DAF film transmission device of wafer film pasting equipment

Abstract

The utility model discloses a DAF film transmission device of wafer film pasting equipment, which comprises a feed roller, a film tearing platform and a wind-up roller, a plurality of front tension rollers are arranged between the feed roller and the film tearing platform, a plurality of rear tension rollers are arranged between the film tearing platform and the wind-up roller, a DAF film is arranged on the feed roller, and the DAF film is arranged on the wind-up roller. The outer end of the DAF film sequentially penetrates through the front tensioning roller, the film tearing platform and the rear tensioning roller to be connected with the winding roller, a thickness sensor is installed at the position of the rear tensioning roller, and the thickness sensor and the alarm unit are both electrically connected with the control unit. The thickness sensor is installed at the position of the rear tensioning roller, the thickness of the rear tensioning roller is monitored in real time, an alarm is given in time once glue adheres to the rear tensioning roller, the phenomenon that the thickness of the rear tensioning roller is not uniform due to the fact that the glue adheres to the rear tensioning roller is avoided, the stress uniformity of a DAF film is guaranteed, and the product quality and safety are guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging, in particular to a DAF film transmission device of wafer film mounting equipment. Background Art

[0002] During the semiconductor wafer grinding process, two film-laminating operations are involved. The first is to laminarize the wafer after laminating the front side of the wafer. This process protects the front side of the wafer from physical damage and prevents contamination of the wafer by debris and polishing fluid generated during the grinding process. It also reduces stress-induced wafer breakage or ripples by providing stress relief and stretchability. The second is to laminarize the back side of the wafer. This process protects the wafer from physical damage and contamination, precisely controls the amount of adhesive used to reduce warping, simplifies the chip bonding process, and improves production efficiency. It also provides excellent isolation performance and good thermal conductivity, enhances package reliability, and supports layered and thin packaging technologies.

[0003] However, when implementing the above technical solution, the applicant found that since there is still a waste adhesive layer on the waste film after the DAF film is pasted, the waste adhesive layer is easy to adhere to the roller during the subsequent waste film winding process, causing uneven force on the DAFA film, causing the DAF film to break, resulting in damage to the wafer.

[0004] Based on the above technical problems, the present application proposes a DAF film transmission device for wafer film mounting equipment. Utility Model Content

[0005] The purpose of the utility model is to provide a DAF film transmission device for a wafer lamination device to solve the technical problems mentioned in the background technology. The purpose of the utility model is achieved through the following technical solutions:

[0006] A DAF film transmission device of a wafer laminating equipment includes a feed roller, a film tearing platform and a winding roller. A plurality of front tensioning rollers are arranged between the feed roller and the film tearing platform, and a plurality of rear tensioning rollers are arranged between the film tearing platform and the winding roller. The DAF film is installed on the feed roller, and the outer end of the DAF film passes through the front tensioning roller, the film tearing platform, the rear tensioning roller and is connected to the winding roller in sequence. The device also includes a control unit and an alarm unit. A thickness sensor is installed at the rear tensioning roller, and the thickness sensor and the alarm unit are both electrically connected to the control unit.

[0007] Furthermore, the thickness sensor is a three-dimensional laser sensor, and the detection surface of the three-dimensional laser sensor faces the roller surface of the rear tension roller.

[0008] Furthermore, the thickness sensor is a through-beam photoelectric sensor, which includes a transmitting end and a receiving end, and the transmitting end and the receiving end are respectively installed at two ends of the rear tensioning roller.

[0009] Furthermore, there are at least three rear tension rollers and two thickness sensors, one thickness sensor is installed at the rear tension roller close to the film tearing platform, and the other thickness sensor is installed at the rear tension roller close to the winding roller.

[0010] The technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:

[0011] By installing a thickness sensor at the rear tensioning roller, the thickness of the rear tensioning roller is monitored in real time. Once glue adheres to the rear tensioning roller, an alarm is issued in time to avoid uneven thickness of the rear tensioning roller caused by glue on the rear tensioning roller, ensuring the uniformity of the force on the DAF film and the quality and safety of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The drawings in the specification, which constitute a part of this application, are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the present invention.

[0013] Figure 1 This is a structural diagram of Example 1 of the present application;

[0014] Figure 2 This is a structural diagram of Example 2 of this application;

[0015] Figure 3 This is a schematic diagram of the thickness sensor installation in Example 2 of the present application;

[0016] Figure 4 This is a circuit diagram of an embodiment of the present application.

[0017] Markings in the attached figure: 1. Feed roller; 2. Front tensioning roller; 3. Film tearing platform; 4. Rear tensioning roller; 5. Winding roller; 6. DAF film; 7. Thickness sensor; 71. Transmitter; 72. Receiver. DETAILED DESCRIPTION

[0018] In order to better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the drawings and specific implementation methods of the specification. Obviously, the described embodiments are only some embodiments of the present utility model, rather than all embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is in no way intended to limit the present utility model and its application or use. Based on the embodiments of the present utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present utility model.

[0019] Example 1

[0020] like Figure 1The DAF film transport device shown in the figure for wafer lamination equipment includes a feed roller 1, a front tensioning roller 2, a film tearing platform 3, a rear tensioning roller 4, and a take-up roller 5. A feed motor (not shown) is mounted on the feed roller 1, the output shaft of which is connected to the feed roller 1 and drives the feed roller 1 to rotate and feed the film. The film tearing platform 3 is mounted on the underside of the feed roller 1, with three front tensioning rollers 2 staggered between the feed roller 1 and the film tearing platform 3. The take-up roller 5 is mounted on the right side of the feed roller 1, with four rear tensioning rollers 4 staggered between the film tearing platform 3 and the take-up roller 5. A take-up motor (not shown) is mounted on the take-up roller 5, the output shaft of which is connected to the take-up roller 5 and drives the take-up roller 5 to rewind the film. A DAF film 6 is mounted on the feed roller 1, and the outer end of the DAF film 6 passes through the front tensioning roller 2, the film tearing platform 3, and the rear tensioning roller 4 in sequence before being wound around the take-up roller 5. The front tensioning roller 2 and the rear tensioning roller 4 are used to tension the DAF film, and the film tearing platform 3 is used to tear the DAF film.

[0021] like Figure 1 As shown, a thickness sensor 7 is installed at the rear tensioning roller 4. There are two thickness sensors 7. One thickness sensor 7 is installed at the rear tensioning roller 4 close to the film tearing platform 3, that is, the first rear tensioning roller 4, and is used to detect the thickness of the entry end of the rear tensioning roller 4; the other thickness sensor 7 is installed at the rear tensioning roller 4 close to the winding roller 5, that is, the last rear tensioning roller 4, and is used to detect the thickness of the outflow end of the rear tensioning roller 4.

[0022] like Figure 4 As shown, the transmission device also includes a control unit and an alarm unit. Both the rear thickness sensor 7 and the alarm unit are electrically connected to the control unit. The thickness sensor 7 is a three-dimensional laser sensor, mounted on the side of the rear tensioning roller 4 facing away from the DAF film, with its detection surface facing the roller surface of the rear tensioning roller 4. During operation, the 3D laser sensor scans the roller surface of the rear tensioning roller 4. If adhesive is present on the rear tensioning roller 4, the control unit calculates that the thickness detected by the thickness sensor 7 exceeds a threshold and activates the alarm unit to sound and visually alarm, prompting the operator to promptly remove the adhesive.

[0023] Example 2

[0024] like Figure 2 、 Figure 3The DAF film transport device shown in the figure for wafer lamination equipment includes a feed roller 1, a front tensioning roller 2, a film tearing platform 3, a rear tensioning roller 4, and a take-up roller 5. A feed motor (not shown) is mounted on the feed roller 1, the output shaft of which is connected to the feed roller 1 and drives the feed roller 1 to rotate and feed the film. The film tearing platform 3 is mounted on the underside of the feed roller 1, with three front tensioning rollers 2 staggered between the feed roller 1 and the film tearing platform 3. The take-up roller 5 is mounted on the right side of the feed roller 1, with four rear tensioning rollers 4 staggered between the film tearing platform 3 and the take-up roller 5. A take-up motor (not shown) is mounted on the take-up roller 5, the output shaft of which is connected to the take-up roller 5 and drives the take-up roller 5 to rewind the film. A DAF film 6 is mounted on the feed roller 1, and the outer end of the DAF film 6 passes through the front tensioning roller 2, the film tearing platform 3, and the rear tensioning roller 4 in sequence before being wound around the take-up roller 5. The front tensioning roller 2 and the rear tensioning roller 4 are used to tension the DAF film, and the film tearing platform 3 is used to tear the DAF film.

[0025] like Figure 2 As shown, a thickness sensor 7 is installed at the rear tensioning roller 4. There are two thickness sensors 7. One thickness sensor 7 is installed at the rear tensioning roller 4 close to the film tearing platform 3, that is, the first rear tensioning roller 4, and is used to detect the thickness of the entry end of the rear tensioning roller 4; the other thickness sensor 7 is installed at the rear tensioning roller 4 close to the winding roller 5, that is, the last rear tensioning roller 4, and is used to detect the thickness of the outflow end of the rear tensioning roller 4.

[0026] like Figure 4 As shown, the transmission device also includes a control unit and an alarm unit, and the thickness sensor 7 and the alarm unit are electrically connected to the control unit. Figure 2 、 Figure 3 As shown, the thickness sensor 7 is a through-beam photoelectric sensor, which includes a transmitting end 71 and a receiving end 72. The transmitting end 71 and the receiving end 72 are respectively fixedly mounted on the two ends of the rear tensioning roller 4 through brackets. The detection light of the through-beam photoelectric sensor is just located at the circumference of the rear tensioning roller 4. If there is glue on the rear tensioning roller 4, the glue will block the detection light emitted by the transmitting end 71, and the receiving end 72 cannot receive the detection light. The control unit determines that there is glue on the surface of the rear tensioning roller 4, and drives the alarm unit to sound and light alarm, reminding the operator to clean up the glue in time.

[0027] The technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:

[0028] By installing a thickness sensor at the rear tensioning roller, the thickness of the rear tensioning roller is monitored in real time. Once glue adheres to the rear tensioning roller, an alarm is issued in time to avoid uneven thickness of the rear tensioning roller caused by glue on the rear tensioning roller, ensuring the uniformity of the force on the DAF film and the quality and safety of the product.

[0029] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, they indicate the presence of features, steps, operations, devices, components and / or combinations thereof.

[0030] In the description of the present invention, it needs to be understood that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "horizontal, vertical, vertical, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings. They are only for the convenience of describing the present invention and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the scope of protection of the present invention: the directional words "inside and outside" refer to the inside and outside relative to the outline of each component itself.

[0031] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that the present invention is susceptible to various modifications and variations. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A DAF film transmission device for wafer lamination equipment, comprising a feed roller, a film tearing platform and a winding roller, wherein a plurality of front tensioning rollers are arranged between the feed roller and the film tearing platform, and a plurality of rear tensioning rollers are arranged between the film tearing platform and the winding roller, a DAF film is mounted on the feed roller, and the outer end of the DAF film passes through the front tensioning roller, the film tearing platform, the rear tensioning roller and is connected to the winding roller in sequence, characterized in that: It also includes a control unit and an alarm unit. A thickness sensor is installed at the rear tensioning roller. The thickness sensor and the alarm unit are both electrically connected to the control unit.

2. The DAF film transmission device of the wafer film mounting equipment according to claim 1, characterized in that: The thickness sensor is a three-dimensional laser sensor, and the detection surface of the three-dimensional laser sensor faces the roller surface of the rear tension roller.

3. The DAF film transmission device of the wafer film mounting equipment according to claim 1, characterized in that: The thickness sensor is a through-beam photoelectric sensor, which includes a transmitting end and a receiving end. The transmitting end and the receiving end are respectively installed at two ends of the rear tensioning roller.

4. The DAF film transmission device of the wafer lamination equipment according to claim 1, characterized in that: There are at least three rear tension rollers and two thickness sensors, one of which is installed at the rear tension roller close to the film tearing platform, and the other is installed at the rear tension roller close to the winding roller.

Images