Chip transfer device, station layout device and sequencing system

Abstract

The utility model discloses a chip transfer device, a station layout device and a sequencing system. The chip transfer device comprises a multi-axis mechanical arm, a station layout device and a sequencing system, the chip grabbing mechanism is arranged on the multi-axis mechanical arm, and the multi-axis mechanical arm can drive the chip grabbing mechanism to move so as to realize multi-dimensional movement, so that the chip grabbing mechanism can grab a chip at any station and place the chip at another station; the chip grabbing mechanism comprises a first clamping jaw driving piece arranged on the multi-axis mechanical arm; the first clamping jaw is connected with the first clamping jaw driving part, the first clamping jaw comprises a first clamping jaw part and a second clamping jaw part which are oppositely arranged, and the first clamping jaw part and the second clamping jaw part are driven by the first clamping jaw driving part to get close to each other or get away from each other so as to grab or place a chip. According to the chip transfer device, multi-station multi-chip sequencing is achieved, the sequencing efficiency can be effectively improved, the chip grabbing mechanism can reliably grab or place the chips, additional design of the chips is not needed, the structure is simple, and the cost is low.

Description

Technical Field

[0001] The utility model relates to the technical field of biological analysis, in particular to a chip transfer device, a workstation layout device and a sequencing system. Background Art

[0002] The subject matter discussed in this section should not be considered to be prior art simply because it is mentioned in this section. Similarly, technical problems mentioned in this section or associated with the subject matter provided as background technology should not be considered to have been previously recognized in the prior art.

[0003] As an important component of human whole genome sequencing, the throughput sequencer plays a vital role. At present, in order to improve sequencing efficiency, some types of sequencers are equipped with multiple stations, which drive the sequencing chip to circulate between the stations through a driving mechanism to achieve multi-station multi-chip sequencing. In this design of sequencer, the driving mechanism adopts a single-rod support structure, and the sequencing chip is set on the bearing structure. The single-rod support structure cooperates with the bearing structure to achieve the purpose of lifting the sequencing chip at one station. After the sequencing chip is moved to another station, the single-rod support structure is separated from the bearing structure to achieve the placement of the sequencing chip at the other station. Since the supporting force provided by the single-rod support structure is unreliable, there is a risk of the bearing structure slipping, that is, there is a risk of the sequencing chip slipping, and a separate bearing structure needs to be set, resulting in a more complex structure and increased costs.

[0004] After the sequencing chip is placed inside the sequencer, sequence signal detection is performed on a single biochemical reaction system and a single imaging system. It is impossible to set up multiple workstations to switch between multiple sequencing chips, resulting in low sequencing efficiency and greatly restricting the development of the industry. Utility Model Content

[0005] In order to solve at least one of the above technical problems to at least a certain extent or to provide a practical commercial means, the embodiments of the present invention provide a chip transfer device, a workstation layout device and a sequencing system.

[0006] A chip transfer device according to an embodiment of the present invention is used in a sequencing system, and the chip transfer device includes:

[0007] Multi-axis robotic arm;

[0008] A chip grabbing mechanism provided on the multi-axis robotic arm, wherein the multi-axis robotic arm is capable of driving the chip grabbing mechanism to move to achieve multi-dimensional movement, so that the chip grabbing mechanism can grab a chip at any station and place the chip at another station;

[0009] Wherein, the chip grabbing mechanism includes:

[0010] a first gripper driving member provided on the multi-axis robotic arm;

[0011] The first clamp is connected to the first clamp driving member, and the first clamp includes a first clamp member and a second clamp member that are arranged opposite to each other. Under the drive of the first clamp driving member, the first clamp member and the second clamp member approach each other or move away from each other to grasp or place the chip.

[0012] In the chip transfer device provided in the embodiment of the present invention, the multi-axis robotic arm can drive the chip grabbing mechanism to move to achieve multi-dimensional movement. The chip grabbing mechanism can grab a chip at any station and place the chip at another station, thereby realizing multi-station multi-chip sequencing, which can effectively improve sequencing efficiency. The chip grabbing mechanism adopts a first clamping member and a second clamping member to cooperate. After the first clamping member and the second clamping member are close to each other, the force applied to both sides of the chip is applied to enable the chip to be grabbed. After the first clamping member and the second clamping member are separated from each other, the force applied to both sides of the chip is lost, thereby preventing the chip from being moved. The chip grabbing mechanism can reliably grab or place the chip without the need for additional chip design, with a simple structure and low cost.

[0013] In some embodiments, the first clamping jaw and the second clamping jaw are both provided with a first positioning pin, and when the first clamping jaw and the second clamping jaw are moved closer to or farther away from each other, the first positioning pin contacts or moves away from the positioning groove of the chip.

[0014] In some embodiments, the multi-axis robotic arm can also drive the chip grabbing mechanism to achieve rotational motion, and the chip grabbing mechanism further includes:

[0015] a mounting base connected to the multi-axis robotic arm, wherein the first gripper driving member is disposed on the mounting base;

[0016] A second jaw drive member disposed on the mounting base; and

[0017] The second clamp is connected to the second clamp driving member, and the second clamp includes a third clamp member and a fourth clamp member arranged opposite to each other. Under the drive of the second clamp driving member, the third clamp member and the fourth clamp member approach each other or move away from each other to grasp or place the chip.

[0018] In some embodiments, the third clamping member and the fourth clamping member are both provided with a second positioning pin, and when the third clamping member and the fourth clamping member move closer to or farther away from each other, the second positioning pin contacts or disengages from the positioning groove of the chip.

[0019] In some embodiments, the chip grabbing mechanism further comprises:

[0020] a first connecting block provided on the first jaw driving member;

[0021] A first pressing plate provided on the mounting seat; and

[0022] A first elastic member is provided between the first connecting block and the first pressing plate.

[0023] In some embodiments, the chip grabbing mechanism further includes a first guide rail disposed on the mounting seat and a first guide block disposed on the first guide rail, and the first connecting block is disposed between the first gripper driving member and the first guide block.

[0024] In some embodiments, the chip grabbing mechanism further comprises:

[0025] a second connecting block provided on the second jaw driving member;

[0026] A second pressing plate provided on the mounting seat; and

[0027] A second elastic member is provided between the second connecting block and the second pressing plate.

[0028] In some embodiments, the chip grabbing mechanism further includes a second guide rail disposed on the mounting seat and a second guide block disposed on the second guide rail, and the second connecting block is disposed between the second gripper driving member and the second guide block.

[0029] A workstation layout device in an embodiment of the present invention cooperates with the chip transfer device described in any of the above embodiments. The workstation layout device includes at least one first workstation, on which at least one biochemical position, at least one photographing position, at least one loading position and at least one cleaning position are provided. The workstation layout device also includes at least one second workstation or warehouse body, on which at least one recycling position is provided.

[0030] In some embodiments, a plurality of biochemical sites are provided, and the biochemical sites and the photographic sites are arranged in sequence along the first straight line from left to right or from right to left.

[0031] In some embodiments, the cleaning position and the loading position are arranged on the first straight line, the photographing position is arranged on one side of the biochemical position, and the cleaning position and the loading position are arranged on the other side of the biochemical position.

[0032] In some embodiments, at least one emergency position is further provided on the first workbench.

[0033] In some embodiments, the emergency position is arranged on the first straight line, and the emergency position is arranged at the edge of the first straight line away from the photographing position.

[0034] In certain embodiments, the recovery position is located near a door of the sequencing system.

[0035] A sequencing system according to an embodiment of the present invention includes the chip transfer device described in any one of the above embodiments, or includes the workstation layout device described in any one of the above embodiments.

[0036] Additional aspects and advantages of the embodiments of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through practice of the embodiments of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] The above and / or additional aspects and advantages of the embodiments of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0038] Figure 1 A schematic structural diagram of a chip transfer device and a workstation layout device provided in an embodiment of the present invention;

[0039] Figure 2 A schematic structural diagram of a multi-axis robotic arm provided in an embodiment of the present utility model;

[0040] Figure 3 A schematic structural diagram of a chip grabbing mechanism provided in an embodiment of the present utility model;

[0041] Figure 4 A schematic structural diagram of a chip grabbing mechanism from another perspective provided by an embodiment of the present invention;

[0042] Figure 5 A schematic structural diagram of a first clamping jaw provided in an embodiment of the present utility model;

[0043] Figure 6 A schematic structural diagram of the first clamping jaw from another perspective provided in an embodiment of the present utility model;

[0044] Figure 7 A schematic diagram of the structure of a chip provided in an embodiment of the present utility model;

[0045] Figure 8 A schematic structural diagram of the first workstation provided in an embodiment of the present utility model;

[0046] Figure 9 A schematic diagram of a workstation layout provided in an embodiment of the present utility model;

[0047] Figure 10 A schematic flow chart of a chip transfer method provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0048] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be understood as limiting the present invention.

[0049] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like, indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the said features. In the description of the present invention, "multiple" means two or more, unless otherwise clearly and specifically defined.

[0050] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections, or mutual communication; direct connections or indirect connections through an intermediate medium; and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0051] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0052] The disclosure below provides many different embodiments or examples for realizing different structures of the present invention. In order to simplify the disclosure of the present invention, the components and settings of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. In addition, the present invention may repeat reference numbers and / or reference letters in different examples. Such repetition is for the purpose of simplicity and clarity and does not in itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present invention provides examples of various specific processes and materials, but a person of ordinary skill in the art will recognize the application of other processes and / or the use of other materials.

[0053] Please refer to Figures 1 to 4 The present invention provides a chip transfer device 1000 for use in a sequencing system. The chip transfer device 1000 includes a multi-axis robotic arm 200 and a chip grabbing mechanism 300. The chip grabbing mechanism 300 is mounted on the multi-axis robotic arm 200. The multi-axis robotic arm 200 drives the chip grabbing mechanism 300 to move in multiple dimensions, enabling the chip grabbing mechanism 300 to grab a chip 2000 at any workstation 10 and place the chip 2000 at another workstation 10.

[0054] Among them, the chip grasping mechanism 300 includes a first clamping jaw driving member 310 and a first clamping jaw. The first clamping jaw driving member 310 is arranged on the multi-axis robot arm 200. The first clamping jaw is connected to the first clamping jaw driving member 310. The first clamping jaw includes a first clamping jaw member 321 and a second clamping jaw member 322 arranged in opposition. Under the drive of the first clamping jaw driving member 310, the first clamping jaw member 321 and the second clamping jaw member 322 approach each other or move away from each other to achieve grasping or placing the chip 2000.

[0055] The sequencing system can be a sequencer, which includes a control device, a fluidic mechanism, and an optical mechanism. Under the control of the control device, the fluidic mechanism can pass DNA or RNA samples and biochemical reagents into chip 2000. The optical mechanism can take a photograph and image the chip 2000. The control device performs sequencing based on the obtained photograph to obtain sequencing results. Alternatively, the sequencing system can be an integrated system combining a sequencer and a server. The sequencer includes a control device, a communication device, a fluidic mechanism, and an optical mechanism. Under the control of the control device, the fluidic mechanism can pass DNA or RNA samples and biochemical reagents into chip 2000. The optical mechanism can take a photograph and image the chip 2000. The control device performs sequencing based on the obtained photograph to obtain sequencing results. The control device then controls the communication device to transmit the sequencing data to the server, which stores and / or processes the sequencing data.

[0056] The chip transfer device 1000 further includes a frame 100 , on which the multi-axis robot arm 200 is disposed. The frame 100 provides support for the multi-axis robot arm 200 .

[0057] The multi-axis robotic arm 200 includes a lifting shaft 210, a first rotating shaft 220 and a second rotating shaft 230. The lifting shaft 210 can be arranged vertically. One end of the first rotating shaft 220 is connected to the lifting shaft 210, and the other end of the first rotating shaft 220 is connected to one end of the second rotating shaft 230. The other end of the second rotating shaft 230 is connected to the chip grasping mechanism 300.

[0058] The lifting shaft 210 can drive the first rotating shaft 220 to move up and down. Since the second rotating shaft 230 is connected to the first rotating shaft 220, the first rotating shaft 220 drives the second rotating shaft 230 to move up and down. Since the chip grabbing mechanism 300 is connected to the second rotating shaft 230, the second rotating shaft 230 drives the chip grabbing mechanism 300 to move up and down. The first rotating shaft 220 can rotate around the portion connected to the lifting shaft 210. Since the second rotating shaft 230 is connected to the first rotating shaft 220, the first rotating shaft 220 drives the second rotating shaft 230 to move. Since the chip grabbing mechanism 300 is connected to the second rotating shaft 230, the second rotating shaft 230 drives the chip grabbing mechanism 300 to move. The second rotating shaft 230 can rotate around the portion connected to the first rotating shaft 220. Since the chip grabbing mechanism 300 is connected to the second rotating shaft 230, the second rotating shaft 230 drives the chip grabbing mechanism 300 to move.

[0059] For the multi-axis robotic arm 200, each movement is independently controlled, and the lifting axis 210 can drive the first rotating axis 220 to move up and down, rotate the first rotating axis 220, or rotate the second rotating axis 230. For example, ①, only the lifting axis 210 drives the first rotating axis 220 to move up and down; ②, only the first rotating axis 220 rotates; ③, only the second rotating axis 230 rotates; ④, the lifting axis 210 drives the first rotating axis 220 to move up and down and rotate the first rotating axis 220; ⑤, the lifting axis 210 drives the first rotating axis 220 to move up and down and rotate the second rotating axis 230; ⑥, the first rotating axis 220 rotates and the second rotating axis 230 rotates; ⑦, the lifting axis 210 drives the first rotating axis 220 to move up and down, rotate the first rotating axis 220, and rotate the second rotating axis 230. By performing the above-mentioned actions, the multi-axis robot arm 200 can drive the chip grabbing mechanism 300 to move to the location of each workstation 10 , so that the chip grabbing mechanism 300 can grab the chip 2000 at any workstation 10 and place the chip 2000 at another workstation 10 .

[0060] Driven by the multi-axis robotic arm 200, the chip grabbing mechanism 300 can be moved to the locations of various workstations 10. Thus, the chip grabbing mechanism 300 can grab a chip 2000 at any workstation 10 and place it at another workstation 10. For example, the workstations 10 include a loading station 13, a biochemical station 12, a photographing station 11, a cleaning station 15, and a recycling station 14. Multiple chips 2000 can be placed at the loading station 13, such as three chips 2000, and a cleaning chip 2000 can be placed at the cleaning station 15. The cleaning chip 2000 can be the same as the chip 2000. Because the cleaning chip 2000 only performs cleaning and does not perform biochemical reactions or sequencing and photographing, it is referred to as a cleaning chip 2000. The chip grabbing mechanism 300 grabs the first chip 2000 at the loading station 13 and places it at the biochemical station 12, where the biochemical reaction on the first chip 2000 is performed. After the biochemical reaction is complete, the chip grabbing mechanism 300 grabs the first chip 2000 at the biochemical station 12 and places it in the imaging station 11, where the first chip 2000 undergoes sequencing and imaging. The chip grabbing mechanism 300 then grabs a cleaned chip 2000 at the cleaning station 15 and places it in the biochemical station 12 to clean components of the biochemical station 12, such as the liquid inlet and outlet. After cleaning is complete, the chip grabbing mechanism 300 grabs a cleaned chip 2000 at the biochemical station 12 and places it in the cleaning station 15. The chip grabbing mechanism 300 then grabs a second chip 2000 at the loading station 13 and places it in the biochemical station 12, where the second chip 2000 undergoes a biochemical reaction. Alternatively, the biochemical station 12 is not cleaned. The chip gripping mechanism 300 grabs a second chip 2000 at the loading station 13 and places it in the biochemical station 12, where the second chip 2000 undergoes a biochemical reaction. After the first chip 2000 at the imaging station 11 completes sequencing and imaging, the chip gripping mechanism 300 grabs the first chip 2000 at the imaging station 11 and places it in the recycling station 14. After the second chip 2000 at the biochemical station 12 completes biochemical reaction, the chip gripping mechanism 300 grabs a second chip 2000 at the biochemical station 12 and places it in the imaging station 11, where the second chip 2000 undergoes sequencing and imaging. The chip gripping mechanism 300 then grabs a cleaned chip 2000 at the cleaning station 15 and places it in the biochemical station 12. After cleaning is complete, the chip grabbing mechanism 300 grabs the cleaned chip 2000 at the biochemical station 12 and places it in the cleaning station 15. The chip grabbing mechanism 300 then grabs a third chip 2000 at the loading station 13 and places it in the biochemical station 12, where the biochemical reaction on the third chip 2000 is performed. Alternatively, the biochemical station 12 may not be cleaned, and the chip grabbing mechanism 300 grabs a third chip 2000 at the loading station 13 and places it in the biochemical station 12, where the biochemical reaction on the third chip 2000 is performed.After the second chip 2000 at the imaging station 11 completes sequencing and imaging, the chip grabbing mechanism 300 grabs the second chip 2000 at the imaging station 11 and places it in the recycling station 14. After the third chip 2000 at the biochemical station 12 completes biochemical reaction, the chip grabbing mechanism 300 grabs the third chip 2000 at the biochemical station 12 and places it in the imaging station 11. After the third chip 2000 at the imaging station 11 completes sequencing and imaging, the chip grabbing mechanism 300 grabs the third chip 2000 at the imaging station 11 and places it in the recycling station 14. During the sequencing process of multiple chips 2000, the chips 2000 are transferred between different workstations 10 through the chip grabbing mechanism 300, so that the orderly transfer of each chip 2000 can be achieved. Since multiple workstations 10 are provided, multiple chips 2000 and multiple workstations 10 can work simultaneously, such as one chip 2000 performs biochemical reaction while another chip 2000 performs sequencing and photography at the same time, thereby effectively improving the sequencing efficiency.

[0061] After chip 2000 completes a biochemical reaction at biochemical station 12 and is transferred to imaging station 11 for sequencing and imaging, it may not yet be fully sequenced. For example, after only 1-10 cycles of sequencing, 11-20 cycles of sequencing are still required. The chip grabbing mechanism 300 grabs and cleans chip 2000 from cleaning station 15 and transfers it to biochemical station 12 for cleaning. The chip 2000 is then transferred from imaging station 11 to biochemical station 12. Alternatively, the chip 2000 may be transferred from imaging station 11 to biochemical station 12 without cleaning biochemical station 12, then undergoes a biochemical reaction. After the biochemical reaction is complete, the chip 2000 is transferred to imaging station 11 for sequencing and imaging. After the chip 2000 is fully sequenced, the chip grabbing mechanism 300 transfers the chip 2000 from imaging station 11 to recycling station 14. After the chip 2000 is transferred from the biochemical position 12 to the photographing position 11 for the last time, the chip grabbing mechanism 300 grabs the cleaned chip 2000 from the cleaning position 15 and transfers it to the biochemical position 12 for cleaning, and grabs the next chip 2000 from the loading position 13 and transfers it to the biochemical position.

[0062] Furthermore, multiple biochemical stations 12 can be provided, allowing multiple chips 2000 to undergo biochemical reactions at each station 12. Specifically, for a chip 2000 requiring a biochemical reaction, if a biochemical station 12 is idle (no chip 2000 is currently undergoing a biochemical reaction at that station 12), the chip grabbing mechanism 300 transfers the chip 2000 requiring a biochemical reaction to the idle biochemical station 12 for the biochemical reaction if that station 12 has not previously undergone a biochemical reaction. If that station 12 has previously undergone a biochemical reaction, the chip grabbing mechanism 300 transfers a cleaned chip 2000 from the cleaning station 15 to that station 12. After cleaning, the chip 2000 requiring a biochemical reaction is then transferred to that station 12 for the biochemical reaction. Alternatively, the biochemical station 12 is not cleaned and the chip 2000 requiring a biochemical reaction is transferred to that station 12 for the biochemical reaction. Multiple imaging stations 11 can be provided to allow multiple chips 2000 to be sequenced and photographed at each imaging station 11. Specifically, for a chip 2000 requiring sequencing and photographing, if a imaging station 11 is idle (no chip 2000 is currently being sequenced and photographed at that imaging station 11), the chip grabbing mechanism 300 transfers the chip 2000 requiring sequencing and photographing to an idle imaging station 11 for sequencing and photographing. Multiple cleaning chips 2000 can be placed at the cleaning station 15, or multiple cleaning stations 15 can be provided, each with a cleaning chip 2000, so that the chip grabbing mechanism 300 can transfer each cleaning chip 2000 to a biochemical station 12 requiring cleaning. Specifically, if a cleaning chip 2000 is present at a cleaning station 15 for a biochemical station 12 requiring cleaning, the chip grabbing mechanism 300 transfers the cleaning chip 2000 to the biochemical station 12 requiring cleaning for cleaning. Through the above implementation scheme, more biochemical sites 12, and / or more photographing sites 11, and / or more cleaning chips 2000 are provided, so that more sequencing processes can be performed simultaneously, such as multiple biochemical reaction processes, and / or multiple sequencing photographing processes, and / or multiple cleaning processes, thereby further improving the sequencing efficiency.

[0063] In this embodiment, an initial position can be set, such as setting the position above the loading position 13 as the initial position. After the chip grabbing mechanism 300 completes the operation of grabbing and placing the chip 2000 once, the chip grabbing mechanism 300 returns to the initial position, and waits for the next operation of grabbing and placing the chip 2000. The chip grabbing mechanism 300 starts from the initial position and performs the operation of grabbing and placing the chip 2000. Alternatively, after each operation of grabbing and placing the chip 2000, the multi-axis robot arm 200 drives the chip grabbing mechanism 300 to move, such as upward, and the chip grabbing mechanism 300 stops at this position. Waiting for the next operation of grabbing and placing the chip 2000, the chip grabbing mechanism 300 starts from this position and performs the operation of grabbing and placing the chip 2000.

[0064] The first gripper driver 310 is mounted on the multi-axis robotic arm 200. Specifically, the first gripper driver 310 is mounted at the other end of the second rotating shaft 230 (the end away from the connection between the second rotating shaft 230 and the first rotating shaft 220). The multi-axis robotic arm 200 drives the first gripper driver 310 to perform multi-dimensional movement. Because the first gripper is connected to the first gripper driver 310, the first gripper driver 310 drives the first gripper to perform multi-dimensional movement.

[0065] The first gripper 321 has an inwardly curved first claw tip 3211, and the second gripper 322 has an inwardly curved second claw tip 3221. Driven by the first gripper driver 310, the first gripper 321 and the second gripper 322 approach each other, and the chip 2000 can be grasped by the first claw tip 3211 and the second claw tip 3221.

[0066] Driven by the multi-axis robotic arm 200, the chip grasping mechanism 300 moves to a position above the chip 2000 to be grasped, and the first clamping jaw driving component 310 drives the first clamping jaw component 321 and the second clamping jaw component 322 to move away from each other. Then the multi-axis robotic arm 200 drives the chip grasping mechanism 300 to move such as moving downward, and the first clamping jaw driving component 310 drives the first clamping jaw component 321 and the second clamping jaw component 322 to approach each other, and grasps the chip 2000 through the first claw tip 3211 and the second claw tip 3221. Then the multi-axis robotic arm 200 drives the chip grasping mechanism 300 to move such as moving upward, and the multi-axis robotic arm 200 drives the chip grasping mechanism 300 to a position above the chip 2000 to be placed. Then the multi-axis robotic arm 200 drives the chip grasping mechanism 300 to move such as moving downward, and the first clamping jaw driving component 310 drives the first clamping jaw component 321 and the second clamping jaw component 322 to move away from each other to place the chip 2000.

[0067] The working process of the chip grabbing mechanism 300 is described in conjunction with the workstation 10 .

[0068] For example, if a chip 2000 from loading station 13 needs to be transferred to biochemical station 12, the multi-axis robotic arm 200 drives the chip grasping mechanism 300 to a position above loading station 13. The first gripper driver 310 drives the first gripper 321 and the second gripper 322 away from each other. The multi-axis robotic arm 200 then drives the chip grasping mechanism 300 downward, and the first gripper driver 310 drives the first gripper 321 and the second gripper 322 toward each other, grasping the chip 2000 with the first and second gripper tips 3211 and 3221. The multi-axis robotic arm 200 then drives the chip grasping mechanism 300 upward, again moving it to a position above biochemical station 12. Then the multi-axis robot arm 200 drives the chip grabbing mechanism 300 to move downward, and the first gripper driving member 310 drives the first gripper member 321 and the second gripper member 322 away from each other to place the chip 2000 on the biochemical site 12 .

[0069] For example, if chip 2000 from biochemical station 12 needs to be transferred to imaging station 11, the multi-axis robotic arm 200 drives the chip grabbing mechanism 300 to a position above biochemical station 12. The first gripper driver 310 drives the first gripper 321 and the second gripper 322 away from each other. The multi-axis robotic arm 200 then drives the chip grabbing mechanism 300 downward, and the first gripper driver 310 drives the first gripper 321 and the second gripper 322 toward each other, grabbing chip 2000 with the first and second gripper tips 3211 and 3221. The multi-axis robotic arm 200 then drives the chip grabbing mechanism 300 upward, again moving it to a position above imaging station 11. Then the multi-axis robot arm 200 drives the chip grabbing mechanism 300 to move downward, and the first gripper driving member 310 drives the first gripper member 321 and the second gripper member 322 to move away from each other, so as to place the chip 2000 on the photographing position 11 .

[0070] For example, if chip 2000 from imaging station 11 needs to be transferred to recycling station 14, the multi-axis robotic arm 200 drives the chip grabbing mechanism 300 to a position above imaging station 11. The first gripper driver 310 drives the first gripper 321 and the second gripper 322 away from each other. The multi-axis robotic arm 200 then drives the chip grabbing mechanism 300 downward, and the first gripper driver 310 drives the first gripper 321 and the second gripper 322 toward each other, grabbing the chip 2000 with the first claw tip 3211 and the second claw tip 3221. The multi-axis robotic arm 200 then drives the chip grabbing mechanism 300 upward, again moving the chip grabbing mechanism 300 to a position above recycling station 14. Then the multi-axis robot arm 200 drives the chip grabbing mechanism 300 to move downward, and the first gripper driving member 310 drives the first gripper member 321 and the second gripper member 322 away from each other to place the chip 2000 on the recovery position 14 .

[0071] For example, if a cleaning chip 2000 from cleaning station 15 needs to be transferred to biochemical station 12, the multi-axis robotic arm 200 drives the chip grabbing mechanism 300 to a position above the cleaning station 15. The first gripper driver 310 drives the first gripper 321 and the second gripper 322 away from each other. The multi-axis robotic arm 200 then drives the chip grabbing mechanism 300 downward, and the first gripper driver 310 drives the first gripper 321 and the second gripper 322 toward each other, gripping the cleaning chip 2000 with the first and second gripper tips 3211 and 3221. The multi-axis robotic arm 200 then drives the chip grabbing mechanism 300 upward, again moving it to a position above the biochemical station 12. Then the multi-axis robot arm 200 drives the chip grabbing mechanism 300 to move downward, and the first gripper driving member 310 drives the first gripper member 321 and the second gripper member 322 away from each other to place the cleaning chip 2000 on the biochemical position 12 .

[0072] In some specific embodiments of the present invention, please refer to Figure 5 and Figure 6 The first clamping jaw 321 and the second clamping jaw 322 are both provided with a first positioning pin 323. When the first clamping jaw 321 and the second clamping jaw 322 approach or move away from each other, the first positioning pin 323 contacts or moves away from the positioning groove of the chip 2000.

[0073] In the first clamping jaw 321, a first locating pin 323 is provided on the first claw tip 3211, and in the second clamping jaw 322, a first locating pin 323 is provided on the second claw tip 3221. When the first clamping jaw driver 310 drives the first and second clamping jaws 321 and 322 toward each other, the first locating pin 323 contacts the positioning groove 2100 of the chip 2000, and the first and second claw tips 3211 and 3221 hold the chip 2000, thereby grasping the chip 2000. When the first clamping jaw driver 310 drives the first and second clamping jaws 321 and 322 away from each other, the first locating pin 323 disengages from the positioning groove 2100 of the chip 2000, thereby placing the chip 2000. The provision of the first locating pin 323 ensures the required precision in grasping the chip 2000 and prevents the chip 2000 from falling due to power outages.

[0074] In some specific embodiments of the present invention, please refer to Figure 7 The chip 2000 is provided with multiple positioning grooves 2100, each having a first shape and a second shape, wherein the first shape and the second shape are different. For example, the chip 2000 is provided with positioning grooves 2100 at each of its four ends. The positioning grooves 2100 located at the ends of one long side of the chip 2000 are rectangular and triangular, respectively, while the positioning grooves 2100 located at the ends of the other long side of the chip 2000 are rectangular and triangular, respectively. The two rectangular grooves are opposite each other, and the two triangular grooves are opposite each other. By providing multiple positioning grooves 2100 with different shapes, the accuracy of chip 2000 capture can be further improved.

[0075] In some specific embodiments of the present invention, please refer to Figure 7 , the two ends of the chip 2000 are provided with positioning holes 2200 and foolproof holes 2300. Please refer to Figure 8 The workstation 10 is provided with a workstation platform, on which are provided a positioning shaft 430 that cooperates with the positioning hole 2200 and a foolproof shaft 440 that cooperates with the foolproof hole 2300. When the chip 2000 is placed on the workstation 10, the positioning shaft 430 is inserted into the positioning hole 2200 to position the chip 2000, and the foolproof shaft 440 is inserted into the foolproof hole 2300 to prevent the chip 2000 from being fooled.

[0076] Alternatively, chip 2000 is provided with positioning shafts and anti-fouling shafts at both ends. Workstation 10 is provided with a workbench, which is provided with positioning holes that cooperate with the positioning shafts and anti-fouling holes that cooperate with the anti-fouling shafts. When chip 2000 is placed on workstation 10, the positioning shafts are inserted into the positioning holes to position chip 2000, and the anti-fouling shafts are inserted into the anti-fouling holes to prevent chip 2000 from being misplaced.

[0077] In some specific embodiments of the present invention, please refer to Figure 1 、 Figure 3 and Figure 4 The multi-axis robotic arm 200 can also drive the chip grasping mechanism 300 to achieve rotational movement. The chip grasping mechanism 300 also includes a mounting base 330, a second clamping jaw driving member 340 and a second clamping jaw. The mounting base 330 is connected to the multi-axis robotic arm 200, the first clamping jaw driving member 310 is set on the mounting base 330, the second clamping jaw driving member 340 is set on the mounting base 330, the second clamping jaw is connected to the second clamping jaw driving member 340, and the second clamping jaw includes a third clamping jaw member 351 and a fourth clamping jaw member 352 set in opposition. Under the drive of the second clamping jaw driving member 340, the third clamping jaw member 351 and the fourth clamping jaw member 352 approach each other or move away from each other to grasp or place the chip 2000.

[0078] Specifically, the first clamping jaw driving member 310 is disposed on one side of the mounting base 330 , and the second clamping jaw driving member 340 is disposed on the other side of the mounting base 330 .

[0079] The mounting base 330 is connected to the multi-axis robotic arm 200. Specifically, the mounting base 330 is connected to the other end of the second rotating shaft 230 (the end away from the connection between the second rotating shaft 230 and the first rotating shaft 220). The multi-axis robotic arm 200 drives the mounting base 330 to perform multi-dimensional movement. Since the first gripper driver 310 and the second gripper driver 340 are arranged on the mounting base 330, the mounting base 330 drives the first gripper driver 310 and the second gripper driver 340 to perform multi-dimensional movement. Since the first gripper is arranged on the first gripper driver 310, the first gripper driver 310 drives the first gripper to perform multi-dimensional movement. Since the second gripper is arranged on the second gripper driver 340, the second gripper driver 340 drives the second gripper to perform multi-dimensional movement.

[0080] The third gripper 351 has a third claw tip that curves inwards, and the fourth gripper 352 has a fourth claw tip that curves inwards. Driven by the second gripper driver 340, the third gripper 351 and the fourth gripper 352 approach each other, and the chip 2000 can be grasped by the first claw tip 3211 and the second claw tip 3221.

[0081] Driven by the multi-axis robotic arm 200, the second gripper driving member 340 moves to a position above the chip 2000 to be grasped, and the second gripper driving member 340 drives the third gripper member 351 and the fourth gripper member 352 to move away from each other, and then the multi-axis robotic arm 200 drives the second gripper driving member 340 to move such as moving downward, and the second gripper driving member 340 drives the third gripper member 351 and the fourth gripper member 352 to approach each other, and grasps the chip 2000 through the third claw tip and the fourth claw tip, and then the multi-axis robotic arm 200 drives the second gripper driving member 340 to move such as moving upward, and the multi-axis robotic arm 200 drives the second gripper driving member 340 to a position above the chip 2000 to be placed, and then the multi-axis robotic arm 200 drives the second gripper driving member 340 to move such as moving downward, and the second gripper driving member 340 drives the third gripper member 351 and the fourth gripper member 352 to move away from each other to place the chip 2000.

[0082] The working process of the second clamping jaw driving member 340 and the second clamping jaw will be described in conjunction with the workstation 10.

[0083] For example, if a chip 2000 from loading station 13 needs to be transferred to biochemical station 12, the multi-axis robotic arm 200 drives the second gripper driver 340 to a position above loading station 13. The second gripper driver 340 then drives the third gripper 351 and fourth gripper 352 away from each other. The multi-axis robotic arm 200 then drives the second gripper driver 340 downward, driving the third gripper 351 and fourth gripper 352 toward each other, and the third and fourth gripper tips grasp the chip 2000. The multi-axis robotic arm 200 then drives the second gripper driver 340 upward, again moving the second gripper driver 340 above biochemical station 12. Then the multi-axis robot arm 200 drives the second gripper driver 340 to move downward, and the second gripper driver 340 drives the third gripper 351 and the fourth gripper 352 away from each other, so as to place the chip 2000 on the biochemical site 12 .

[0084] For example, if chip 2000 from biochemical station 12 needs to be transferred to imaging station 11, the multi-axis robotic arm 200 drives the second gripper driver 340 to a position above biochemical station 12. The second gripper driver 340 then drives the third and fourth gripper members 351 and 352 away from each other. The multi-axis robotic arm 200 then drives the second gripper driver 340 downward, forcing the third and fourth gripper members 351 and 352 toward each other, and the third and fourth gripper tips grasp the chip 2000. The multi-axis robotic arm 2000 then drives the second gripper driver 340 upward, forcing it to a position above imaging station 11. Then the multi-axis robot arm 200 drives the second gripper driver 340 to move downward, and the second gripper driver 340 drives the third gripper 351 and the fourth gripper 352 to move away from each other, so as to place the chip 2000 on the photographing position 11 .

[0085] For example, if a chip 2000 from the imaging station 11 needs to be transferred to the recovery station 14, the multi-axis robotic arm 200 drives the second gripper driver 340 to a position above the imaging station 11. The second gripper driver 340 then drives the third gripper 351 and the fourth gripper 352 away from each other. The multi-axis robotic arm 200 then drives the second gripper driver 340 downward, driving the third gripper 351 and the fourth gripper 352 toward each other, and the third and fourth gripper tips grasp the chip 2000. The multi-axis robotic arm 200 then drives the second gripper driver 340 upward, moving it back to a position above the recovery station 14. Then the multi-axis robot arm 200 drives the second gripper driver 340 to move downward, and the second gripper driver 340 drives the third gripper 351 and the fourth gripper 352 to move away from each other, so as to place the chip 2000 on the recovery position 14 .

[0086] For example, if a cleaning chip 2000 from cleaning station 15 needs to be transferred to biochemical station 12, the multi-axis robotic arm 200 drives the second gripper driver 340 to a position above the cleaning station 15. The second gripper driver 340 then drives the third gripper 351 and the fourth gripper 352 away from each other. The multi-axis robotic arm 200 then drives the second gripper driver 340 downward, driving the third gripper 351 and the fourth gripper 352 toward each other, and the third and fourth gripper tips grasp the cleaning chip 2000. The multi-axis robotic arm 200 then drives the second gripper driver 340 upward, moving it again to a position above the biochemical station 12. Then the multi-axis robot arm 200 drives the second gripper driver 340 to move downward, and the second gripper driver 340 drives the third gripper 351 and the fourth gripper 352 away from each other, so as to place the cleaning chip 2000 on the biochemical position 12 .

[0087] In this embodiment, the chip grasping mechanism 300 is provided with two sets of clamping mechanisms, which expands the usage scenarios compared with a single set of clamping mechanisms. For example, one set of clamping mechanisms can grasp the chip 2000, and the other set of clamping mechanisms can place the chip 2000, or the two sets of clamping mechanisms can first grasp the chip 2000, and then place the chip 2000 in sequence, and so on. This can shorten the moving path of the chip grasping mechanism 300, reduce the time for grasping the chip 2000 and placing the chip 2000, and greatly improve efficiency.

[0088] Please refer to Figure 2A rotating member 240 is provided at the other end of the second rotating shaft 230 (the end away from the connection between the second rotating shaft 230 and the first rotating shaft 220 ), a connecting member 250 is provided on the rotating member 240 , and a mounting seat 330 is provided on the connecting member 250 . The rotating member 240 rotates, and since the connecting member 250 is set on the rotating member 240, the rotating member 240 drives the connecting member 250 to rotate. Since the mounting seat 330 is set on the connecting member 250, the connecting member 250 drives the mounting seat 330 to rotate. Since the first jaw driving member 310 and the second jaw driving member 340 are set on the mounting seat 330, the mounting seat 330 drives the first jaw driving member 310 and the second jaw driving member 340 to rotate around it. Since the first jaw is set on the first jaw driving member 310, the first jaw driving member 310 drives the first jaw to rotate around the mounting seat 330. Since the second jaw is set on the second jaw driving member 340, the second jaw driving member 340 drives the second jaw to rotate around the mounting seat 330. When the rotating member 240 rotates, the rotating member 240 drives the mounting base 330 to rotate, and the mounting base 330 drives the two sets of clamping mechanisms to rotate with it as the center, making the two sets of clamping mechanisms more flexible, further shortening the moving path, reducing the time for grabbing the chip 2000 and placing the chip 2000, and greatly improving efficiency.

[0089] In some specific embodiments of the present invention, the third clamping member 351 and the fourth clamping member 352 are both provided with a second positioning pin. When the third clamping member 351 and the fourth clamping member 352 approach or move away from each other, the second positioning pin contacts or disengages from the positioning groove of the chip 2000.

[0090] In the third clamping jaw 351, a second locating pin is provided on the third claw tip, and in the fourth clamping jaw 352, a second locating pin is provided on the fourth claw tip. When the second clamping jaw driving member 340 drives the third clamping jaw 351 and the fourth clamping jaw 352 toward each other, the second locating pin contacts the positioning groove 2100 of the chip 2000, and the third and fourth claw tips drag the chip 2000, thereby achieving the capture of the chip 2000. When the second clamping jaw driving member 340 drives the third clamping jaw 351 and the fourth clamping jaw 352 away from each other, the second locating pin disengages from the positioning groove 2100 of the chip 2000, thereby achieving the placement of the chip 2000. By providing the second locating pin, the precision requirements for capturing the chip 2000 are met, and the chip 2000 can be prevented from falling due to power outages.

[0091] In some specific embodiments of the present invention, please refer to Figure 1 、 Figure 3 and Figure 4The chip grabbing mechanism 300 also includes a first connecting block 361, a first pressing plate 362 and a first elastic member 363. The first connecting block 361 is arranged on the first clamping driving member 310, the first pressing plate 362 is arranged on the mounting seat 330, and the first elastic member 363 is arranged between the first connecting block 361 and the first pressing plate 362.

[0092] The first elastic member 363 may include but is not limited to a spring, a spring, a rubber ring, and a rubber sheet.

[0093] The multi-axis robotic arm 200 drives the mounting base 330 to move downward. The mounting base 330 simultaneously drives the first gripper driver 310, the first connecting block 361, the first pressing plate 362, and the first elastic member 363 to move downward. The first gripper driver 310, the first connecting block 361, the first pressing plate 362, and the first elastic member 363 remain stationary relative to each other during this movement. The first gripper driver 310 then drives the first gripper into contact with the chip 2000. The first elastic member 363 provides a spring margin, allowing the first gripper driver 310 and the first gripper to float and press against the chip 2000, thereby preventing damage to the chip 2000.

[0094] In one embodiment, after the chip grasping mechanism 300 places the chip 2000 on the workstation 10, the chip 2000 is adsorbed onto the workstation 10 using vacuum adsorption. For example, the workstation 10 is provided with an adsorption table connected to a vacuum pump. After the chip 2000 is placed on the adsorption table, the vacuum pump removes the air from the adsorption table to allow the chip 2000 to be adsorbed on the adsorption table. By providing a first connecting block 361, a first pressing plate 362, and a first elastic member 363 disposed between the first connecting block 361 and the first pressing plate 362, the first clamping jaw driving member 310 and the first clamping jaw achieve floating pressure on the chip 2000, thereby preventing damage to the chip 2000 while further facilitating the first clamping jaw's smooth grasping of the chip 2000.

[0095] In some specific embodiments of the present invention, please refer to Figure 1 、 Figure 3 and Figure 4 The chip grabbing mechanism 300 further includes a first guide rail 371 disposed on the mounting seat 330 and a first guide block 372 disposed on the first guide rail 371 , and the first connecting block 361 is disposed between the first clamping jaw driving member 310 and the first guide block 372 .

[0096] The orientation of the first guide rail 371 is the same as the floating direction of the first elastic member 363. After the first gripper driver 310 drives the first gripper to contact the chip 2000, the first elastic member 363 provides a spring force, allowing the first gripper driver 310 to move away from the chip 2000. The first gripper driver 310, via the first connecting block 361, drives the first guide block 372 to move along the first guide rail 371. The first guide block 372 and the first guide rail 371 cooperate to guide the first gripper driver 310, thereby ensuring the movement accuracy of the first gripper driver 310. Furthermore, the provision of the first guide block 372 and the first guide rail 371 ensures that the first gripper driver 310, the first gripper, and the first connecting block 361 can float, such as up and down. Furthermore, the first guide rail 371, disposed on the mounting base 330, provides good support for the first gripper driver 310, the first gripper, and the first connecting block 361 through the first guide block 372.

[0097] In some specific embodiments of the present invention, please refer to Figure 1 、 Figure 3 and Figure 4 The chip grabbing mechanism 300 also includes a second connecting block 381, a second pressing plate 382 and a second elastic member 383. The second connecting block 381 is arranged on the second clamping driving member 340, the second pressing plate 382 is arranged on the mounting seat 330, and the second elastic member 383 is arranged between the second connecting block 381 and the second pressing plate 382.

[0098] The second elastic member 383 may include but is not limited to a spring, a spring, a rubber ring, and a rubber sheet.

[0099] The multi-axis robotic arm 200 drives the mounting base 330 to move downward, which in turn drives the second gripper driver 340, the second connecting block 381, the second pressing plate 382, ​​and the second elastic member 383 to move downward. The second gripper driver 340, the second connecting block 381, the second pressing plate 382, ​​and the second elastic member 383 remain stationary relative to each other during this movement. The second gripper driver 340 then drives the second gripper into contact with the chip 2000. The second elastic member 383573 provides a spring margin, allowing the second gripper driver 340 and the second gripper to float and press against the chip 2000, thereby preventing damage to the chip 2000.

[0100] In one embodiment, after the chip grasping mechanism 300 places the chip 2000 on the workstation 10, the chip 2000 is adsorbed onto the workstation 10 using vacuum adsorption. For example, an adsorption table is provided on the workstation 10, and the adsorption table is connected to a vacuum pump. After the chip 2000 is placed on the adsorption table, the vacuum pump removes the air from the adsorption table to allow the chip 2000 to be adsorbed on the adsorption table. By providing a second connecting block 381, a second pressing plate 382, ​​and a second elastic member 383 disposed between the second connecting block 381 and the second pressing plate 382, ​​the second clamping jaw driving member 340 and the second clamping jaw can achieve floating pressure on the chip 2000, which ensures that the chip 2000 is not damaged while further facilitating the second clamping jaw to smoothly grasp the chip 2000.

[0101] In some specific embodiments of the present invention, please refer to Figure 1 、 Figure 3 and Figure 4 The chip grabbing mechanism 300 further includes a second guide rail 391 disposed on the other side of the mounting seat 330 and a second guide block 392 disposed on the second guide rail 391 , and the second connecting block 381 is disposed between the second clamping jaw driving member 340 and the second guide block 392 .

[0102] The second guide rail 391 is positioned in the same direction as the floating direction of the second elastic member 383. After the second gripper driver 340 drives the second gripper to contact the chip 2000, the second elastic member 383 provides a spring force, allowing the second gripper driver 340 to move away from the chip 2000. The second gripper driver 340, via the second connecting block 381, drives the second guide block 392 to move along the second guide rail 391. The second guide block 392 cooperates with the second guide rail 391 to guide the second gripper driver 340, thereby ensuring the movement accuracy of the second gripper driver 340. Furthermore, the second guide block 392 and the second guide rail 391 ensure that the second gripper driver 340, the second gripper, and the second connecting block 381 can float, such as up and down. Furthermore, the second guide rail 391, positioned on the mounting base 330, provides good support for the second gripper driver 340, the second gripper, and the second connecting block 381 through the second guide block 392.

[0103] Please refer to Figure 1 、 Figure 8 and Figure 9 The present invention provides a workstation layout device for use with the chip transfer device 1000 described in any of the aforementioned embodiments. The workstation layout device includes at least one first workstation, which is provided with at least one biochemical station 12, at least one imaging station 11, at least one loading station 13, and at least one cleaning station 15. The workstation layout device also includes at least one second workstation or storage body, which is provided with at least one recycling station 14.

[0104] The first work station can be provided with one, at least one biochemical position 12, at least one photographing position 11, at least one loading position 13 and at least one cleaning position 15 are all provided on the first work station.

[0105] There may be multiple first workstations, where the number of first workstations is consistent with the total number of biochemical stations 12, photography stations 11, loading stations 13, and cleaning stations 15, with at least one biochemical station 12, at least one photography station 11, at least one loading station 13, and at least one cleaning station 15 each being located on a first workstation. Alternatively, there may be multiple first workstations, where the number of first workstations is not consistent with the total number of biochemical stations 12, photography stations 11, loading stations 13, and cleaning stations 15, with some of the multiple workstations 10 being located on a single first workstation, while some of the single workstations 10 are located on a single first workstation.

[0106] The recovery station 14 can be provided on the second work station. The second work station can be provided with one, at least one recovery station 14 being provided on the second work station. The second work station can be provided with multiple, the number of second work stations and the number of recovery stations 14 being the same, and the multiple recovery stations 14 being provided on the second work station. Alternatively, the second work station can be provided with multiple, the number of second work stations and the number of recovery stations 14 being different, and at least one recovery station 14 being provided on a single second work station.

[0107] The recycling position 14 can be provided on the warehouse body. The warehouse body can be provided with one recycling position 14. When the recycling position 14 is provided on the warehouse body, the chip grabbing mechanism 300 can grab the old chip 2000, move it above the warehouse body, release the old chip 2000, and discard the old chip 2000 into the warehouse body.

[0108] The first workstation may include a first contact table 410 and a first support leg 420 disposed below the first contact table 410. The first contact table 410 has a first surface 411 for placing the chip 2000. The first support leg 420 provides support for the first contact table 410 and can elevate the first contact table 410, effectively shortening the travel time of the chip transfer device 1000 when it needs to grasp or place the chip 2000 on the first contact table 410. Alternatively, the first workstation may include only the first contact table 410; the first contact table 410 has a first surface 411 for placing the chip 2000.

[0109] The second workstation may include a second contact table and a second support leg disposed below the second contact table. The second contact table has a second tabletop for placing the chip 2000. The second support leg provides support for the second contact table and can elevate the second contact table, effectively shortening the travel time of the chip transfer device 1000 when it needs to grasp or place the chip 2000 on the second contact table. Alternatively, the second workstation may only include the second contact table, which has a second tabletop for placing the chip 2000.

[0110] The bin body may include a cavity, and when the chip grabbing mechanism 300 discards the old chip 2000 , the old chip 2000 may fall into the cavity.

[0111] The first workstation and the second workstation can be independently arranged or integrated into one workstation.

[0112] In this embodiment, multiple chips 2000, such as three chips 2000, can be placed in the loading station 13, and a cleaning chip 2000 can be placed in the cleaning station 15. The chip gripper mechanism 300 grabs the first chip 2000 at the loading station 13 and places it in the biochemical station 12, where the first chip 2000 undergoes a biochemical reaction. After the biochemical reaction is complete, the chip gripper mechanism 300 grabs the first chip 2000 at the biochemical station 12 and places it in the imaging station 11, where the first chip 2000 undergoes sequencing and imaging. The chip gripper mechanism 300 then grabs a cleaning chip 2000 at the cleaning station 15 and places it in the biochemical station 12 to clean components of the biochemical station 12, such as the liquid inlet and outlet. After cleaning is complete, the chip gripper mechanism 300 grabs a cleaning chip 2000 at the biochemical station 12 and places it in the cleaning station 15. The chip grabbing mechanism 300 then grabs a second chip 2000 at the loading station 13 and places it in the biochemical station 12, where the second chip 2000 undergoes a biochemical reaction. Alternatively, the biochemical station 12 may not be cleaned, and the chip grabbing mechanism 300 grabs a second chip 2000 at the loading station 13 and places it in the biochemical station 12, where the second chip 2000 undergoes a biochemical reaction. After the first chip 2000 at the imaging station 11 completes sequencing and imaging, the chip grabbing mechanism 300 grabs the first chip 2000 at the imaging station 11 and places it in the recycling station 14. After the second chip 2000 at the biochemical station 12 completes biochemical reaction, the chip grabbing mechanism 300 grabs a second chip 2000 at the biochemical station 12 and places it in the imaging station 11, where the second chip 2000 undergoes sequencing and imaging. The chip grabbing mechanism 300 then grabs the cleaned chip 2000 at the cleaning station 15 and places it in the biochemical station 12. After cleaning is complete, the chip grabbing mechanism 300 grabs the cleaned chip 2000 at the biochemical station 12 and places it in the cleaning station 15. The chip grabbing mechanism 300 then grabs a third chip 2000 at the loading station 13 and places it in the biochemical station 12, where the biochemical reaction on the third chip 2000 proceeds. Alternatively, if the biochemical station 12 is not cleaned, the chip grabbing mechanism 300 grabs the third chip 2000 at the loading station 13 and places it in the biochemical station 12, where the biochemical reaction on the third chip 2000 proceeds. After the second chip 2000 at the imaging station 11 completes sequencing and imaging, the chip grabbing mechanism 300 grabs a second chip 2000 at the imaging station 11 and places it in the recycling station 14. After the biochemical reaction of the third chip 2000 in biochemical position 12 is completed, the chip grabbing mechanism 300 grabs another chip 2000 in biochemical position 12 and places it in the photographing position 11. After the sequencing and photographing of the third chip 2000 in photographing position 11 are completed, the chip grabbing mechanism 300 grabs another chip 2000 in photographing position 11 and places it in the recycling position 14.During the sequencing process of multiple chips 2000, the chips 2000 are transferred between different workstations 10 through the chip grabbing mechanism 300, so that the orderly transfer of each chip 2000 can be achieved. Since multiple workstations 10 are provided, multiple chips 2000 and multiple workstations 10 can work simultaneously, such as one chip 2000 performs biochemical reaction while another chip 2000 performs sequencing and photography at the same time, thereby effectively improving the sequencing efficiency.

[0113] After chip 2000 completes a biochemical reaction at biochemical station 12 and is transferred to imaging station 11 for sequencing and imaging, it may not yet be fully sequenced. For example, after only 1-10 cycles of sequencing, 11-20 cycles of sequencing are still required. The chip grabbing mechanism 300 grabs and cleans chip 2000 from cleaning station 15 and transfers it to biochemical station 12 for cleaning. The chip 2000 is then transferred from imaging station 11 to biochemical station 12. Alternatively, the chip 2000 may be transferred from imaging station 11 to biochemical station 12 without cleaning biochemical station 12, then undergoes a biochemical reaction. After the biochemical reaction is complete, the chip 2000 is transferred to imaging station 11 for sequencing and imaging. After the chip 2000 is fully sequenced, the chip grabbing mechanism 300 transfers the chip 2000 from imaging station 11 to recycling station 14. After the chip 2000 is transferred from the biochemical position 12 to the photographing position 11 for the last time, the chip grabbing mechanism 300 grabs the cleaned chip 2000 from the cleaning position 15 and transfers it to the biochemical position 12 for cleaning, and grabs the next chip 2000 from the loading position 13 and transfers it to the biochemical position.

[0114] Furthermore, multiple biochemical stations 12 can be provided, allowing multiple chips 2000 to undergo biochemical reactions at each station 12. Specifically, for a chip 2000 requiring a biochemical reaction, if a biochemical station 12 is idle (no chip 2000 is currently undergoing a biochemical reaction at that station 12), the chip grabbing mechanism 300 transfers the chip 2000 requiring a biochemical reaction to the idle biochemical station 12 for the biochemical reaction if that station 12 has not previously undergone a biochemical reaction. If that station 12 has previously undergone a biochemical reaction, the chip grabbing mechanism 300 transfers a cleaned chip 2000 from the cleaning station 15 to that station 12. After cleaning, the chip 2000 requiring a biochemical reaction is then transferred to that station 12 for the biochemical reaction. Alternatively, the biochemical station 12 is not cleaned and the chip 2000 requiring a biochemical reaction is transferred to that station 12 for the biochemical reaction. Multiple imaging stations 11 can be provided to allow multiple chips 2000 to be sequenced and photographed at each imaging station 11. Specifically, for a chip 2000 requiring sequencing and photographing, if a imaging station 11 is idle (no chip 2000 is currently being sequenced and photographed at that imaging station 11), the chip grabbing mechanism 300 transfers the chip 2000 requiring sequencing and photographing to an idle imaging station 11 for sequencing and photographing. Multiple cleaning chips 2000 can be placed at the cleaning station 15, or multiple cleaning stations 15 can be provided, each with a cleaning chip 2000, so that the chip grabbing mechanism 300 can transfer each cleaning chip 2000 to a biochemical station 12 requiring cleaning. Specifically, if a cleaning chip 2000 is present at a cleaning station 15 for a biochemical station 12 requiring cleaning, the chip grabbing mechanism 300 transfers the cleaning chip 2000 to the biochemical station 12 requiring cleaning for cleaning. Through the above implementation scheme, more biochemical sites 12, and / or more photographing sites 11, and / or more cleaning chips 2000 are provided, so that more sequencing processes can be performed simultaneously, such as multiple biochemical reaction processes, and / or multiple sequencing photographing processes, and / or multiple cleaning processes, thereby further improving the sequencing efficiency.

[0115] In some specific embodiments of the present invention, please refer to Figure 9 There are multiple biochemical positions 12, and each biochemical position 12 and the photographing position 11 are arranged in sequence from left to right or from right to left along the first straight line.

[0116] By providing multiple biochemical positions 12, when a chip 2000 located at the biochemical position 12 completes a biochemical reaction and the photographing position 11 is idle, the chip 2000 can be transferred to the photographing position 11 so that the next chip 2000 located at the loading position 13 can be transferred to the biochemical position 12. This can meet the requirement of simultaneously performing biochemical reactions on multiple chips 2000, fully utilize each work station 10 to avoid waste of resources, and effectively improve efficiency.

[0117] Exemplarily, there are four biochemical stations 12 and one photography station 11. The four biochemical stations 12 and the one photography station 11 are arranged in a first straight line. The four biochemical stations 12 are arranged from left to right in the following order: biochemical station 12a, biochemical station 12b, biochemical station 12c, and biochemical station 12d. The photography station 11 is located to one side of biochemical station 12a. The chip grabbing mechanism 300 first transfers the four chips 2000 located at the loading station 13 to the biochemical stations 12a, 12b, 12c, and 12d, respectively. After the biochemical reaction of the chip 2000 in biochemical station 12a is completed, the chip 2000 in biochemical station 12a is transferred to the photography station 11, and biochemical station 12a becomes idle. After chip 2000 in imaging station 11 completes sequencing and imaging, chip 2000 in imaging station 11 is transferred to recycling station 14. After chip 2000 in biochemical station 12b completes the biochemical reaction, chip 2000 in biochemical station 12b is transferred to imaging station 11, leaving biochemical station 12b in an idle state. After chip 2000 in imaging station 11 completes sequencing and imaging, chip 2000 in imaging station 11 is transferred to recycling station 14. After chip 2000 in biochemical station 12c completes the biochemical reaction, chip 2000 in biochemical station 12c is transferred to imaging station 11, leaving biochemical station 12c in an idle state. After the chip 2000 in imaging station 11 completes sequencing and imaging, the chip 2000 in imaging station 11 is transferred to recycling station 14. After the chip 2000 in biochemical station 12d completes the biochemical reaction, the chip 2000 in biochemical station 12d is transferred to imaging station 11, leaving biochemical station 12d idle. After the chip 2000 in imaging station 11 completes sequencing and imaging, the chip 2000 in imaging station 11 is transferred to recycling station 14. Finally, sequencing of all chips 2000 is completed. This process fully utilizes each station 10, avoids resource waste, and effectively improves efficiency. If chip 2000 at imaging station 11 completes sequencing and imaging, but not yet fully sequenced, and one of biochemical stations 12a, 12b, 12c, or 12d is idle, chip 2000 at imaging station 11 is transferred to biochemical station 12 after cleaning, and then undergoes a biochemical reaction. After the reaction is complete, chip 2000 is transferred to imaging station 11 for sequencing and imaging. Alternatively, chip 2000 at imaging station 11 is transferred to biochemical station 12 without cleaning, and then undergoes a biochemical reaction. After the reaction is complete, chip 2000 is transferred to imaging station 11 for sequencing and imaging. If chip 2000 at imaging station 11 completes sequencing and imaging, and the chip 2000 has been fully sequenced, chip grabbing mechanism 300 transfers chip 2000 from imaging station 11 to recycling station 14.

[0118] Since chip 2000 typically needs to be sequenced and photographed after undergoing a biochemical reaction, arranging the biochemical station 12 and the photographing station 11 in a first straight line effectively shortens the movement path of the chip grasping mechanism 300. Furthermore, arranging the photographing station 11 at the edge of the first straight line, compared to arranging the photographing station 11 in the middle of the first straight line, avoids the need for the chip grasping mechanism 300 to move to the edge of the biochemical station 12 to grasp chip 2000 and then to the middle photographing station 11 to place chip 2000. This further shortens the movement path of the chip grasping mechanism 300 and facilitates the layout of both the biochemical system for performing biochemical reactions on chip 2000 and the imaging system for performing sequencing and photographing chip 2000. In summary, the biochemical station 12 and the photographing station 11 are arranged in a first straight line, and the photographing station 11 is set at the edge of the first straight line. The layout of the workstation 10 is more reasonable, which can shorten the moving path of the chip grasping mechanism 300 and save the transfer time of the chip 2000, and also facilitate the layout of peripheral systems such as the biochemical system and the imaging system.

[0119] In some specific embodiments of the present invention, please refer to Figure 9 The cleaning position 15 and the loading position 13 are arranged on the first straight line, the photographing position 11 is arranged on one side of the biochemical position 12, and the cleaning position 15 and the loading position 13 are arranged on the other side of the biochemical position 12.

[0120] By arranging the imaging station 11, biochemical station 12, cleaning station 15, and loading station 13 on a straight line, the chip grabbing mechanism 300 only needs to move back and forth along the same straight line when transferring chips 2000 between the imaging station 11, biochemical station 12, cleaning station 15, and loading station 13. This facilitates the multi-axis robotic arm 200 to drive the chip grabbing mechanism 300. This also prevents the multi-axis robotic arm 200 from having to move the chip grabbing mechanism 300 into a blind spot. For example, if the multi-axis robotic arm 200 is used as a dividing line, the side away from the workstation 10 is a blind spot, and the multi-axis robotic arm 200 cannot move the chip grabbing mechanism 300 into this blind spot. The cleaning chip 2000 transferred from the cleaning position 15 usually needs to be transferred to the biochemical position 12, and the chip 2000 transferred from the loading position 13 also usually needs to be transferred to the biochemical position 12. Therefore, the cleaning position 15 and the loading position 13 are set on one side of the biochemical position 12, and this side is away from the photographing position 11, so as to avoid the chip grasping mechanism 300 from passing through the photographing position 11 when transferring the chip 2000 from the cleaning position 15 and the loading position 13, thereby reducing the moving path of the chip grasping mechanism 300 and improving the transfer efficiency of the chip 2000.

[0121] Furthermore, the cleaning station 15 is closer to the biochemical station 12 than the loading station 13. The chip grabbing mechanism 300 transfers the cleaning chip 2000 from the cleaning station 15 to the biochemical station 12. This typically requires transferring the cleaning chip 2000 from the biochemical station 12 to the cleaning station 15 after cleaning is complete, which involves a reciprocating movement process. However, the chip grabbing mechanism 300 transfers the chip 2000 from the loading station 13 to the biochemical station 12. This typically does not require transferring the chip 2000 from the biochemical station 12 to the loading station 13. This is a one-way movement process. Therefore, placing the cleaning station 15 closer to the biochemical station 12 than the loading station 13 can further reduce the movement path of the chip grabbing mechanism 300 and improve the efficiency of transferring the chip 2000.

[0122] In some specific embodiments of the present invention, please refer to Figure 9 At least one emergency position 16 is also provided on the first workstation.

[0123] By setting up the emergency position 16, in special circumstances, such as a problem with a chip 2000 performing a biochemical reaction in the biochemical position 12, preventing the biochemical reaction from proceeding smoothly, the chip 2000 can be transferred from the biochemical position 12 to the emergency position 16 via the chip grabbing mechanism 300. After troubleshooting the problem, the chip 2000 can be transferred from the emergency position 16 to the biochemical position 12 via the chip grabbing mechanism 300. Alternatively, the biochemical position 12 can be discarded and the problem can be investigated after sequencing of the batch of chips 2000 is complete.

[0124] In some specific embodiments of the present invention, please refer to Figure 9 The emergency position 16 is arranged on the first straight line, and the emergency position 16 is arranged at the edge position of the first straight line away from the photographing position 11.

[0125] In this embodiment, since the emergency position 16 can be used in fewer cases, the emergency position 16 is farther away from the biochemical position 12 and the photographing position 11 than the cleaning position 15 and the loading position 13. It can be understood that the emergency position 16 is located in the corner of all workstations 10. This arrangement helps the chip grasping mechanism 300 to grasp and place the cleaning chip 2000 at the cleaning position 15, and grasp the chip 2000 at the loading position 13, which can further shorten the moving path of the chip grasping mechanism 300.

[0126] In some specific embodiments of the present invention, please refer to Figure 9 The recovery position 14 is set near the door of the sequencing system.

[0127] It should be noted that although Figure 1The rack 100 shown is through-hole on all sides. In actual scenarios, the rack 100 will be provided with a hood to prevent the external environment from affecting the internal environment. Exemplarily, a door that opens and closes automatically or manually is provided on the hood. After the door is opened, the old chips 2000 can be recycled at the recycling position 14, so the recycling position 14 is set at a position close to the door, which helps to recycle the chips 2000. Furthermore, the loading position 13 is set at a position close to the recycling position 14. After the door is opened, new chips 2000 can be added to the loading position 13, so the loading position 13 is set at a position close to the recycling position 14, which helps to add chips 2000.

[0128] An embodiment of the present invention provides a sequencing system, comprising the chip transfer device 1000 described in any one of the above embodiments, or comprising the workstation layout device described in any one of the above embodiments.

[0129] The sequencing system can be a sequencer, which includes a control device, a fluidic mechanism, and an optical mechanism. Under the control of the control device, the fluidic mechanism can pass DNA or RNA samples and biochemical reagents into chip 2000. The optical mechanism can take a photograph and image the chip 2000. The control device performs sequencing based on the obtained photograph to obtain sequencing results. Alternatively, the sequencing system can be an integrated system combining a sequencer and a server. The sequencer includes a control device, a communication device, a fluidic mechanism, and an optical mechanism. Under the control of the control device, the fluidic mechanism can pass DNA or RNA samples and biochemical reagents into chip 2000. The optical mechanism can take a photograph and image the chip 2000. The control device performs sequencing based on the obtained photograph to obtain sequencing results. The control device then controls the communication device to transmit the sequencing data to the server, which stores and / or processes the sequencing data.

[0130] In the chip transfer device 1000 provided in the embodiment of the present invention, driven by the multi-axis robotic arm 200, the chip grabbing mechanism 300 can realize multi-dimensional movement. The chip grabbing mechanism 300 can grab the chip 2000 at any station 10 and place the chip 2000 at any other station 10, thereby realizing multi-station 10 multi-chip 2000 sequencing, which can effectively improve sequencing efficiency.

[0131] In the workstation layout device provided in the embodiment of the present invention, the workstation layout device cooperates with the chip transfer device 1000. During the sequencing process of multiple chips 2000, the chips 2000 are transferred between different workstations 10 through the chip grabbing mechanism 300, so that the orderly transfer of each chip 2000 can be achieved. Since multiple workstations 10 are provided, multiple chips 2000 and multiple workstations 10 can work simultaneously, such as one chip 2000 performs a biochemical reaction while another chip 2000 performs sequencing and photography at the same time, thereby effectively improving the sequencing efficiency.

[0132] Please refer to Figure 10 A chip transfer method provided by an embodiment of the present invention is used for the chip transfer device of any of the above-mentioned embodiments. The chip transfer method includes the following steps: S1. The chip transfer device transfers the chip located at the loading position to the biochemical position; S2. After the chip completes the biochemical reaction, the chip transfer device transfers the chip located at the biochemical position to the photographing position, and transfers the cleaning chip located at the cleaning position to the biochemical position; S3. After the cleaning chip completes the station cleaning, the chip transfer device transfers the cleaning chip located at the biochemical position to the cleaning position, and after the chip completes sequencing and photographing, the chip transfer device transfers the chip located at the photographing position to the recovery position.

[0133] In this embodiment, after placing chip 2000 in loading station 13 and cleaning chip 2000 in cleaning station 15, chip transfer device 1000 transfers chip 2000 in loading station 13 to biochemical station 12, where chip 2000 undergoes a biochemical reaction. After the biochemical reaction is complete, chip transfer device 1000 transfers chip 2000 in biochemical station 12 to imaging station 11, where chip 2000 undergoes sequencing and imaging. At this point, biochemical station 12 is idle, and chip transfer device 1000 transfers cleaning chip 2000 in cleaning station 15 to biochemical station 12 to clean components of biochemical station 12, such as the liquid inlet and outlet. After cleaning chip 2000 completes station cleaning, chip transfer device 1000 transfers cleaning chip 2000 in biochemical station 12 to cleaning station 15. After the chip 2000 completes sequencing and photographing, the chip transfer device 1000 transfers the chip 2000 located at the photographing position 11 to the recycling position 14 .

[0134] In some specific embodiments of the present invention, after the chip completes sequencing and photographing, the chip transfer device transfers the chip located at the photographing position to the recovery position, including the following steps: S32, after the chip completes sequencing and photographing and the cleaning chip located at the biochemical position has been transferred to the cleaning position, the chip transfer device transfers the chip located at the photographing position to the biochemical position; S34, after the chip completes the biochemical reaction, the chip transfer device transfers the chip located at the biochemical position to the photographing position, and transfers the cleaning chip located at the cleaning position to the biochemical position; S36, repeat S32 and S34 until the chip completes the last round of sequencing and photographing, and the chip transfer device transfers the chip located at the photographing position to the recovery position.

[0135] In this embodiment, after the chip 2000 completes a biochemical reaction at the biochemical position 12 and is transferred to the photographing position 11 to complete sequencing and photographing, it may not yet be fully sequenced. For example, only 1-10 cycles of sequencing have been completed, and 11-20 cycles of sequencing are required. In this case, after the chip 2000 completes sequencing and photographing, the chip transfer device 1000 does not transfer the chip 2000 at the photographing position 11 to the recycling position 14. Instead, after confirming that the cleaning chip 2000 at the biochemical position 12 has been transferred to the cleaning position 15, it transfers the chip 2000 at the photographing position 11 to the biochemical position 12. The process of completing the biochemical reaction at the biochemical position 12 and completing sequencing and photographing at the photographing position 11 is then repeated. After each biochemical reaction at the biochemical position 12 completes, the chip transfer device 1000 transfers the cleaning chip 2000 to the biochemical position 12 to clean the biochemical position 12. After the chip 2000 completes the last round of sequencing and photographing, the chip transfer device 1000 transfers the chip 2000 located at the photographing position 11 to the recycling position 14 .

[0136] In some specific embodiments of the present invention, there are multiple chips 2000, or there are multiple chips 2000 and multiple biochemical positions 12, and the chip transfer method also includes the following steps: S42, when the biochemical position is in an idle state, the chip transfer device transfers the next chip located at the loading position to the biochemical position; S44, when the next chip completes the biochemical reaction and the photographing position is in an idle state, the chip transfer device transfers the next chip located at the biochemical position to the photographing position, and transfers the cleaning chip located at the cleaning position to the biochemical position; S46, after the next chip completes sequencing and photographing, the chip transfer device transfers the next chip located at the photographing position to the recovery position; S48, repeat S42, S44 and S46 until all chips are transferred to the recovery position.

[0137] There are multiple chips 2000 and one biochemical station 12. For example, after the chip transfer device 1000 transfers the current chip 2000 from the biochemical station 12 to the imaging station 11, the biochemical station 12 is idle. The chip transfer device 1000 then transfers the next chip 2000 located at the loading station 13 to the biochemical station 12, allowing the next chip 2000 to undergo a biochemical reaction in the biochemical station 12. After the chip transfer device 1000 transfers the current chip 2000 from the imaging station 11 to the recycling station 14, the imaging station 11 is idle. After the next chip 2000 completes the biochemical reaction, the chip transfer device 1000 transfers the next chip 2000 from the biochemical station 12 to the imaging station 11, so that the next chip 2000 can be sequenced and photographed at the imaging station 11. At this time, the biochemical station 12 is idle, and the chip transfer device 1000 transfers the cleaning chip 2000 located in the cleaning station 15 to the biochemical station 12 to perform station cleaning on the biochemical station 12. After the next chip 2000 completes the sequencing and photographing, the chip transfer device 1000 transfers the next chip 2000 located in the imaging station 11 to the recycling station 14. The above steps are repeated until all chips 2000 have been transferred to the recycling station 14.

[0138] Alternatively, there are multiple chips 2000 and multiple biochemical stations 12. For example, after the chip transfer device 1000 transfers a chip 2000, such as the first chip 2000, from the biochemical station 12 to the imaging station 11, if one biochemical station 12 is idle, the chip transfer device 1000 transfers a chip 2000, such as the second chip 2000, from the loading station 13 to the biochemical station 12, so that the second chip 2000 can undergo a biochemical reaction in the biochemical station 12. At this point, since there are multiple biochemical stations 12 and one biochemical station 12 is still idle, the chip transfer device 1000 transfers a chip 2000, such as the third chip 2000, from the loading station 13 to the biochemical station 12, so that the third chip 2000 can undergo a biochemical reaction in the biochemical station 12. After the chip transfer device 1000 transfers the first chip 2000 from the imaging station 11 to the recycling station 14, the imaging station 11 is idle. After the second chip 2000 completes the biochemical reaction, the chip transfer device 1000 transfers the second chip 2000 from the biochemical station 12 to the imaging station 11, so that the second chip 2000 undergoes sequencing and imaging at the imaging station 11. After the second chip 2000 completes sequencing and imaging, the chip transfer device 1000 transfers the second chip 2000 from the imaging station 11 to the recycling station 14, so that the imaging station 11 is idle. If the third chip 2000 completes the biochemical reaction at this time, the chip transfer device 1000 transfers the third chip 2000 from the biochemical station 12 to the imaging station 11, so that the third chip 2000 undergoes sequencing and imaging at the imaging station 11. After the third chip 2000 completes sequencing and imaging, the chip transfer device 1000 transfers the third chip 2000 from the imaging station 11 to the recycling station 14. If there are more chips 2000, such as the fourth chip 2000, the fifth chip 2000, and so on... after the biochemical position 12 is idle and has been cleaned, the chip transfer device 1000 transfers the chip 2000 to the biochemical position 12. After the photographing position 11 is idle, the chip transfer device 1000 transfers the chip 2000 that has completed the biochemical reaction to the photographing position 11. After the chip 2000 completes sequencing and photographing, the chip transfer device 1000 transfers the chip 2000 that has completed sequencing and photographing to the recycling position 14. This process is repeated until all chips 2000 are transferred to the recycling position 14.

[0139] Furthermore, if a chip 2000 that has completed sequencing and imaging at imaging station 11 is still not fully sequenced, the chip transfer device 1000 can transfer the chip 2000 from imaging station 11 to biochemical station 12 after the biochemical station 12 is idle and cleaned, allowing the chip 2000 to undergo a subsequent biochemical reaction. After imaging station 11 is idle and the biochemical reaction on the chip 2000 has completed, the chip transfer device 1000 then transfers the chip 2000 from biochemical station 12 to imaging station 11. After the chip 2000 completes its final round of sequencing and imaging, the chip transfer device 1000 transfers the chip 2000 in imaging station 11 to the recycling station 14.

[0140] In some specific embodiments of the present invention, the chip grabbing mechanism 300 is provided with two sets of grabbing mechanisms, which can successively grab the chip 2000 and / or the cleaning chip 2000 and place the chip 2000 and / or the cleaning chip 2000.

[0141] One set of the two gripping mechanisms can be set on one side of the mounting base 330 described in any of the above embodiments, including a first clamping jaw driving member 310, a first clamping jaw, a first connecting block 361, a first pressing plate 362, a first elastic member 363, a first guide rail 371, and a first guide block 372. The other set of the two gripping mechanisms can be set on the other side of the mounting base 330, including a second clamping jaw driving member 340, a second clamping jaw, a second connecting block 381, a second pressing plate 382, ​​a second elastic member 383, a second guide rail 391, and a second guide block 392.

[0142] In this embodiment, two sets of grasping mechanisms can successively grasp the chip 2000 and / or clean the chip 2000. After the chip transfer device 1000 moves, the two sets of grasping mechanisms can successively place the chip 2000 and / or clean the chip 2000, thereby shortening the moving path of the chip grasping mechanism 300, reducing the time for grasping and placing the chip 2000 and / or cleaning the chip 2000, and greatly improving efficiency.

[0143] In some specific embodiments of the present invention, the chip transfer device 1000 also includes a rotating mechanism arranged between the two sets of grasping mechanisms. After the two sets of grasping mechanisms successively grasp the chip 2000 and / or the cleaning chip 2000, the rotating mechanism can drive the two sets of grasping mechanisms to rotate with the rotating mechanism as the rotation center to achieve the exchange of the position of the chip 2000 and / or the cleaning chip 2000.

[0144] The rotation mechanism may be part of the multi-axis robotic arm described in any of the above embodiments. The movement of the multi-axis robotic arm can drive the two gripping mechanisms to rotate, which in turn drives the gripped chips 2000 and / or cleaning chips 2000 to rotate. This makes the two gripping mechanisms more flexible, further shortens the movement path, reduces the time required to grip and place the chips 2000 and / or clean the chips 2000, and significantly improves efficiency.

[0145] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "example," "certain examples," "specific examples," or "embodiments" means that a specific feature, structure, material, or characteristic described in conjunction with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0146] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present invention. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present invention.

Claims

1. A chip transfer device, characterized in that: For a sequencing system, the chip transfer device comprises: Multi-axis robotic arm; A chip grabbing mechanism provided on the multi-axis robotic arm, wherein the multi-axis robotic arm is capable of driving the chip grabbing mechanism to move to achieve multi-dimensional movement, so that the chip grabbing mechanism can grab a chip at any station and place the chip at another station; Wherein, the chip grabbing mechanism includes: a first gripper driving member provided on the multi-axis robotic arm; The first clamp is connected to the first clamp driving member, and the first clamp includes a first clamp member and a second clamp member that are arranged opposite to each other. Under the drive of the first clamp driving member, the first clamp member and the second clamp member approach each other or move away from each other to grasp or place the chip.

2. The chip transfer device according to claim 1, wherein: The first clamping jaw member and the second clamping jaw member are both provided with a first positioning pin. When the first clamping jaw member and the second clamping jaw member approach or move away from each other, the first positioning pin contacts or moves away from the positioning groove of the chip.

3. The chip transfer device according to claim 1, wherein: The multi-axis robotic arm can also drive the chip grabbing mechanism to achieve rotational motion, and the chip grabbing mechanism also includes: a mounting base connected to the multi-axis robotic arm, wherein the first gripper driving member is disposed on the mounting base; A second jaw drive member disposed on the mounting base; and The second clamp is connected to the second clamp driving member, and the second clamp includes a third clamp member and a fourth clamp member arranged opposite to each other. Under the drive of the second clamp driving member, the third clamp member and the fourth clamp member approach each other or move away from each other to grasp or place the chip.

4. The chip transfer device according to claim 3, characterized in that: The third clamping jaw and the fourth clamping jaw are both provided with a second positioning pin. When the third clamping jaw and the fourth clamping jaw are close to or away from each other, the second positioning pin contacts or disengages from the positioning groove of the chip.

5. The chip transfer device according to claim 3, characterized in that: The chip grabbing mechanism further includes: a first connecting block provided on the first jaw driving member; A first pressing plate provided on the mounting seat; and A first elastic member is provided between the first connecting block and the first pressing plate.

6. The chip transfer device according to claim 5, characterized in that: The chip grabbing mechanism further includes a first guide rail provided on the mounting seat and a first guide block provided on the first guide rail, and the first connecting block is provided between the first clamping jaw driving member and the first guide block.

7. The chip transfer device according to any one of claims 3 to 6, characterized in that: The chip grabbing mechanism further includes: a second connecting block provided on the second jaw driving member; A second pressing plate provided on the mounting seat; and A second elastic member is provided between the second connecting block and the second pressing plate.

8. The chip transfer device according to claim 7, wherein: The chip grabbing mechanism further includes a second guide rail arranged on the mounting seat and a second guide block arranged on the second guide rail, and the second connecting block is arranged between the second clamping claw driving member and the second guide block.

9. A workstation layout device, characterized in that: In conjunction with the chip transfer device according to any one of claims 1 to 8, the work station layout device includes at least one first work station, on which at least one biochemical position, at least one photographing position, at least one loading position and at least one cleaning position are provided. The work station layout device also includes at least one second work station or warehouse body, on which at least one recycling position is provided.

10. The workstation layout device according to claim 9, characterized in that: There are multiple biochemical positions, and the biochemical positions and the photographing positions are arranged in sequence from left to right or from right to left along the first straight line.

11. The workstation layout device according to claim 10, characterized in that: The cleaning position and the loading position are arranged on the first straight line, the photographing position is arranged on one side of the biochemical position, and the cleaning position and the loading position are arranged on the other side of the biochemical position.

12. The workstation layout device according to claim 10, characterized in that: At least one emergency position is also provided on the first workstation.

13. The workstation layout device according to claim 12, characterized in that: The emergency position is arranged on the first straight line, and the emergency position is arranged at the edge position of the first straight line away from the photographing position.

14. The workstation layout device according to any one of claims 9 to 13, characterized in that: The recovery position is arranged near the door of the sequencing system.

15. A sequencing system, characterized in that The chip transfer device comprises any one of claims 1 to 8, or the workstation layout device comprises any one of claims 9 to 14.

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