Glue pouring assembly

Abstract

The glue pouring assembly comprises a glue pouring box, an electronic device is placed in the glue pouring box, heat-conducting glue is filled in the glue pouring box, at least one square device is attached to at least one side wall of the glue pouring box, and the bottom face of the glue pouring box is tightly attached to a liquid cooling plate. According to the glue pouring assembly, the square device can be attached to the side wall of the glue pouring box, heat generated by the device can be conducted to the bottom face of the glue pouring box through the side wall of the glue pouring box, then heat is dissipated through the liquid cooling plate attached to the bottom face of the glue pouring box, and therefore the good heat dissipation effect can be achieved.

Description

Technical Field

[0001] The utility model relates to the field of device heat dissipation, and more specifically, to a glue-filling component. Background Art

[0002] As the power of the charging module increases, the heat generated by the electronic components inside it increases. To meet these heat dissipation requirements, electronic components are usually designed to be heat-conducting with a liquid cold plate. However, due to the layout, circuitry, and compact space of the printed circuit board (PCB), some square components, such as square capacitors, switches, and metal-oxide-semiconductor field-effect transistors (MOSFETs), cannot directly dissipate heat well. This results in poor heat dissipation, affecting the operation of the components and even the entire charging module. Utility Model Content

[0003] The technical problem to be solved by the present invention is to provide a glue potting assembly to address the above-mentioned defects of the prior art, which enables square components to be attached to the side walls of the glue potting box to facilitate heat dissipation.

[0004] The technical solution adopted by the present invention to solve its technical problem is: constructing a glue pouring assembly, including a glue pouring box, in which electronic components are placed and filled with thermal conductive glue, at least one square component is attached to at least one side wall of the glue pouring box, and the bottom surface of the glue pouring box is arranged in close contact with the liquid cooling plate.

[0005] The glue potting assembly of the present invention further comprises a fixed pressing plate for fixing the square device. The bottom surface of the glue potting box extends outward to form a boss, and the fixed pressing plate is fixed on the boss.

[0006] In the glue-potting assembly described in the present invention, the fixed pressure plate includes a horizontal fixing portion, a bending portion and a vertical pressing portion; a plurality of first screw holes are provided on the horizontal fixing portion; a plurality of second screw holes and a plurality of positioning columns are provided on the boss, and the first screw holes and the second screw holes correspond one to one; the horizontal fixing portion is positioned by the positioning columns and is fixed by fixing screws passing through the first screw holes and the second screw holes; the bending portion bends inward and extends from the horizontal fixing portion until it matches the thickness of the square device; the vertical pressing portion extends vertically downward from the bending portion to press and fix the square device.

[0007] In the glue potting assembly described in the present invention, a ceramic sheet is provided between the side wall of the glue potting box and the square component.

[0008] In the glue potting assembly described in the present invention, the glue potting box further includes a protective cover, and the protective cover is provided with a pin positioning groove corresponding to the position of each square component.

[0009] In the glue pouring assembly described in the present invention, the inner side surface of the protective cover facing the glue pouring box is provided with pin positioning holes, and the outer side surface facing away from the glue pouring box is provided with fixing columns and glue pouring holes.

[0010] In the glue pouring assembly described in the present invention, the protective cover is a plastic protective cover, and the glue pouring box is a metal glue pouring box.

[0011] In the glue-potting assembly described in the present invention, the square components include square capacitors and switching tubes.

[0012] Another technical solution adopted by the present invention to solve the technical problem is to construct a glue potting assembly, including a metal glue potting box, a plastic protective cover, an electronic device accommodated in the metal glue potting box, a plurality of square devices attached to at least one side wall of the metal glue potting box, and a fixed pressure plate for fixing the square devices; the interior of the metal glue potting box is filled with thermally conductive glue, and the bottom surface is placed in close contact with the liquid cooling plate;

[0013] The fixed pressing plate includes a horizontal fixing portion, a bent portion, and a vertical pressing portion; the horizontal fixing portion is provided with a plurality of first screw holes; the bent portion bends inwardly from the horizontal fixing portion until it is adapted to the thickness of the square component; the vertical pressing portion extends vertically downward from the bent portion to press and fix the square component;

[0014] The bottom surface of the metal glue-potting box extends outward to form a boss, and a plurality of second screw holes and a plurality of positioning posts are provided on the boss; the first screw holes and the second screw holes correspond to each other one by one; the horizontal fixing portion is positioned by the positioning posts and fixed by fixing screws passing through the first screw holes and the second screw holes;

[0015] A ceramic sheet is provided between the side wall of the metal glue potting box and the square device;

[0016] The plastic protective cover is provided with a pin positioning groove corresponding to the position of each square component;

[0017] The plastic protective cover is provided with a pin positioning hole on the inner side facing the metal glue potting box, and a fixing column and a glue potting hole are provided on the outer side facing away from the metal glue potting box;

[0018] The square device includes a square capacitor and a switch tube.

[0019] In the glue-potting assembly described in the present invention, the switch tube is a metal oxide semiconductor field effect transistor.

[0020] By implementing the glue potting assembly of the present invention, a square device can be attached to the side wall of the glue potting box, and the heat generated by the device can be conducted to the bottom surface of the glue potting box through the side wall of the glue potting box, and then dissipated through the liquid cooling plate attached to the bottom surface of the glue potting box, thereby achieving a good heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The present invention will be further described below with reference to the accompanying drawings and embodiments, in which:

[0022] Figure 1 This is an exploded schematic diagram of the glue-filling assembly of the present invention;

[0023] Figure 2 This is a structural schematic diagram of the glue filling box of the glue filling assembly of the utility model from a first angle;

[0024] Figure 3 This is a structural schematic diagram of the glue filling box of the glue filling assembly of the utility model from a second angle;

[0025] Figure 4 This is a schematic structural diagram of the protective cover of the glue-filling assembly of the present invention from a first angle;

[0026] Figure 5 This is a schematic structural diagram of the protective cover of the glue-filling assembly of the present invention from a second angle;

[0027] Figure 6 It is a schematic diagram of the assembled state of the glue-filling component of the present invention. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0029] Figure 1 It is an exploded schematic diagram of the glue-filling component of the present invention. Figure 2 It is a structural schematic diagram of the glue filling box of the glue filling assembly of the utility model from a first angle. Figure 3 It is a structural schematic diagram of the glue filling box of the glue filling assembly of the present invention from a second angle. Figure 4 This is a schematic structural diagram of the protective cover of the glue-filling assembly of the present invention from a first angle. Figure 5 This is a structural schematic diagram of the protective cover of the glue-filling assembly of the present invention from a second angle. Figure 6 This is a schematic diagram of the assembly state of the glue filling component of the utility model. Figures 1 to 6 , the glue-filling assembly of the present invention is described as follows.

[0030] like Figures 1 to 6 As shown, the glue potting assembly 100 of the present invention includes a glue potting box 10, in which electronic components 20 are placed and filled with thermally conductive glue. A plurality of square components 30 are attached to at least one side wall 11 of the glue potting box 10, and the bottom surface 12 of the glue potting box 10 is placed in close contact with the liquid cooling plate 40. Of course, depending on actual needs, only one, two, three, or more square components 30 can be provided.

[0031] In a preferred embodiment of the present invention, the potting box 10 is a metal potting box for better heat dissipation. The square device can be a square capacitor or switch tube, such as a triode, MOS tube, or any other square electronic device. In the present invention, the square device 30 can be attached to the side wall 11 in any suitable manner, such as screw fixation, bonding, attachment, pressing, etc., all of which fall within the scope of protection of the present invention.

[0032] Here, the electronic device 20 can be any known electronic device on a printed circuit board 70, which is accommodated in the internal space 18 of the potting box 10. The internal space 18 matches the shape of the electronic device 20. The thermally conductive adhesive can include potting adhesive, thermally conductive gel, thermally conductive silicone grease, etc. to dissipate heat or conduct heat from the electronic device 20 and / or the square device 30. The liquid cooling plate 40 can also adopt any liquid cooling plate structure known in the art.

[0033] Since the square device can be attached to at least one side wall of the potting box 10, the heat generated by the device can be conducted to the bottom surface of the potting box through the side wall of the potting box, and then dissipated through the liquid cooling plate attached to the bottom surface of the potting box, thereby achieving a good heat dissipation effect.

[0034] In a further preferred embodiment of the present invention, the square device can be attached to the side wall 11 of the glue potting box 10 by a fixed pressing plate. Figures 1 to 3 As shown, the glue potting assembly further includes a fixed pressure plate 50 for fixing the square component 30. The bottom surface 12 of the glue potting box 10 extends outward to form a boss 13, and the fixed pressure plate 50 is fixed to the boss 13. Here, the fixed pressure plate 50 can adopt any suitable structure, such as a horizontal fixing portion plus a bent pressing portion, such as an L-shaped pressure plate or a T-shaped pressure plate.

[0035] In a preferred embodiment of the present invention, Figures 1 to 3 As shown, the fixed pressing plate 50 includes a horizontal fixing portion 51, a bending portion 52 and a vertical pressing portion 53. The horizontal fixing portion 51 is provided with a plurality of first screw holes 511; the boss 13 is provided with a plurality of second screw holes 131 and positioning columns 132, and the first screw holes 511 and the second screw holes 131 correspond to each other one by one. Figures 1 to 3 ,as well as Figure 6 As shown, the horizontal fixing portion 51 is positioned by the positioning post 132 and secured by a fixing screw 54 passing through the first screw hole 511 and the second screw hole 131. The bent portion 52 bends inward from the horizontal fixing portion 51 and extends until it matches the thickness of the square component 30. The vertical pressing portion 53 extends vertically downward from the bent portion 52 to press and secure the square component 30. By adopting the aforementioned fixed pressure plate 50, not only can the square component 30 and the potting box 10 be easily fixed and removed without affecting their structure, but the thickness of the assembly is also maintained. The pressure plate design allows the square component 30 to be fixedly attached to at least one side wall of the potting box 10. Therefore, heat generated by the component can be transferred to the bottom surface of the potting box through the side wall, and then dissipated through the liquid cooling plate attached to the bottom surface of the potting box, thus achieving good heat dissipation.

[0036] In a preferred embodiment of the present invention, Figures 1 to 3 As shown, a ceramic sheet 60 is provided between the side wall of the potting box 10 and the square device 30 to perform heat conduction and insulation functions. This is particularly suitable for the case where the square device 30 is a switch tube and the potting box 10 is a metal potting box, because the switch tube usually cannot be directly attached to the metal side wall.

[0037] In a preferred embodiment of the present invention, the glue filling box 10 further includes a protective cover 14. The protective cover 14 is preferably a plastic protective cover. Figure 1 As shown in Figures 4 to 5, the shape of the protective cover 14 matches the opening shape of the glue potting box 10 so as to better seal the glue potting box 10. The protective cover 14 is provided with a pin positioning groove 141 corresponding to the position of each square device 30, so as to accurately position the square device 30. The protective cover 14 is provided with a pin positioning hole 142 on the inner side of the glue potting box 10. This design can ensure that the pins of the device are assembled to the printed circuit board without deviation after the glue potting, so that the glue potting component can be supported to be potted first, and then the entire glue potting component is soldered to the printed circuit board through wave soldering. The outer side of the protective cover 14 facing away from the glue potting box 10 is provided with a fixing column 142 and a glue potting hole 143. The protective cover 14 can be fixed to the printed circuit board 70 by the fixing column 142. The fixing column 142 can ensure that the entire glue potting component is accurately positioned when assembled on the printed circuit board 70. The thermal conductive glue is filled through the glue potting hole 143. As shown Figure 6 As shown, the potting assembly 100 can be assembled to the printed circuit board 70 and then locked to the liquid cooling plate 40 .

[0038] By implementing the glue potting assembly of the present invention, a square device can be attached to the side wall of the glue potting box, and the heat generated by the device can be conducted to the bottom surface of the glue potting box through the side wall of the glue potting box, and then dissipated through the liquid cooling plate attached to the bottom surface of the glue potting box, thereby achieving a good heat dissipation effect.

[0039] Although the present invention is described through specific embodiments, those skilled in the art will appreciate that various modifications and equivalent substitutions may be made to the present invention without departing from the scope of the present invention. Furthermore, various modifications may be made to the present invention to address specific circumstances or materials without departing from the scope of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed, but rather encompasses all embodiments falling within the scope of the claims of the present invention.

[0040] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A glue-filling component, characterized in that: The invention comprises a glue potting box, wherein electronic components are placed inside the glue potting box and filled with thermal conductive glue, at least one square component is attached to at least one side wall of the glue potting box, and the bottom surface of the glue potting box is arranged closely against the liquid cooling plate.

2. The glue potting assembly according to claim 1, characterized in that: It further includes a fixed pressing plate for fixing the square device. The bottom surface of the glue potting box extends outward to form a boss, and the fixed pressing plate is fixed on the boss.

3. The glue potting assembly according to claim 2, characterized in that: The fixed pressure plate includes a horizontal fixing portion, a bending portion and a vertical pressing portion; a plurality of first screw holes are provided on the horizontal fixing portion; a plurality of second screw holes and a plurality of positioning columns are provided on the boss, and the first screw holes and the second screw holes correspond to each other one by one; the horizontal fixing portion is positioned by the positioning columns and is fixed by fixing screws passing through the first screw holes and the second screw holes; the bending portion bends inwardly and extends from the horizontal fixing portion until it matches the thickness of the square device; the vertical pressing portion extends vertically downward from the bending portion to press and fix the square device.

4. The glue potting assembly according to claim 3, characterized in that: A ceramic sheet is arranged between the side wall of the glue potting box and the square component.

5. The glue potting assembly according to claim 3, characterized in that: The glue potting box further comprises a protective cover, and the protective cover is provided with a pin positioning groove corresponding to the position of each square component.

6. The glue potting assembly according to claim 5, characterized in that: The inner side surface of the protective cover facing the glue potting box is provided with a pin positioning hole, and the outer side surface facing away from the glue potting box is provided with a fixing column and a glue potting hole.

7. The glue potting assembly according to claim 6, characterized in that: The protective cover is a plastic protective cover, and the glue pouring box is a metal glue pouring box.

8. The glue potting assembly according to claim 3, characterized in that: The square device includes a square capacitor and a switch tube.

9. A glue-filling component, characterized in that: The invention comprises a metal potting box, a plastic protective cover, an electronic device accommodated in the metal potting box, a plurality of square devices attached to at least one side wall of the metal potting box, and a fixing plate for fixing the square devices; the interior of the metal potting box is filled with thermally conductive glue, and the bottom surface is placed in close contact with the liquid cooling plate; The fixed pressing plate includes a horizontal fixing portion, a bent portion, and a vertical pressing portion; the horizontal fixing portion is provided with a plurality of first screw holes; the bent portion bends inwardly from the horizontal fixing portion until it is adapted to the thickness of the square component; the vertical pressing portion extends vertically downward from the bent portion to press and fix the square component; The bottom surface of the metal glue-potting box extends outward to form a boss, and a plurality of second screw holes and a plurality of positioning posts are provided on the boss; the first screw holes and the second screw holes correspond to each other one by one; the horizontal fixing portion is positioned by the positioning posts and fixed by fixing screws passing through the first screw holes and the second screw holes; A ceramic sheet is provided between the side wall of the metal glue potting box and the square device; The plastic protective cover is provided with a pin positioning groove corresponding to the position of each square component; The inner side of the plastic protective cover facing the metal glue potting box is provided with a pin positioning hole, and the outer side of the plastic protective cover facing away from the metal glue potting box is provided with a fixing column and a glue potting hole; The square device includes a square capacitor and a switch tube.

10. The glue potting assembly according to claim 9, characterized in that: The switch tube is a metal oxide semiconductor field effect transistor.

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