Electronic cigarette sensor metal structure based on circular stamping mode

Abstract

According to the electronic cigarette sensor metal structure based on the circular stamping mode, a packaging support is formed by stamping and is made of red copper, a die is designed to be circular stamping, electric circuit connection bonding pads formed through traditional stamping are all formed through right-angle stamping and bending, circular stamping is formed through stamping and bending along a circular arc, and therefore the production efficiency is greatly improved. The electret PCB is formed by matching a plurality of components and multiple times of stamping, the pins formed by the structure are directly connected with a circuit, parasitic capacitance of the electret PCB is reduced, SMT surface mounting operation can be realized, batch operation of a module end can be realized, the star-shaped bonding pad which can be used for surface mounting and wire bonding and is recessed in resin adhesive is arranged, the sealing performance and batch production are improved, and the production cost is reduced. The lead frame structure of the electronic cigarette sensor in the circular stamping mode meets the requirement for the circular appearance of 90% of electronic cigarette customers in the existing market, and a corresponding microphone sleeve airway mold does not need to be changed in the electronic cigarette.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic cigarette sensors, in particular to a metal structure of an electronic cigarette sensor based on a circular stamping method. Background Art

[0002] Electret-structured e-cigarette sensors currently dominate the e-cigarette market. The main carrier material used in these sensors is a PCB (printed circuit board), also known as a printed circuit board. PCBs are widely used and are made of FR4-grade epoxy fiberglass cloth. FR4 epoxy fiberglass cloth substrates use epoxy resin as a binder and electronic-grade fiberglass cloth as a reinforcement. Its bonding sheet and inner core thin copper-clad laminate are essential substrates for multilayer printed circuit boards. The PCB production process primarily includes PCB circuit layout, core board fabrication, inner PCB circuit transfer, core board drilling and inspection, lamination, drilling, hole wall copper plating, and outer PCB circuit transfer and etching. PCB circuit layout involves designing the routing pattern based on the e-cigarette sensor's desired circuitry. Core board fabrication involves cleaning the copper-clad laminate to remove dust and stains to prevent short circuits and open circuits later on, which could affect product quality. For inner PCB circuit transfer, the cleaned copper-clad laminate is then coated with a photosensitive film. This film will solidify when exposed to light, forming a protective film on the copper foil of the copper clad board. The photosensitive machine uses a UV lamp to irradiate the photosensitive film on the copper foil. Under the light-transmitting film, the photosensitive film is solidified, while under the opaque film, the photosensitive film is still unsolidified. The copper foil covered under the solidified photosensitive film is the required PCB layout circuit. Drilling: Create through holes between the layers of the circuit board to achieve the purpose of connecting the layers and prepare for the subsequent copper plating process; Copper plating: Also called chemical copper, the PCB board after drilling undergoes an oxidation-reduction reaction in the copper plating tank to form a copper layer to metallize the holes, so that copper is deposited on the surface of the originally insulating substrate to achieve electrical connection between layers; Etching: After exposure and development, the unexposed film is removed by the developer to expose the copper surface. Acidic copper chloride is used to dissolve and corrode this exposed copper surface to obtain the required circuit and protect the exposed copper surface. The optical film is peeled off with sodium hydroxide solution, revealing the circuit pattern. Solder mask: Solder mask ink plays a vital role in the electronics manufacturing process, protecting circuit boards and preventing short circuits and oxidation. It is mainly applied by screen printing or coating solder mask ink on the board surface. Through exposure and development, the pads and holes are exposed, and the rest of the area is covered with solder mask to prevent short circuits during soldering. Surface treatment: Bare copper itself has good solderability, but it is easily oxidized by moisture and air over a long period of time. It tends to exist in the form of oxides and cannot remain in its original state for a long time. Therefore, the copper surface needs to be treated. The most basic purpose of surface treatment is to ensure good solderability and electrical properties.

[0003] The above structure also has the following disadvantages:

[0004] 1. Control of wiring line width, spacing and wiring uniformity. If the spacing is too small, it will cause film clamping, and the film cannot be completely removed, causing a short circuit. If the line width is too small, the adhesion of the film is insufficient, causing the circuit to open. Therefore, the safety spacing during circuit design must also be considered during production.

[0005] 2. The PCB circuit board short circuit causes functional failure. Incomplete etching between the circuits causes copper connections to form a short circuit on the PCB.

[0006] 3. Materials such as solder mask green oil are easy to fall off or have residual debris, resulting in the risk of empty soldering or poor soldering during pad soldering operations. The green oil of solder mask material has poor coverage accuracy and may cover the pad, resulting in solder voids;

[0007] 4. The pad is irregularly formed, and the shape or size deviation of the pad is large;

[0008] 5. PCB open circuit leads to functional failure: overcurrent and overvoltage cause the via metal in the PCB to burn out and open the circuit, and the circuit etching and disconnection lead to open circuit;

[0009] 6. Plating failure: defects in plating process, chemicals, etc., the presence of phosphorus-rich layers in nickel plating easily generates nickel corrosion, resulting in reduced solderability of device pads and electrical contact failure;

[0010] 7. The production and processing of circuit boards is costly, the technical requirements are high, and the safety spacing requirements for etching circuits are high.

[0011] 8. Currently, the stamped lead frames on the market are all rectangular, and the pads are generated by right-angle bending. In addition, the gap between the bent pads and the resin glue is large, which affects the stability of the starting negative pressure. Utility Model Content

[0012] (1) Technical problems solved

[0013] In order to solve the above problems, the utility model provides an electronic cigarette sensor metal structure based on a circular stamping method.

[0014] (2) Technical solution

[0015] To achieve the above objectives, the present invention provides the following technical solutions: a metal structure of an electronic cigarette sensor based on a circular stamping method, comprising a lead frame cavity, an upper cover, a micro-electromechanical sensor, and an ASIC chip. The basic metal frame of the lead frame is stamped into a designed circuit frame structure in a circular shape, and then the metal of the pad portion to be exposed is bent along the inner arc to form a star-shaped pad arrangement, which requires multiple components and multiple stampings to form. The lead frame is made of red copper, and a high step is provided on one side of the bottom wall of the cavity. An air intake channel is provided on the step, which passes through the high step and the bottom wall of the lead frame cavity. The micro-electromechanical sensor is also provided on the high step. A low step is provided in the cavity away from the high step. The ASIC chip is fixed on the low step and fixed and protected with sealant. A layer of filter cotton is provided on the sealant to prevent smoke oil from contaminating the micro-electromechanical sensor at the suction hole. An upper cover adapted to it is provided above the lead frame cavity, and the upper cover is provided with an suction hole. A protective net adapted to the air intake channel is provided below the lead frame cavity.

[0016] The star-shaped pad can be used for SMT patch and can also be used for welding external line connection modules.

[0017] The star-shaped pad is wrapped around the bottom of the cavity by being concave after injection molding, and its height is lower than that of the resin glue, which can effectively reduce SMT patch defects and increase the air tightness of the electronic cigarette sensor.

[0018] The star-shaped pad formed by punching and the middle large pad (low step) maintain the same plane.

[0019] The stamped circular frame has a high step, a low step and a star-shaped pad structure.

[0020] The stamped metal circuits all adopt an electroplating process to increase their weldability and protection.

[0021] The lead frame is stamped into multiple arrays and can be produced and processed in batches.

[0022] (3) Beneficial effects

[0023] Compared with the existing technology, the present invention provides an electronic cigarette sensor metal structure based on a circular stamping method, which has the following beneficial effects:

[0024] 1. The circular stamping method of electronic cigarette sensor lead frame packaging adopts an automated process. Through semiconductor packaging technology and based on semiconductor equipment packaging operations, it realizes the packaging technology of electronic cigarette sensors that can be mass-produced, with high consistency, high quality and low processing cost;

[0025] 2. The circular stamping electronic cigarette sensor lead frame is made of high-temperature resistant plastic and red copper. The materials of the internal micro-electromechanical sensors are all high-temperature resistant materials, ensuring that the electronic cigarette sensor of this structure can withstand high temperature operation during the packaging process, ensuring that the micro-electromechanical sensor is not affected by the high temperature of the packaging process, and ensuring the stability of the micro-electromechanical sensor's startup negative pressure;

[0026] 3. The circular stamping electronic cigarette sensor lead frame is formed by stamping a star-shaped pad structure. The pins formed by this structure are directly connected to the circuit, reducing the generation of parasitic capacitance of the electret PCB board, enabling SMT patch mounting operations and realizing batch operations on the module end; improving sealing and batch production, and can also weld external wires;

[0027] 4. The circular stamping method of the electronic cigarette sensor lead frame structure meets the circular appearance requirements of 90% of the electronic cigarette customers on the market. The electronic cigarette shape does not need to change the corresponding microphone airway mold;

[0028] 5. The circular stamping method of the electronic cigarette sensor lead frame has a star-shaped pad at the bottom that is concave in the injection molding surface and is slightly lower than the resin surface, which can effectively reduce SMT patch defects and increase the airtightness of the electronic cigarette sensor.

[0029] 6. The circular stamping method of the electronic cigarette sensor lead frame and the stamped metal circuit solve the defects of short circuit, open circuit, green glaze residual debris, and open circuit caused by burning of via metal in the production of traditional immersion gold circuit boards.

[0030] 7. The stress generated by the stamping process of the metal circuit frame is much lower than the stress of the PCB circuit board used in the traditional electret, which solves the impact of stress on the MEMS sensor, ensures the original state of the MEMS sensor, and ensures the consistency of the negative pressure when the electronic cigarette sensor is started. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 It is a schematic diagram of the structural cross section of the utility model;

[0032] Figure 2 This is a schematic top view of the structure of the present utility model;

[0033] Figure 3 This is a bottom view schematic diagram of the structure of the present utility model;

[0034] Figure 4 The structure of the utility model is viewed from above Figure 2 ;

[0035] Figure 5 This is a structural diagram of the welding pad of the present utility model.

[0036] In the figure: 1. Cavity; 2. Upper cover; 3. MEMS sensor; 4. ASIC chip; 5. High step; 6. Air intake channel; 7. Partition wall; 8. Sealant; 9. Protective net; 10. Air intake hole; 11. Filter cotton; 12. Star-shaped pad. DETAILED DESCRIPTION

[0037] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0038] See also Figure 1-4 A metal structure for an electronic cigarette sensor based on a circular stamping method includes a lead frame cavity 1, an upper cover 2, a micro-electromechanical sensor 3, and an ASIC chip 4. The basic metal frame of the lead frame is stamped into a circular shape to form a designed circuit frame structure. The metal of the pad portion to be exposed is then bent along the inner arc to form a star-shaped pad arrangement. This requires multiple components and multiple stamping operations. The lead frame is made of red copper. A high step 5 is provided on one side of the bottom wall of the cavity. A threaded hole is provided on the high step 5 to pass through the high step 5 and the lead frame cavity. The air inlet channel 6 on the bottom wall of the body 1 is provided with the micro-electromechanical sensor 3 on the high step 5. A low step is provided in the cavity 1 away from the high step 5. The ASIC chip 4 is fixed on the low step and fixed and protected by a sealant 8. A layer of filter cotton 11 is provided on the sealant 8 to prevent smoke oil from contaminating the micro-electromechanical sensor 3 at the suction hole 10; an upper cover 2 adapted thereto is provided above the lead frame cavity 1, and the upper cover 2 is provided with an suction hole 10. A protective net 9 adapted to the air inlet channel 6 is provided below the lead frame cavity 1.

[0039] The star-shaped pad 12 can be used as an SMT patch or as a soldering pad for external line connection modules.

[0040] The star-shaped pad 12 is concavely wrapped around the bottom of the cavity 1 after injection molding, and its height is lower than that of the resin glue, which can effectively reduce SMT patch defects and increase the airtightness of the electronic cigarette sensor.

[0041] The star-shaped pad 12 formed by punching and the middle large pad (low step) maintain the same plane.

[0042] The stamped circular frame has a high step 5, a low step, and a star-shaped pad 12 structure.

[0043] The stamped metal circuits all adopt an electroplating process to increase their weldability and protection.

[0044] The lead frame is stamped into multiple arrays and can be produced and processed in batches.

[0045] A metal structure of an electronic cigarette sensor based on a circular stamping method, the stamping process includes: material preparation, stamping die production, stamping parameters, stamping processing, and cleaning; material preparation: first, it is necessary to prepare the raw materials for the stamping bracket, generally using cold-rolled plate materials, select the appropriate plate specifications according to product requirements, and cut them into sheet blanks of appropriate sizes. Due to product needs, a power-type electronic cigarette sensor with high power output is provided on the market, and high thermal conductivity and electrical conductivity red copper material is selected. This material has excellent electrical conductivity, thermal conductivity, ductility and corrosion resistance; stamping die design and production: According to the drawing size and process requirements of the product, the stamping die is designed and produced. The die includes upper and lower templates, concave and convex dies, etc. During the design process, factors such as the shape, size, and strength of the product need to be considered. The mold of the utility model is designed for circular stamping. Traditional stamping is all right-angle stamping and bending. Circular stamping is stamping and bending along the arc, which requires multiple parts and multiple stampings to cooperate to form. Stamping parameter setting: According to the stamping die and product requirements, determine the appropriate stamping parameters, including stamping speed, stamping pressure, number of stamping, etc. These parameters directly affect the quality of the product and production efficiency. Stamping process: Place the prepared sheet on the stamping bed, and the pressure of the upper and lower stamping dies causes the residual plastic deformation of the sheet to form the shape of the bracket. The stamping die includes multiple stamping heads and can stamp multiple parts. During this process, it is necessary to control the stamping process parameters and pay attention to the deformation of the material to ensure the accuracy and quality of the product. Cleaning: After the stamping is completed, there may be burrs and residual oil on the bracket, which needs to be deburred and cleaned to make the surface of the bracket smooth and clean.

[0046] Compared with the existing electret electronic cigarette sensor, the utility model provides an electronic cigarette sensor metal structure based on a circular stamping method to achieve the following beneficial effects:

[0047] 1. The circular stamping method of electronic cigarette sensor lead frame packaging adopts an automated process. Through semiconductor packaging technology and based on semiconductor equipment packaging operations, it realizes the packaging technology of electronic cigarette sensors that can be mass-produced, with high consistency, high quality and low processing cost;

[0048] 2. The circular stamping electronic cigarette sensor lead frame is made of high-temperature resistant plastic and red copper. The materials of the internal micro-electromechanical sensors are all high-temperature resistant materials, ensuring that the electronic cigarette sensor of this structure can withstand high temperature operation during the packaging process, ensuring that the micro-electromechanical sensor is not affected by the high temperature of the packaging process, and ensuring the stability of the micro-electromechanical sensor's startup negative pressure;

[0049] 3. The circular stamping electronic cigarette sensor lead frame is formed by stamping a star-shaped pad structure. The pins formed by this structure are directly connected to the circuit, reducing the generation of parasitic capacitance of the electret PCB board, enabling SMT patch mounting operations and realizing batch operations on the module end; improving sealing and batch production, and can also weld external wires;

[0050] 4. The circular stamping method of the electronic cigarette sensor lead frame structure meets the circular appearance requirements of 90% of the electronic cigarette customers on the market. The electronic cigarette shape does not need to change the corresponding microphone airway mold;

[0051] 5. The circular stamping method of the electronic cigarette sensor lead frame has a star-shaped pad at the bottom that is concave in the injection molding surface and is slightly lower than the resin surface, which can effectively reduce SMT patch defects and increase the airtightness of the electronic cigarette sensor.

[0052] 6. The circular stamping method of the electronic cigarette sensor lead frame and the stamped metal circuit solve the defects of short circuit, open circuit, green glaze residual debris, and open circuit caused by burning of via metal in the production of traditional immersion gold circuit boards.

[0053] 7. The stress generated by the stamping process of the metal circuit frame is much lower than the stress of the PCB circuit board used in the traditional electret, which solves the impact of stress on the MEMS sensor, ensures the original state of the MEMS sensor, and ensures the consistency of the negative pressure when the electronic cigarette sensor is started.

[0054] In order to explain in detail the possible application scenarios, technical principles, specific solutions that can be implemented, and the purpose and effects of this application, the following is a detailed description of the specific embodiments listed in conjunction with the accompanying drawings. The embodiments described herein are only used to more clearly illustrate the technical solutions of this application and are therefore only examples and are not intended to limit the scope of protection of this application.

[0055] References to "embodiments" herein mean that the specific features, structures, or characteristics described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the word "embodiment" in various places in the specification does not necessarily refer to the same embodiment, nor does it particularly limit its independence or relevance to other embodiments. In principle, in this application, as long as there are no technical contradictions or conflicts, the various technical features mentioned in the embodiments can be combined in any manner to form a corresponding implementable technical solution.

[0056] Unless otherwise defined, the technical terms used herein have the same meanings as those generally understood by those skilled in the art to which this application belongs; the use of relevant terms herein is only for describing specific embodiments and is not intended to limit this application.

[0057] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents. The above embodiments only express several preferred embodiments of the present invention, and their descriptions are relatively specific and detailed. It should be understood that the present invention is not limited to the forms disclosed herein and should not be construed as excluding other embodiments. Instead, it can be used in various other combinations, modifications, and environments and can be modified within the scope of the present invention through the above teachings or the technology or knowledge in the relevant field. It should not be construed as limiting the scope of the present invention. It should be pointed out that it is possible for those skilled in the art to make various variations and improvements without departing from the spirit and scope of the present invention. The changes and modifications made by those skilled in the art do not depart from the spirit and scope of the present invention and are within the scope of protection of the appended claims. Therefore, the scope of protection of the present utility model patent shall be based on the appended claims.

Claims

1. A metal structure of an electronic cigarette sensor based on a circular stamping method, characterized in that: The basic metal frame of the lead frame is a circular stamped structure designed for the circuit. The metal of the pad portion to be exposed is then bent along the arc to form a star-shaped pad arrangement. This requires multiple components and multiple stamping cycles. The lead frame is made of red copper. The star-shaped pad (12) can be used for SMT patch and can also be used for welding external line connection modules; The star-shaped pad (12) is concavely wrapped around the bottom of the cavity (1) after injection molding, and its height is lower than that of the resin glue.

2. The metal structure of an electronic cigarette sensor based on a circular stamping method according to claim 1, characterized in that: The star-shaped pad formed by stamping and the middle large pad remain in the same plane.

3. The metal structure of an electronic cigarette sensor based on a circular stamping method according to claim 2, characterized in that: The stamped circular frame has high step, low step and star-shaped pad structures.

4. The circular stamping metal structure of an electronic cigarette sensor according to claim 3, characterized in that: The stamped metal circuits are all electroplated to increase their solderability and protection.

5. The metal structure of an electronic cigarette sensor based on a circular stamping method according to claim 4, characterized in that: The lead frame is stamped into multiple arrays and can be produced and processed in batches.

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