Multilayer circuit board structure capable of improving alignment precision
By setting alignment holes and alignment PADs on the ceramic substrate and using CCD gripping to perform layer-by-layer alignment, the problem of serious misalignment of the circuit layers of the ceramic circuit board is solved, achieving higher alignment accuracy and product quality.
Patent Information
- Application Number
- CN202422612630.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-28
- Publication Date
- 2025-09-30
- Estimated Expiration
- 2034-10-28
AI Technical Summary
When manufacturing circuits on various layers of existing ceramic circuit boards, circular holes are used for alignment, which results in serious misalignment between the circuit layers and makes it difficult to ensure high-precision alignment.
Alignment holes and alignment PADs are set on the ceramic substrate, and the alignment PAD is used as a graphic positioning to perform alignment layer by layer, replacing the traditional round hole alignment method. The alignment PAD is captured by CCD for precise alignment.
It effectively reduces the deviation error between the circuits on each layer, improves the alignment accuracy, makes the circuits more precise, and improves the product quality.
Smart Images
Figure CN223402617U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of ceramic circuit boards, in particular to a multi-layer circuit board structure capable of improving alignment accuracy. Background Art
[0002] Ceramic circuit boards are essentially made of electronic ceramic materials and can be fashioned into a variety of shapes. Their most prominent features are high-temperature resistance and high electrical insulation performance. They also offer advantages such as low dielectric constant and loss, high thermal conductivity, excellent chemical stability, and similar thermal expansion coefficients for components. The packaging and processing of ceramic circuit boards plays a crucial role in their subsequent use.
[0003] With the increasing integration of circuits, ceramic circuit boards are now being molded with multiple layers of circuits to meet the demands of their use. Currently, when manufacturing ceramic circuit boards, multiple layers of circuits must be electroplated onto a ceramic substrate. Each layer of circuits must be aligned during electroplating to ensure the correct placement of the circuits.
[0004] In existing technology, laser drilling is commonly used to directly drill all the required circular holes on the ceramic substrate. Each layer of circuits uses a different circular hole for alignment. Due to drilling precision errors and the inherent gripping errors of the equipment, the alignment between the circuits on each layer can be quite serious. Therefore, it is necessary to develop a solution to this problem. Utility Model Content
[0005] In view of this, the present invention addresses the deficiencies in the prior art, and its main purpose is to provide a multi-layer circuit board structure that can improve alignment accuracy. It can effectively solve the problem of existing ceramic circuit boards that use round holes for alignment in the production of each layer of circuits, resulting in serious misalignment between the layers of circuits.
[0006] In order to achieve the above purpose, the present invention adopts the following technical solutions:
[0007] A multi-layer circuit board structure capable of improving alignment accuracy includes a circuit board body; a plurality of alignment holes are provided on the surface of the circuit board body for alignment during the production of a first layer of circuits, and a plurality of first alignment pads (PADs) are provided on the surface of the circuit board body for alignment during the production of a second layer of circuits, wherein the first alignment pads are formed simultaneously with the first layer of circuits.
[0008] As a preferred solution, a plurality of second alignment PADs are provided on the surface of the circuit board body for alignment during the production of the third layer of circuits, and the second alignment PADs are formed simultaneously with the second layer of circuits.
[0009] As a preferred solution, the circuit board body includes a ceramic substrate and a base copper layer arranged on the ceramic substrate, and the first alignment PAD and the second alignment PAD are both located at the edge of the base copper layer.
[0010] As a preferred solution, a metal dam is formed on the base copper layer by a DPC process so as to package electronic devices and meet the needs of use.
[0011] As a preferred solution, the second alignment PAD is circular, triangular, square or cross-shaped.
[0012] As a preferred solution, the shape of the second alignment PAD is different from that of the first alignment PAD.
[0013] As a preferred solution, the first alignment PAD is circular, triangular, square or cross-shaped.
[0014] As a preferred solution, the alignment hole is located at the edge of the circuit board body, and the alignment hole passes through the upper and lower surfaces of the circuit board body.
[0015] As a preferred solution, the alignment holes are round holes, which makes the alignment more precise.
[0016] Compared with the prior art, the present invention has obvious advantages and beneficial effects. Specifically, it can be seen from the above technical solution that:
[0017] By making an alignment PAD while forming one layer of circuits, the alignment PAD can be directly captured as a graphic positioning to align the production of the next layer of circuits, replacing the traditional method of using round holes for alignment, thereby reducing the deviation error caused by the accuracy of punching position, effectively improving the alignment accuracy, making the produced circuits more precise, and the overall product quality is also better.
[0018] In order to more clearly illustrate the structural features and effects of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 This is a schematic diagram of the first state of the manufacturing process of the preferred embodiment of the present utility model;
[0020] Figure 2 This is a schematic diagram of the second state of the manufacturing process of the preferred embodiment of the present invention.
[0021] Description of the accompanying drawings:
[0022] 10. Circuit board body 11. Ceramic substrate
[0023] 12. Base copper layer 13. Metal dam
[0024] 101, alignment hole 102, first alignment PAD
[0025] 103. The second pair of PAD. DETAILED DESCRIPTION
[0026] Please refer to Figures 1 to 2 As shown, it shows the specific structure of a preferred embodiment of the present utility model, including a circuit board body 10.
[0027] The surface of the circuit board body 10 is provided with a plurality of alignment holes 101 for alignment when the first layer of circuits (not shown in the figure) is produced, and the surface of the circuit board body 10 is provided with a plurality of first alignment PADs 102 for alignment when the second layer of circuits (not shown in the figure) is produced. The first alignment PADs 102 are formed at the same time as the first layer of circuits. In this embodiment, the alignment holes 101 are located at the edge of the circuit board body 10, and the alignment holes 101 pass through the upper and lower surfaces of the circuit board body 10 for more precise alignment. Moreover, the alignment holes 101 are circular holes, but may also be other shapes without limitation. In addition, the first alignment PAD 102 may be circular, triangular, square or cross-shaped, but may also be other shapes without limitation. In this embodiment, the first alignment PAD 102 is circular.
[0028] The surface of the circuit board body 10 is provided with a plurality of second alignment PADs 103 for alignment when the third layer of circuits is produced, and the second alignment PADs 103 are formed simultaneously with the second layer of circuits. Specifically, the circuit board body 10 includes a ceramic substrate 11 and a base copper layer 12 provided on the ceramic substrate 11, and the first alignment PAD 102 and the second alignment PAD 103 are both located at the edge of the base copper layer 12. The second alignment PAD 103 is circular, triangular, square or cross-shaped, and can also be other shapes, without limitation. In the present embodiment, the second alignment PAD 103 is cross-shaped. In addition, the shape of the second alignment PAD 103 is different from that of the first alignment PAD 102, so as to facilitate alignment. In addition, a metal dam 13 is formed on the base copper layer 12 by the DPC process to facilitate the packaging of electronic devices to meet the needs of use.
[0029] The production process of this embodiment is described in detail as follows:
[0030] First, if Figure 1As shown, holes are drilled on the ceramic substrate 11 to form a plurality of alignment holes 101. Then, the plurality of alignment holes 101 are used for alignment to form a first layer of circuits. When forming the first layer of circuits, a first alignment PAD 102 is also formed. Then, the pattern of the first alignment PAD 102 is captured by a CCD, and the first alignment PAD 102 is used for alignment and forming a second layer of circuits to reduce the alignment deviation between the second layer of circuits and the first layer of circuits. When forming the second layer of circuits, a second alignment PAD 103 is also formed. Then, the pattern of the second alignment PAD 103 is captured by a CCD, and the second alignment PAD 103 is used for alignment and forming a third layer of circuits to reduce the alignment deviation between the third layer of circuits and the second layer of circuits. This process is analogous to reducing the alignment error between each layer of circuits.
[0031] The design focus of the utility model is that by making an alignment PAD while forming one layer of circuits, the alignment PAD can be directly grabbed as a graphic positioning to align the production of the next layer of circuits, replacing the traditional method of using round holes for alignment, thereby reducing the deviation error caused by the accuracy of the punching position, effectively improving the alignment accuracy, making the produced circuits more precise, and the overall quality of the product is also better.
[0032] The above description is merely a preferred embodiment of the present invention and does not limit the technical scope of the present invention. Therefore, any minor modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention are still within the scope of the technical solution of the present invention.
Claims
1. A multilayer circuit board structure capable of improving alignment accuracy, comprising a circuit board body; characterized in that: The surface of the circuit board body is provided with a plurality of alignment holes for alignment when the first layer of circuits are produced, and the surface of the circuit board body is provided with a plurality of first alignment PADs for alignment when the second layer of circuits are produced. The first alignment PADs are formed simultaneously with the first layer of circuits.
2. The multi-layer circuit board structure capable of improving alignment accuracy according to claim 1, characterized in that: A plurality of second alignment PADs for alignment during the production of the third layer of circuits are arranged on the surface of the circuit board body, and the second alignment PADs are formed simultaneously with the second layer of circuits.
3. The multi-layer circuit board structure capable of improving alignment accuracy according to claim 2, wherein: The circuit board body includes a ceramic substrate and a base copper layer arranged on the ceramic substrate. The first alignment PAD and the second alignment PAD are both located at the edge of the base copper layer.
4. The multi-layer circuit board structure capable of improving alignment accuracy according to claim 3, wherein: A metal dam is formed on the base copper layer by using a DPC process.
5. The multi-layer circuit board structure capable of improving alignment accuracy according to claim 2, wherein: The second alignment PAD is circular, triangular, square or cross-shaped.
6. The multi-layer circuit board structure capable of improving alignment accuracy according to claim 2, wherein: The shape of the second alignment PAD is different from that of the first alignment PAD.
7. The multi-layer circuit board structure capable of improving alignment accuracy according to claim 1, wherein: The first alignment PAD is circular, triangular, square or cross-shaped.
8. The multi-layer circuit board structure capable of improving alignment accuracy according to claim 1, wherein: The alignment holes are located at the edge of the circuit board body, and the alignment holes pass through the upper and lower surfaces of the circuit board body.
9. The multi-layer circuit board structure capable of improving alignment accuracy according to claim 1, wherein: The alignment hole is a circular hole.