Internet of Things gateway with automatic dehumidification mechanism

Abstract

The utility model relates to the technical field of Internet of Things gateway equipment, in particular to an Internet of Things gateway with an automatic dehumidification mechanism, which is reasonable in structure, simple and convenient to operate and capable of effectively improving the running stability of equipment, and is characterized by further comprising the automatic dehumidification mechanism. The automatic dehumidification mechanism comprises a dehumidification circuit, a water collector, a semiconductor chilling plate, a cooling fin and a fan, the cooling fin is arranged outside the shell and attached to the hot end of the semiconductor chilling plate, the semiconductor chilling plate is located in the shell, the cold end of the semiconductor chilling plate is attached to the water collector, the semiconductor chilling plate is connected with the dehumidification circuit, and the fan is connected with the dehumidification circuit. The water collector adopts a fin-type square side-blowing heat dissipation module, a refrigeration sheet heat conduction layer made of red copper is arranged on one side of the fin-type square side-blowing heat dissipation module, more than two fins which are densely arranged in parallel are arranged in the fin-type square side-blowing heat dissipation module, and airflow channels are formed among the fins.

Description

Technical field:

[0001] The utility model relates to the technical field of Internet of Things gateway equipment, and specifically to an Internet of Things gateway with an automatic dehumidification mechanism, which has a reasonable structure, is easy to operate, and can effectively improve the operating stability of the equipment. Background technology:

[0002] IoT gateways play a crucial role in industrial sensing and information transmission. High humidity can cause corrosion in metal components and circuit boards within the IoT gateway, damaging components and shortening the device's lifespan. This corrosion can affect circuit connectivity and stability, leading to performance degradation or even complete failure. When humidity reaches a certain level and the temperature drops, condensation may form inside the IoT gateway. This condensation can accumulate on circuit boards and other electronic components, causing short circuits, leakage, and even fire hazards.

[0003] Conventional dehumidification solutions require maintenance and replacement of dehumidification materials, which is time-consuming, labor-intensive, and costly: 1. Traditional dehumidification solutions use dehumidification bags, but in high-humidity environments, dehumidification bags need frequent replacement. Failure to replace them promptly can lead to IoT gateway failure and inability to guarantee real-time humidity control. 2. Spraying conformal coating on circuit boards can provide short-term moisture protection, but over time, the coating will peel and become ineffective. Furthermore, the coating can severely affect the heat dissipation of circuit board components and the transmission of circuit board signals, especially high-speed signals. Conformal coating contains flammable ingredients, posing a fire risk and presenting significant drawbacks. Summary of the invention:

[0004] In response to the shortcomings and deficiencies in the existing technology, the utility model proposes an Internet of Things switch with an automatic dehumidification mechanism that adopts an electronic automatic dehumidification solution. It does not require personnel inspection, can monitor the humidity value inside the Internet of Things switch in real time, automatically regulate the humidity inside the Internet of Things switch, and the dehumidification function will not fail during long-term operation.

[0005] The utility model is achieved through the following measures:

[0006] An Internet of Things gateway with an automatic dehumidification mechanism is provided with a shell, and an Internet of Things gateway circuit is provided in the shell. The characteristic is that it is also provided with an automatic dehumidification mechanism, the automatic dehumidification mechanism including a dehumidification circuit, a water collector, a semiconductor refrigeration plate, a heat sink, and a fan, wherein the heat sink is arranged outside the shell and is in contact with the hot end of the semiconductor refrigeration plate, the semiconductor refrigeration plate is located in the shell, and the cold end of the semiconductor refrigeration plate is in contact with the water collector, the semiconductor refrigeration plate is connected to the dehumidification circuit, the water collector adopts a fin-type square side-blowing heat dissipation module, one side of the fin-type square side-blowing heat dissipation module is provided with a heat-conducting layer of a refrigeration plate made of red copper, the fin-type square side-blowing heat dissipation module is provided with two or more fins arranged densely and in parallel, and an air flow channel is formed between the fins, and a fan for sending air into the air flow channel is installed at one end of the air flow channel, and a drainage hole is provided at the bottom of the fin-type square side-blowing heat dissipation module, and the drainage hole is connected to the drain port on the shell through a pipeline.

[0007] The heat-conducting layer of the copper refrigeration plate of the water collector described in the utility model is in contact with the cold end of the semiconductor refrigeration plate. The fins are rapidly cooled under the action of the semiconductor refrigeration plate, causing the air passing through the fins to condense into water, and then flow out along the drainage holes on the fins under the action of gravity and discharged from the shell along the drainage port.

[0008] The dehumidification circuit of the present invention is provided with an ARM controller, a humidity detection circuit, a TEC control circuit, and a fan control circuit. The ARM controller is connected to the humidity monitoring circuit, the TEC control circuit, and the fan control circuit respectively. The fan control circuit is connected to the fan via an interface circuit, and the TEC control circuit is connected to the semiconductor refrigeration plate via an interface circuit.

[0009] When the utility model is working, the humidity detection circuit is used to detect the humidity inside the IoT switch shell. The ARM controller makes a judgment based on the read humidity inside the IoT switch shell to control the start and stop of the dehumidification mechanism, wherein the TEC control circuit realizes the control of the TEC refrigeration plate, and the fan control circuit realizes the control of the working state of the fan. The semiconductor refrigeration plate in the dehumidification mechanism is an electronic semiconductor device, which controls the direction of current flow to cool and heat at the same time, and cools when close to the water collection module; the fan plays a ventilation role, and draws out the air after passing through the water collection module to form an air circulation; the water collection module plays a condensation role, and condenses water when the air passes through the low-temperature water collection module, and the condensed water is discharged through the drain pipe; the heat sink plays a heat dissipation role.

[0010] Compared with the existing technology, the present invention adopts an electronic automatic dehumidification solution, which does not require personnel inspection. It can monitor the humidity value inside the IoT gateway in real time and automatically adjust the humidity inside the IoT gateway. The dehumidification function will not fail during long-term operation, and there is no need to replace the dehumidification material. It avoids the reduction of equipment life and damage of components inside the IoT gateway due to long-term moisture, as well as signal attenuation and gateway performance degradation caused by humidity. Description of the drawings:

[0011] Attachment Figure 1 It is a principle block diagram of the utility model.

[0012] Attachment Figure 2 It is a schematic diagram of the power supply circuit in the embodiment of the present utility model.

[0013] Attachment Figure 3 It is a schematic diagram of the ARM controller in the embodiment of the present utility model.

[0014] Attachment Figure 4 It is a schematic diagram of the TEC control circuit in the embodiment of the present utility model.

[0015] Attachment Figure 5 It is a schematic diagram of a fan control circuit in an embodiment of the present utility model.

[0016] Attachment Figure 6 It is a schematic diagram of the interface circuit in the embodiment of the present utility model.

[0017] Attachment Figure 7 It is a schematic diagram of the humidity detection circuit in the embodiment of the present utility model.

[0018] Attachment Figure 8 It is a schematic diagram of the structure of the water collector in the embodiment of the present utility model.

[0019] Figure numerals: dehumidification circuit 1, water collector 2, semiconductor refrigeration plate 3, heat sink 4, fan 5, ARM controller 6, humidity detection circuit 7, TEC control circuit 8, fan control circuit 9, interface circuit 10, housing 11, drain hole 12, drain outlet 13. Specific implementation method:

[0020] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0021] Example 1:

[0022] This example proposes an Internet of Things gateway device with an automatic dehumidification mechanism, as shown in the attached Figure 1As shown, a shell is provided, an Internet of Things switch circuit is provided in the shell, and an automatic dehumidification mechanism is also provided. The automatic dehumidification mechanism includes a dehumidification circuit 1, a water collector 2, a semiconductor refrigeration plate 3, a heat sink 4, and a fan 5, wherein the heat sink 4 is arranged outside the shell and is in contact with the hot end of the semiconductor refrigeration plate 3. The semiconductor refrigeration plate 3 is located in the shell, and the cold end of the semiconductor refrigeration plate 3 is in contact with the water collector 2. The semiconductor refrigeration plate 3 is connected to the dehumidification circuit 1. The water collector adopts a fin-type square side-blowing heat dissipation module. A refrigeration plate heat conduction structure made of red copper is provided on the side of the water collector, and dense fins are provided inside for heat conduction. A fan is installed on one side of the fin for exhaust, and the other side of the fin is an air inlet. A semiconductor refrigeration plate is installed on the side of the water collector. The fins cool down rapidly under the action of the semiconductor refrigeration plate, causing the air passing through the fins to condense into water, and flow out along the drainage holes on the fins under the action of gravity, and discharged from the Internet of Things switch along the drainage outlet.

[0023] The dehumidification circuit in this example is provided with an ARM controller 6, a humidity detection circuit 7, a TEC control circuit 8, and a fan control circuit 9. The ARM controller 6 is connected to the humidity monitoring circuit 7, the TEC control circuit 8, and the fan control circuit 9, respectively. The fan control circuit 9 is connected to the fan 5 via an interface circuit, and the TEC control circuit 8 is connected to the semiconductor refrigeration plate 3 via an interface circuit.

[0024] This example also has a power supply circuit, which is connected to the dehumidification circuit. The power supply circuit includes a 5.5V power supply circuit for the TEC control circuit and the fan control circuit, and a 3.3V power supply circuit for the ARM and peripheral circuits. Figure 2 As shown; the humidity detection circuit described in this example can read the internal humidity value of the Internet of Things gateway in real time, such as Figure 3 As shown, this can be achieved using the HDC1080DMBR humidity monitoring module;

[0025] The ARM controller in this example is as follows Figure 3 As shown, the TEC control circuit controls the start and stop states of the semiconductor refrigeration plate through the ARM controller, as shown in FIG. Figure 4 As shown; the fan control circuit described in this example controls the start and stop status of the fan via the ARM controller, as shown Figure 5 As shown; in this example, an interface circuit is also provided, such as Figure 6 As shown, the fan and the semiconductor cooling plate are connected.

[0026] Compared with the existing technology, the present invention adopts an electronic automatic dehumidification solution, which does not require personnel inspection. It can monitor the humidity value inside the IoT gateway in real time and automatically adjust the humidity inside the IoT gateway. The dehumidification function will not fail during long-term operation, and there is no need to replace the dehumidification material. It avoids the reduction of equipment life and damage of components inside the IoT gateway due to long-term moisture, as well as signal attenuation and gateway performance degradation caused by humidity.

Claims

1. An Internet of Things gateway with an automatic dehumidification mechanism, comprising a housing, wherein an Internet of Things gateway circuit is provided in the housing, wherein: An automatic dehumidification mechanism is also provided, which includes a dehumidification circuit, a water collector, a semiconductor refrigeration sheet, a heat sink, and a fan, wherein the heat sink is arranged outside the shell and is in contact with the hot end of the semiconductor refrigeration sheet. The semiconductor refrigeration sheet is located inside the shell, and the cold end of the semiconductor refrigeration sheet is in contact with the water collector. The semiconductor refrigeration sheet is connected to the dehumidification circuit. The water collector adopts a fin-type square side-blowing heat dissipation module. One side of the fin-type square side-blowing heat dissipation module is provided with a heat-conducting layer of a refrigeration sheet made of red copper. The fin-type square side-blowing heat dissipation module is provided with more than two fins arranged densely and in parallel, and an air flow channel is formed between the fins. A fan for sending air into the air flow channel is installed at one end of the air flow channel. A drainage hole is provided at the bottom of the fin-type square side-blowing heat dissipation module, and the drainage hole is connected to the drain port on the shell through a pipeline.

2. The Internet of Things gateway with an automatic dehumidification mechanism according to claim 1, characterized in that: The copper cooling fin heat conducting layer of the water collector fits the cold end of the semiconductor cooling fin. The fins cool down rapidly under the action of the semiconductor cooling fins, causing the air passing through the fins to condense into water, and then flow out along the drainage holes on the fins under the action of gravity and discharged from the shell along the drainage port.

3. The Internet of Things gateway with an automatic dehumidification mechanism according to claim 1, characterized in that: The dehumidification circuit is provided with an ARM controller, a humidity detection circuit, a TEC control circuit, and a fan control circuit. The ARM controller is connected to the humidity monitoring circuit, the TEC control circuit, and the fan control circuit respectively. The fan control circuit is connected to the fan via an interface circuit, and the TEC control circuit is connected to the semiconductor refrigeration plate via an interface circuit.

4. The Internet of Things gateway with an automatic dehumidification mechanism according to claim 3, characterized in that: The humidity detection circuit is implemented using the HDC1080DMBR humidity monitoring module.

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