Circuit board structure of CCM product
By adding a first copper plating layer with a thickness of no less than 5 μm and a second copper plating layer with a thickness of no less than 10 μm to the circuit board structure of the CCM product, the problems of easy damage and water seepage in the open cover area and abnormal resistance in the ink open area are solved, thereby improving the product yield.
Patent Information
- Application Number
- CN202422731933.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-11
- Publication Date
- 2025-09-30
- Estimated Expiration
- 2034-11-11
AI Technical Summary
The open cover area in the circuit board structure of CCM products is prone to damage and water seepage, and the resistance value of the ink open area is abnormal, resulting in a decrease in product yield.
A first copper plating layer with a thickness of not less than 5um is set at the top of the open cover area, and a second copper plating layer with a thickness of not less than 10um is set at the bottom inner side of the ink open area to increase the copper thickness to improve water seepage and reduce the impact of ink height difference.
By increasing the thickness of the copper plating layer, the water seepage phenomenon in the open cover area is improved, the abnormal resistance value in the ink open area is reduced, and the product yield is improved.
Smart Images
Figure CN223402620U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of circuit board manufacturing, and in particular to a circuit board structure of a CCM product. Background Art
[0002] Compact Camera Modules (CCMs) are commonly used in electronic products with digital photography and video recording capabilities. This micro-lens technology enables high-quality imaging even in limited spaces, enhancing the user experience across various applications. Traditional CCM modules consist of a substrate (circuit board), image sensor chip, ring dam, metal wires, and a glass cover.
[0003] The circuit boards used in these CCM products typically feature an open cover area and an ink-open area. The open cover area is only a 12µm thick copper sheet. This area is easily damaged by wet process erosion (chemical erosion, roller extrusion, ultrasonic vibration, etc.), allowing chemical liquid to enter the open cover area and cause water seepage. Furthermore, the ink-open area has a height difference that the conductive adhesive cannot fill, preventing compaction of the steel sheet, resulting in cavities and abnormal resistance.
[0004] In view of this, the present application aims to provide a circuit board structure for a CCM product to better solve the above technical problems. Summary of the Invention
[0005] The purpose of the embodiments of the present application is to provide a circuit board structure for a CCM product, which can solve the technical problems of the circuit board structure of the CCM product being easily damaged and leaking in the cover area, and the abnormal resistance value in the ink open area.
[0006] An embodiment of the present application provides a circuit board structure of a CCM product, including a circuit board body, wherein the circuit board body is provided with a cover opening area and an ink open area, a first copper plating layer is provided at the top of the cover opening area, and a second copper plating layer is provided at the inner bottom end of the ink open area.
[0007] Furthermore, the thickness of the first copper plating layer is set to be no less than 5 μm.
[0008] Furthermore, the thickness of the second copper plating layer is set to be no less than 10 um.
[0009] Furthermore, the opening area is set as an opening cavity, PP layers are provided on both sides of the opening area, the top side of the opening area is covered with a copper layer, and the first copper plating layer is provided on the top side of the copper layer and is located directly above the opening area.
[0010] Furthermore, the width of the first copper plating layer is smaller than the width of the cover opening area, so as to leave gaps on both sides of the first copper plating layer.
[0011] Furthermore, the ink open area is set as a conductive glue filling area, ink layers are provided on both sides of the ink open area, the top side of the ink open area is covered with a steel sheet layer, and the second copper plating layer is provided on the bottom side of the ink open area.
[0012] Furthermore, the width of the second copper plating layer is smaller than the width of the conductive adhesive filling area, so as to leave gaps on both sides of the second copper plating layer.
[0013] Beneficial effects of the utility model:
[0014] The circuit board structure of the CCM product provided by the utility model includes a circuit board body, wherein the circuit board body is provided with a cover opening area and an ink open area, a first copper plating layer is provided at the top of the cover opening area, and a second copper plating layer is provided at the inner bottom end of the ink open area. The utility model has a simple structure and a reasonable design. By adding the first copper plating layer to the cover opening area, the copper thickness can be increased and water seepage can be improved. By providing the second copper plating layer at the inner bottom end of the ink open area, the influence of ink height difference can be reduced, and abnormal resistance of the steel sheet can be improved, thereby effectively ensuring product yield. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.
[0016] Figure 1 Schematic diagram of the structure of the cover opening area in some embodiments of the present invention;
[0017] Figure 2 This is a schematic diagram of the configuration structure of the ink open area in some embodiments of the present invention.
[0018] The reference numerals are:
[0019] Circuit board body 1, cover opening area 2, ink open area 3, first copper plating layer 4, second copper plating layer 5, PP layer 6, copper skin layer 7, ink layer 8, steel sheet layer 9. DETAILED DESCRIPTION
[0020] To make the objectives, technical solutions, and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Generally, the components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.
[0021] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for protection, but merely represents selected embodiments of the present application. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments in the present application without creative work are within the scope of protection of the present application.
[0022] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.
[0023] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the product of this application is typically placed when in use. These terms are intended only to facilitate the description of this application and simplify the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.
[0024] Furthermore, terms such as "horizontal," "vertical," and "overhanging" do not necessarily imply that a component must be absolutely horizontal or overhanging, but rather that it can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but rather that it can be slightly tilted.
[0025] It should also be noted that, in the description of this application, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.
[0026] See also Figure 1-Figure 2As shown, the circuit board structure of the CCM product described in this embodiment includes a circuit board body 1, wherein the circuit board body 1 is provided with an open cover area 2 and an ink open area 3, a first copper plating layer 4 is provided on the top of the open cover area 2, and a second copper plating layer 5 is provided on the inner bottom end of the ink open area 3.
[0027] This embodiment has a simple structure and a reasonable design. By adding a first copper plating layer 4 in the cover opening area 2, the copper thickness can be increased and water seepage can be improved. By providing a second copper plating layer 5 at the bottom inner end of the ink open area 3, the influence of the ink height difference can be reduced and the abnormal resistance value of the steel sheet can be improved, thereby effectively ensuring the product yield.
[0028] Specifically, in this embodiment, the thickness of the first copper plating layer 4 is set to be no less than 5 μm.
[0029] Specifically, in this embodiment, the thickness of the second copper plating layer 5 is set to be no less than 10 um.
[0030] In this embodiment, the thickness setting range of the first copper plating layer 4 and the second copper plating layer 5 is specifically limited to better meet the copper thickness increase in the open cover area 2 and the height difference problem of the ink open area 3, solve the problems of water seepage in the open cover area 2 of the CCM product and abnormal steel sheet resistance, and ensure product yield.
[0031] In some embodiments, the opening area 2 is set as an opening cavity, PP layers 6 are provided on both sides of the opening area 2, the top side of the opening area 2 is covered with a copper skin layer 7, and the first copper plating layer 4 is provided on the top side of the copper skin layer 7 and is located directly above the opening area 2.
[0032] Specifically, the width of the first copper plating layer 4 is smaller than the width of the cover opening area 2 , so as to leave gaps on both sides of the first copper plating layer 4 .
[0033] In this embodiment, the width of the first copper plating layer 4 is smaller than the width of the cover opening area 2. Figure 1 As shown, it can be slightly smaller than the width of the opening area 2 to prevent the PP layer 6 from flowing into the cavity of the opening area 2, resulting in the copper layer 7 at the edge connecting with the PP, causing poor opening of the cover.
[0034] In some embodiments, the ink open area 3 is set as a conductive glue filling area, ink layers 8 are provided on both sides of the ink open area 3, the top side of the ink open area 3 is covered with a steel sheet layer 9, and the second copper plating layer 5 is provided on the bottom side of the ink open area 3.
[0035] Specifically, the width of the second copper plating layer 5 is smaller than the width of the conductive paste-filled area, so as to leave gaps on both sides of the second copper plating layer 5 .
[0036] In this embodiment, the width of the second copper plating layer 5 is smaller than the width of the conductive glue filling area. Figure 2 As shown, it can be slightly smaller than the width of the conductive glue filling area. This setting is mainly due to the fact that during the circuit board production process, the ink and the second copper plating layer 5 are not produced in the same process. The difference in positioning accuracy may cause the ink to cover the second copper plating layer 5, affecting the product yield.
[0037] The above are merely preferred embodiments of the present application and are not intended to limit the present application. Persons skilled in the art will readily appreciate that various modifications and variations are possible. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present application shall be included within the scope of protection of the present application.
Claims
1. A circuit board structure of a CCM product, characterized by: The circuit board comprises a circuit board body, wherein the circuit board body is provided with an open cover area and an ink open area, the top of the open cover area is provided with a first copper plating layer, and the inner bottom end of the ink open area is provided with a second copper plating layer.
2. The circuit board structure of the CCM product according to claim 1, characterized in that: The thickness of the first copper plating layer is set to be no less than 5 μm.
3. The circuit board structure of the CCM product according to claim 1, characterized in that: The thickness of the second copper plating layer is set to be no less than 10 μm.
4. The circuit board structure of the CCM product according to claim 1, characterized in that: The opening area is set as an opening cavity, PP layers are provided on both sides of the opening area, the top side of the opening area is covered with a copper layer, and the first copper plating layer is provided on the top side of the copper layer and is located directly above the opening area.
5. The circuit board structure of the CCM product according to claim 4, characterized in that: The width of the first copper plating layer is smaller than the width of the cover opening area, so as to leave gaps on both sides of the first copper plating layer.
6. The circuit board structure of the CCM product according to claim 1, characterized in that: The ink open area is set as a conductive glue filling area, ink layers are provided on both sides of the ink open area, the top side of the ink open area is covered with a steel sheet layer, and the second copper plating layer is provided on the bottom side of the ink open area.
7. The circuit board structure of the CCM product according to claim 6, characterized in that: The width of the second copper plating layer is smaller than the width of the conductive paste filling area, so as to leave gaps on both sides of the second copper plating layer.