity of the first side panel 51 and the second side panel 52 can be ensured, thereby ensuring the relative sealing effect of the shell 11.

[0080] In a specific example provided by the present disclosure, the shell 11 is rectangular, wherein the long axis direction refers to the direction of the longest side of the shell 11, and the short axis direction refers to the direction of a side shorter than the long axis direction.

[0081] Assuming that the three dimensions of the rectangular housing 11 are length (L), width (W), and height (H), the following definitions can be used: If L>W and L>H, then the L direction is the major axis direction, and the shorter of W and H is the minor axis direction. If W>L and W>H, then the W direction is the major axis direction, and the shorter of L and H is the minor axis direction. If H>L and H>W, then the H direction is the major axis direction, and the shorter of L and W is the minor axis direction.

[0082] In some embodiments, the first side panel 51, the second side panel 52, the third side panel 53, and the fourth side panel 54 are detachably connected to the top panel 30 and the bottom panel 40, respectively. The advantages of employing detachable connections include: firstly, detachable connections make it easy and quick to replace damaged or worn side panels, facilitating maintenance; secondly, detachable side panel connections facilitate future replacement or upgrades, meeting user needs.

[0083] In some embodiments, reference Figure 12-15 The first side panel 51 includes a first sub-side panel 511 and a second sub-side panel 512, and the second side panel 52 includes a third sub-side panel 521 and a fourth sub-side panel 522. The first ends of the first and third sub-side panels 511, 521 are mounted on the bottom panel 40. The second ends of the first and third sub-side panels 511, 521 are provided with a step groove 5111, and the second ends of the third sub-side panels 521 are provided with a step groove 5211. The step grooves are used to accommodate the limiting structure 14.

[0084] In some embodiments, the limiting structure 14 is detachably mounted on the step groove, and the detachable connection method includes but is not limited to threaded connection or clamping. The detachable connection method between the limiting structure 14 and the step groove is convenient for later replacement, upgrading and maintenance.

[0085] The second sub-side panel 512 is covered on the outside of the first sub-side panel 511, and the two ends of the second sub-side panel 512 are respectively connected to the top panel 30 and the bottom panel 40, and a first avoidance opening 60 is provided at the position of the second sub-side panel 512 corresponding to the insertion cavity 144, wherein the optical module is inserted into the insertion cavity 144 through the first avoidance opening 60.

[0086] In some embodiments, the first sub-side panel 511 is detachably connected to the bottom panel 40, and the second sub-side panel 512 is detachably connected to the top panel 30 and the bottom panel 40, respectively. The detachable connection methods include, but are not limited to, threaded connections or snap connections. The detachable connection method between the first sub-side panel 511 and the second sub-side panel 512 facilitates subsequent replacement, upgrading, and maintenance.

[0087] In some embodiments, the surface of the first sub-side panel 511 facing the second sub-side panel 512 is coplanar with the surfaces of the bottom panel 40 and the top panel 30 facing the second sub-side panel 512. In a direction perpendicular to the surface of the second sub-side panel 512, the projection of the second sub-side panel 512 completely overlaps the projection of the first sub-side panel 511. This design ensures the flatness of the surfaces of the first sub-side panel 511, the bottom panel 40, and the top panel 30 facing the second sub-side panel 512, facilitating a sealed connection between the second sub-side panel 512, the first sub-side panel 511, the bottom panel 40, and the top panel 30. Furthermore, the second sub-side panel 512 has a larger area than the first sub-side panel 511, further ensuring the sealing of the housing 11.

[0088] The first end of the fourth sub-side panel 522 is connected to the top panel 30, the second end of the fourth sub-side panel 522 is arranged at the second end of the third sub-side panel 521, and the fourth sub-side panel 522 is spaced apart from the third sub-side panel 521 at a position corresponding to the insertion cavity 144 to form a second avoidance opening 70, wherein the optical module is connected to the DUT board through the second avoidance opening 70.

[0089] In a specific example provided by the present disclosure, the first end of the fourth sub-side panel 522 is detachably connected to the top panel 30, the second end of the fourth sub-side panel 522 is abutted against the second end of the third sub-side panel 521, and the second end of the fourth sub-side panel 522 is provided with a through groove, and the through groove 5221 of the fourth sub-side panel 522 and the step groove 5211 of the third sub-side panel 521 jointly form a second avoidance opening 70 at a position corresponding to the insertion cavity 144, wherein the optical module is connected to the DUT board through the second avoidance opening 70.

[0090] refer to Figure 23-24 In some embodiments, the optical module testing equipment further includes a first air source, a first speed regulating valve, a relay, and a first solenoid valve disposed within the test chamber 210. The housing 11 is provided with an air flow channel 31 having air outlets corresponding to opposite ends of the optical module under test. A test board is positioned in the fixture, corresponding to the insertion cavity. The test board is provided with an air vent 301 that communicates with the insertion cavity 144.

[0091] The first speed regulating valve is arranged in the pipeline between the first air source and the input end of the first solenoid valve. The output end of the first solenoid valve is connected to the vent and the air inlet of the air flow channel through the pipeline respectively. The MCU control board is electrically connected to the first speed regulating valve, and the MCU control board is also electrically connected to the first solenoid valve through a relay.

[0092] A specific example provided by the present disclosure includes: the pipeline is a first main air pipe, and the first solenoid valve is a single-way solenoid valve. The first speed regulating valve is arranged in the first main air pipe between the air source and the input end of the single-way solenoid valve, and the output end of the single-way solenoid valve is connected to a tee through the first main air pipe, and the two outlet ports of the tee are respectively provided with a first bronchus and a second bronchus. The first bronchus forms two-way air through a tee, and the blowing ports of the two-way air are respectively blowing port A and blowing port B, wherein blowing port A and blowing port B respectively correspond to the air inlet of the air flow channel 31 connected to the top plate 30. The second bronchus forms four-way air through three tees in sequence, and the blowing ports of the four-way air are respectively blowing port 1, blowing port 2, blowing port 3 and blowing port 4, and blowing port 1, blowing port 2, blowing port 3 and blowing port 4 are respectively connected to the corresponding vents 301 of the four support plates 300.

[0093] In some embodiments, reference Figure 13 and Figure 16The top plate 30 is provided with an air flow channel 31. The fixture 10 further includes a first air path assembly 80 disposed on the top plate 30. The first air path assembly 80 is in communication with the air inlet of the air flow channel 31. The air outlet 32 ​​of the air flow channel 31 is in communication with the accommodation space. Dry gas provided by the first air path assembly 80 is passed into the accommodation space through the air outlet 32 ​​of the air flow channel 31 to maintain the dryness of the air in the accommodation space and reduce the generation of condensed water vapor.

[0094] In the present disclosure, an air flow channel 31 is opened on the top plate 30. On the one hand, it can reduce the number of air pipes, make the air path design and arrangement simpler, and also facilitate the later maintenance of the equipment.

[0095] In some embodiments, the top plate 30 is provided with a plurality of air outlets 32, and the plurality of air outlets 32 correspond to the positions of the temperature control components. It is understood that the plurality of air outlets 32 can be arranged regularly or irregularly, depending on the specific use requirements, and the specific number of air outlets 32 can be set as needed.

[0096] In one embodiment provided herein, multiple air outlets 32 are arranged at intervals along the minor axis of the housing 11 and corresponding to the location of the temperature control component. It is understood that the multiple air outlets 32 can be arranged at equal or unequal intervals. By providing the air outlets 32 at locations on the top plate 30 corresponding to the location of the temperature control component, airflow can be directed to the target location (temperature control component), thereby eliminating the problem of condensation in the temperature control component.

[0097] In some embodiments, the air inlet of the airflow channel 31 (not shown) is provided on the surface of the top plate 30 facing the second side plate 52. The second side plate 52 is provided with a first through-slot 523 corresponding to the position of the air inlet, wherein the first air path assembly 80 penetrates the first through-slot 523, and the blowing port A and the blowing port B are respectively connected to the air inlet of the airflow channel 31 through the first air path assembly 80. In the present disclosure, by providing the first through-slot 523 on the second side plate 52, the first air path assembly 80 penetrates the first through-slot 523 and directly connects to the air inlet of the airflow channel 31 on the top plate 30, making the equipment structure simpler and facilitating subsequent maintenance. In addition, this design is beneficial to the space utilization of the optical module testing equipment and can effectively control the structural dimensions of the optical module testing equipment.

[0098] In some embodiments, the driving mechanism includes a crimping cylinder, the cylinder body of which is located on the side of the temperature control component away from the limiting structure 14 and connected to the top plate 30, and the piston rod of the crimping cylinder corresponds to the temperature control component.

[0099] Specifically, the optical module testing equipment also includes a third gas source, a second speed control valve and a third solenoid valve arranged in the test box 210. The fixture 10 also includes a temperature control component and a crimping cylinder connected to the temperature control component. The temperature control component corresponds to the position of the insertion cavity, and the third temperature detection element measures the temperature of the optical module in the insertion cavity.

[0100] The second speed regulating valve is arranged in the pipeline between the third air source and the input end of the third solenoid valve. The output end of the third solenoid valve is connected to the crimping cylinder through the pipeline. The MCU control board is electrically connected to the second speed regulating valve, and the MCU control board is electrically connected to the third solenoid valve through a relay.

[0101] refer to Figure 26 , a specific example provided by the present disclosure includes: four temperature control components, four crimping cylinders, each cylinder includes a first cylinder 15 and a second cylinder 16, and the four first cylinders 15 and the four second cylinders 16 correspond to the four temperature control components respectively. The bit error meter includes an air source, a second speed regulating valve, a second four-way solenoid valve and a third main air pipe arranged in the test box 210. The second speed regulating valve is arranged on the third main air pipe between the air source and the second speed regulating valve input end, and the second four-way solenoid valve configures the air supply of the third main air pipe to form a four-way gas, and the blowing ports of the four-way gas are respectively the blowing ports top1, top2, top3 and top4, and the blowing ports top1, top2, top3 and top4 are respectively connected to the corresponding crimping cylinders.

[0102] Furthermore, the clamp 10 also includes a second air circuit assembly 90, which is arranged on the side of the top plate 30 facing the second side plate 52, and a second through groove 524 is provided on the second side plate 52 corresponding to the position of the second air circuit assembly 90, wherein the second air circuit assembly 90 respectively penetrates the second through groove 524 and the top plate 30, and the blowing ports top1, top2, top3 and top4 are respectively connected to the cylinder body of the crimping cylinder through the second air circuit assembly 90.

[0103] Specifically, the top plate 30 is provided with an air flow passage (not shown), and the second air path assembly 90 includes a first air path component and a second air path component. The first air path component is connected to the air inlet of the air flow passage, and one end of the second air path component is connected to the air outlet 32 ​​of the air flow passage, and the other end is connected to the cylinder body of the crimping cylinder.

[0104] In the present disclosure, a second through groove 524 is provided on the second side panel 52, so that the second air path assembly 90 passes through the second through groove 524 and is directly connected to the air inlet of the air flow path on the top panel 30. This design has a simple structure, which makes subsequent maintenance of the equipment more convenient. In addition, this design is beneficial to the space utilization of the optical module testing equipment and can effectively control the structural dimensions of the optical module testing equipment.

[0105] In some embodiments, the temperature control assembly includes a water cooling module, a semiconductor cooling module, and a heat sink module. The water cooling module is in transmission connection with the drive mechanism, the heat sink module is located on the side of the limiting structure 14 facing the temperature control assembly, and the semiconductor cooling module is sandwiched between the water cooling module and the heat sink module.

[0106] The fixture 10 further includes a water channel assembly 100 , which is disposed on the third side plate 53 and connected to the water cooling module. The water channel assembly 100 is used to provide a water-cooling medium to the water cooling module.

[0107] In some embodiments, the third side panel 53 includes a fifth sub-side panel 531 and a sixth sub-side panel 532, the first end of the fifth sub-side panel 531 is set on the top panel 30, the first end of the sixth sub-side panel 532 is set on the bottom panel 40, and the second end of the fifth sub-side panel 531 is connected to the second end of the sixth sub-side panel 532, wherein the position of the fifth sub-side panel 531 corresponds to the position of the temperature control component.

[0108] In some embodiments, the fifth sub-side panel 531 and the sixth sub-side panel 532 are detachably connected to the top panel 30 and the bottom panel 40, respectively, by means of detachable connection including, but not limited to, threaded connection or snap connection. The detachable connection facilitates subsequent maintenance of components within the housing 11.

[0109] In a specific embodiment provided by the present disclosure, the first end of the fifth sub-side panel 531 is threadedly connected to the top panel 30, the first end of the sixth sub-side panel 532 is threadedly connected to the bottom panel 40, the second end of the fifth sub-side panel 531 and the second end of the sixth sub-side panel 532 are relatively abutted, and the fifth sub-side panel 531 corresponds to the position of the temperature control component.

[0110] In the present disclosure, on the one hand, the threaded connection can provide stable connection strength, ensuring a firm connection between the fifth sub-side panel 531 and the sixth sub-side panel 532 and the top panel 30 and the bottom panel 40. On the other hand, the threaded connection can be disassembled and reassembled multiple times without significantly reducing the connection performance between the fifth sub-side panel 531 and the sixth sub-side panel 532 and the top panel 30 and the bottom panel 40. On the third hand, the position or preload force between the fifth sub-side panel 531 and the sixth sub-side panel 532 and the top panel 30 and the bottom panel 40 can be fine-tuned by adjusting the tightness of the threaded connection. On the fourth hand, the position of the fifth sub-side panel 531 corresponds to the position of the temperature control assembly, and the temperature control assembly can be inspected and repaired by disassembling the fifth sub-side panel 531.

[0111] In some embodiments, the temperature control assembly includes a first temperature control assembly 12 and a second temperature control assembly 13. The first temperature control assembly 12 and the second temperature control assembly 13 are disposed relative to each other within the housing 11. Specifically, the first temperature control assembly 12 and the second temperature control assembly 13 are positioned relative to each other and disposed at the top and bottom of the housing, respectively, and are separated by a predetermined distance.

[0112] refer to Figure 3 The limiting bosses include a first limiting boss 142 and a second limiting boss 143. The limiting structure 14 is sandwiched between the first temperature control component 12 and the second temperature control component 13. The first limiting boss 142 and the second limiting boss 143 corresponding to the first temperature control component 12 and the second temperature control component 13 are respectively provided on both sides of the limiting through hole 141. An insertion cavity 144 for accommodating the optical module to be tested is formed between the first limiting boss 142 and the second limiting boss 143. The shape of the insertion cavity 144 is adapted to the shape of the optical module.

[0113] The driving mechanism is disposed in the housing 11 and is respectively connected to the first temperature control component 12 and the second temperature control component 13 to drive the first temperature control component 12 and the second temperature control component 13 to move toward the limiting structure 14 to abut against the optical module.

[0114] In the present disclosure, the first limiting boss 142 and the second limiting boss 143 can effectively limit the position of the optical module when it is inserted into the insertion cavity 144, thereby preventing the optical module from being offset and causing wear during the insertion process. Furthermore, in the direction in which the second limiting boss 143 points to the first limiting boss 142, the edges of the first limiting boss 142 and the second limiting boss 143 do not exceed the limiting structure 14. Therefore, when the optical module to be tested is inserted into the insertion cavity 144, the upper surface and lower surface of the optical module to be tested are respectively lower than the upper surface and lower surface of the limiting structure 14, that is, the first limiting boss 142 is lower than the upper surface of the limiting structure 14, and the second limiting boss is higher than the lower surface of the limiting structure 14. Thus, the first limiting protrusion 142 can form a certain gap between the first temperature control assembly 12 and the optical module, and the second limiting protrusion 143 can form a certain gap between the second temperature control assembly 13 and the optical module, thereby preventing direct contact between the optical module and the first and second temperature control assemblies 12 and 13, further reducing wear on the optical module. Furthermore, the limiting effect of the first and second limiting protrusions 142 and 143 can ensure the accuracy of the optical module insertion position, thereby ensuring the structural stability of the connector connected to the optical module and its service life.

[0115] In some embodiments, the limiting structure 14 is made of PIG (phosphor in glass) material. PIG has the high heat resistance and high thermal conductivity characteristics of inorganic materials and can significantly improve wear resistance.

[0116] In some embodiments, the limiting structure 14 is made of a self-lubricating material, including a non-metallic self-lubricating material or a polymer self-lubricating material. The use of a self-lubricating material can significantly reduce the friction between the insertion cavity 144 and the optical module, thereby effectively reducing the degree of wear.

[0117] In some embodiments, reference Figure 4-6 The limiting structure 14 includes a first limiting block 145 and a second limiting block 146 that are relatively spaced apart. A first limiting boss 142 is correspondingly provided at one end of the first limiting block 145 and the second limiting block 146 that is close to the first temperature control component 12, and a second limiting boss 143 is correspondingly provided at one end of the first limiting block 145 and the second limiting block 146 that is close to the second temperature control component 13. The first limiting boss 142 and the second limiting boss 143 extend along the depth direction of the insertion cavity 144 respectively. It can be understood that the extension length of the first limiting boss 142 and the second limiting boss 143 is designed according to the actual contact length between the first limiting boss 142 and the second limiting boss 143 and the optical module.

[0118] In the present disclosure, by providing first and second limiting bosses 142, 143, the optical module inserted into insertion cavity 144 can be circumferentially positioned, thereby preventing the optical module from shifting during insertion and causing wear. Furthermore, first and second limiting bosses 142, 143 guide the optical module along the length of insertion cavity 144, effectively ensuring the insertion accuracy of the optical module and preventing damage caused by inaccurate insertion.

[0119] In some embodiments, reference Figure 7-11 The crimping cylinder includes a first cylinder 15 and a second cylinder 16. The cylinder body of the first cylinder 15 is located on the side of the first temperature control component 12 facing away from the second temperature control component 13 and is connected to the housing 11. The first piston rod of the first cylinder 15 corresponds to the first temperature control component 12. The cylinder body of the second cylinder 16 is located on the side of the second temperature control component 13 facing away from the first temperature control component 12 and is connected to the housing 11. The second piston rod of the second cylinder 16 corresponds to the second temperature control component 13.

[0120] In a specific embodiment, the cylinder body of the first cylinder 15 is connected to the housing top. One end of the first piston rod is connected to the piston of the cylinder body of the first cylinder 15, and the other end of the first piston rod is connected to the first temperature control component 12. The piston movement of the first piston rod within the cylinder body of the first cylinder 15 drives the first temperature control component 12 to move toward the insertion cavity 144 to abut the optical module.

[0121] The cylinder body of the second cylinder 16 is connected to the bottom of the housing. One end of the second piston rod is connected to the piston of the cylinder body of the second cylinder 16, and the other end of the second piston rod is connected to the second temperature control assembly 13. The piston movement of the second piston rod within the cylinder body of the second cylinder 16 drives the second temperature control assembly 13 to move toward the insertion cavity 144 to abut the optical module.

[0122] In this disclosure, the use of a first cylinder 15 and a second cylinder 16 as the transmission mechanism reduces production costs and facilitates maintenance and repair. Furthermore, the cylinders offer fast response times, enabling rapid start and stop times, meeting the requirements of optical module testing. Furthermore, the cylinders are adjustable, allowing for adjustment of transmission speed and force as needed.

[0123] In some embodiments, the drive mechanism includes a first motor and a second motor.

[0124] In some embodiments, reference Figure 5 The first temperature control assembly 12 includes a first water-cooling module 121, a first semiconductor cooling module 122 (TEC), and a first heat sink module 123. The first water-cooling module 121 is in driving connection with the drive mechanism. The first heat sink module 123 is located on the side of the retaining structure 14 facing away from the second temperature control assembly 13. The first semiconductor cooling module 122 is sandwiched between the first water-cooling module 121 and the first heat sink module 123.

[0125] Furthermore, the first piston rod of the first cylinder 15 is connected to the first water-cooling module 121. The first water-cooling module 121 includes a first water-cooling seat 1211 and a first water-cooling head 1212. The surface of the first water-cooling seat 1211 facing the first semiconductor refrigeration module 122 is provided with a first accommodating cavity, and the first water-cooling head 1212 is disposed within the first accommodating cavity. A cooling channel is provided within the first water-cooling head 1212, and the cooling channel is used for the circulation of the cooling medium. The first water-cooling head 1212 also includes a pagoda head provided at the inlet and outlet of the cooling channel, and a throat clamp provided on the pagoda head, and the pagoda head is used to connect to the cooling pipeline. The first cylinder 15 is connected to the first water-cooling seat 1211.

[0126] In some embodiments, reference Figure 2 and Figure 8 The fixture 10 also includes a third stopper 23, which is located on the side of the first temperature control assembly 12 facing away from the second temperature control assembly 13 and is connected to the housing 11. A first stopper groove 12111 is provided on the surface of the first water-cooling seat 1211 facing away from the first semiconductor refrigeration module 122. The first stopper groove 12111 corresponds to the position of the third stopper 23. When the first cylinder 15 contracts, the third stopper 23 abuts against the first stopper groove 12111 to limit the contraction stroke of the first temperature control assembly 12.

[0127] The second temperature control assembly 13 includes a second water-cooling module 131, a second TEC (thermoelectric cooling) module 132, and a second heat sink module 133. The second water-cooling module 131 is in driving connection with the drive mechanism. The second heat sink module 133 is located on the side of the retaining structure 14 facing away from the first temperature control assembly 12. The second TEC (thermoelectric cooling) module 132 is sandwiched between the second water-cooling module 131 and the second heat sink module 133.

[0128] Furthermore, the second piston rod of the second cylinder 16 is connected to the second water-cooling module 131. The second water-cooling module 131 includes a second water-cooling seat 1311 and a second water-cooling head 1312. The surface of the second water-cooling seat 1311 facing the second semiconductor refrigeration module 132 is provided with a second accommodating cavity, and the second water-cooling head 1312 is disposed within the second accommodating cavity. A cooling channel is provided within the second water-cooling head 1312, and the cooling channel is used for the circulation of the cooling medium. The second water-cooling head 1312 also includes a pagoda head provided at the inlet and outlet of the cooling channel, and a throat clamp provided on the pagoda head, and the pagoda head is used to connect to the cooling pipeline. The second cylinder 16 is connected to the second water-cooling seat 1311. It can be understood that the first semiconductor refrigeration module 122 and the second semiconductor refrigeration module 132 are both TEC refrigeration modules.

[0129] In some embodiments, the fixture 10 further includes a fourth stopper 24, which is located on a side of the second temperature control assembly 13 facing away from the first temperature control assembly 12 and is connected to the housing 11. A second stopper groove (not shown) is provided on the surface of the second water-cooling seat 1311 facing away from the second semiconductor refrigeration module 132. The second stopper groove corresponds to the position of the fourth stopper 24. When the second cylinder 16 contracts, the fourth stopper 24 abuts against the second stopper groove to limit the contraction stroke of the second temperature control assembly 13.

[0130] In some embodiments, reference Figure 7 and Figure 10-11 The first heat sink module 123 includes a first heat sink 1231 and a first heat sink cover plate 1232 covering the first heat sink 1231. The first end of the first heat sink 1231 abuts against the first semiconductor refrigeration module 122. The second end of the first heat sink 1231 passes through the first heat sink cover plate 1232 and corresponds to the limiting through hole 141 of the limiting structure 14.

[0131] In a specific embodiment provided by the present disclosure, a first avoidance through-hole 12321 and a first mounting groove 12322 are provided on the side of the first heat sink cover 1232 facing the first heat sink 1231. A first protrusion 12311 is provided on the second end of the first heat sink 1231, protruding toward the first heat sink cover 1232. The first heat sink 1231 is disposed in the first mounting groove 12322. The first protrusion 12311 passes through the first avoidance through-hole 12321 and corresponds to the position-limiting through-hole 141. Driven by the first cylinder 15, the first temperature control assembly 12 causes the first protrusion 12311 to penetrate the position-limiting through-hole 141, extend into the insertion cavity 144, and abut against the optical module.

[0132] Furthermore, the first mounting groove 12322 corresponds to the position of the first accommodating cavity, and the first heat sink 1231 and the first semiconductor cooling module 122 are covered in the first accommodating cavity using the first heat sink cover 1232. This arrangement can protect the heat sink and the semiconductor cooling module, ensuring normal operation of the device.

[0133] The second heat sink module 133 includes a second heat sink 1331 and a second heat sink cover plate 1332 covering the second heat sink 1331. The first end of the second heat sink 1331 abuts against the second semiconductor refrigeration module 132. The second end of the second heat sink 1331 passes through the second heat sink cover plate 1332 and corresponds to the limiting through hole 141 of the limiting structure 14.

[0134] In a specific example provided by the present disclosure, a second avoidance through-hole 13321 and a second mounting groove (not shown in the figure) are provided on the side of the second heat sink cover 1332 facing the second heat sink 1331. A second protrusion 13311 is provided at the second end of the second heat sink 1331, protruding toward the second heat sink cover 1332. The second heat sink 1331 is disposed in the second mounting groove. The second protrusion 13311 passes through the second avoidance through-hole 13321 and corresponds to the position-limiting through-hole 141. Driven by the second cylinder 16, the second temperature control component 13 causes the second protrusion 13311 to penetrate the position-limiting through-hole 141, extend into the insertion cavity 144, and abut against the optical module.

[0135] Furthermore, the second mounting slot corresponds to the second accommodating cavity, and the second heat sink 1331 and the second semiconductor cooling module 132 are covered in the second accommodating cavity using a second heat sink cover 1332. This arrangement protects the heat sink and semiconductor cooling module, ensuring normal operation of the device.

[0136] In some embodiments, the first heat sink module 123 further includes a first temperature detection element 1233 , and the second heat sink module 133 further includes a second temperature detection element 1333 . The first end of the first temperature detection element 1233 is inserted into the first heat sink 1231 , and the second end of the first temperature detection element 1233 is fixed to the first heat sink cover 1232 .

[0137] In some embodiments, reference Figure 10-11 A first insertion hole is provided on the first protrusion 12311 , and the first end of the first temperature detection element 1233 is inserted into the first insertion hole.

[0138] In some embodiments, reference Figure 8-9 The first end of the second temperature detection element 1333 is inserted into the second heat sink 1331 , and the second end of the second temperature detection element 1333 is fixed to the second heat sink cover 1332 .

[0139] In some embodiments, the second protrusion 13311 is provided with a second insertion hole, into which the first end of the second temperature detection element 1333 is inserted. The second heat sink module 133 further includes a fixing member 25 for fixing the second temperature detection element 1333 to the second heat sink cover 1332.

[0140] In some embodiments, the second heat sink module 133 further includes a gasket 26, which is disposed between the fixing member 25 and the second temperature sensing element 1333. The gasket 26 is crimped onto the second temperature sensing element 1333 by connecting a threaded connector to a threaded hole, thereby securing the second temperature sensing element 1333 to the second heat sink cover 1332. In the present disclosure, the connection between the threaded connector and the threaded hole is detachable, facilitating subsequent maintenance of the second temperature sensing element 1333 and enhancing the user experience.

[0141] In some embodiments, the optical module testing equipment further includes a second air source, a pressure regulating valve, and a second solenoid valve disposed within the test chamber 210. The fixture further includes a third temperature sensing element and a telescopic cylinder. The third temperature sensing element is positioned corresponding to the insertion cavity, and the telescopic cylinder is in transmission connection with the third temperature sensing element. The third temperature sensing element is configured to measure the temperature of the optical module within the insertion cavity.

[0142] The pressure regulating valve is arranged in the pipeline between the second air source and the input end of the second solenoid valve. The output end of the second solenoid valve is connected to the telescopic cylinder through the pipeline. The MCU control board is electrically connected to the pressure regulating valve, and the MCU control board is also electrically connected to the second solenoid valve through a relay.

[0143] refer to Figure 25 A specific example provided by the present disclosure includes: four limiting structures 14 and four third temperature detection elements.

[0144] The optical module testing equipment includes an air source, a pressure regulating valve, a first four-way solenoid valve, and a second main air pipe, all located within a test chamber 210. The pressure regulating valve is located within the second main air pipe between the air source and the first four-way solenoid valve. The first four-way solenoid valve configures the air supply from the second main air pipe into a four-way air supply. The four-way air supply ports are designated as side1, side2, side3, and side4, respectively. These ports are connected to corresponding telescopic cylinders, which are used to extend and retract the third temperature detection element.

[0145] In some embodiments, the fixture 10 further includes a guide mechanism, which is connected to the shell 11 and movably connected to the first temperature control component 12 and / or the second temperature control component 13 to guide the movement of the first temperature control component 12 and / or the second temperature control component 13.

[0146] In some embodiments, reference Figure 2 、 Figure 4-5 and Figure 8 The guide mechanism includes a first guide member 17 and a second guide member 18. The first end of the first guide member 17 is connected to the shell 11, and the second end of the first guide member 17 passes through the first temperature control component 12 to guide the movement of the first temperature control component 12.

[0147] A first end of the second guide member 18 is connected to the housing 11 , and a second end of the second guide member 18 passes through the second temperature control assembly 13 to guide the movement of the second temperature control assembly 13 .

[0148] In some embodiments, the guide mechanism further includes a first stopper 19, a first elastic member 20, a second stopper 21, and a second elastic member 22. The first stopper 19 and the first elastic member 20 are located on the side of the first water-cooling seat 1211 facing away from the housing top. The first stopper 19 is disposed at the second end of the first guide member 17, and the first elastic member 20 is sandwiched between the first temperature control assembly 12 and the first stopper 19. The first elastic member 20 is used to provide a buffering and restoring force for the first temperature control assembly 12. Specifically, the first elastic member 20 is sandwiched between the first water-cooling seat 1211 and the first stopper 19.

[0149] The second stopper 21 and the second elastic member 22 are located on the side of the second water-cooling seat 1311 facing away from the housing bottom. The second stopper 21 is disposed at the second end of the second guide member 18. The second elastic member 22 is sandwiched between the second temperature control assembly 13 and the second stopper 21. The second elastic member 22 is used to provide a buffering and restoring force for the second temperature control assembly 13. Specifically, the second elastic member 22 is sandwiched between the second water-cooling seat 1311 and the second stopper 21.

[0150] In some embodiments, the first elastic member 20 and the second elastic member 22 are spring members.

[0151] In the present disclosure, the optical module insertion state includes: during the insertion of the optical module into the insertion cavity of the retaining structure, the heat sink, driven by the drive mechanism, moves away from the retaining structure, forming a gap between the heat sink and the optical module. The optical module testing state includes: prior to testing, the heat sink, driven by the drive mechanism, moves toward the retaining structure, bringing the heat sink and the optical module into contact, and the semiconductor cooling module of the temperature control assembly regulates the temperature of the optical module through the heat conduction characteristics of the heat sink.

[0152] In some embodiments, reference Figure 12 The present disclosure provides an optical module testing device, which includes a test box 210 and a fixture 10 for optical module testing. The fixture 10 for optical module testing is detachably connected to the test box 210.

[0153] It is understood that the above embodiments are merely exemplary embodiments for illustrating the principles of the present disclosure, and the present disclosure is not limited thereto. Those skilled in the art may make various modifications and improvements without departing from the spirit and substance of the present disclosure, and such modifications and improvements are also considered to be within the scope of protection of the present disclosure.

Claims

1. An optical module testing device, characterized in that: The optical module testing equipment includes a test box, a test board and a fixture; The test box is provided with a bit error rate test board group, the bit error rate test board group includes a high-speed signal board arranged relatively spaced apart and a low-speed signal board detachably electrically connected to the high-speed signal board; The fixture is detachably connected to the test box, and is provided with an insertion cavity and a mounting cavity corresponding to the insertion cavity; the insertion cavity is used to insert the optical module to be tested, and the test board is arranged in the mounting cavity; The first end of the test board is provided with a socket for matching and connecting with the optical module to be tested, and the second end of the test board is detachably electrically connected to the low-speed signal board and the high-speed signal board respectively.

2. The optical module testing device according to claim 1, characterized in that: The optical module testing equipment further includes a first connector, and the high-speed signal board and the low-speed signal board are detachably electrically connected via the first connector.

3. The optical module testing device according to claim 1, wherein: The optical module testing equipment further includes a second connector, and the second end of the test board and the low-speed signal board are detachably electrically connected via the second connector.

4. The optical module testing device according to claim 3, characterized in that: The second connector includes a gold finger and a slot; One of the gold finger and the slot is arranged at the second end of the test board, and the other of the gold finger and the slot is arranged on the low-speed signal board, and the gold finger is used to be plugged into the slot.

5. The optical module testing device according to claim 1, wherein: A first RF connector is provided at the first end of the test board, a second RF connector is provided at the high-speed signal board, and the test board is electrically connected to the high-speed signal board through the first RF connector and the second RF connector.

6. The optical module testing device according to any one of claims 1 to 5, characterized in that: The high-speed signal board and the low-speed signal board are arranged at intervals along the height direction of the test box; The optical module testing equipment further includes a support member supported between the high-speed signal board and the low-speed signal board.

7. The optical module testing device according to any one of claims 1 to 5, characterized in that: The low-speed signal board is provided with a first mounting hole, and the test box is provided with a second mounting hole at a position corresponding to the first mounting hole, so that the low-speed signal board is fixed to the test box by fasteners passing through the first mounting hole and the second mounting hole.

8. The optical module testing device according to any one of claims 1 to 5, characterized in that: The optical module testing device further includes a partition plate provided in the test box, wherein the partition plate separates the test box into a first receiving space and a second receiving space; The fixture and the test board are both arranged in the first receiving space, and the bit error rate test board group is arranged in the second receiving space.

9. The optical module testing device according to claim 8, characterized in that: When the test board is provided with a first RF connector and the high-speed signal board is provided with a second RF connector, the partition is further provided with a communication opening; The first RF connector is communicatively connected to the second RF connector through the communication opening.

10. The optical module testing device according to any one of claims 1 to 5, characterized in that: The test box is provided with an inspection opening at a position corresponding to the fixture; The test box body further includes an inspection cover rotatably arranged on the inspection opening.

11. The optical module testing device according to any one of claims 1 to 5, characterized in that: The fixture includes a TEC refrigeration module, and the test box is also provided with a TEC controller, an adapter board and an MCU control board; the high-speed signal board is provided with an error code test chip; The MCU control board is electrically connected to the TEC controller and the error code test chip respectively, and the TEC controller is electrically connected to the TEC refrigeration module through the adapter board.

12. The optical module testing device according to claim 11, characterized in that: A radiator and a fan are further provided in the test box. The radiator is provided correspondingly to the position of the error code test chip, and the fan is provided correspondingly to the position of the radiator.

13. The optical module testing device according to claim 11, characterized in that: The test board, the bit error rate test board group, the TEC controller and the MCU control board are arranged in sequence along the depth direction of the insertion cavity.

14. The optical module testing device according to claim 11, characterized in that: The optical module testing equipment further includes a first gas source, a first speed regulating valve, a relay and a first solenoid valve arranged in the test box; The test box is provided with an air flow channel, and the air flow channel is provided with air outlets corresponding to the two opposite ends of the optical module to be tested; the test board is located corresponding to the insertion cavity and is arranged on the fixture, and the test board is provided with a vent hole communicating with the insertion cavity; The first speed regulating valve is arranged in a pipeline between the first air source and the input end of the first solenoid valve; the output end of the first solenoid valve is connected to the air vent and the air inlet of the air flow channel through pipelines; the MCU control board is electrically connected to the first speed regulating valve, and the MCU control board is also electrically connected to the first solenoid valve through the relay.

15. The optical module testing device according to claim 14, characterized in that: The optical module testing equipment further includes a second air source, a pressure regulating valve, and a second solenoid valve provided in the test box. The fixture further includes a third temperature detection element and a telescopic cylinder. The third temperature detection element corresponds to the position of the insertion cavity. The telescopic cylinder is in transmission connection with the third temperature detection element. The third temperature detection element is used to measure the temperature of the optical module in the insertion cavity. The pressure regulating valve is arranged in the pipeline between the second air source and the input end of the second solenoid valve, the output end of the second solenoid valve is connected to the telescopic cylinder through the pipeline, the MCU control board is electrically connected to the pressure regulating valve, and the MCU control board is also electrically connected to the second solenoid valve through the relay.

16. The optical module testing device according to claim 15, characterized in that: The optical module testing equipment further includes a third air source, a second speed regulating valve, and a third solenoid valve provided in the test box; the fixture further includes a temperature control component and a crimping cylinder connected to the temperature control component, the temperature control component corresponds to the position of the insertion cavity, and the third temperature detection element measures the temperature of the optical module in the insertion cavity; The second speed regulating valve is arranged in the pipeline between the third air source and the input end of the third solenoid valve, the output end of the third solenoid valve is connected to the crimping cylinder through the pipeline, the MCU control board is electrically connected to the second speed regulating valve, and the MCU control board is electrically connected to the third solenoid valve through the relay.

17. The optical module testing device according to any one of claims 1 to 5, characterized in that: The optical module testing device further includes a buckle, and the clamp is detachably connected to the test box via the buckle.

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