Transmit-receive integrated optical module heat radiation structure

Abstract

The utility model relates to a transmit-receive integrated optical module heat radiation structure, which comprises a base, a bottom cover and a heat radiation piece, the bottom cover is connected to the bottom of the base, the heat radiation piece is connected to the top of the base, and the bottom of the heat radiation piece extends into the base and is in contact with an electric chip of a circuit board arranged in the base through a heat conduction interface material. The heat dissipation piece is provided with a plurality of heat dissipation air channels arranged in parallel, and the heat dissipation piece is made of red copper. The heat conduction function of the heat dissipation structure is improved by more than 2.4 times compared with that of an existing aluminum alloy scheme, the power consumption of the receiving and emitting light module is effectively reduced, the performance of the receiving and emitting light module serving as a core assembly of an optical fiber communication system is effectively improved, the service life of the receiving and emitting light module is effectively prolonged, and then the stability and efficiency of the whole communication system are effectively improved.

Description

Technical Field

[0001] The utility model relates to the technical field of optical communications, and in particular to a heat dissipation structure of a transceiver integrated optical module. Background Art

[0002] With the rapid rise of large AI models, such as ChatGPT, modern data centers require faster, higher-bandwidth information transmission technologies to cope with the ever-increasing volume of data. Fiber optic communication, with its unique high capacity and low loss characteristics, has become the ideal transmission method for modern data centers. As a core component of fiber optic communication systems, the performance of optical transceiver modules is directly related to the stability and efficiency of the entire communication system.

[0003] High-speed transceiver optical modules primarily perform optoelectronic / electro-optical conversion and are a crucial component of fiber-optic communication systems. These modules consist primarily of optoelectronic components (primarily transmitter and receiver units), functional circuits (primarily management units and digital signal processing (DSP) chips), and optical interfaces. When operating, these components generate significant heat. Poor heat dissipation can significantly reduce the lifespan and performance of these components.

[0004] Currently, the more mature processing technology is aluminum alloy die-casting or extrusion molding, and the thermal conductivity of aluminum alloy is approximately 160W / (m*K). With the rapid iteration of AI and cloud computing power driving a large market demand for 800G / 1.6T high-speed optical modules, the operating power consumption of high-speed optical modules has doubled and the heat generated has increased. The low thermal conductivity of aluminum alloy cannot meet the growing heat dissipation requirements of higher-speed and higher-bandwidth optical modules (such as 800G and 1.6T), which can easily reduce the heat dissipation efficiency of optical transceiver modules and shorten their service life. Summary of the Invention

[0005] The utility model provides a heat dissipation structure of a transceiver integrated optical module, aiming to solve the problem of poor heat dissipation effect of the heat dissipation structure of the transceiver optical module.

[0006] The utility model provides a heat dissipation structure of a transceiver integrated optical module, comprising a base, a bottom cover and a heat sink, wherein the bottom cover is connected to the bottom of the base, the heat sink is connected to the top of the base, the bottom of the heat sink extends into the base and contacts an electric chip of a circuit board arranged in the base through a thermal interface material, the heat sink is provided with a plurality of parallel heat dissipation ducts, and the material of the heat sink is copper.

[0007] As a further improvement of the present invention, a V-shaped groove is provided at the top front end of the base, a placement groove is provided extending from the V-shaped groove to the tail of the base, a through hole is provided in the placement groove, and the heat sink is provided in the through hole.

[0008] As a further improvement of the present invention, the heat dissipation element includes a first heat dissipation plate, a second heat dissipation plate and a plurality of fins, one side of the fin is connected to the top of the second heat dissipation plate, and the other side of the fin is connected to the bottom of the first heat dissipation plate, and the heat dissipation duct is formed between adjacent fins.

[0009] As a further improvement of the present invention, the bottom surface of the first heat dissipation plate is provided with a plurality of parallel grooves, and the other side of the fin is connected to the grooves.

[0010] As a further improvement of the present invention, a heat dissipation boss is provided at the bottom of the second heat dissipation plate, and the heat dissipation boss is a step structure. The low-order surface of the heat dissipation boss is clamped in the through hole, and the high-order surface of the heat dissipation boss is in contact with the electrical chip through a thermal interface material.

[0011] As a further improvement of the present invention, the second heat sink, heat dissipation boss and fins are an integrally formed structure. As a further improvement of the present invention, the base and bottom cover are made of aluminum.

[0012] As a further improvement of the present invention, it further includes a handle and an unlocking plate, wherein the unlocking plate is inserted into the tail end of the handle, and the unlocking plate is clamped on both sides of the base and located between the base and the bottom cover.

[0013] The beneficial effects of the present invention are as follows: the thermal conductivity of the heat dissipation structure of the present invention is improved by more than 2.4 times compared with the existing aluminum alloy solution, effectively reducing the power consumption of the light-receiving and light-emitting modules, and effectively improving the performance and service life of the light-receiving and light-emitting modules as core components of the optical fiber communication system, thereby effectively improving the stability and efficiency of the entire communication system. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is an overall diagram of the light-emitting and receiving module of the present invention;

[0015] Figure 2 It is a schematic diagram of the heat dissipation element of the utility model;

[0016] Figure 3 It is a schematic diagram of the bottom of the heat sink of the utility model;

[0017] Figure 4 It is a schematic diagram of the bottom surface of the first heat dissipation plate of the utility model;

[0018] Figure 5It is a schematic diagram of the base of the utility model;

[0019] Figure 6 It is a schematic diagram of the bottom of the heat sink of the utility model after being combined with the base.

[0020] Figure markings: 1-base, 2-bottom cover, 3-heat sink, 4-handle, 5-unlocking plate, 10-V-groove, 11-placement groove, 12-through hole, 31-first heat sink, 32-second heat sink, 33-fin, 34-heat dissipation duct, 35-heat dissipation boss, 36-groove. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be noted that the terms "front," "rear," "left," "right," "upper," and "lower" used in the following description refer to directions in the accompanying drawings, and the terms "bottom," "top," "inner," and "outer" refer to directions toward or away from the geometric center of a specific component, respectively.

[0022] like Figure 1-6 As shown, the utility model provides a heat dissipation structure of a transceiver integrated optical module, including a base 1, a bottom cover 2 and a heat sink 3, wherein the bottom cover 2 is connected to the bottom of the base 1, and the heat sink 3 is connected to the top of the base 1. The bottom of the heat sink 3 extends into the base 1 and contacts the electric chip of the circuit board arranged in the base 1 through a thermal interface material. The heat sink 3 is provided with a plurality of parallel heat dissipation ducts 34, and the material of the heat sink 3 is copper.

[0023] As an embodiment of the present utility model, a V-shaped groove 10 is provided at the top front end of the base 1, and a placement groove 11 is provided extending from the V-shaped groove 10 to the tail of the base 1. A through hole 12 is provided in the placement groove 11, and the heat sink 3 is arranged in the through hole 12.

[0024] As another embodiment of the present invention, the heat dissipation element 3 includes a first heat dissipation plate 31, a second heat dissipation plate 32 and a plurality of fins 33, one side of the fin 33 is connected to the top of the second heat dissipation plate 32, and the other side of the fin 33 is connected to the bottom of the first heat dissipation plate 31, and the heat dissipation duct 34 is formed between adjacent fins 33.

[0025] As another embodiment of the present invention, a plurality of parallel grooves 36 are provided on the bottom surface of the first heat dissipation plate 31 , and the other side of the fin 33 is connected to the groove 36 .

[0026] As another embodiment of the present invention, a heat dissipation boss 35 is provided at the bottom of the second heat dissipation plate 32. The heat dissipation boss 35 is a step structure. The low-order surface of the heat dissipation boss 35 is clamped in the through hole 12, and the high-order surface of the heat dissipation boss 35 is in contact with the electrical chip through the thermal interface material.

[0027] As another embodiment of the present invention, the second heat dissipation plate 32 , the heat dissipation boss 35 and the fins 33 are an integrally formed structure.

[0028] As another embodiment of the present invention, the base 1 and the bottom cover 2 are made of aluminum.

[0029] As another embodiment of the present invention, it further includes a handle 4 and an unlocking plate 5, wherein the unlocking plate 5 is inserted into the tail end of the handle 4, and the unlocking plate 5 is clamped on both sides of the base 1 and located between the base 1 and the bottom cover 2.

[0030] The present invention provides a heat dissipation structure for an integrated transceiver optical module, aiming to improve the poor heat dissipation problem of an existing eight-channel small form factor pluggable (OSFP) high-speed integrated transceiver optical module, and to provide a heat dissipation optimization solution for a top-surface enclosed heat sink. The heat sink 3 placed on top of the base 1 is made of copper. The thermal conductivity of copper C1100 is 385W / (m*K), which has significant advantages. Compared with the thermal conductivity of traditional die-cast or extruded aluminum alloy of 160W / (m*K), its thermal conductivity is improved by more than 2.4 times. At the same time, the heat dissipation boss 35 of the heat sink 3 extends into the interior of the base 1 and contacts the electronic chip through the thermal interface material, thereby improving the heat dissipation efficiency of the electronic chip.

[0031] The assembly process of the heat sink 3 is as follows: Using red copper C1100, the second heat sink 32 and heat dissipation boss 35 are milled using a CNC machine. Several fins 33 are machined on the top of the second heat sink 32 using a CNC machine. The first heat sink 31 is manufactured using CNC machining or stamping, and several grooves 36 are machined on the bottom surface of the first heat sink 31. The first heat sink 31 is attached to the top of the fins 33 by bonding or solder paste SMT reflow, so that the other side of the fins 33 is connected to the grooves 36. After the assembly is completed, the heat dissipation ducts 34 are formed between adjacent fins 33. The surface flatness of the heat sink 3 is greater than 0.075 mm, and the surface roughness is less than 0.08 μm.

[0032] The assembly process of the heat sink 3 and the base 1 is as follows: the heat sink 3 is placed in the placement groove 11 of the base 1 and connected to the top of the base 1 by bonding or solder paste SMT reflow. The heat dissipation boss 35 extends into the interior of the base 1 through the through hole 12, and the low-level surface of the heat dissipation boss 35 is snap-fitted into the through hole 12. The base 1 and bottom cover 2 are made of high-thermal-conductivity aluminum 6063 die-cast, sandblasted, and electroplated.

[0033] When assembling the light-emitting / receiving module, the base 1 is equipped with a circuit board, electronic chips, connectors, and other components. The unlocking plate 5 is installed in the grooves on both sides of the base 1. The bottom cover 2 is then connected to the bottom of the base 1. The high-order surface of the heat dissipation boss 35 contacts the electronic chips through the thermal interface material. At this point, the handle 4 is located at the front end of the base 1, and the light-emitting / receiving module can be taken out by the handle 4. The assembly of the light-emitting / receiving module is now complete.

[0034] When the light-emitting and receiving module is working, the heat dissipation boss 35 can promptly conduct heat from the electric chip through the thermal interface material, and use the air flow to blow out the light-emitting and receiving module through the heat dissipation duct 34 to achieve rapid heat dissipation. The V-shaped groove 10 is set at the front end of the placement groove 11, which can better gather the air flow and guide the air flow to the heat dissipation duct 34 to accelerate the heat dissipation speed. The second heat dissipation plate 32, the heat dissipation boss 35 and the fin 33 are an integrally formed structure of copper C1100 material, and the fin 33 is formed by the shovel process of a CNC machine tool. The material of the handle 4 is SANTOPRENE 251-92W232.

[0035] The above content is a further detailed description of the present invention in conjunction with specific preferred embodiments, and the specific implementation of the present invention cannot be considered to be limited to these descriptions. For those skilled in the art of the present invention, without departing from the concept of the present invention, several simple deductions or substitutions can be made, which should be considered to fall within the scope of protection of the present invention.

Claims

1. A heat dissipation structure of a transceiver integrated optical module, characterized in that: It includes a base, a bottom cover and a heat sink. The bottom cover is connected to the bottom of the base, the heat sink is connected to the top of the base, the bottom of the heat sink extends into the base and contacts the electric chip of the circuit board arranged in the base through a thermal interface material. The heat sink is provided with a plurality of parallel heat dissipation ducts, and the material of the heat sink is copper.

2. The heat dissipation structure of the transceiver integrated optical module according to claim 1, characterized in that: A V-shaped groove is provided at the top front end of the base, a placement groove is provided extending from the V-shaped groove to the tail of the base, a through hole is provided in the placement groove, and the heat sink is provided in the through hole.

3. The heat dissipation structure of the transceiver integrated optical module according to claim 2, characterized in that: The heat sink includes a first heat sink, a second heat sink and a plurality of fins. One side of the fin is connected to the top of the second heat sink, and the other side of the fin is connected to the bottom of the first heat sink. The heat dissipation duct is formed between adjacent fins.

4. The heat dissipation structure of the transceiver integrated optical module according to claim 3, characterized in that: The bottom surface of the first heat dissipation plate is provided with a plurality of parallel grooves, and the other side of the fin is connected to the groove.

5. The heat dissipation structure of the transceiver integrated optical module according to claim 3, characterized in that: A heat dissipation boss is provided at the bottom of the second heat dissipation plate. The heat dissipation boss is a step structure. The low-order surface of the heat dissipation boss is clamped in the through hole, and the high-order surface of the heat dissipation boss is in contact with the electric chip through a thermal interface material.

6. The heat dissipation structure of the transceiver integrated optical module according to claim 5, characterized in that: The second heat dissipation plate, the heat dissipation boss and the fins are an integrally formed structure.

7. The heat dissipation structure of the transceiver integrated optical module according to claim 1, characterized in that: The base and the bottom cover are made of aluminum.

8. The heat dissipation structure of the transceiver integrated optical module according to claim 1, characterized in that: It also includes a handle and an unlocking plate. The unlocking plate is plugged into the tail end of the handle. The unlocking plate is clamped on both sides of the base and is located between the base and the bottom cover.

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