Etching apparatus

Abstract

The utility model discloses an etching device, which comprises a conveying mechanism, the conveying mechanism comprises a first conveying roller and a second conveying roller, the first conveying roller is positioned above a double-sided circuit board so as to be pressed on the double-sided circuit board, and the second conveying roller is positioned below the double-sided circuit board so as to support the double-sided circuit board; the first etching liquid nozzle is arranged below the second conveying roller, and the first etching liquid nozzle is used for spraying etching liquid to the lower surface of the double-sided circuit board; wherein in the conveying direction, the first etching liquid nozzle and the second conveying roller are arranged in a staggered mode, the second conveying roller is located on the edge of a spraying area of the first etching liquid nozzle, and at least part of the second conveying roller can shield etching liquid sprayed to the lower surface of the double-sided circuit board. The etching device provided by the utility model can reduce the line width difference between the dense area and the sparse area on the lower surface of the double-sided circuit board.

Description

Technical Field

[0001] The utility model relates to circuit board processing equipment, in particular to an etching device. Background Art

[0002] Double-sided circuit boards consist of an insulating layer and a metallic copper layer formed on its upper and lower surfaces. Parts of the copper layer are covered by an etchant layer, while areas uncovered react with the etchant, etching away the copper and ultimately forming the designed circuit patterns and pads. During this process, the etching solution exchange times vary depending on the pattern and line spacing. Locations with smaller spacing exchange slower, resulting in less etching. This causes line widths at different spacings across the board to vary from the designed values, resulting in poor line width uniformity and the risk of out-of-tolerance line widths. The industry generally uses dynamic compensation rules for outer layer fine line compensation design, performing differentiated compensation across the board based on compensation values ​​at different spacings. Compensation is increased at isolated locations to improve line width uniformity.

[0003] However, when etching a double-sided circuit board, the line width difference between the dense and sparse areas on the upper surface is small, while the line width difference between the dense and sparse areas on the lower surface is large, resulting in a poor line width CpK in the sparse area on the lower surface. Utility Model Content

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides an etching device capable of reducing the difference in line width between dense and sparse areas on the lower surface of a double-sided circuit board.

[0005] The present invention further provides an etching device, comprising:

[0006] a conveying mechanism for conveying a double-sided circuit board, the conveying mechanism comprising a plurality of first conveying rollers spaced apart along a conveying direction and a plurality of second conveying rollers spaced apart along the conveying direction, the first conveying rollers being positioned above the double-sided circuit board to press against the double-sided circuit board, and the second conveying rollers being positioned below the double-sided circuit board to support the double-sided circuit board; and

[0007] a first etching liquid nozzle, disposed below the second conveying roller, the first etching liquid nozzle being used to spray etching liquid onto the lower surface of the double-sided circuit board;

[0008] Among them, along the conveying direction, the first etching liquid nozzle and the second conveying roller are staggered, and the second conveying roller is at the edge of the spraying area of ​​the first etching liquid nozzle. At least part of the second conveying roller can block the etching liquid sprayed toward the lower surface of the double-sided circuit board.

[0009] The etching device according to the embodiment of the present invention has at least the following beneficial effects: a double-sided circuit board is conveyed between a first conveyor roller and a second conveyor roller. The first etching liquid nozzle is used to spray etching liquid onto the lower surface of the double-sided circuit board. The second conveyor roller is located at the edge of the spraying area of ​​the first etching liquid nozzle, and at least part of the second conveyor roller can block the etching liquid sprayed onto the lower surface of the double-sided circuit board, thereby reducing the etching liquid sprayed onto the lower surface of the double-sided circuit board at a large inclination angle, slowing the penetration speed of the etching liquid in the sparse area of ​​the lower surface from between the insulating layer and the copper layer, thereby reducing the difference in line width between the dense area and the sparse area of ​​the lower surface of the double-sided circuit board, and improving the controllability of the line width of the sparse area of ​​the lower surface.

[0010] According to some embodiments of the present invention, at least part of the second conveying rollers are cylindrical rollers, and the outer peripheral surface of the cylindrical rollers is a cylindrical surface.

[0011] According to some embodiments of the present invention, part of the second conveying roller is a cylindrical roller, and the outer peripheral surface of the cylindrical roller is a cylindrical surface; the remaining part of the second conveying roller is a roller-type conveying roller, and the roller-type conveying roller includes a plurality of roller plates arranged along the width direction of the conveying mechanism and spaced apart from each other.

[0012] According to some embodiments of the present invention, the second conveying roller is made of polypropylene.

[0013] According to some embodiments of the present invention, the material of the first conveying roller is polypropylene.

[0014] According to some embodiments of the present invention, the etching device includes a second etching liquid nozzle, which is arranged above the first conveying roller and is used to spray etching liquid on the upper surface of the double-sided circuit board.

[0015] According to some embodiments of the present invention, the pressure of the first etching liquid nozzle is greater than or equal to the pressure of the second etching liquid nozzle.

[0016] According to some embodiments of the present invention, the difference between the pressure of the first etching liquid nozzle and the pressure of the second etching liquid nozzle is less than 1.5 kg / cm 2 .

[0017] According to some embodiments of the present invention, the etching device includes at least one etching cylinder, each of which is correspondingly provided with at least one second etching liquid nozzle and at least one first etching liquid nozzle, and the etching cylinder is used to provide etching liquid to the corresponding second etching liquid nozzle and the first etching liquid nozzle, and to receive the etching liquid sprayed from the corresponding second etching liquid nozzle and the first etching liquid nozzle.

[0018] According to some embodiments of the present invention, each etching cylinder is correspondingly provided with a plurality of the second etching liquid nozzles and a plurality of the first etching liquid nozzles, the plurality of the second etching liquid nozzles are arranged in sequence along the conveying direction, and the plurality of the first etching liquid nozzles are arranged in sequence along the conveying direction;

[0019] The second conveying roller is a roller-type conveying roller located between the first etching liquid nozzle and the conveying path of the double-sided circuit board at the last position of the etching cylinder along the conveying direction.

[0020] According to some embodiments of the present invention, a plurality of etching cylinders are provided along the conveying direction, and the second conveying rollers between adjacent etching cylinders are roller-type conveying rollers.

[0021] Additional aspects and advantages of the present invention will be given in part in the following description and will become apparent from the following description or learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0023] Figure 1 This is a partial structural diagram of an etching device according to an embodiment of the present invention;

[0024] Figure 2 This is a schematic structural diagram of the second conveying roller of the etching device according to an embodiment of the present utility model;

[0025] Figure 3 This is a schematic structural diagram of a first conveying roller or a second conveying roller of an etching device according to an embodiment of the present utility model;

[0026] Figure 4 This is a schematic structural diagram of an etching cylinder of an etching device according to an embodiment of the present invention.

[0027] Reference numerals:

[0028] 110, first conveyor roller; 111, roller; 120, second conveyor roller; 120a, cylindrical surface;

[0029] 200, second etching liquid nozzle; 300, first etching liquid nozzle; 400, etching tank;

[0030] 10. Double-sided circuit board. DETAILED DESCRIPTION

[0031] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0032] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention.

[0033] In the description of this utility model, "several" means more than one, "plurality" means more than two, "greater than," "less than," and "exceed" are understood to exclude the number itself, while "above," "below," and "within" are understood to include the number itself. The use of the terms "first" and "second" is solely for the purpose of distinguishing technical features and is not to be construed as indicating or implying relative importance, implicitly specifying the number of the indicated technical features, or implicitly specifying the order of the indicated technical features.

[0034] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, and connecting should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0035] In the description of the present invention, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the exemplary expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0036] In related art, the surface of a double-sided circuit board is divided into dense and sparse areas based on the density of the circuit lines. The line width difference between the dense and sparse areas on the lower surface is large. Analysis shows that because the etching liquid nozzle sprays the etching liquid outward in a cone shape, the etching liquid has a spraying area on the double-sided circuit board conveying path. The etching liquid in the center of the spraying area is sprayed on the double-sided circuit board at a nearly vertical angle, and the etching liquid in the edge of the spraying area is sprayed on the double-sided circuit board at a large inclination angle. When the etching liquid is sprayed on the double-sided circuit board at a large inclination angle, the etching liquid sprayed in the sparse area of ​​the lower surface is relatively more likely to penetrate between the insulating layer and the copper layer than the dense area of ​​the lower surface, resulting in a large difference in line width between the dense and sparse areas of the lower surface, and a poorer line width CpK in the sparse area of ​​the lower surface.

[0037] For this, please refer to Figure 1-Figure 4 An embodiment of the present application provides an etching device, which includes a conveying mechanism, a second etching liquid nozzle 200 and a first etching liquid nozzle 300.

[0038] The conveying mechanism is used to convey a double-sided circuit board 10 , wherein the upper surface and the lower surface of the double-sided circuit board 10 have a metal copper layer.

[0039] The conveying mechanism includes a plurality of first conveyor rollers 110 spaced apart along the conveying direction and a plurality of second conveyor rollers 120 spaced apart along the conveying direction. The first conveyor rollers 110 are positioned above the double-sided circuit board 10 to press against the double-sided circuit board 10, while the second conveyor rollers 120 are positioned below the double-sided circuit board 10 to support the double-sided circuit board 10. In other words, the double-sided circuit board 10 is conveyed while being sandwiched between the first conveyor rollers 110 and the second conveyor rollers.

[0040] The second etching liquid nozzle 200 is disposed above the first conveyor roller 110 and is used to spray etching liquid onto the upper surface of the double-sided circuit board 10. The first etching liquid nozzle 300 is disposed below the second conveyor roller 120 and is used to spray etching liquid onto the lower surface of the double-sided circuit board 10.

[0041] The first etching liquid nozzle 300 and the second conveyor roller 120 are staggered along the conveying direction. The second conveyor roller 120 is at the edge of the spraying area of ​​the first etching liquid nozzle 300. At least part of the second conveyor roller 120 can block the etching liquid sprayed toward the lower surface of the double-sided circuit board 10.

[0042] In the above embodiment, the double-sided circuit board 10 is conveyed between the first conveyor roller 110 and the second conveyor roller 120, and the second etching liquid nozzle 200 is used to spray etching liquid on the upper surface of the double-sided circuit board 10. The first etching liquid nozzle 300 is used to spray etching liquid on the lower surface of the double-sided circuit board 10. The second conveyor roller 120 shields the edge of the spraying area of ​​the first etching liquid nozzle 300, thereby reducing the etching liquid sprayed at a large angle on the lower surface of the double-sided circuit board 10, slowing the penetration rate of etching liquid from the insulating layer and the copper layer in the sparse area of ​​the lower surface, thereby reducing the difference in line width between the dense area and the sparse area of ​​the lower surface of the double-sided circuit board 10, and improving the controllability of the line width in the sparse area of ​​the lower surface.

[0043] At least one end of the plurality of second conveyor rollers 120 is provided with a gear, and the gears of each second conveyor roller 120 are connected by a timing belt, so that each second conveyor roller 120 has the same rotational speed. Similarly, at least one end of the plurality of first conveyor rollers 110 is provided with a gear, and the gears of each first conveyor roller 110 are connected by a timing belt, so that each first conveyor roller 110 has the same rotational speed. One of the second conveyor rollers 120 and one of the first conveyor rollers 110 can be connected in a synchronous transmission manner.

[0044] The first conveyor roller 110 and the second conveyor roller 120 can be arranged vertically opposite to each other to reduce bending deformation of the double-sided circuit board 10. In some embodiments, the first conveyor roller 110 and the second conveyor roller 120 are staggered in the vertical direction to prevent the double-sided circuit board 10 from being crushed by bending deformation.

[0045] The specific structures of the second conveying roller 120 and the first conveying roller 110 are not limited.

[0046] Please refer to Figure 2 and Figure 3 In some embodiments, at least a portion of the second conveyor rollers 120 are cylindrical rollers, and the outer circumference of the cylindrical rollers is a cylindrical surface 120a. The outer circumference of the cylindrical roller is the surface that contacts the double-sided circuit board 10. It is understood that the second conveyor rollers 120 can be partially or entirely cylindrical rollers.

[0047] The first conveyor roller 110 is a roller-type conveyor roller, comprising a plurality of spaced rollers 111 arranged along the width of the conveyor mechanism. It will be appreciated that the gaps between adjacent rollers 111 allow the etching liquid to pass through. However, the outer circumference of the cylindrical roller is a cylindrical surface 120a, without such gaps. Therefore, the area of ​​the spraying area of ​​the first etching liquid nozzle 300 blocked by the cylindrical roller is increased, ensuring that more of the edge of the spraying area is covered.

[0048] Furthermore, in some specific embodiments, some of the second conveyor rollers 120 are cylindrical rollers, with the outer circumference of the cylindrical roller being a cylindrical surface 120a. The remaining second conveyor rollers 120 are roller-type conveyor rollers, each comprising a plurality of mutually spaced rollers 111 arranged along the width of the conveyor mechanism. The first conveyor roller 110 is also a roller-type conveyor roller, comprising a plurality of mutually spaced rollers 111 arranged along the width of the conveyor mechanism.

[0049] It is understandable that part of the second conveying roller 120 adopts the same roller-type conveying roller as the first conveying roller 110. In this way, the area of ​​the spraying area blocked by the part of the second conveying roller 120 is the same as the area of ​​the spraying area blocked by the first conveying roller 110.

[0050] The multiple second conveyor rollers 120 are of two types: some are cylindrical rollers, while the remaining are blade-type conveyor rollers. Both types of second conveyor rollers 120 have the same length and maximum shaft diameter. It should be noted that by adjusting the ratio of cylindrical rollers to blade-type conveyor rollers in the multiple second conveyor rollers 120, the total area of ​​the edge of the spraying area blocked by the multiple second conveyor rollers 120 can be adjusted.

[0051] The second cylindrical conveyor roller 120 can be hollow to save material. In some embodiments, the cylindrical roller is a solid cylindrical roller. As will be appreciated, a solid cylindrical roller, due to its solid structure, has relatively higher rigidity, which can reduce bending deformation along its length, thereby providing more stable support for the double-sided circuit board 10. Furthermore, it is less prone to damage and has a relatively longer service life.

[0052] The second conveyor roller 120 and the first conveyor roller 110 are both made of corrosion-resistant materials. In some embodiments, the second conveyor roller 120 is made of polypropylene. In some embodiments, the first conveyor roller 110 is made of polypropylene. Polypropylene-made first and second conveyor rollers 110 and 120 have smooth surfaces and are resistant to acids, alkalis, and high temperatures, meeting the requirements of etching environments.

[0053] In order to ensure uniformity and efficiency during the etching process, the first etching liquid nozzle 300 and the second etching liquid nozzle 200 have pressure, so as to spray the etching liquid more uniformly and with a higher initial velocity under the action of pressure.

[0054] In some embodiments, the pressure of the first etching liquid nozzle 300 is greater than or equal to the pressure of the second etching liquid nozzle 200. It should be noted that in existing equipment, due to the pool effect on the upper surface of the double-layer circuit board, the pressure of the second etching liquid nozzle 200 is generally greater than the pressure of the first etching liquid nozzle 300 to minimize the impact of the above-mentioned pool effect. In this embodiment, the pressure of the first etching liquid nozzle 300 is relatively increased, so that the pressure of the first etching liquid nozzle 300 is greater than or equal to the pressure of the second etching liquid nozzle 200, so that the first etching liquid nozzle 300 can spray more etching liquid per unit time, thereby accelerating the exchange speed of the etching liquid, thereby compensating for the etching liquid on the lower surface of the double-sided circuit board 10.

[0055] Furthermore, in some specific embodiments, the difference between the pressure of the first etching liquid nozzle 300 and the pressure of the second etching liquid nozzle 200 is less than 1.5 kg / cm2, thereby preventing the problem of warping and board jamming when the thickness of the double-layer circuit board is relatively thin. In particular, the pressure of the first etching liquid nozzle 300 is within the maximum set pressure range of the equipment and is relatively close to the maximum set pressure range of the equipment.

[0056] The etching device includes an etching tank 400, which is used to contain etching liquid.

[0057] Please refer to Figure 1 and Figure 4 In some embodiments, there is at least one etching cylinder 400, and each etching cylinder 400 is correspondingly provided with at least one second etching liquid nozzle 200 and at least one first etching liquid nozzle 300. The etching cylinder 400 is used to provide etching liquid to the corresponding second etching liquid nozzle 200 and the first etching liquid nozzle 300, and to receive the etching liquid sprayed from the corresponding second etching liquid nozzle 200 and the first etching liquid nozzle 300.

[0058] It is understandable that there may be one or more etching tanks 400. By using multiple etching tanks 400, the concentration of the etching solution in each etching tank 400 can be independently controlled, thereby better controlling the entire etching process.

[0059] It should be added that the front end portion of the lower surface of the double-sided circuit board 10 along the conveying direction is prone to large amount of corrosion.

[0060] In this regard, in some embodiments, each etching tank 400 is correspondingly provided with multiple second etching liquid nozzles 200 and multiple first etching liquid nozzles 300, and the multiple second etching liquid nozzles 200 are arranged in sequence along the conveying direction, and the multiple first etching liquid nozzles 300 are arranged in sequence along the conveying direction.

[0061] The second conveyor roller 120 is a roll-to-roll conveyor roller located between the first etching liquid nozzle 300 at the rearmost position of the etching tank 400 and the conveying path of the double-sided circuit board 10. This reduces the amount of etching erosion at the front end of the lower surface of the double-sided circuit board 10.

[0062] In some embodiments, multiple etching cylinders 400 are provided along the conveying direction, and the second conveying rollers 120 between adjacent etching cylinders 400 are roll-type conveying rollers. This further reduces the amount of etching bite at the front end of the lower surface of the double-sided circuit board 10.

[0063] The number of etching tanks 400 is not limited. In some embodiments, three etching tanks 400 are provided along the conveying direction. The double-sided circuit board 10 passes through the three etching tanks 400 in sequence.

[0064] In some embodiments, the amount of erosion at the front end of the lower spray nozzle 3-5 cm away from the panel surface is ensured to be comparable to that at other positions, and the range of the entire panel R≤5um or R≤6u is determined according to the equipment capability to meet the equipment process capability.

[0065] Using a board with sparse and dense line widths, the test was conducted. Under the premise that the erosion amount on the upper and lower surfaces of the double-sided circuit board 10 was consistent at 2 mils at the 10 / 3.5 mil line width spacing, the erosion amount at the position with the maximum spacing ≥ 40 mil was measured, and then the line width CpK capability of the sparse area of ​​the double-sided circuit board 10 was analyzed and compared.

[0066] Before optimization, the width difference between the sparse and dense areas on the upper surface is 0.53 mil, and the width difference between the sparse and dense areas on the lower surface is 1.10 mil. If dynamic compensation is used for the entire board, an additional 0.53 mil will be added. The 0.57 mil difference on the lower surface is not compensated in place, resulting in a line width CpK of only 0.09 in the sparse area of ​​the lower surface, and the line width in the sparse area is at risk of exceeding the tolerance.

[0067] After optimization, the difference in sparse and dense line widths on the upper surface is 0.59 mil, and the difference in sparse and dense line widths on the lower surface is 0.68 mil. If dynamic compensation is used for the entire board, an additional 0.59 mil will be added, and only 0.09 mil difference on the lower surface will not be compensated. The line width CpK of the sparse area on the lower surface can reach 1.33, which improves the CpK capability of etching high-precision line widths on the lower surface.

[0068] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Various modifications can be made within the scope of knowledge possessed by a person skilled in the art without departing from the spirit of the present invention. In addition, the embodiments of the present invention and the features of the embodiments can be combined with each other unless there is a conflict.

Claims

1. An etching device, characterized in that: The etching device comprises: a conveying mechanism for conveying a double-sided circuit board, the conveying mechanism comprising a plurality of first conveying rollers spaced apart along a conveying direction and a plurality of second conveying rollers spaced apart along the conveying direction, the first conveying rollers being positioned above the double-sided circuit board to press against the double-sided circuit board, and the second conveying rollers being positioned below the double-sided circuit board to support the double-sided circuit board; and a first etching liquid nozzle, disposed below the second conveying roller, the first etching liquid nozzle being used to spray etching liquid onto the lower surface of the double-sided circuit board; Among them, along the conveying direction, the first etching liquid nozzle and the second conveying roller are staggered, and the second conveying roller is at the edge of the spraying area of ​​the first etching liquid nozzle. At least part of the second conveying roller can block the etching liquid sprayed toward the lower surface of the double-sided circuit board.

2. The etching device according to claim 1, characterized in that At least part of the second conveying rollers are cylindrical rollers, and the outer peripheral surface of the cylindrical rollers is a cylindrical surface.

3. The etching device according to claim 1, wherein Part of the second conveying rollers are cylindrical rollers, and the outer peripheral surface of the cylindrical rollers is a cylindrical surface; the remaining part of the second conveying rollers are roller-type conveying rollers, and the roller-type conveying rollers include a plurality of rollers spaced apart from each other and arranged along the width direction of the conveying mechanism.

4. The etching device according to any one of claims 1 to 3, characterized in that: The second conveying roller is made of polypropylene; and / or the first conveying roller is made of polypropylene.

5. The etching device according to claim 1, characterized in that The etching device includes a second etching liquid nozzle, which is arranged above the first conveying roller and is used to spray etching liquid on the upper surface of the double-sided circuit board.

6. The etching device according to claim 5, characterized in that The pressure of the first etching liquid nozzle is greater than or equal to the pressure of the second etching liquid nozzle.

7. The etching device according to claim 6, characterized in that The difference between the pressure of the first etching liquid nozzle and the pressure of the second etching liquid nozzle is less than 1.5 kg / cm 2 .

8. The etching device according to claim 5, characterized in that The etching device includes at least one etching cylinder, each of which is correspondingly provided with at least one second etching liquid nozzle and at least one first etching liquid nozzle. The etching cylinder is used to provide etching liquid to the corresponding second etching liquid nozzle and the first etching liquid nozzle, and to receive the etching liquid sprayed from the corresponding second etching liquid nozzle and the first etching liquid nozzle.

9. The etching device according to claim 8, characterized in that Each etching cylinder is correspondingly provided with a plurality of second etching liquid nozzles and a plurality of first etching liquid nozzles, the plurality of second etching liquid nozzles are sequentially arranged along the conveying direction, and the plurality of first etching liquid nozzles are sequentially arranged along the conveying direction; The second conveying roller is a roller-type conveying roller located between the first etching liquid nozzle and the conveying path of the double-sided circuit board at the last position of the etching cylinder along the conveying direction.

10. The etching device according to claim 8, characterized in that Along the conveying direction, a plurality of etching cylinders are provided, and the second conveying rollers between adjacent etching cylinders are roller-type conveying rollers.

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