Display device
By designing an inorganic deposition layer and an encapsulation layer in the display device, combined with a light control layer, the problems of external light reflection and insufficient optical properties are solved, and efficient optical performance of the flexible display device is achieved.
Patent Information
- Application Number
- CN202422273153.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Priority Date
- 2023-09-19
- Filing Date
- 2024-09-18
- Publication Date
- 2025-09-30
- Estimated Expiration
- 2034-09-18
AI Technical Summary
Existing display devices have deficiencies in reducing external light reflection and improving optical properties and display efficiency, especially in flexible and bendable display devices.
An inorganic deposition layer design is adopted, including a first upper surface of the first part inclined at a first angle and a second upper surface of the second part parallel to the upper surface of the base substrate, combined with an encapsulation layer and a light control layer, an irregular pattern is formed by etching to improve light efficiency, and inorganic materials such as Bi and Yb are used to reduce external light reflection.
The optical properties and display efficiency of the display device are improved, external light reflection is reduced, and the device is suitable for flexible and bendable display devices.
Smart Images

Figure CN223402781U_ABST
Abstract
Description
[0001] This application claims priority to and the benefit of Korean Patent Application No. 10-2023-0124883 filed in the Korean Intellectual Property Office on September 19, 2023, the disclosure of which is incorporated herein by reference in its entirety. Technical Field
[0002] The disclosure relates to a display device having improved display efficiency and a method of manufacturing the display device. Background Art
[0003] Due to the continuous development of information technology, the importance of display devices such as televisions, mobile phones, tablet computers, and game consoles has been emphasized. Each display device may include various optical functional layers and provide users with color images of improved quality.
[0004] It is desirable that a display device be made thin to achieve or improve its flexibility and have a curved surface, a rollable screen, or a foldable screen. A thin display device may have a reduced number of optical functional layers and optical functional layers having various functions.
[0005] It will be understood that this background section is intended, in part, to provide a useful background for understanding the technology. However, this background section may also include ideas, concepts, or cognitions that were not part of what was understood by those skilled in the relevant art before the corresponding effective filing date of the subject matter disclosed herein. Utility Model Content
[0006] An object of the present invention is to provide a display device that can reduce external light reflection and has improved optical properties and display efficiency.
[0007] Another object of the present invention is to provide a method for manufacturing a display device capable of improving optical properties and display efficiency.
[0008] Disclosed embodiments provide a display device including a display panel. The display panel includes: a light-emitting element disposed on a base substrate and including a light-emitting layer; an inorganic deposited layer disposed on the light-emitting element; and an encapsulation layer disposed on the inorganic deposited layer. The inorganic deposited layer includes: a first portion including a first upper surface inclined at a first angle relative to the upper surface of the base substrate; and a second portion including a second upper surface substantially parallel to the upper surface of the base substrate, wherein a first thickness of the first portion is greater than a second thickness of the second portion.
[0009] In an embodiment, the first angle may be in the range of about 60 degrees to about 90 degrees.
[0010] In an embodiment, the surface roughness of the first upper surface may be smaller than the surface roughness of the second upper surface.
[0011] In embodiments, an irregular pattern may be defined on the second upper surface.
[0012] In an embodiment, the display panel may further include: a pixel defining film disposed on the base substrate and having a pixel opening, and the light emitting layer may be disposed in the pixel opening.
[0013] In an embodiment, the pixel defining film may include a side surface defining a pixel opening. The side surface of the pixel defining film may be inclined at a second angle relative to the upper surface of the base substrate. The second angle may be substantially the same as the first angle.
[0014] In an embodiment, the inorganic deposition layer may include an inorganic material having a refractive index of about 1.0 or greater and an absorption coefficient of about 0.5 or greater.
[0015] In an embodiment, the inorganic deposition layer may include at least one selected from the group consisting of bismuth (Bi) and ytterbium (Yb).
[0016] In an embodiment, the difference between the first thickness and the second thickness may be about 5 to about 50 within the range.
[0017] In an embodiment, the first thickness may be about 50 to about 200 within the range.
[0018] In an embodiment, the second thickness may be about 40 to about 100 within the range.
[0019] In an embodiment, the encapsulation layer may integrally contact the first upper surface and the second upper surface.
[0020] In an embodiment, the light-emitting element may further include: a first electrode disposed on the base substrate; a second electrode spaced apart from the first electrode; a hole transport region disposed between the first electrode and the light-emitting layer; an electron transport region disposed between the second electrode and the light-emitting layer; and a capping layer disposed on the second electrode. The light-emitting layer may be disposed between the first electrode and the second electrode. The inorganic deposited layer may be disposed directly on the capping layer.
[0021] In an embodiment, the display device may further include: a light control layer disposed on the display panel and including at least one of a dye and a pigment; and a sensor layer disposed between the display panel and the light control layer.
[0022] In a disclosed embodiment, a display device includes: a display panel; and a light control layer disposed on the display panel and comprising at least one of a dye and a pigment. The display panel includes: a light-emitting element disposed on a base substrate and comprising a light-emitting layer; an inorganic deposition layer disposed on the light-emitting element and comprising a partition and a flat portion adjacent to the partition; and an encapsulation layer integrally contacting a first upper surface of the partition and a second upper surface of the flat portion. The first upper surface is inclined at a first angle relative to the upper surface of the base substrate, and the second upper surface is substantially parallel to the upper surface of the base substrate. The surface roughness of the first upper surface is less than the surface roughness of the second upper surface.
[0023] In a disclosed embodiment, a method for manufacturing a display device may include the following steps: providing a base substrate and a light-emitting element disposed on the base substrate and including a light-emitting layer; forming an inorganic deposition layer including an inorganic material on the light-emitting element; and forming an encapsulation layer on the inorganic deposition layer. The step of forming the inorganic deposition layer may include forming an initial inorganic deposition layer including a first initial portion and a second initial portion, the first initial portion including a first initial upper surface inclined at a first angle relative to the upper surface of the base substrate, and the second initial portion including a second initial upper surface substantially parallel to the upper surface of the base substrate; and forming an irregular pattern by etching at least a portion of the second initial upper surface.
[0024] In an embodiment, the first angle may be in the range of about 60 degrees to about 90 degrees.
[0025] In an embodiment, forming the initial inorganic deposition layer may include performing a thermal evaporation process.
[0026] In an embodiment, forming the irregular pattern may include performing any one of a wet etching process, a dry etching process, and an ion milling process.
[0027] In an embodiment, the thickness of the first initial portion and the thickness of the second initial portion may be substantially the same.
[0028] According to the present invention, a display device may include a portion having a non-uniform thickness in an inorganic deposition layer, thereby improving light efficiency of a display device including a light emitting element and reducing external light reflection. BRIEF DESCRIPTION OF THE DRAWINGS
[0029] Additional understanding according to the disclosed embodiments will become more apparent by describing the disclosed embodiments in detail with reference to the accompanying drawings, in which:
[0030] Figure 1 is a schematic perspective view of a display device according to a disclosed embodiment;
[0031] Figure 2is a schematic exploded perspective view of a display device according to a disclosed embodiment;
[0032] Figure 3 is a schematic plan view of a display device according to an embodiment;
[0033] Figure 4 is a schematic cross-sectional view of a display device according to an embodiment;
[0034] Figure 5 is a schematic enlarged cross-sectional view of a portion of a display device according to a disclosed embodiment;
[0035] Figure 6A and Figure 6B is a schematic flow chart illustrating a method of manufacturing a display device according to a disclosed embodiment; and
[0036] Figure 7A and Figure 7B is a schematic diagram sequentially illustrating some operations of a method of manufacturing a display device according to a disclosed embodiment. DETAILED DESCRIPTION
[0037] In the following description, for the purpose of explanation, many specific details are set forth to provide a thorough understanding of the various embodiments or implementations disclosed. As used herein, "embodiment" and "implementation" are interchangeable terms that are non-limiting examples of the apparatus or method disclosed herein. However, it is apparent that the various embodiments may be practiced without these specific details or with one or more equivalent arrangements. Here, the various embodiments do not necessarily have to be exclusive or limit the disclosure. For example, the specific shape, configuration, and characteristics of one embodiment may be used or implemented in another embodiment.
[0038] When an element or layer is referred to as being “on,” “connected to,” or “coupled to” another element or layer, it can be directly on, directly connected to, or directly coupled to the other element or layer, or intervening elements or layers may be present. However, when an element or layer is referred to as being “directly on,” “directly connected to,” or “directly coupled to” another element or layer, no intervening elements or layers may be present. For this purpose, the term “connected” may refer to being physically connected, electrically connected, and / or fluidically connected, with or without intervening elements.
[0039] Unless otherwise stated, the illustrated embodiments will be understood to provide the disclosed features. Therefore, unless otherwise stated, the features, components, modules, layers, films, panels, regions and / or aspects, etc. (hereinafter individually or collectively referred to as "elements") of the various embodiments may be further combined, separated, interchanged and / or rearranged without departing from the disclosure.
[0040] The use of cross hatching and / or shading is generally provided in the accompanying drawings to make the boundaries between adjacent elements clear. Thus, unless otherwise specified, the presence or absence of cross hatching or shading does not convey or indicate any preference or requirement for the specific material, material properties, size, ratio, commonality between the elements shown and / or any other characteristics, attributes, properties, etc. of the elements. In addition, in the accompanying drawings, the size and relative size of the elements may be exaggerated for clarity and / or descriptive purposes. When the embodiments can be implemented differently, a specific process sequence can be performed in a different order than described. For example, two processes described in succession can be performed substantially simultaneously or in an order opposite to the order described. In addition, the same reference numerals represent the same elements.
[0041] Although the terms "first," "second," etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another. Thus, the first element discussed below could be named the second element without departing from the disclosed teachings.
[0042] For descriptive purposes, spatially relative terms such as "under," "beneath," "beneath," "down," "above," "upper," "above," "higher," "side" (e.g., as in "sidewall"), etc., may be used herein to describe the relationship of one element to another element as shown in the accompanying drawings. Spatially relative terms are intended to encompass different orientations of the device in use, operation, and / or manufacture in addition to the orientation depicted in the accompanying drawings. For example, if the device in the drawings is turned over, an element described as "under" or "beneath" another element or feature would then be oriented "above" the other element or feature. Thus, the term "under" can encompass both an above and a below orientation. Furthermore, the device may be otherwise oriented (e.g., rotated 90 degrees or at other orientations), and as such, the spatially relative descriptors used herein should be interpreted accordingly.
[0043] The terminology used herein is for the purpose of describing specific embodiments and is not intended to be limiting. Unless the context clearly indicates otherwise, as used herein, the singular forms "a," "an," and "the" are intended to include the plural forms as well. In addition, when the terms "comprise," "include," and / or their variations are used in this specification, they indicate the presence of the stated features, integers, steps, operations, elements, components, and / or groups thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.
[0044] Various embodiments are described herein with reference to cross-sectional views and / or exploded views that are schematic illustrations of embodiments and / or intermediate structures. As such, variations in the shapes of the illustrations due to, for example, manufacturing techniques and / or tolerances are to be expected. Therefore, the embodiments disclosed herein should not necessarily be construed as limited to the shapes of the specifically illustrated regions, but rather include deviations in shape due to, for example, manufacturing. In this manner, the regions illustrated in the accompanying drawings may be schematic in nature, and the shapes of these regions may not reflect the actual shapes of regions of the device and are not necessarily intended to be limiting.
[0045] As is customary in the art, some embodiments are described and illustrated in the accompanying drawings in terms of functional blocks, units, and / or modules. Those skilled in the art will appreciate that these blocks, units, and / or modules are physically implemented using electronic (or optical) circuitry (such as logic circuits, discrete components, microprocessors, hard-wired circuits, memory elements, wiring connections, etc.) that can be formed using semiconductor-based or other manufacturing technologies. Where the blocks, units, and / or modules are implemented by a microprocessor or other similar hardware, they can be programmed and controlled using software (e.g., microcode) to perform the various functions discussed herein, and can optionally be driven by firmware and / or software. It is also contemplated that each block, unit, and / or module can be implemented by dedicated hardware, or as a combination of dedicated hardware that performs some functions and a processor (e.g., one or more programmed microprocessors and associated circuitry) that performs other functions. Furthermore, each block, unit, and / or module of some embodiments can be physically divided into two or more interacting and discrete blocks, units, and / or modules without departing from the scope of this disclosure. Furthermore, the blocks, units and / or modules of some embodiments may be physically combined into more complex blocks, units and / or modules without departing from the scope of the disclosure.
[0046] As used herein, "about" or "approximately" is inclusive of the stated value and means within an acceptable range of deviation from the particular value as determined by one of ordinary skill in the art, taking into account the measurements being discussed and errors associated with the measurement of the particular quantity (i.e., limitations of the measurement system). For example, "about" can mean within one or more standard deviations, or within ±30%, ±20%, ±10%, ±5% of the stated value.
[0047] For the purposes of the present disclosure, the phrase “at least one of A and B” may be interpreted as only A, only B, or any combination of A and B. Furthermore, “at least one of X, Y, and Z” and “at least one selected from the group consisting of X, Y, and Z” may be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z.
[0048] Unless otherwise defined or implied herein, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those skilled in the art to which the present disclosure belongs. It will also be understood that terms (such as those defined in common dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and in the context of the disclosure, and will not be interpreted in an idealized or overly formal sense unless expressly defined as such herein.
[0049] Hereinafter, a display device according to disclosed embodiments will be described with reference to the accompanying drawings.
[0050] Figure 1 is a schematic perspective view of a display device according to a disclosed embodiment. Figure 1 A portable electronic device is shown as an example of a display device DD. However, the display device DD can be used in large-scale electronic devices such as televisions, monitors, and billboards. For example, the display device DD can be used in small or medium-sized electronic devices such as personal computers, laptop computers, personal digital assistants, car navigation units, game consoles, smartphones, tablet PCs, and cameras. However, the disclosure is not limited thereto. The display device DD can also be used in other electronic devices without departing from the scope of the disclosure.
[0051] The display device DD may have a hexahedral shape having a thickness in a third direction DR3 perpendicular to a plane defined by the first and second directions DR1 and DR2 intersecting (eg, crossing) each other. However, the disclosure is not limited thereto, and the display device DD may have various shapes.
[0052] In an embodiment, the upper surface (or front surface) and the lower surface (or rear surface) of each member may be defined based on the direction in which the image IM is displayed. The upper surface and the lower surface may be opposite to each other in the third direction DR3, and the normal direction of each of the upper surface and the lower surface may be parallel to the third direction DR3.
[0053] Directions indicated by the first direction DR1 , the second direction DR2 , and the third direction DR3 may be relative and may be changed to other directions.
[0054] The display device DD can display an image IM through a display surface IS. The display surface IS may include a display area DA that displays the image IM and a non-display area NDA adjacent to the display area DA. The non-display area NDA is an area where no image is displayed. The image IM may be a dynamic image or a still image. Figure 1 Application icons, a clock, and the like are shown as examples of the image IM.
[0055] The display area DA may have a quadrilateral shape. The non-display area NDA may be adjacent to (e.g., surround) the display area DA. However, the disclosure is not limited thereto. Therefore, the shapes of the display area DA and the non-display area NDA may be relatively designed (or may have various shapes). The non-display area NDA may not exist on the front surface of the display device DD.
[0056] The display device DD may be flexible. A flexible display device DD may be bendable, and the flexibility of the display device DD may range from a fully foldable structure to a structure that can bend down to a few nanometers. For example, the display device DD may be a curved display device or a foldable display device. However, the disclosed embodiments are not limited thereto, and the display device DD may be rigid.
[0057] Figure 2 is a schematic exploded perspective view of a display device according to an embodiment of the disclosure. Figure 2 , the display device DD according to the embodiment may include a display panel DP, a sensor layer TU, and a light-control layer AR sequentially stacked on one another in a third direction DR3.
[0058] The display panel DP may include pixels in an area corresponding to the display device DD (e.g., a display area DA). The non-display area NDA may be adjacent to the display area DA (e.g., may surround the display area DA). The pixels may be connected to a first pixel area (e.g., a red pixel area) PXA-R, a second pixel area (e.g., a blue pixel area) PXA-B, and a third pixel area (e.g., a green pixel area) PXA-G (e.g., referring to FIG. 1 ). Figure 3 ) corresponds. The pixels can display light in response to the electrical signals. The pixels can generate light and display an image IM in the display area DA.
[0059] The display panel DP according to the embodiment can independently emit light. For example, the display panel DP can be a micro LED display panel, a nano LED display panel, an organic light emitting display panel, a quantum dot light emitting display panel, etc. However, the disclosure is not limited thereto, and the display panel DP can have various panels that independently emit light.
[0060] The light-emitting layer of an organic light-emitting display panel may include an organic light-emitting material. The light-emitting layer of a quantum dot light-emitting display panel may include quantum dots and / or quantum rods, etc. A micro-LED display panel may include micro-LED elements, which are ultra-small light-emitting elements, and a nano-LED display panel may include nano-LED elements. Hereinafter, the display panel DP is described as an organic light-emitting display panel.
[0061] The light control layer AR may be disposed on the display panel DP. The light control layer AR may be an anti-reflection layer that reduces the reflectivity of external light incident from the outside. The light control layer AR may be a layer that selectively transmits light emitted from the display panel DP. The light control layer AR may not include a polarizing layer. Therefore, light that passes through the light control layer AR and is incident on the display panel DP and the sensor layer TU may be unpolarized light. The display panel DP and the sensor layer TU may receive unpolarized light from the light control layer AR (e.g., from the upper surface of the light control layer AR).
[0062] The sensor layer TU may be disposed between the display panel DP and the light control layer AR. The sensor layer TU may acquire (or sense) external input to generate information used to generate an image on the display panel DP. The external input may be user input. The user input may include various external inputs such as a user's body part (e.g., a finger, an iris, etc.), light, heat, a pen, pressure, and the like.
[0063] Figure 3 is a schematic plan view of a display device according to an embodiment. Figure 4 is a schematic cross-sectional view of a display device according to an embodiment. Figure 4 It is along Figure 3 Schematic cross-sectional view of a portion of the display device according to the embodiment, taken along line II'.
[0064] Reference Figure 3 and Figure 4 , the display device DD according to the embodiment includes a display panel DP, a sensor layer TU disposed on the display panel DP, and a light-control layer AR disposed on the sensor layer TU, which are sequentially stacked on each other.
[0065] The display panel DP may include a base substrate BS, a circuit layer DP-CL, and a display element layer DP-ED stacked sequentially. The display element layer DP-ED may include a pixel defining layer PDL, a light emitting element ED disposed in a pixel opening OH defined in the pixel defining layer PDL, and an encapsulation layer TFE disposed on the light emitting element ED.
[0066] The base substrate BS may be rigid or flexible. The base substrate BS may be a polymer substrate, a plastic substrate, a glass substrate, a metal substrate, a composite substrate, or the like. The base substrate BS may have a multilayer structure. In other embodiments, the base substrate BS may have a single-layer structure. The base substrate BS may include a synthetic resin film, and the base substrate BS may have a multilayer structure including a synthetic resin film layer. The synthetic resin film of the base substrate BS may include at least one of a polyimide material, an acrylate material, a vinyl material, an epoxy material, a urethane material, a cellulose material, and a perylene material. However, the disclosure is not limited thereto, and the synthetic resin film may have various materials.
[0067] The circuit layer DP-CL may be disposed on the base substrate BS. The circuit layer DP-CL may include an insulating layer, a semiconductor pattern, a conductive pattern, signal lines, and the like. The circuit layer DP-CL may include transistors (not shown) formed from the semiconductor pattern, the conductive pattern, the signal lines, and the like. Each of the transistors (not shown) may include a control electrode, an input electrode, and an output electrode. For example, the circuit layer DP-CL may include a driving transistor and a switching transistor for driving the light-emitting element ED.
[0068] The display element layer DP-ED may be disposed on the circuit layer DP-CL. The display element layer DP-ED may include a pixel definition layer PDL, a light emitting element ED, and an encapsulation layer TFE.
[0069] The light-emitting element ED may include a first light-emitting element ED-1, a second light-emitting element ED-2, and a third light-emitting element ED-3. Each of the first light-emitting element ED-1, the second light-emitting element ED-2, and the third light-emitting element ED-3 may include a first electrode EL1, a hole transport region HTR, an electron transport region ETR, a second electrode EL2, and a capping layer CPL. The first light-emitting element ED-1, the second light-emitting element ED-2, and the third light-emitting element ED-3 may include a first light-emitting layer EML-R, a second light-emitting layer EML-B, and a third light-emitting layer EML-G, respectively. The first light-emitting element ED-1 may include a first light-emitting layer EML-R that overlaps with the first pixel region PXA-R in a plan view. The second light-emitting element ED-2 may include a second light-emitting layer EML-B that overlaps with the second pixel region PXA-B in a plan view. The third light-emitting element ED-3 may include a third light-emitting layer EML-G that overlaps with the third pixel region PXA-G in a plan view.
[0070] A pixel-defining film (PDL) may be disposed on the circuit layer DP-CL. A pixel opening (e.g., a predetermined or selected pixel opening) OH may be defined in the pixel-defining film (PDL). The pixel openings OH defined in the pixel-defining film (PDL) may correspond to the first pixel region (PXA-R), the second pixel region (PXA-B), and the third pixel region (PXA-G), respectively. The light-shielding region NPXA may be a region between adjacent pixel regions in the first pixel region (PXA-R), the second pixel region (PXA-B), and the third pixel region (PXA-G), and may be a region corresponding to the pixel-defining film (PDL).
[0071] The pixel-defining layer (PDL) may absorb light (e.g., may have light-absorbing properties). For example, the pixel-defining layer (PDL) may have a black color. The pixel-defining layer (PDL) may include a black colorant. The black colorant may include a black dye or a black pigment. The black colorant may include carbon black, a metal (such as chromium), or an oxide thereof. The pixel-defining layer (PDL) may correspond to a light-shielding pattern having light-shielding properties.
[0072] The pixel definition film PDL may include an organic resin or an inorganic material. For example, the pixel definition film PDL may be made of a material including polyacrylate resin, polyimide resin, silicon nitride (SiN x ), silicon oxide (SiO x ) and silicon oxynitride (SiO x N y However, the disclosure is not limited thereto, and the pixel defining film PDL may include various materials.
[0073] exist Figure 4 In the embodiment, the first light-emitting element ED-1, the second light-emitting element ED-2, and the third light-emitting element ED-3, the first light-emitting layer EML-R, the second light-emitting layer EML-B, and the third light-emitting layer EML-G can be set in the pixel opening OH defined in the pixel definition film PDL. The hole transport region HTR, the electron transport region ETR, the second electrode EL2, and the cap layer CPL can be set as a common layer in all of the first light-emitting element ED-1, the second light-emitting element ED-2, and the third light-emitting element ED-3. However, the disclosed embodiments are not limited thereto, and in the embodiment, Figure 4Unlike that shown in , the hole transport region HTR, the electron transport region ETR, the second electrode EL2, the cap layer CPL, etc. can be patterned in the pixel opening OH defined in the pixel definition layer PDL. In an embodiment, the hole transport region HTR, the electron transport region ETR, the second electrode EL2, the cap layer CPL, and at least one of the first light-emitting layer EML-R, the second light-emitting layer EML-B, and the third light-emitting layer EML-G of the first light-emitting element ED-1, the second light-emitting element ED-2, and the third light-emitting element ED-3 can be patterned by an inkjet printing method.
[0074] In each light-emitting element ED, the first electrode EL1 may be disposed on the circuit layer DP-CL. The first electrode EL1 may be an anode or a cathode. The first electrode EL1 may be a pixel electrode. The first electrode EL1 may be a transmissive electrode, a transflective electrode, or a reflective electrode.
[0075] The hole transport region HTR may be disposed between the first electrode EL1 and the light-emitting layer EML. The hole transport region HTR may include at least one of a hole injection layer, a hole transport layer, and an electron blocking layer. The hole transport region HTR may be provided as a common layer and may overlap with the first pixel region PXA-R, the second pixel region PXA-B, the third pixel region PXA-G, and the pixel-defining film PDL in a plan view (e.g., overlap entirely with the first pixel region PXA-R, the second pixel region PXA-B, the third pixel region PXA-G, and the pixel-defining film PDL). The pixel-defining film PDL may separate the first pixel region PXA-R, the second pixel region PXA-B, and the third pixel region PXA-G in a plan view. For example, the pixel-defining film PDL may be disposed between adjacent pixel regions among the first pixel region PXA-R, the second pixel region PXA-B, and the third pixel region PXA-G. However, the disclosed embodiments are not limited thereto, and the hole transport regions HTR may be provided by patterning, and the patterned hole transport regions may be individually provided to correspond to the first pixel region PXA-R, the second pixel region PXA-B, and the third pixel region PXA-G, respectively.
[0076] The light-emitting layer EML may be disposed on the first electrode EL1. The light-emitting layer EML may include a first light-emitting layer EML-R, a second light-emitting layer EML-B, and a third light-emitting layer EML-G. The first light-emitting layer EML-R may overlap with the first pixel region PXA-R in a plan view and emit a first light. The second light-emitting layer EML-B may overlap with the second pixel region PXA-B in a plan view and emit a second light. The third light-emitting layer EML-G may overlap with the third pixel region PXA-G in a plan view and emit a third light. In the first light-emitting element ED-1, the second light-emitting element ED-2, and the third light-emitting element ED-3 according to the embodiment, the first to third lights may be within substantially different wavelength ranges. For example, the first light may be red light within a wavelength range of approximately 625 nm to approximately 675 nm. For example, the second light may be blue light within a wavelength range of approximately 410 nm to approximately 480 nm. The third light may be green light within a wavelength range of approximately 500 nm to approximately 570 nm.
[0077] The electron transport region ETR may be disposed between the light-emitting layer EML and the second electrode EL2. The electron transport region ETR may include at least one of an electron injection layer, an electron transport layer, and a hole blocking layer. The electron transport region ETR may be provided as a common layer and may overlap with the first pixel region PXA-R, the second pixel region PXA-B, the third pixel region PXA-G, and the pixel-defining film PDL in a plan view (e.g., overlap entirely with the first pixel region PXA-R, the second pixel region PXA-B, the third pixel region PXA-G, and the pixel-defining film PDL). The pixel-defining film PDL may separate the first pixel region PXA-R, the second pixel region PXA-B, and the third pixel region PXA-G. For example, the pixel-defining film PDL may be disposed between adjacent pixel regions among the first pixel region PXA-R, the second pixel region PXA-B, and the third pixel region PXA-G. However, the disclosed embodiments are not limited thereto, and the electron transport region ETR may be provided by patterning, and the patterned electron transport regions may be individually provided to correspond to the first pixel region PXA-R, the second pixel region PXA-B, and the third pixel region PXA-G, respectively.
[0078] The second electrode EL2 is disposed on the electron transport region ETR. The second electrode EL2 may be a common electrode. The second electrode EL2 may be a cathode or an anode, but the disclosed embodiments are not limited thereto. For example, if the first electrode EL1 is an anode, the second electrode EL2 may be a cathode, and if the first electrode EL1 is a cathode, the second electrode EL2 may be an anode. The second electrode EL2 may be a transmissive electrode, a transflective electrode, or a reflective electrode.
[0079] A cap layer CPL may be further provided on the second electrode EL2. The cap layer CPL may include multiple layers or a single layer. In an embodiment, the cap layer CPL may be an organic layer or an inorganic layer. For example, in the case where the cap layer CPL includes an inorganic material, the inorganic material may include an alkali metal compound (such as LiF), an alkaline earth metal compound (such as MgF2), a semiconductor compound (such as SiON, SiN X 、SiO y ) and the like. For example, in the case where the cap layer CPL includes an organic material, the organic material may include α-NPD, NPB, TPD, m-MTDATA, Alq3, CuPc, N4,N4,N4',N4'-tetrakis(biphenyl-4-yl)biphenyl-4,4'-diamine (TPD15), 4,4',4"-tris(carbazol-9-yl)triphenylamine (TCTA), and the like, or include an epoxy resin or an acrylate (such as methacrylate). However, the disclosed embodiments are not limited thereto.
[0080] The cap layer CPL may have a refractive index of about 1.6 or greater. For example, the cap layer CPL may have a refractive index of about 1.6 or greater with respect to light within a wavelength range of about 550 nm to about 660 nm.
[0081] The encapsulation layer TFE may be disposed on the pixel definition film PDL and cover the light emitting element ED. The encapsulation layer TFE may fill a portion of the pixel opening OH and may be disposed on the cover layer CPL. Figure 4 As shown, when the display element layer DP-ED includes an inorganic deposition layer INF, an encapsulation layer TFE may be provided on the inorganic deposition layer INF. The encapsulation layer TFE may be used to protect the light emitting element ED from moisture and / or oxygen and from foreign substances such as dust particles.
[0082] Figure 4 Although the encapsulation layer TFE is shown as a single layer, the encapsulation layer TFE may include at least one organic film or an inorganic film, or both an organic film and an inorganic film. The encapsulation layer TFE may have a thin film encapsulation layer structure including at least one organic film and at least one inorganic film. For example, the encapsulation layer TFE may have a structure in which organic films and inorganic films are alternately and repeatedly stacked on top of each other, or a structure in which inorganic films, organic films, and inorganic films are sequentially stacked on top of each other.
[0083] The inorganic film included in the encapsulation layer TFE may include, for example, a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, an aluminum oxide layer, etc., but the disclosed embodiments are not limited thereto. The organic film included in the encapsulation layer TFE may include an acrylic organic film, but the disclosed embodiments are not limited thereto.
[0084] The display device DD may include a light-shielding region NPXA and first, second, and third pixel regions PXA-R, PXA-B, and PXA-G. The first, second, and third pixel regions PXA-R, PXA-B, and PXA-G may be regions that emit light generated by the first, second, and third light-emitting elements ED-1, ED-2, and ED-3, respectively. The first, second, and third pixel regions PXA-R, PXA-B, and PXA-G may be spaced apart from each other in a plan view.
[0085] The first pixel area PXA-R, the second pixel area PXA-B and the third pixel area PXA-G can all be separated by a pixel defining film PDL. For example, the pixel defining film PDL can be set between adjacent pixel areas in the first pixel area PXA-R, the second pixel area PXA-B and the third pixel area PXA-G. The light-shielding area NPXA can be an area between adjacent pixel areas in the first pixel area PXA-R, the second pixel area PXA-B and the third pixel area PXA-G, and can be an area corresponding to the pixel defining film PDL. For example, each of the first pixel area PXA-R, the second pixel area PXA-B and the third pixel area PXA-G can correspond to a pixel. The pixel defining film PDL can separate the first light-emitting element ED-1, the second light-emitting element ED-2 and the third light-emitting element ED-3. For example, the pixel defining film PDL can be set between adjacent light-emitting elements in the first light-emitting element ED-1, the second light-emitting element ED-2 and the third light-emitting element ED-3. The first light-emitting layer EML-R, the second light-emitting layer EML-B, and the third light-emitting layer EML-G of the first light-emitting element ED-1, the second light-emitting element ED-2, and the third light-emitting element ED-3 may be separately disposed in the pixel opening OH defined in the pixel defining layer PDL. For example, the first light-emitting layer EML-R, the second light-emitting layer EML-B, and the third light-emitting layer EML-G of the first light-emitting element ED-1, the second light-emitting element ED-2, and the third light-emitting element ED-3 may be spaced apart from each other.
[0086] The first pixel region PXA-R, the second pixel region PXA-B, and the third pixel region PXA-G may be divided into a plurality of groups according to the color of light generated from the first light emitting element ED-1, the second light emitting element ED-2, and the third light emitting element ED-3. Figure 3 and Figure 4In the display device DD shown in FIG, three pixel regions PXA-R, PXA-B, and PXA-G can emit red light, blue light, and green light, respectively. For example, the display device DD according to an embodiment may include a first pixel region PXA-R, a second pixel region PXA-B, and a third pixel region PXA-G that are distinguished from (or spaced apart from) each other. In an embodiment, the first pixel region PXA-R may be referred to as a red pixel region, the second pixel region PXA-B may be referred to as a blue pixel region, and the third pixel region PXA-G may be referred to as a green pixel region. In the display device DD according to an embodiment, the first pixel region PXA-R, the second pixel region PXA-B, and the third pixel region PXA-G may be grouped and referred to as a pixel group PXG. Although not shown, at least one of the first pixel region PXA-R, the second pixel region PXA-B, and the third pixel region PXA-G included in the pixel group PXG may be provided in plural. For example, the number of first pixel regions PXA-R, second pixel regions PXA-B, and third pixel regions PXA-G in each pixel group PXG may be two or more. For example, one first pixel region PXA-R, one second pixel region PXA-B, and two third pixel regions PXA-G may be included in the pixel group PXG.
[0087] In the display device DD according to the embodiment, the first light-emitting element ED-1, the second light-emitting element ED-2, and the third light-emitting element ED-3 can emit light of different wavelength ranges. For example, the display device DD according to the embodiment may include a first light-emitting element ED-1 that emits red light, a second light-emitting element ED-2 that emits blue light, and a third light-emitting element ED-3 that emits green light. For example, the red pixel region PXA-R, the blue pixel region PXA-B, and the green pixel region PXA-G of the display device DD may correspond to the first light-emitting element ED-1, the second light-emitting element ED-2, and the third light-emitting element ED-3, respectively.
[0088] However, the disclosed embodiments are not limited thereto, and the first light-emitting element ED-1, the second light-emitting element ED-2, and the third light-emitting element ED-3 may emit light within the same wavelength range. In other embodiments, at least one of the first light-emitting element ED-1, the second light-emitting element ED-2, and the third light-emitting element ED-3 may emit light within a different wavelength range than the other light-emitting elements of the first light-emitting element ED-1, the second light-emitting element ED-2, and the third light-emitting element ED-3. In other embodiments, all of the first light-emitting element ED-1, the second light-emitting element ED-2, and the third light-emitting element ED-3 may emit blue light.
[0089] In the display device DD according to the embodiment, the first pixel region PXA-R, the second pixel region PXA-B, and the third pixel region PXA-G may be arranged in a stripe shape. Figure 3 The red pixel region (e.g., the first pixel region) PXA-R, the blue pixel region (e.g., the second pixel region) PXA-B, and the green pixel region (e.g., the third pixel region) PXA-G may all be arranged (or disposed) in the second direction DR2. The red pixel region PXA-R, the green pixel region PXA-G, and the blue pixel region PXA-B may be alternately and repeatedly arranged in a sequence (e.g., a predetermined or selected sequence) in the first direction DR1.
[0090] exist Figure 3 and Figure 4 In the embodiment, all first pixel regions PXA-R, second pixel regions PXA-B, and third pixel regions PXA-G may have similar areas. However, the disclosed embodiments are not limited thereto. Therefore, the areas of the first pixel regions PXA-R, the second pixel regions PXA-B, and the third pixel regions PXA-G may vary depending on the wavelength range of the emitted light. The areas of the first pixel regions PXA-R, the second pixel regions PXA-B, and the third pixel regions PXA-G may be defined by a first direction DR1 and a second direction DR2 in a plan view.
[0091] The arrangement of the first pixel region PXA-R, the second pixel region PXA-B, and the third pixel region PXA-G is not limited to Figure 3 , and the red pixel regions PXA-R, the blue pixel regions PXA-B, and the green pixel regions PXA-G may have various arrangements (e.g., combinations) according to the characteristics of the display quality required by the display device DD. For example, the first pixel region PXA-R, the second pixel region PXA-B, and the third pixel region PXA-G may be arranged as a PenTile ® Shape or DiamondPixel ® shape.
[0092] The areas of the first pixel region PXA-R, the second pixel region PXA-B, and the third pixel region PXA-G may be different from each other. For example, in an embodiment, the area of the green pixel region PXA-G may be smaller than the area of the blue pixel region PXA-B. However, the disclosed embodiments are not limited thereto.
[0093] Reference Figure 4 , the display panel DP according to the embodiment may include an inorganic deposition layer INF disposed on the first light emitting element ED- 1 , the second light emitting element ED- 2 , and the third light emitting element ED- 3 .
[0094] The inorganic deposition layer INF may be disposed on the cap layer CPL. The inorganic deposition layer INF may be disposed (e.g., directly) on the cap layer CPL. The inorganic deposition layer INF may be a layer for preventing external light from being reflected by the second electrode EL2 of the first light-emitting element ED-1, the second light-emitting element ED-2, and the third light-emitting element ED-3. For example, destructive interference may occur between light reflected at the surface of the inorganic deposition layer INF and light reflected at the second electrode EL2. Thus, the amount of external light reflected at the surface of the second electrode EL2 may be reduced (or offset). The thickness of the inorganic deposition layer INF and the cap layer CPL may be adjusted, and destructive interference may occur between light reflected at the surface of the inorganic deposition layer INF and light reflected at the second electrode EL2.
[0095] The inorganic deposition layer INF may include an inorganic material having a refractive index of about 1.0 or greater and an absorption coefficient of about 0.5 or greater. With respect to the visible light wavelength range of about 380 nm to about 780 nm, the inorganic material included in the inorganic deposition layer INF may have a refractive index of about 1.0 or greater and an absorption coefficient of about 0.5 or greater. The inorganic deposition layer INF may be formed by a thermal evaporation process and include an inorganic material having a melting point of about 1000°C or less. The inorganic deposition layer INF may include, for example, at least one selected from the group consisting of bismuth (Bi) and ytterbium (Yb). The material forming the inorganic deposition layer INF may consist of bismuth (Bi) or ytterbium (Yb). In other embodiments, the inorganic deposition layer INF may include Yb x Bi y Mixed deposition material. The encapsulation layer TFE can be disposed on (eg, directly disposed on) at least a portion of the inorganic deposition layer INF. Figure 5 A detailed description of the inorganic deposition layer INF is provided.
[0096] In a display device DD according to an embodiment, a light control layer AR may be provided on the display panel DP. The light control layer AR may absorb a portion of the light emitted from the display panel DP and transmit a portion of the light. Thus, the color gamut of the display device DD may be improved. As used herein, the term "color gamut" refers to the range of colors displayable by a display device. For example, the color gamut may be improved by selectively absorbing light within a certain wavelength range (e.g., a specific or selectable wavelength range).
[0097] The light control layer AR may overlap with the display element layer DP-ED in a plan view (e.g., overlap entirely with the display element layer DP-ED). The light control layer AR may overlap with each of the first light-emitting element ED-1, the second light-emitting element ED-2, and the third light-emitting element ED-3 in a plan view (e.g., overlap entirely with each of the first light-emitting element ED-1, the second light-emitting element ED-2, and the third light-emitting element ED-3). The light control layer AR may cover the front surface of the display panel DP and protect the display panel DP.
[0098] The light control layer AR may have a high light absorption rate within a certain wavelength range (e.g., a specific or selectable wavelength range). The light control layer AR may include a first colorant that has a high light absorption rate within a certain wavelength range (e.g., a specific or selectable wavelength range). The first colorant may have a high light absorption rate within a certain wavelength range (e.g., a specific or selectable wavelength range). The first colorant may have a high light absorption rate within at least one wavelength range. The first colorant may absorb light within a wavelength range other than the wavelength ranges of the first, second, and third light (e.g., the first colorant may have a maximum absorption wavelength within a wavelength range other than the wavelength ranges of the first, second, and third light). In an embodiment, the first colorant may absorb light within a wavelength range of approximately 490 nm to approximately 505 nm and light within a wavelength range of approximately 585 nm to approximately 600 nm, while transmitting the remaining light. The first colorant may have a maximum absorption wavelength within a wavelength range of approximately 490 nm to approximately 505 nm and within a wavelength range of approximately 585 nm to approximately 600 nm. The first colorant included in the light-control layer AR can absorb light within a certain wavelength range (e.g., a specific or selectable wavelength range) and transmit light within the remaining wavelength range. Therefore, external light reflection can be prevented and the hue of light emitted from the display panel DP can be adjusted.
[0099] The first colorant may include at least one of a dye and a pigment. For example, the first colorant included in the light control layer AR may include at least one selected from the group consisting of anthraquinone compounds, phthalocyanine compounds, azo compounds, perylene compounds, xanthene compounds, diimonium compounds, dipyrromethene compounds, porphyrin compounds, squarylium compounds, oxazine compounds, triarylmethane compounds, and cyanine compounds. For example, the light control layer AR may include at least one of porphyrin compounds, cyanine compounds, squarylium compounds, and oxazine compounds. However, the disclosure is not limited thereto, and the light control layer AR may include various materials.
[0100] The light control layer AR may include about 0.01 wt % to about 5.00 wt % of the first colorant relative to the total weight of the light control layer AR. If the light control layer AR includes less than about 0.01 wt % of the first colorant, light within a certain wavelength range (e.g., a specific or selectable wavelength range) may not be sufficiently absorbed, and the color gamut may not be improved. If the light control layer AR includes more than about 5.00 wt % of the first colorant, cohesion of the first colorant may occur.
[0101] In an embodiment, the display device DD may further include a light-shielding portion BM disposed on the display element layer DP-ED. The light-shielding portion BM may be covered by the light-control layer AR and overlap the light-shielding area NPXA in plan view. The light-shielding portions BM may be spaced apart from each other. The light-shielding portions BM may prevent light leakage. The light-shielding portions BM may be a light-shielding member (e.g., a black matrix). The light-shielding portions BM may include an organic light-shielding material, a black dye, a black pigment, etc. The light-control layer AR may fill the gaps between the spaced-apart light-shielding portions BM.
[0102] The sensor layer TU may be disposed between the display panel DP and the light control layer AR. The sensor layer TU may include a sensor base layer BS-TU, a first conductive layer SP1, an inorganic insulating layer IL, a second conductive layer SP2, and an organic insulating layer OL. The first conductive layer SP1 may be disposed on the sensor base layer BS-TU. The inorganic insulating layer IL may cover the first conductive layer SP1 and may be disposed on the sensor base layer BS-TU and the first conductive layer SP1. The second conductive layer SP2 may be disposed on the inorganic insulating layer IL. The organic insulating layer OL may cover the second conductive layer SP2 and may be disposed on the inorganic insulating layer IL and the second conductive layer SP2.
[0103] The sensor base layer BS-TU may be an inorganic layer including at least one of silicon nitride, silicon oxynitride, and silicon oxide. In other embodiments, the sensor base layer BS-TU may be an organic layer including at least one of epoxy resin, acryl resin, and imide resin. However, the disclosure is not limited thereto, and the sensor base layer BS-TU may include various materials. The sensor base layer BS-TU may have a single-layer structure or a multi-layer structure in which multiple layers are stacked one on top of another in the third direction DR3. The sensor base layer BS-TU may be disposed on the encapsulation layer TFE (e.g., directly on the encapsulation layer TFE).
[0104] Each of the first conductive layer SP1 and the second conductive layer SP2 can have a single-layer structure or a multi-layer structure in which multiple layers are stacked one on top of another in the third direction DR3. When each of the first conductive layer SP1 and the second conductive layer SP2 has a single-layer structure, each of the first conductive layer SP1 and the second conductive layer SP2 can include a metal layer or a transparent conductive layer. The metal layer can include at least one of molybdenum, silver, titanium, copper, and aluminum. In other embodiments, the metal layer can include a combination or alloy thereof. The transparent conductive layer can include at least one transparent conductive oxide selected from indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), and indium zinc tin oxide (IZTO). The transparent conductive layer can include a conductive polymer (such as PEDOT), metal nanowires, graphene, etc. However, the present disclosure is not limited thereto, and the first conductive layer SP1 and the second conductive layer SP2 can include a variety of materials.
[0105] Each of the first conductive layer SP1 and the second conductive layer SP2 may have a multilayer structure including a metal layer. For example, the metal layer may have a three-layer structure of titanium (Ti) / aluminum (Al) / titanium (Ti). Each of the first conductive layer SP1 and the second conductive layer SP2 may have a multilayer structure including at least one metal layer and at least one transparent conductive layer.
[0106] The inorganic insulating layer IL may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon oxynitride, zirconium oxide, and hafnium oxide. However, the disclosure is not limited thereto.
[0107] The contact hole CN may be defined in the inorganic insulating layer IL. The first conductive layer SP1 and the second conductive layer SP2 may be electrically connected to each other through the contact hole CN. The contact hole CN may be filled with a material of the second conductive layer SP2. Figure 4 It is shown that a single contact hole CN is defined in the inorganic insulating layer IL. However, the disclosed embodiments are not limited thereto, and a plurality of contact holes may be defined in the inorganic insulating layer IL.
[0108] The organic insulating layer OL may cover the inorganic insulating layer IL and the second conductive layer SP2. The organic insulating layer OL may include at least one of an acrylate resin, a methacrylate resin, a polyisoprene resin, a vinyl resin, an epoxy resin, a urethane resin, a cellulose resin, a siloxane resin, a polyimide resin, a polyamide resin, and a perylene resin. However, the present disclosure is not limited thereto, and the organic insulating layer OL may include various materials.
[0109] Figure 5 is a schematic enlarged cross-sectional view of a portion of a display device according to a disclosed embodiment. Figure 5 Shown with Figure 4The enlarged cross section corresponding to the AA region is shown in order to more specifically illustrate the shape in which the inorganic deposition layer INF is disposed on the light emitting element ED. Figure 5 A detailed description of the disclosed inorganic deposition layer INF is provided, and detailed descriptions of the same constituent elements are omitted.
[0110] The inorganic deposition layer INF may include a first portion P1 and a second portion P2. The first portion P1 may be defined as a portion including a first upper surface US1, and the second portion P2 may be defined as a portion including a second upper surface US2. In the inorganic deposition layer INF, each of the first upper surface US1 and the second upper surface US2 may refer to a surface in contact with the encapsulation layer TFE. For example, the first upper surface US1 may be provided on the interface between the first portion P1 and the encapsulation layer TFE, and the second upper surface US2 may be provided on the interface between the second portion P2 and the encapsulation layer TFE. As used herein, the first portion P1 may be referred to as a "separating portion" and the second portion P2 may be referred to as a "flat portion."
[0111] The first upper surface US1 of the first portion P1 may refer to a flat surface that is inclined at a first angle θ1 relative to the upper surface B_US of the base substrate BS. The first angle θ1 may refer to an angle formed by the first upper surface US1 and the upper surface B_US of the base substrate BS. The first angle θ1 may be in a range of about 60 degrees to about 90 degrees. For example, the first angle θ1 may be in a range of about 65 degrees to about 85 degrees. The normal direction of the first upper surface US1 may not be parallel to the third direction DR3.
[0112] The first portion P1 may correspond to the side surface SS of the pixel definition film PDL. The first portion P1 may be a portion disposed on a portion of the light emitting element ED disposed on the side surface SS of the pixel definition film PDL. The side surface SS of the pixel definition film PDL may refer to a portion defining the pixel opening OH (e.g., referring to FIG. 1 ). Figure 4) surface. The first upper surface US1 of the first portion P1 may be substantially parallel to the side surface SS of the pixel defining film PDL. The upper surface B_US of the base substrate BS may be inclined at a first angle θ1 relative to the first upper surface US1. The upper surface B_US of the base substrate BS may be inclined at a second angle θ2 relative to the side surface SS of the pixel defining film PDL. The first angle θ1 may be substantially the same as the second angle θ2. As used herein, the term "substantially parallel" includes not only a case where the two surfaces do not intersect with each other no matter how long they extend, but also a case where, although the two surfaces are parallel to each other (for example, designed to be parallel to each other), there is a difference in distance between the two surfaces that falls within an error range in the process (or an acceptable manufacturing tolerance). The term "substantially the same" includes not only a case where components have the same thickness (for example, physically exactly the same thickness, etc.), but also a case where, although the components are designed the same, there is a difference in thickness, etc. between them that falls within an error range in the process.
[0113] The second upper surface US2 may be substantially parallel to the upper surface B_US of the base substrate BS. Each of the second upper surface US2 and the upper surface B_US of the base substrate BS may be parallel to a plane defined by the first direction DR1 and the second direction DR2 that intersect (e.g., cross) each other. Therefore, the normal direction of each of the second upper surface US2 and the upper surface B_US of the base substrate BS may be parallel to the third direction DR3.
[0114] The first thickness d1 of the first portion P1 may be greater than the second thickness d2 of the second portion P2. The first thickness d1 may be the shortest distance between the first upper surface US1 and the light emitting element ED. For example, the first thickness d1 may be the vertical distance from the upper surface of the cap layer CPL in the light emitting element ED to the first upper surface US1. As used herein, the term "vertical distance" may be the shortest distance measured in the normal direction (for example, in the direction perpendicular to the tangent line) at the measurement point. The second thickness d2 may be the shortest distance between the second upper surface US2 and the light emitting element ED. For example, the second thickness d2 may be the distance from the upper surface of the cap layer CPL in the light emitting element ED to the second upper surface US2 in the third direction DR3. The difference between the first thickness d1 and the second thickness d2 may be about 5 to about 50 For example, the first thickness d1 may be about 50 to about 200 In the range of about 40 to about 100 The first thickness d1 of the first portion P1 is less than about 50 In the case of the first portion P1, the layer uniformity of the inorganic deposition layer INF including the first portion P1 may be reduced. In an embodiment, when the first portion P1 is composed of bismuth (Bi) (eg, a bismuth (Bi)-based material), the first thickness d1 may be ideally about 100 The first portion P1 is composed of bismuth (Bi) and the first thickness d1 is about 100 In the case of Yb, the layer uniformity of the inorganic deposition layer INF including the first portion P1 can be ensured. x Bi y In the case of mixed deposition materials, the first thickness d1 may be about 50 to about 70 In the first part P1, Yb x Bi y The mixed deposition material is composed of a first thickness d1 of about 50 to about 70 In the case where the second thickness d2 of the second portion P2 is greater than about 100, the layer uniformity of the inorganic deposition layer INF including the first portion P1 can be ensured. In the case of a display device DD comprising a second portion P2 (eg, reference Figure 4 )’s external light reflectivity will increase, thereby reducing the light emission efficiency.
[0115] The surface roughness of the first upper surface US1 of the first portion P1 may be less than the surface roughness of the second upper surface US2 of the second portion P2. The second upper surface US2 may include the irregular pattern PT, and the first upper surface US1 may not include the irregular pattern PT. The irregular pattern PT may be formed by etching at least a portion of the second portion P2 through an etching process.
[0116] According to the disclosed embodiments, the display device may include a portion having an uneven thickness in the inorganic deposition layer. In the inorganic deposition layer, the flat portion arranged parallel to the base substrate or the like may have a relatively thin structure, and the partition portion having a certain inclination (e.g., a specific or selectable inclination) due to the opening defining the pixel may have a relatively thick structure. For example, the flat portion arranged parallel to the base substrate may have a thickness smaller than that of the partition portion having the inclination. Therefore, the display device according to the disclosed embodiments may have improved light efficiency and reduced external light reflection. For example, since the flat portion is relatively thin in the inorganic deposition layer, external light reflection may be reduced and the effectiveness of light transmittance may be improved. Since the partition portion is relatively thick in the inorganic deposition layer, layer uniformity may be ensured and light emission efficiency may be improved. Therefore, the display device may have improved reliability and increased manufacturing efficiency. Because the flat portion (e.g., second portion P2) can have an irregular pattern on its upper surface (e.g., second upper surface US2) and a relatively high surface roughness, the display device can have reduced white angle dependency (WAD) characteristics compared to the partition portion (e.g., first portion P1). Therefore, the display device according to the disclosed embodiment can include an inorganic deposition layer including the flat portion (e.g., second portion P2) and the partition portion (e.g., first portion P1). As a result, reliability and light emission characteristics can be improved.
[0117] Refer to the following Figure 6A 、 Figure 6B 、 Figure 7A and Figure 7B A detailed description is provided of a method of manufacturing a display device according to a disclosed embodiment.
[0118] Figure 6A is a schematic flowchart illustrating a method of manufacturing a display device according to a disclosed embodiment. Figure 6B is a schematic flowchart illustrating forming an inorganic deposition layer in a method of manufacturing a display device according to an embodiment of the disclosure. Figure 7A and Figure 7B 1 is a schematic diagram sequentially illustrating some operations in a method for manufacturing a display device according to a disclosed embodiment. In the description of the method for manufacturing a display device according to a disclosed embodiment, detailed descriptions of the same constituent elements are omitted.
[0119] Reference Figure 6A and Figure 7A , the method of manufacturing a display device according to the disclosed embodiment may include providing a base substrate BS and a light emitting element ED disposed on the base substrate BS and including a light emitting layer EML ( S100 ).
[0120] Reference Figure 6A and Figure 7B , the method of manufacturing a display device according to the disclosed embodiment may include forming an inorganic deposition layer INF on the light emitting element ED ( S200 ) after providing the light emitting element ED ( S100 ).
[0121] Reference Figure 6B 、 Figure 7A and Figure 7B The formation of the inorganic deposition layer INF (S200) may include forming an initial inorganic deposition layer P_INF including a first initial portion P_P1 and a second initial portion P_P2 (S210), and etching at least a portion of the second initial upper surface P_US2 to form an irregular pattern PT (S220). The first initial portion P_P1 may include a first initial upper surface P_US1 inclined at a first angle θ1 relative to the upper surface B_US of the base substrate BS, and the second initial portion P_P2 may include a second initial upper surface P_US2 substantially parallel to the upper surface B_US of the base substrate BS.
[0122] Reference Figure 7A and Figure 7B In the formation of the initial inorganic deposition layer P_INF, the initial inorganic deposition layer P_INF may include a first initial portion P_P1 and a second initial portion P_P2. The first initial portion P_P1 may include a first initial upper surface P_US1, and the second initial portion P_P2 may include a second initial upper surface P_US2. The first initial upper surface P_US1 may be inclined at a first angle θ1 relative to the upper surface B_US of the base substrate BS, and the second initial upper surface P_US2 may be substantially parallel to the upper surface B_US of the base substrate BS. The first angle θ1 may be in a range of about 60 degrees to about 90 degrees, and the first initial upper surface P_US1 may be inclined at the first angle θ1 relative to the upper surface B_US of the base substrate BS. The first initial portion P_P1 including the first initial upper surface P_US1 may be formed on the side surface of the pixel defining film PDL.
[0123] In the formation of the initial inorganic deposition layer P_INF, the first initial portion P_P1 and the second initial portion P_P2 can be formed of the same material by the same process. Therefore, the thickness d11 of the first initial portion P_P1 and the thickness d12 of the second initial portion P_P2 can be substantially the same. The thickness d11 of the first initial portion P_P1 and the thickness d12 of the second initial portion P_P2 can be approximately 50 to about 200 within the range.
[0124] The formation of the initial inorganic deposition layer P_INF may include a process of depositing an inorganic material having a refractive index of approximately 1.0 or greater and an absorption coefficient of approximately 0.5 or greater. The formation of the initial inorganic deposition layer P_INF may include a process of depositing an inorganic material having a melting point of approximately 1000° C. or less. The initial inorganic deposition layer P_INF may overlap with the light emitting element ED in a plan view (e.g., entirely overlap with the light emitting element ED). The formation of the initial inorganic deposition layer P_INF may include performing a thermal evaporation process. The formation of the initial inorganic deposition layer P_INF may be composed of a thermal evaporation process.
[0125] Forming the irregular pattern PT may include etching at least a portion of the second preliminary portion P_P2. Forming the irregular pattern PT may include etching at least a portion of the second preliminary upper surface P_US2. Etching at least a portion of the second preliminary upper surface P_US2 may include performing any one of a wet etching process, a dry etching process, an ion milling process, and a spacer patterning technology (SPT) process. However, the disclosure is not limited thereto.
[0126] The formation of the irregular pattern PT may include etching at least a portion of the second preliminary upper surface P_US2 and forming a second portion P2. At least a portion of the second preliminary upper surface P_US2 may be etched, and the thickness of the second portion P2 may be about 40 to about 100 within the range.
[0127] During the etching of the second preliminary upper surface P_US2, particles (not shown) of the second preliminary portion P_P2 are generated. These particles (not shown) reach the first preliminary upper surface P_US1. The particles (not shown) adhere to the first preliminary upper surface P_US1 of the first preliminary portion P_P1. Thus, the first portion P1 can be formed. Therefore, the first portion P1, to which the particles (not shown) are additionally attached, can have a greater thickness (e.g., a larger thickness value) than the first preliminary portion P_P1. Since at least a portion of the second preliminary upper surface P_US2 is etched, the thickness of the first portion P1 can become greater than that of the first preliminary portion P_P1, and the thickness of the second portion P2 can become less than that of the second preliminary portion P_P2. Therefore, the thickness of the first portion P1 can be greater than that of the second portion P2.
[0128] The formation of the irregular pattern PT may include etching of the second preliminary upper surface P_US2, but not etching of the first preliminary upper surface P_US1. The irregular pattern PT may be formed only on the upper surface of the second portion P2 and may not be formed on the upper surface of the first portion P1. Therefore, the surface roughness of the upper surface of the second portion P2 may be higher than the surface roughness of the upper surface of the first portion P1.
[0129] According to the disclosed embodiments, a display device may include a portion having a non-uniform thickness in an inorganic deposition layer, thereby improving light efficiency of a display device including a light emitting element and reducing external light reflection.
[0130] The above description is an example of the disclosed technical features, and those skilled in the art will be able to make various modifications and changes. Therefore, the disclosed embodiments described above can be implemented individually or in combination with each other.
[0131] Therefore, the embodiments disclosed in the disclosure are not intended to limit the disclosed technical spirit, but to describe the disclosed technical spirit, and the scope of the disclosed technical spirit is not limited by these embodiments. The scope of protection disclosed should be interpreted by the claims, and should be interpreted as all technical spirits within the equivalent scope are included in the scope of the disclosure.
Claims
1. A display device comprising a display panel, characterized in that: The display panel includes: The light-emitting element is provided on the base substrate and includes a light-emitting layer; an inorganic deposition layer, disposed on the light-emitting element; and an encapsulation layer, disposed on the inorganic deposition layer, The inorganic deposition layer includes: a first portion including a first upper surface inclined at a first angle relative to the upper surface of the base substrate; and a second portion including a second upper surface parallel to the upper surface of the base substrate, and A first thickness of the first portion is greater than a second thickness of the second portion.
2. The display device according to claim 1, wherein The first angle is in the range of 60 degrees to 90 degrees.
3. The display device according to claim 1, wherein The surface roughness of the first upper surface is smaller than the surface roughness of the second upper surface.
4. The display device according to claim 1, wherein An irregular pattern is defined on the second upper surface.
5. The display device according to claim 1, wherein The display panel further includes: A pixel defining film is provided on the base substrate and has a pixel opening, and The light emitting layer is disposed in the pixel opening.
6. The display device according to claim 5, wherein: The pixel definition film includes a side surface defining the pixel opening, The side surface of the pixel definition film is inclined at a second angle relative to the upper surface of the base substrate, and The second angle is the same as the first angle.
7. The display device according to claim 1, wherein The difference between the first thickness and the second thickness is 5 to 50 within the range.
8. The display device according to claim 1, wherein The first thickness is 50 to 200 within the range.
9. The display device according to claim 1, wherein The second thickness is 40 to 100 within the range.
10. The display device according to claim 1, wherein The encapsulation layer integrally contacts the first upper surface and the second upper surface.
11. The display device according to claim 1, wherein The light emitting element further comprises: A first electrode is provided on the base substrate; a second electrode spaced apart from the first electrode; a hole transport region, disposed between the first electrode and the light-emitting layer; an electron transport region, disposed between the second electrode and the light-emitting layer; and a capping layer, disposed on the second electrode, The light emitting layer is provided between the first electrode and the second electrode, and The inorganic deposition layer is directly disposed on the cap layer.
12. The display device according to claim 1, wherein The display device further includes: a light control layer, disposed on the display panel; and The sensor layer is arranged between the display panel and the light control layer.
13. A display device, characterized in that: The display device includes: display panel; and A light control layer is provided on the display panel. The display panel includes: a light-emitting element disposed on a base substrate and including a light-emitting layer; an inorganic deposition layer disposed on the light-emitting element and including a partition portion and a flat portion adjacent to the partition portion; and an encapsulation layer integrally contacting a first upper surface of the partition portion and a second upper surface of the flat portion. The first upper surface is inclined at a first angle relative to the upper surface of the base substrate. The second upper surface is parallel to the upper surface of the base substrate, and The surface roughness of the first upper surface is smaller than the surface roughness of the second upper surface.
Citation Information
Patent Citations
Method for producing nicotinamide mononucleotide
KR1020230124883A