Wafer box cleanliness detection device based on gas particle concentration

Abstract

The utility model discloses a wafer box cleanliness detection device based on gas particle concentration, and relates to the technical field of gas particle concentration detection, and the wafer box cleanliness detection device comprises a cavity which is a core area for wafer processing and is used for providing a closed and clean environment; the temperature and oxygen concentration sensor is fixedly mounted in the cavity, and the temperature and oxygen concentration sensor is used for monitoring the temperature and the oxygen concentration; and the front opening type wafer box is arranged in the cavity body. According to the utility model, through the design of the closed chamber, a stable test environment is provided, external interference is avoided, the air tightness of the front open type wafer box is rapidly judged by using temperature and oxygen concentration changes during air inflation, the detection probability is improved through temperature and oxygen concentration dual detection, leakage points are rapidly identified through multi-point monitoring, and the detection efficiency is improved. And the influence of the environment can be effectively reduced when the air tightness of the front open type wafer box is detected.

Description

Technical Field

[0001] The utility model belongs to the technical field of gas particle concentration detection, in particular to a wafer box cleanliness detection device based on gas particle concentration. Background Art

[0002] In semiconductor manufacturing, wafer cassettes, the storage and transport containers for wafers, have a cleanliness level that directly impacts wafer quality and the performance of the final product. During production, transportation, and storage, wafer cassettes may be exposed to airborne contaminants such as dust and particulate matter. If these tiny particles adhere to the wafer surface, they can severely impact wafer processing accuracy and reliability, and even reduce the yield rate of the entire production line. Therefore, accurate and efficient testing of wafer cassette cleanliness is crucial for ensuring semiconductor production quality.

[0003] The existing technology has the following shortcomings: the existing gas particle concentration wafer box cleanliness detection device takes a long time to detect, cannot quickly measure the air tightness of the wafer box, is greatly affected by the environment, and the temperature and surrounding wind speed when stationary affect the results. At the same time, it is affected by the environment, and the external ambient temperature affects the detection accuracy. Utility Model Content

[0004] The utility model aims to solve at least one of the technical problems existing in the prior art; to this end, the utility model proposes a wafer box cleanliness detection device based on gas particle concentration.

[0005] In order to achieve the above-mentioned purpose, the present invention adopts the following technical solution: a wafer box cleanliness detection device based on gas particle concentration, comprising: a cavity, which is the core area of ​​wafer processing and is used to provide a closed and clean environment;

[0006] Temperature and oxygen concentration sensors are fixedly installed inside the cavity and are used to monitor temperature and oxygen concentration;

[0007] A front-opening wafer cassette is disposed inside the cavity and is used to ensure the safety and cleanliness of wafers during transportation and storage;

[0008] The cavity door is connected to one side of the cavity for opening and closing, and is used to ensure the stability of the internal environment.

[0009] Preferably, it also includes a first solenoid valve, a second solenoid valve, a third solenoid valve, and a fourth solenoid valve. The first solenoid valve, the second solenoid valve, the third solenoid valve, and the fourth solenoid valve are all arranged outside the cavity, and the first solenoid valve, the second solenoid valve, the third solenoid valve, and the fourth solenoid valve are used to control the inlet and outlet of gas.

[0010] Preferably, four groups of gas transmission channels are fixedly installed on the cavity and communicate with the interior of the cavity, and the first solenoid valve, the second solenoid valve, the third solenoid valve, and the fourth solenoid valve are all installed in the four groups of gas transmission channels.

[0011] Preferably, the first solenoid valve, the second solenoid valve, the third solenoid valve, the fourth solenoid valve, the temperature sensor and the oxygen concentration sensor are all electrically connected.

[0012] Preferably, the front-opening wafer box is fixedly mounted on a connecting plate by bolts, and the connecting plate is provided with connecting holes for threaded connection with the bolts, and the connecting holes are provided in four groups and arranged around the connecting plate.

[0013] Preferably, a bracket mechanism is installed on the lower surface of the connecting plate, and the bracket mechanism is provided in two groups and is symmetrically arranged.

[0014] Preferably, the bracket mechanism includes a support column, one side of the support column is fixedly connected to the cavity, the bracket mechanism is used to provide supporting force, a large bevel gear is rotatably connected to the support column, and the large bevel gear is meshedly connected to the small bevel gear, and the middle part of the small bevel gear is fixedly connected to a connecting shaft, and the side of the connecting shaft away from the small bevel gear is fixedly connected to a knob;

[0015] A lifting column is slidably connected to the supporting column. The lifting column is used to move and adjust the height. One side of the lifting column is threadedly connected to a threaded screw, and the threaded screw is fixedly connected to the middle of the large bevel gear.

[0016] Preferably, the connecting shaft passes through and is rotatably connected to one side of the support column, and sliding blocks are fixedly connected to both sides of the support column, and the sliding blocks move through the sliding grooves opened on both sides of the support column, and the sliding blocks are slidably connected to the limit column, and the limit column is fixedly installed in the sliding groove set in the support column.

[0017] Compared with the prior art, the beneficial effects of the present invention are:

[0018] (1) In this application, a closed chamber design is used to provide a stable test environment to avoid external interference. The temperature and oxygen concentration changes during inflation are used to quickly determine the airtightness of the front-opening wafer box. The dual detection of temperature and oxygen concentration increases the probability of detection. The multi-point monitoring allows for rapid identification of leak points, effectively reducing the impact of the environment when testing the airtightness of the front-opening wafer box.

[0019] (2) In this utility model, by turning the knob, the knob drives the connecting shaft and the small bevel gear to rotate along one side of the support column, the small bevel gear drives the large bevel gear to rotate, the large bevel gear drives the threaded screw to rotate, and the threaded screw rotates so that the lifting column moves upward along the limit column and the slide groove in the support column through the limit of the sliding block. The lifting column moves upward and then drives the connecting plate upward to adjust the height. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a schematic cross-sectional view of a wafer box cleanliness detection device based on gas particle concentration according to the present invention;

[0021] Figure 2 This is a schematic diagram of the three-dimensional structure of the bracket mechanism and the connecting plate of the utility model;

[0022] Figure 3 This is a schematic diagram of the split structure of the bracket mechanism of the utility model;

[0023] Figure 4 for Figure 3 Enlarged view of point A in the middle.

[0024] In the figure: 101, first solenoid valve; 102, second solenoid valve; 103, third solenoid valve; 104, fourth solenoid valve; 105, temperature and oxygen concentration sensor; 106, chamber; 107, front-opening wafer box; 108, chamber door; 109, bracket mechanism; 1091, small bevel gear; 1092, support column; 1093, lifting column; 1094, knob; 1095, connecting shaft; 1096, large bevel gear; 1097, threaded screw; 1098, sliding block; 1099, limit column; 201, connecting plate; 202, connecting hole. DETAILED DESCRIPTION

[0025] The following will clearly and completely describe the technical solutions of the present invention in conjunction with the embodiments. Obviously, the embodiments described are only a part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0026] Example 1

[0027] See also Figure 1 - Figure 4 , the present application provides a wafer box cleanliness detection device based on gas particle concentration, comprising: a cavity 106, the cavity 106 is the core area of ​​the wafer processing, and the cavity 106 is used to provide a closed and clean environment;

[0028] Temperature and oxygen concentration sensor 105, the temperature and oxygen concentration sensor 105 is fixedly installed inside the cavity 106, and the temperature and oxygen concentration sensor 105 is used to monitor the temperature and oxygen concentration;

[0029] A front-opening wafer box 107 is provided inside the cavity 106 and is used to ensure the safety and cleanliness of wafers during transportation and storage;

[0030] The cavity door 108 is connected to one side of the cavity body 106 for opening and closing, and is used to ensure the stability of the internal environment.

[0031] It should be noted that the chamber door 108 is slidably connected to the chamber body 106, making it easier to slide the chamber door 108 open. The temperature and oxygen concentration sensor 105 is specifically located at the front opening seam of the front-opening wafer box 107 and next to the inlet and outlet valve body of the front-opening wafer box 107.

[0032] In this embodiment, preferably, the first solenoid valve 101, the second solenoid valve 102, the third solenoid valve 103, and the fourth solenoid valve 104 are also included. The first solenoid valve 101, the second solenoid valve 102, the third solenoid valve 103, and the fourth solenoid valve 104 are all arranged outside the cavity 106, and the first solenoid valve 101, the second solenoid valve 102, the third solenoid valve 103, and the fourth solenoid valve 104 are used to control the inlet and outlet of gas.

[0033] In this embodiment, preferably, four groups of gas transmission channels are fixedly installed on the upper portion of the cavity 106 and are connected to the interior of the cavity 106, and the first solenoid valve 101, the second solenoid valve 102, the third solenoid valve 103, and the fourth solenoid valve 104 are all installed in the four groups of gas transmission channels.

[0034] It should be noted that an intake one-way valve is installed in the gas transmission channel where the first solenoid valve 101 and the fourth solenoid valve 104 are located, and an exhaust one-way valve is installed in the gas transmission channel where the second solenoid valve 102 and the fourth solenoid valve 104 are located. The first solenoid valve 101 and the second solenoid valve 102 are used in pairs, and the third solenoid valve 103 and the fourth solenoid valve 104 are used in pairs.

[0035] In this embodiment, preferably, the first solenoid valve 101 , the second solenoid valve 102 , the third solenoid valve 103 , the fourth solenoid valve 104 , and the temperature and oxygen concentration sensor 105 are all electrically connected.

[0036] It should be noted that the first solenoid valve 101 , the second solenoid valve 102 , the third solenoid valve 103 , the fourth solenoid valve 104 , and the temperature and oxygen concentration sensor 105 are all controlled by a controller (not shown) through wireless signal transmission.

[0037] When in use, first place the front-opening wafer box 107 on the connecting plate 201 in the chamber 106 and connect it to the connecting hole 202 through bolts, and then manually push the chamber door 108 to close it;

[0038] The controller opens the first solenoid valve 101, the second solenoid valve 102, the third solenoid valve 103, and the fourth solenoid valve 104 to fill the cavity 106 with clean, dry air. The clean, dry air flows in from the first solenoid valve 101 and out from the second solenoid valve 102. After the values ​​of the temperature and oxygen concentration sensor 105 stabilize, the first solenoid valve 101 and the second solenoid valve 102 are closed.

[0039] Open the fourth solenoid valve 104 and the third solenoid valve 103 to fill nitrogen into the front-opening wafer box 107 at a flow rate of 35 L / Min for 90 seconds.

[0040] When the values ​​of the temperature and oxygen concentration sensor 105 change, if the temperature and oxygen concentration do not decrease significantly, the airtightness of the front-opening wafer box 107 is good; if either the temperature or the oxygen concentration decreases, the airtightness of the front-opening wafer box 107 is poor;

[0041] Close the fourth solenoid valve 104 and the third solenoid valve 103 to stop nitrogen filling;

[0042] The chamber door 108 is opened, the front-opening wafer box 107 is taken out, and the airtightness test is completed.

[0043] Example 2

[0044] In this embodiment, preferably, the front-opening wafer box 107 is fixed to the connecting plate 201 by bolts. The connecting plate 201 is provided with connecting holes 202, which are used for threaded connection with the bolts. There are four groups of connecting holes 202 and they are arranged around the connecting plate 201.

[0045] It should be noted that threads are provided in the connection hole 202 to make the front-opening wafer box 107 more convenient to install.

[0046] In this embodiment, preferably, a bracket mechanism 109 is installed on the lower surface of the connecting plate 201 , and two groups of bracket mechanisms 109 are provided and are symmetrically arranged.

[0047] In this embodiment, preferably, the bracket mechanism 109 includes a support column 1092, one side of the support column 1092 is fixedly connected to the cavity 106, and the bracket mechanism 109 is used to provide a supporting force. A large bevel gear 1096 is rotatably connected to the support column 1092, and the large bevel gear 1096 is meshedly connected to the small bevel gear 1091. At the same time, a connecting shaft 1095 is fixedly connected to the middle of the small bevel gear 1091, and a knob 1094 is fixedly connected to the side of the connecting shaft 1095 away from the small bevel gear 1091;

[0048] Lifting column 1093, lifting column 1093 is slidably connected to the support column 1092, and the lifting column 1093 is used to move and adjust the height. One side of the lifting column 1093 is threadedly connected to a threaded screw 1097, and the threaded screw 1097 is fixedly connected to the middle of the large bevel gear 1096.

[0049] In this embodiment, preferably, the connecting shaft 1095 passes through and is rotatably connected to one side of the support column 1092, and sliding blocks 1098 are fixedly connected to both sides of the support column 1092, and the sliding blocks 1098 move through the sliding grooves opened on both sides of the support column 1092, and the sliding blocks 1098 are slidably connected to the limiting column 1099, and the limiting column 1099 is fixedly installed in the sliding groove set in the support column 1092.

[0050] It should be noted that the support column 1092 and the lifting column 1093 are both cylindrical in shape, making them easier to support. The small bevel gear 1091, the large bevel gear 1096, and the threaded screw 1097 are all arranged inside the support column 1092 to avoid interference during transmission, which can effectively maintain the stability of its transmission.

[0051] During use, when it is necessary to adjust the height of the front-opening wafer box 107 on the connecting plate 201, turn the knob 1094, and the knob 1094 drives the connecting shaft 1095 and the small bevel gear 1091 to rotate along one side of the support column 1092. The small bevel gear 1091 drives the large bevel gear 1096 to rotate, and the large bevel gear 1096 drives the threaded screw 1097 to rotate. The rotation of the threaded screw 1097 causes the lifting column 1093 to move upward along the limit column 1099 and the slide groove in the support column 1092 through the limit of the sliding block 1098 with the sliding block 1098. The lifting column 1093 moves upward and then drives the connecting plate 201 upward to adjust the height.

[0052] The above embodiments are only used to illustrate the technical method of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical method of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical method of the present invention.

Claims

1. A wafer box cleanliness detection device based on gas particle concentration, characterized in that: include: A cavity (106), the cavity (106) being a core area for wafer processing, and the cavity (106) being used to provide a closed and clean environment; a temperature and oxygen concentration sensor (105), wherein the temperature and oxygen concentration sensor (105) is fixedly installed inside the cavity (106), and the temperature and oxygen concentration sensor (105) is used to monitor the temperature and oxygen concentration; A front-opening wafer box (107), the front-opening wafer box (107) being arranged inside the cavity (106), the front-opening wafer box (107) being used to ensure the safety and cleanliness of wafers during transportation and storage; A cavity door (108) is connected to one side of the cavity (106) for opening and closing, and the cavity door (108) is used to ensure the stability of the internal environment.

2. The wafer box cleanliness detection device based on gas particle concentration according to claim 1, characterized in that: The invention also includes a first solenoid valve (101), a second solenoid valve (102), a third solenoid valve (103), and a fourth solenoid valve (104). The first solenoid valve (101), the second solenoid valve (102), the third solenoid valve (103), and the fourth solenoid valve (104) are all arranged outside the cavity (106). The first solenoid valve (101), the second solenoid valve (102), the third solenoid valve (103), and the fourth solenoid valve (104) are used to control the inlet and outlet of gas.

3. The wafer box cleanliness detection device based on gas particle concentration according to claim 2, characterized in that: Four groups of gas transmission channels are fixedly installed on the cavity (106) and communicate with the interior of the cavity (106), and the first solenoid valve (101), the second solenoid valve (102), the third solenoid valve (103), and the fourth solenoid valve (104) are all installed in the four groups of gas transmission channels.

4. The wafer box cleanliness detection device based on gas particle concentration according to claim 3, characterized in that: The first solenoid valve (101), the second solenoid valve (102), the third solenoid valve (103), the fourth solenoid valve (104), and the temperature and oxygen concentration sensor (105) are all electrically connected.

5. The wafer box cleanliness detection device based on gas particle concentration according to claim 4, characterized in that: The front-opening wafer box (107) is fixedly mounted on the connecting plate (201) by means of bolts. The connecting plate (201) is provided with connecting holes (202). The connecting holes (202) are used for threaded connection with the bolts. The connecting holes (202) are provided in four groups and are arranged around the connecting plate (201).

6. The wafer box cleanliness detection device based on gas particle concentration according to claim 5, characterized in that: A bracket mechanism (109) is installed on the lower surface of the connecting plate (201), and the bracket mechanism (109) is provided in two groups and is symmetrically arranged.

7. The wafer box cleanliness detection device based on gas particle concentration according to claim 6, characterized in that: The support mechanism (109) includes a support column (1092), one side of the support column (1092) is fixedly connected to the cavity (106), and the support mechanism (109) is used to provide a supporting force. A large bevel gear (1096) is rotatably connected to the support column (1092), and the large bevel gear (1096) is meshedly connected to the small bevel gear (1091). At the same time, a connecting shaft (1095) is fixedly connected to the middle of the small bevel gear (1091), and a knob (1094) is fixedly connected to the side of the connecting shaft (1095) away from the small bevel gear (1091); A lifting column (1093) is slidably connected to the support column (1092). The lifting column (1093) is used to move and adjust the height. One side of the lifting column (1093) is threadedly connected to a threaded screw (1097), and the threaded screw (1097) is fixedly connected to the middle of the large bevel gear (1096).

8. The wafer box cleanliness detection device based on gas particle concentration according to claim 7, characterized in that: The connecting shaft (1095) passes through and is rotatably connected to one side of the support column (1092). Both sides of the support column (1092) are fixedly connected with sliding blocks (1098), and the sliding blocks (1098) move through the sliding grooves opened on both sides of the support column (1092). The sliding blocks (1098) are slidably connected to the limiting column (1099), and the limiting column (1099) is fixedly installed in the sliding groove provided in the support column (1092).

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