Low-cost constant-voltage integrated module application device

Abstract

The utility model discloses a low-cost constant-voltage integrated module application device, and belongs to the technical field of automobile lamp driving. Comprising a load substrate; the constant-voltage integrated module is arranged on the load substrate, and the constant-voltage integrated module comprises a circuit board arranged on the load substrate; and the shielding structure is connected with the circuit board, the shielding structure and the circuit board form an accommodating space, and a constant-voltage conversion assembly is arranged in the accommodating space. The technical scheme has the beneficial effects that by adopting the technical scheme, electronic devices can be prevented from being directly arranged on the load substrate, and the cost of the load circuit is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of vehicle lamp driving, in particular to a constant voltage integrated module application device. Background Art

[0002] Amidst the rapid advancement of automotive electronics, the field of headlight control and drive is facing higher requirements. With the diversification of vehicle headlight designs, the number of LEDs (Light-Emitting Diodes) required for headlight load boards continues to increase, leading to a gradual expansion in the overall area of ​​the LED load boards. However, due to the limited internal space within the entire lamp module, simply listing the constant voltage integrated module application device alone is insufficient to meet the module's internal space requirements. Therefore, the constant voltage integrated module application device must be placed directly on the headlight load board.

[0003] Constant voltage integrated modules typically include a high-frequency DC / DC constant voltage chip. Given the stringent electromagnetic compatibility (EMC) requirements of automotive electronics, these chips typically require a four-layer FR4 circuit board design. In contrast, the control scheme of the headlight load board is relatively simple, typically requiring only a two-layer FR4 circuit board design. Because the headlight load board requires a large FR4 substrate area, placing the high-frequency DC / DC constant voltage chip directly on the board would inevitably require upgrading the two-layer FR4 board to a four-layer one, further increasing board costs. Utility Model Content

[0004] The purpose of this utility model is to provide a low-cost constant voltage integrated module application device to solve the above technical problems;

[0005] A low-cost constant voltage integrated module application device, comprising:

[0006] load substrate;

[0007] A constant voltage integrated module is provided on the load substrate, and the constant voltage integrated module includes:

[0008] A circuit board is provided on the load substrate;

[0009] A shielding structure is connected to the circuit board, wherein the shielding structure and the circuit board form an accommodating space, and a constant voltage conversion component is provided in the accommodating space.

[0010] Preferably, the constant voltage conversion component includes:

[0011] Filter, connected to input power;

[0012] A constant voltage chip, wherein the input end of the constant voltage chip is connected to the filter, and the output end of the constant voltage chip is connected to the LED lamp.

[0013] Preferably, the circuit board is a 4-layer FR4 circuit board, and the circuit board includes:

[0014] a first insulating layer;

[0015] a first conductive layer, disposed above the first insulating layer;

[0016] a second insulating layer, disposed above the first conductive layer;

[0017] The second conductive layer is disposed above the second insulating layer.

[0018] Preferably, the shielding structure is a shielding cover.

[0019] Preferably, the shielding structure is a reflow soldering integrated molding type.

[0020] Preferably, the filter is a front-end π-type filter.

[0021] Preferably, the size of the load substrate is larger than that of the constant voltage integrated module.

[0022] Preferably, the load substrate is a metal load board or a double-layer FR4 circuit board.

[0023] Preferably, the LED lamp is also provided on the load substrate.

[0024] Preferably, the size of the circuit board is larger than the size of the shielding structure.

[0025] The beneficial effect of the present invention is that, due to the adoption of the above technical solution, it is possible to avoid directly arranging electronic devices on the load substrate, thereby reducing the cost of the load circuit. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is a front view of the low-cost constant voltage integrated module application device of the utility model;

[0027] Figure 2 It is a side view of the low-cost constant-voltage integrated module application device of the present utility model.

[0028] In the accompanying drawings: 1. load substrate; 2. constant voltage integrated module; 21. circuit board; 22. shielding structure; 3. constant voltage conversion component; 4. LED lamp. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0030] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features therein can be combined with each other.

[0031] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, but they are not intended to limit the present invention.

[0032] A low-cost constant voltage integrated module application device, such as Figure 1 、 Figure 2 Shown, including,

[0033] Load substrate 1;

[0034] The constant voltage integrated module 2 is provided on the load substrate 1 and includes:

[0035] The circuit board 21 is provided on the load substrate 1;

[0036] The shielding structure 22 is connected to the circuit board 21 . The shielding structure 22 and the circuit board 21 form an accommodating space. The constant voltage conversion component 3 is disposed in the accommodating space.

[0037] Specifically, the utility model provides a low-cost constant voltage integrated module application device, in which a circuit board 21 is arranged between the constant voltage conversion component 3 and the load substrate 1, and the constant voltage conversion component 3 is placed on the circuit board 21. The constant voltage integrated module 2 is connected to the load substrate 1 through a reflow soldering process, thereby avoiding direct contact between the constant voltage conversion component 3 and the load substrate 1, and solving the problem of needing to use a large number of high-priced circuit boards.

[0038] In a preferred embodiment, the constant voltage conversion component 3 includes:

[0039] Filter, connected to input power;

[0040] A constant voltage chip, the input end of the constant voltage chip is connected to the filter, and the output end of the constant voltage chip is connected to the LED light 4;

[0041] The filter is a front-end π-type filter.

[0042] Specifically, the main function of the filter is to remove high-frequency noise and pulsation in the input power supply and provide a smooth and stable DC power signal to the constant voltage chip.

[0043] By filtering, the influence of power supply fluctuation on subsequent circuits (such as the constant voltage chip and the LED lamp 4) can be prevented, thereby ensuring their normal operation.

[0044] The constant voltage chip converts the input voltage into a stable output voltage, which remains constant when the load (such as LED light 4) changes.

[0045] The constant voltage conversion component 3 also includes other auxiliary electronic components, such as an input capacitor for smoothing the input voltage, an output capacitor for smoothing the output voltage, and a diode for preventing reverse current.

[0046] In a preferred embodiment, the circuit board 21 is a 4-layer FR4 circuit board, and the circuit board 21 includes:

[0047] a first insulating layer;

[0048] a first conductive layer disposed above the first insulating layer;

[0049] a second insulating layer disposed above the first conductive layer;

[0050] The second conductive layer is disposed above the second insulating layer.

[0051] Specifically, FR4 in FR4 circuit boards is a glass fiber reinforced epoxy resin with good electrical insulation, thermal stability and mechanical strength.

[0052] PCB 21 is a thin, 4-layer FR4 circuit board with a thickness of less than 1.6mm. It can handle more signals and is suitable for high-density and high-performance applications. PCB 21 provides better electromagnetic compatibility because the internal layers can be used as ground planes, effectively reducing interference.

[0053] In a preferred embodiment, the shielding structure 22 is a shielding cover;

[0054] The shielding structure 22 is a reflow soldering integrated molding type.

[0055] Specifically, shielding structure 22 forms a closed structure by connecting circuit board 21. The shielding cover can block the influence of external electromagnetic waves and reduce the electromagnetic radiation of the internal circuit to the external environment. Shielding structure 22 also provides physical protection, preventing dust, moisture, etc. from damaging circuit components.

[0056] In high-speed signal transmission applications, shielding can effectively reduce crosstalk between signals and improve the reliability of data transmission.

[0057] Through reflow soldering, the shield can be connected to the circuit board 21 in a single process, reducing additional assembly steps and costs. This integrated design ensures a tight connection between the shield can and the circuit board 21, improving connection reliability and reducing the risk of loosening or falling off during use. This allows for a more compact circuit layout, saving space and suiting high-density designs.

[0058] In a preferred embodiment, the size of the load substrate 1 is larger than the size of the constant voltage integrated module 2;

[0059] The load substrate 1 is also provided with an LED light 4;

[0060] The size of the circuit board 21 is larger than that of the shielding structure 22 .

[0061] Specifically, the load substrate 1 is larger than the constant-voltage integrated module 2, allowing for more LED lights 4 to be placed in the remaining space, meeting more complex design requirements. The larger load substrate 1 dissipates heat more effectively, while the constant-voltage integrated module 2 generates relatively concentrated heat. This design allows for ample space for heat dissipation, improving overall system reliability.

[0062] The circuit board 21 is larger than the shielding structure 22 , and can provide more electromagnetic interference shielding and signal routing space around the shielding cover, which helps to reduce crosstalk between signals and improve signal integrity.

[0063] In a preferred embodiment, the load substrate 1 is a metal load board or a double-layer FR4 circuit board.

[0064] Specifically, a circuit board 21 is provided between the constant voltage conversion assembly 3 and the load substrate 1. Placing the constant voltage conversion assembly 3 on the circuit board 21 increases the choice of load substrate 1. Metal load boards typically use materials with good thermal conductivity, such as aluminum and copper. This allows for rapid heat transfer and improved heat dissipation. A double-layer FR4 circuit board can reduce the design cost of the load substrate 1.

[0065] The above description is only a preferred embodiment of the present invention and does not limit the implementation method and protection scope of the present invention. For those skilled in the art, it should be aware that all solutions obtained by equivalent substitutions and obvious changes made using the description and illustrations of the present invention should be included in the protection scope of the present invention.

Claims

1. A low-cost constant voltage integrated module application device, characterized in that: include, load substrate; A constant voltage integrated module is provided on the load substrate, and the constant voltage integrated module includes: A circuit board is provided on the load substrate; A shielding structure is connected to the circuit board, wherein the shielding structure and the circuit board form an accommodating space, and a constant voltage conversion component is provided in the accommodating space.

2. The low-cost constant voltage integrated module application device according to claim 1, characterized in that: The constant voltage conversion component includes: Filter, connected to input power; A constant voltage chip, wherein the input end of the constant voltage chip is connected to the filter, and the output end of the constant voltage chip is connected to the LED lamp.

3. The low-cost constant voltage integrated module application device according to claim 1, characterized in that: The circuit board is a 4-layer FR4 circuit board, and the circuit board includes: a first insulating layer; a first conductive layer, disposed above the first insulating layer; a second insulating layer, disposed above the first conductive layer; The second conductive layer is disposed above the second insulating layer.

4. The low-cost constant voltage integrated module application device according to claim 1, characterized in that: The shielding structure is a shielding cover.

5. The low-cost constant voltage integrated module application device according to claim 1, characterized in that: The shielding structure is a reflow soldering integrated molding type.

6. The low-cost constant voltage integrated module application device according to claim 2, characterized in that: The filter is a front-end π-type filter.

7. The low-cost constant voltage integrated module application device according to claim 1, characterized in that: The size of the load substrate is larger than that of the constant voltage integrated module.

8. The low-cost constant voltage integrated module application device according to claim 1, characterized in that: The load substrate is a metal load board or a double-layer FR4 circuit board.

9. The low-cost constant voltage integrated module application device according to claim 2, characterized in that: The LED lamp is also provided on the load substrate.

10. The low-cost constant voltage integrated module application device according to claim 1, characterized in that: The size of the circuit board is larger than that of the shielding structure.

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