Non-contact high-precision thickness measuring instrument mechanical device

Abstract

The utility model relates to the technical field of film thickness measurement, and discloses a non-contact high-precision thickness measuring instrument mechanical device which comprises a supporting plate. A middle interlayer plate is arranged above the supporting plate; the lower portion of the middle interlayer plate is attached to the top face of the lower pole plate, and the bottom face of the lower pole plate is attached to the supporting plate. An upper pole plate is lapped on the top surface of the middle interlayer plate, and the top surface of the upper pole plate is attached to the bottom surface of the protective cover; a round through opening is formed in the middle interlayer plate, and a film feeding opening communicated with the round through opening is formed in one side of the middle interlayer plate. According to the utility model, the film can be effectively assisted to be stably and flexibly put between two polar plates through the film putting notch formed in the middle interlayer plate, so that the test effect is achieved.

Description

Technical Field

[0001] The utility model belongs to the technical field of film thickness measurement, in particular to a non-contact high-precision thickness measuring instrument mechanical device. Background Art

[0002] Existing industrial production and scientific research often require high-precision measurement of film thickness.

[0003] Traditional thickness measurement methods, such as mechanical micrometers and ultrasonic thickness gauges, often have problems such as limited measurement accuracy, complex operation, and susceptibility to environmental interference.

[0004] A probe mechanism for a contactless film thickness gauge based on the PCAP01 high-precision capacitance measurement chip has been developed. Because the change in probe capacitance per unit film thickness change is negatively correlated with the distance between the probe's two metal plates, this distance must be kept as small as possible. This presents challenges in probe fabrication and placement within the film. This mechanical design provides a feasible solution for securing the two plates and inserting the film without mechanical disturbance.

[0005] The mechanical device has the advantages of strong resistance to mechanical disturbance, easy assembly, and simple operation.

[0006] In view of this, the present utility model is proposed. Utility Model Content

[0007] In order to solve the above technical problems, the basic concept of the technical solution adopted by the present invention is:

[0008] A non-contact high-precision thickness measuring instrument mechanical device comprises a support plate; an intermediate partition plate is arranged above the support plate;

[0009] The bottom of the middle partition plate is attached to the top surface of the lower electrode plate, and the bottom surface of the lower electrode plate is attached to the support plate;

[0010] The top surface of the middle interlayer plate is overlapped with the upper electrode plate, and the top surface of the upper electrode plate is attached to the bottom surface of the protective cover; a circular opening is opened on the middle interlayer plate, and a film placement notch communicating with the circular opening is opened on one side of the middle interlayer plate.

[0011] As a preferred embodiment of the present invention, the diameter of the circular opening is smaller than the diameter of the upper electrode plate, and the upper electrode plate and the lower electrode plate have the same diameter.

[0012] As a preferred embodiment of the present invention, the four corners of the middle partition plate are movably penetrated by four screws installed on the support plate.

[0013] As a preferred embodiment of the present invention, four screws installed on the support plate are movably inserted into the protective cover and fixed to the protective cover by matching nuts.

[0014] As a preferred embodiment of the present invention, the protective cover and the supporting plate are provided with milling grooves on the facing sides thereof for wiring and connecting the plates.

[0015] As a preferred embodiment of the present invention, the support plate, protective cover and middle partition plate are all made of acrylic plates; the upper plate and the lower plate have three mounting holes distributed at equal angles; and the upper plate and the lower plate are provided with wiring holes near the edge, and the wiring holes are vertically aligned with the milling grooves.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] The utility model can effectively assist in stably and flexibly placing the film between the two plates through the film placing notch opened by the middle partition plate, thereby achieving the testing effect.

[0018] The specific embodiments of the present invention will be described in further detail below with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In the attached figure:

[0020] Figure 1 This is a schematic diagram of the explosion structure of the protective cover, upper plate and support plate combined in the utility model;

[0021] Figure 2 This is a schematic diagram of the distribution structure of the upper electrode plate overlapped on the middle partition plate of the utility model;

[0022] Figure 3 This is a schematic diagram of the overall structure of the utility model;

[0023] Figure 4 This is a schematic diagram of the distribution structure of the film of the utility model on the plastic sealing film.

[0024] In the figure: 1. Support plate; 2. Protective cover; 3. Upper plate; 4. Lower plate; 5. Middle interlayer plate; 6. Milling groove; 7. Film placement notch; 8. Mounting hole; 9. Wiring hole; 10. Film to be tested; 11. Plastic film. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. The following embodiments are used to illustrate the present invention.

[0026] like Figures 1 to 3As shown, a non-contact high-precision thickness measuring instrument mechanical device includes a support plate 1; an intermediate partition plate 5 is arranged above the support plate 1; the lower side of the intermediate partition plate 5 is attached to the top surface of the lower electrode plate 4, and the bottom surface of the lower electrode plate 4 is attached to the support plate 1; the top surface of the intermediate partition plate 5 is overlapped with the upper electrode plate 3, and the top surface of the upper electrode plate 3 is attached to the bottom surface of the protective cover 2; a circular opening is opened on the intermediate partition plate 5, and a film placement notch 7 communicating with the circular opening is opened on one side of the intermediate partition plate 5.

[0027] like Figures 1 to 3 As shown, the diameter of the circular opening is smaller than that of the upper plate 3, and the upper plate 3 and the lower plate 4 have the same diameter. In this arrangement, this ensures that the intermediate plate 5 can separate the upper plate 3 and the lower plate 4, leaving space for inserting the film. When inserting the film, the film 10 needs to be placed on the plastic film 11 for sealing, and then the plastic film 11 is pushed into the gap between the two plates through the film insertion notch 7.

[0028] like Figures 1 to 3 As shown, further, four corners of the middle partition plate 5 are movably penetrated by four screws installed on the support plate 1.

[0029] like Figures 1 to 3 As shown, further, the four screws installed on the support plate 1 are movable through the protective cover 2 and fixed with the protective cover 2 by suitable nuts. The protective cover 2 and the support plate 1 are provided with milling grooves 6 on the facing sides for wiring and connecting the plates. The support plate 1, the protective cover 2 and the middle partition plate 5 are all made of acrylic plates; three mounting holes 8 distributed at equal angles are provided on the upper plate 3 and the lower plate 4; and wiring holes 9 are provided near the edge of the upper plate 3 and the lower plate 4, and the wiring holes 9 are vertically aligned with the milling grooves 6, so that the wires connected to the plates can be wired from the milling grooves 6 and finally connected to the wiring holes 9 of the plates, thereby achieving the purpose of electrical connection.

[0030] The mechanical device of a non-contact, high-precision thickness gauge in this embodiment operates as follows: A metal upper plate and a metal lower plate, each with a diameter of 195 mm, are separated by a 1.3 mm thick, hollowed-out acrylic sheet. The hollowed-out circle has a diameter of 181 mm, slightly smaller than the plate diameter. Three sets of M3 nylon bolts and nuts spaced 120° apart secure the relative positions of the plates, as well as the plates and the acrylic material, ensuring that the plates maintain their facing positions and prevent relative sliding between the plates and the device. Because the method of inserting and removing a film, which involves tilting the device and then tilting it, introduces significant mechanical disturbances to the entire device, resulting in significant data instability, a 50 μm x 2 plastic film is used as a film carrier. Each time a film is inserted or removed, the film carrier is carefully extracted from the notch in the middle acrylic layer, placed on / removed from the carrier, and then carefully inserted back into the plates, achieving film insertion and removal with minimal mechanical disturbance.

[0031] This technical solution is based on the principle that the probe consists of two circular, fixed, parallel aluminum alloy plates with a constant facing area and spacing between the plates. When films of varying thicknesses are placed between the two plates of the parallel-plate capacitance probe, the probe's capacitance value changes accordingly. The STM32F106C8T6 microcontroller communicates with PCAP01 via the SPI protocol to obtain the probe's capacitance value. This capacitance data is then filtered in the microcontroller using software filtering, including Kalman filtering, moving average filtering, and exponential smoothing, to achieve relatively stable capacitance data. After the system has been powered on and stabilized for a period of time, on-site calibration is performed: films of varying standard thicknesses are placed in the probe, and the nominal thickness and corresponding capacitance values ​​are recorded. Because capacitance data fluctuate even when measuring films of the same thickness, the average of these recorded values ​​is used as the capacitance value corresponding to the current film thickness. The film is replaced and the above steps are repeated to obtain a number of (C, d) data points. MATLAB is used to fit the function d = f(C), which is then written to the MCU and reprogrammed under no-load conditions and reset. Then, a film of unknown thickness is placed on the device. The microcontroller then substitutes the capacitance value obtained at this point into the function to calculate the thickness. The user only needs to wait for the measured value displayed on the OLED screen to stabilize before reading the thickness data and completing the thickness measurement.

[0032] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "include," "comprise," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a series of elements includes not only those elements but also other elements not explicitly listed, or also includes elements inherent to such process, method, article, or apparatus;

[0033] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

[0034] The above description only describes the specific implementation methods of the utility model. Various examples do not limit the essential content of the utility model. Ordinary technicians in the relevant technical field can make modifications or deformations to the specific implementation methods described above after reading the description without departing from the essence and scope of the utility model.

Claims

1. A non-contact high-precision thickness measuring instrument mechanical device, characterized in that: include: A support plate (1); a middle partition plate (5) is provided above the support plate (1); The lower side of the middle partition plate (5) is attached to the top surface of the lower electrode plate (4), and the bottom surface of the lower electrode plate (4) is attached to the support plate (1); The top surface of the middle interlayer plate (5) is overlapped with the upper electrode plate (3), and the top surface of the upper electrode plate (3) is attached to the bottom surface of the protective cover (2); a circular opening is provided on the middle interlayer plate (5), and a film placement notch (7) communicating with the circular opening is provided on one side of the middle interlayer plate (5).

2. A non-contact high-precision thickness measuring instrument mechanical device according to claim 1, characterized in that: The diameter of the circular opening is smaller than the diameter of the upper electrode plate (3), and the upper electrode plate (3) and the lower electrode plate (4) have the same diameter.

3. A non-contact high-precision thickness measuring instrument according to claim 1, characterized in that: The four corners of the middle partition plate (5) are movably penetrated by four screws installed on the support plate (1).

4. A non-contact high-precision thickness measuring instrument according to claim 3, characterized in that: Four screws mounted on the support plate (1) are movably inserted into the protective cover (2) and fixed to the protective cover (2) via matching nuts.

5. The non-contact high-precision thickness measuring instrument according to claim 1, characterized in that: Milling grooves (6) are provided on the facing sides of the protective cover (2) and the support plate (1) for wiring and connecting the plates.

6. The non-contact high-precision thickness measuring instrument according to claim 1, characterized in that: The support plate (1), the protective cover (2) and the middle partition plate (5) are all made of acrylic plates.

7. The non-contact high-precision thickness measuring instrument according to claim 1, characterized in that: The upper plate (3) and the lower plate (4) are provided with three mounting holes (8) distributed at equal angles; and the upper plate (3) and the lower plate (4) are both provided with wiring holes (9) near the edges, and the wiring holes (9) are vertically aligned with the milling grooves (6).

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