Semiconductor electroplating equipment with draining and discharging functions

Abstract

The semiconductor electroplating equipment comprises a bottom plate, an electroplating box body is arranged at the upper end of the bottom plate, a baffle is arranged at the center in the electroplating box body, a through hole is formed in the lower end of the baffle, a discharging opening is formed in the upper end of the baffle, an electroplating lifting structure is arranged on one side in the electroplating box body, and a discharging opening is formed in the other side in the electroplating box body. A draining and discharging structure is arranged on the other side of the electroplating box body; the electroplating lifting structure comprises two linear modules, two supporting plates, a storage screen frame, a discharging opening and a connecting assembly. The utility model relates to the technical field of semiconductor production, through the arrangement of the electroplating lifting structure, the lifting and descending of the storage screen frame can be realized through the two linear modules, the automatic lifting of the electroplated semiconductor can be realized, and through the arrangement of the inclined screen frame, the discharge port and the discharge port, the automatic lifting of the electroplated semiconductor can be realized. And the electroplated semiconductors are automatically conveyed into the draining and discharging structure.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor production, in particular to semiconductor electroplating equipment with a dry material control and discharge function. Background Art

[0002] Electroplating is a process that uses electrolysis to adhere a layer of metal film to the surface of metal or other material workpieces. Electroplating can prevent metal oxidation (such as rust), improve wear resistance, conductivity, reflectivity, corrosion resistance (copper sulfate, etc.) and enhance aesthetics. It is widely used in the manufacture of some metal layers in semiconductors.

[0003] Current electroplating devices require manual intervention to remove the semiconductor object from the electroplating tank after placing the device inside the electroplating tank and moving it to the top of the drying device to drain the liquid on the outside of the semiconductor. The operation is relatively cumbersome and cannot guarantee the overall processing efficiency of the semiconductor. In view of this, there may be technical means to solve the above problems in the existing technology, but this case intends to provide an alternative or replacement technical solution. Utility Model Content

[0004] To achieve the above objectives, the present invention is implemented through the following technical solutions: a semiconductor electroplating device with a dry material discharging control function, comprising a base plate, an electroplating box body provided at the upper end of the base plate, a baffle provided at the center of the electroplating box body, a through hole provided at the lower end of the baffle body, a discharge port provided at the upper end of the baffle body, an electroplating lifting structure provided on one side of the electroplating box body, and a dry material discharging control structure provided on the other side of the electroplating box body;

[0005] The electroplating lifting structure includes: two linear modules, two support plates, a storage frame, a discharge port and a connecting component;

[0006] The two linear modules are respectively installed on the two side walls of the electroplating box, the two support plates are respectively installed on the two driving ends of the linear modules, the storage screen frame is placed on the upper ends of the two support plates, and one side is in contact with the side of the baffle, the discharge port is opened at the lower end of the wall of one side of the storage screen frame, and the connecting component is installed between the storage screen frame and the two support plates.

[0007] Preferably, the connecting assembly comprises: two connecting sleeves and two fixing screws;

[0008] The two connecting sleeves are respectively installed on both sides of the lower end of the storage net frame, and the two fixing screws are respectively embedded in the two connecting sleeves and both sides of the two support plates.

[0009] Preferably, the dry control and unloading structure includes: two mounting shafts, a discharge port, a dry control net frame, two connecting plates and two lifting assemblies;

[0010] The two mounting shafts are movably embedded in both sides of the upper end of the electroplating box, the discharge port is opened on one side of the upper end of the electroplating box, the two sides of one end of the control net frame are respectively connected to the two mounting shafts, the two connecting plates are respectively installed on both sides of the upper end of the control net frame, the two lifting assemblies are respectively installed on the outer walls on both sides of the electroplating box, and one end is respectively connected to the two connecting plates.

[0011] Preferably, the two lifting assemblies each include: an articulated seat, an electric push rod, and a connecting shaft;

[0012] The hinge seat is fixedly installed on the outside of the electroplating box, the bottom end of the electric push rod is installed in the hinge seat, one end of the connecting shaft is connected to one side of the connecting plate, and is movably connected to the telescopic end of the electric push rod.

[0013] Preferably, an inclined screen frame is provided at the lower end of the storage screen frame.

[0014] Beneficial effects

[0015] The utility model provides a semiconductor electroplating equipment with a dry-control and discharge function, which has the following beneficial effects: through the provided electroplating lifting structure, the storage screen frame can be lifted and lowered by two linear modules, and the semiconductor can be automatically lifted after electroplating, and through the provided inclined screen frame, the discharge port and the discharge port, the electroplated semiconductor can be automatically transported to the dry-control and unloading structure, and the electroplated semiconductor can be dry-controlled. Finally, through the provided lifting component, the dry-control screen frame can be turned over as a whole, and the dry-controlled semiconductor can be automatically unloaded. Without a large amount of manual participation, the automated electroplating processing and dry-control operation of the semiconductor can be realized, and the electroplating efficiency of the semiconductor can be fully guaranteed while reducing the labor intensity. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the main three-dimensional structure of a semiconductor electroplating device with a dry material control and discharge function described in the present invention.

[0017] Figure 2 This is a rear perspective structural diagram of a semiconductor electroplating device with a dry material control and discharge function described in the present invention.

[0018] Figure 3 This is a schematic diagram of the main cross-sectional structure of a semiconductor electroplating device with a dry material control and discharge function described in the present invention.

[0019] In the figure: 1. Base plate, 2. Electroplating box, 3. Baffle, 4. Through hole, 5. Discharge port, 6. Linear module, 7. Support plate, 8. Storage screen frame, 9. Discharge port, 10. Connecting sleeve, 11. Fixing screw, 12. Mounting shaft, 13. Discharge port, 14. Drying control screen frame, 15. Connecting plate, 16. Articulated seat, 17. Electric push rod, 18. Connecting shaft, 19. Tilting screen frame. DETAILED DESCRIPTION

[0020] Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative work shall fall within the scope of protection of the present invention.

[0021] Example: See Figure 1-3 A semiconductor electroplating device with a dry-discharging control function includes a base plate 1, an electroplating box 2 is provided on the upper end of the base plate 1, a baffle 3 is provided at the center of the electroplating box 2, a through hole 4 is provided at the lower end of the baffle 3, a discharge port 5 is provided at the upper end of the baffle 3, an electroplating lifting structure is provided on one side of the electroplating box 2, and a dry-discharging control structure is provided on the other side of the electroplating box 2;

[0022] The electroplating lifting structure includes: two linear modules 6, two support plates 7, a storage screen frame 8, a discharge port 9 and a connecting component;

[0023] The two linear modules 6 are respectively installed on the two side walls of the electroplating box 2, and the two support plates 7 are respectively installed on the driving ends of the two linear modules 6. The storage screen frame 8 is placed on the upper ends of the two support plates 7, and one side is in contact with the side of the baffle 3. The discharge port 9 is opened at the lower end of the wall on one side of the storage screen frame 8, and the connecting component is installed between the storage screen frame 8 and the two support plates 7.

[0024] When electroplating the semiconductor, the staff first injects the electroplating liquid into the electroplating box 2, then energizes the electroplating box 2, and fills the storage frame 8 with the semiconductor raw materials that need to be electroplated. The two linear modules 6 work to drive the storage frame 8 to be immersed in the liquid in the electroplating box 2 to electroplate the semiconductor. When the electroplating is completed, the two linear modules 6 are driven again to lift the storage frame 8 to a specified height through the two support plates 7. When the discharge port 9 on one side of the storage frame 8 corresponds to the discharge port 5 at the upper end of the baffle 3, under the action of the inclined frame 19 in the storage frame 8, the electroplated semiconductor passes through the discharge port 9 and the discharge port 5 into the dry control and unloading structure. Finally, the electroplated semiconductor is controlled and unloaded through the dry control and unloading structure.

[0025] In the specific implementation process, the connection assembly includes: two connecting sleeves 10 and two fixing screws 11;

[0026] The two connecting sleeves 10 are respectively installed on both sides of the lower end of the storage frame 8, and the two fixing screws 11 are respectively embedded in the two connecting sleeves 10 and both sides of the two support plates 7.

[0027] During subsequent maintenance, the two fixing screws 11 can be removed from the two support plates 7 and the two connecting sleeves 10, and the storage net frame 8 can be removed as a whole to be replaced.

[0028] In the specific implementation process, the dry control and discharge structure includes: two mounting shafts 12, a discharge port 13, a dry control net frame 14, two connecting plates 15 and two lifting components;

[0029] The two mounting shafts 12 are movably embedded in both sides of the upper end of the electroplating box 2, the discharge port 13 is opened on one side of the upper end of the electroplating box 2, the two sides of one end of the drying control net frame 14 are respectively connected to the two mounting shafts 12, and the two connecting plates 15 are respectively installed on both sides of the upper end of the drying control net frame 14. The two lifting assemblies are respectively installed on the outer walls on both sides of the electroplating box 2, and one end is respectively connected to the two connecting plates 15.

[0030] When draining the semiconductor that has been electroplated, the semiconductor transported through the discharge port 9 and the discharge port 5 falls into the draining net frame 14, and the liquid on the upper end of the semiconductor is drained by the draining net frame 14. The dripping liquid falls into the electroplating box 2 and is connected through the through hole 4 at the lower end of the baffle 3, so that the bottom end of the electroplating box 2 is in a connected state to facilitate the reuse of the electroplating liquid. When the semiconductor is drained, the two lifting components work to drive the draining net box to rotate at the upper ends of the two mounting shafts 12, and the semiconductor in the draining net box is unloaded by flipping the draining net box at the mounting shaft 12 and the discharge port 13.

[0031] In the specific implementation process, both lifting assemblies include: an articulated seat 16, an electric push rod 17 and a connecting shaft 18;

[0032] The hinge seat 16 is fixedly installed on the outside of the electroplating box 2, the bottom end of the electric push rod 17 is installed in the hinge seat 16, one end of the connecting shaft 18 is connected to one side of the connecting plate 15, and is movably connected to the telescopic end of the electric push rod 17.

[0033] When semiconductors are unloaded, the electric push rod 17 in the hinge seat 16 works. The extension of the electric push rod 17 pushes the movement of the connecting shaft 18 and the connecting plate 15, thereby driving the drying net frame 14 to flip.

[0034] In the specific implementation process, an inclined screen frame 19 is provided at the lower end of the storage screen frame 8 .

[0035] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor electroplating device with a dry material control and discharge function, comprising a bottom plate (1), characterized in that: The upper end of the bottom plate (1) is provided with an electroplating box (2), a baffle (3) is provided at the center of the electroplating box (2), a through hole (4) is provided at the lower end of the baffle (3), a discharge port (5) is provided at the upper end of the baffle (3), an electroplating lifting structure is provided on one side of the electroplating box (2), and a dry control discharge structure is provided on the other side of the electroplating box (2); The electroplating lifting structure comprises: two linear modules (6), two support plates (7), a storage mesh frame (8), a discharge port (9) and a connecting component; The two linear modules (6) are respectively installed on the inner wall surfaces on both sides of the electroplating box (2); the two support plates (7) are respectively installed on the driving ends of the two linear modules (6); the storage net frame (8) is placed on the upper ends of the two support plates (7), and one side is in contact with the side of the baffle (3); the discharge port (9) is opened at the lower end of the wall surface on one side of the storage net frame (8); and the connecting component is installed between the storage net frame (8) and the two support plates (7).

2. The semiconductor electroplating equipment with dry material control and discharge function according to claim 1, characterized in that: The connecting assembly comprises: two connecting sleeves (10) and two fixing screws (11); The two connecting sleeves (10) are respectively installed on both sides of the lower end of the storage net frame (8), and the two fixing screws (11) are respectively embedded in the two connecting sleeves (10) and the two sides of the two support plates (7).

3. The semiconductor electroplating equipment with dry material control and discharge function according to claim 1, characterized in that: The dry control and discharge structure comprises: two mounting shafts (12), a discharge port (13), a dry control net frame (14), two connecting plates (15) and two lifting assemblies; The two mounting shafts (12) are movably embedded in both sides of the upper end of the electroplating box (2), the discharge port (13) is opened on one side of the upper end of the electroplating box (2), the two sides of one end of the control net frame (14) are respectively connected to the two mounting shafts (12), the two connecting plates (15) are respectively installed on both sides of the upper end of the control net frame (14), and the two lifting assemblies are respectively installed on the outer walls of both sides of the electroplating box (2), and one end is respectively connected to the two connecting plates (15).

4. The semiconductor electroplating equipment with dry material control and discharge function according to claim 3, characterized in that: The two lifting assemblies each comprise: an articulated seat (16), an electric push rod (17) and a connecting shaft (18); The hinge seat (16) is fixedly mounted on the outside of the electroplating box (2), the bottom end of the electric push rod (17) is mounted in the hinge seat (16), one end of the connecting shaft (18) is connected to one side of the connecting plate (15), and is movably connected to the telescopic end of the electric push rod (17).

5. The semiconductor electroplating equipment with dry material control and discharge function according to claim 1, characterized in that: An inclined net frame (19) is provided at the lower end of the storage net frame (8).

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