Display module interlayer structure, display module, display panel and display device

Abstract

The interlayer structure of the display module, the display module, the display panel and the display device provided by the utility model comprise a substrate layer and an ink layer, a single-layer area is arranged between the substrate layer and the ink layer, buffer glue is arranged in the single-layer area, and a thixotropic agent of the buffer glue is a non-silicon-based material. The non-silicon-based material, such as polyamide wax or calcium carbonate, is adopted as the thixotropic agent, so that the problem that silicon micromolecules in the existing buffer rubber are diffused at high temperature is solved, and the micromolecules are prevented from permeating into the ink layer, so that the shearing force of the ink layer and the mechanical strength of the module are maintained, and the long-term reliability of the display module is improved.

Description

Technical Field

[0001] The utility model relates to the field of display panel structures, and in particular to an interlayer structure of a display module, a display module, a display panel, and a display device. Background Art

[0002] With the advancement of display technology, thin-film transistor liquid crystal display (TFT-LCD) and active-matrix organic light-emitting diode (AMOLED) display modules have become essential components in electronic products. These display modules typically consist of a multi-layer structure, including a substrate layer, an ink layer, and a buffer layer to enhance the module's mechanical strength. These modules are widely used in high-end electronic devices such as smartphones, tablets, and smartwatches.

[0003] In the prior art, a single-layer region is typically provided between the substrate layer and the ink layer, and a buffering adhesive is applied within the single-layer region to enhance the mechanical strength of the module. Conventional buffering adhesives primarily utilize silicon-based materials as thixotropic agents. These materials impart excellent mechanical properties and thixotropy to the buffering adhesive, effectively buffering the module when subjected to external forces and protecting internal components from damage. However, these silicon-based thixotropic agents are susceptible to decomposition into small molecules of silicon under high-temperature aging or long-term storage conditions, which can diffuse into the ink layer in the display module, causing a decrease in the ink shear force, thereby affecting the stability of the module and the reliability of the overall assembly.

[0004] To address this issue, the industry typically adds fumed silica as a thixotropic agent to silicone-based adhesive buffers to reduce glue buildup during application and prevent overflow. However, while fumed silica as a thixotropic agent improves the stability of the adhesive buffer to a certain extent, it can still lead to degradation of the ink layer's performance due to diffusion of small silicon molecules over long-term use.

[0005] Therefore, effectively preventing the diffusion of small silicon molecules in the buffer glue while maintaining its good mechanical properties and thixotropy has become a major technical challenge in display module structural design. This is particularly true in display modules using low-temperature polycrystalline silicon (LTPS) technology, where the single-layer structure is more complex and precise, placing even higher demands on the performance of the buffer glue. Consequently, a more stable and efficient solution is needed to ensure the long-term reliability and excellent mechanical strength of the display module.

[0006] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present invention, and therefore may include information that does not constitute prior art known to ordinary technicians in this field. Utility Model Content

[0007] In light of this, the present invention provides an interlayer structure for a display module, a display module, a display panel, and a display device. These structures effectively address the prior art issue of small-molecule silicon diffusion caused by silicon-based thixotropic agents in the buffer adhesive, thereby preventing a reduction in the shear force of the ink layer and improving the overall stability and mechanical strength of the display module. By introducing a buffer adhesive using a non-silicon-based material as a thixotropic agent within the single-layer region of the display module, the present invention ensures that the performance of the display module is not compromised during high-temperature aging or long-term storage.

[0008] One aspect of the present invention provides a display module interlayer structure, including a substrate layer and an ink layer, wherein a single layer area is provided between the substrate layer and the ink layer, and a buffer glue is provided in the single layer area, and the thixotropic agent of the buffer glue is a non-silicon-based material.

[0009] Furthermore, the thixotropic agent is polyamide wax.

[0010] Furthermore, the thixotropic agent is calcium carbonate.

[0011] Furthermore, the non-silicon-based material is nanoparticles.

[0012] Furthermore, the thixotropic agent also includes a non-silicon-based surfactant or dispersant.

[0013] Furthermore, the surfactant is polyethylene glycol (PEG) or polyvinyl pyrrolidone.

[0014] Furthermore, the dispersant is a polyurethane dispersant.

[0015] Furthermore, the buffer rubber consists of at least two layers.

[0016] Furthermore, when the buffer glue has a two-layer structure, the upper layer is made of polyamide wax, which has excellent thixotropy and mechanical properties and mainly serves to enhance mechanical strength. The lower layer is made of calcium carbonate, a highly chemically stable material, which effectively prevents the diffusion of small silicon molecules at high temperatures and firmly bonds with the LTPS glass.

[0017] Furthermore, microstructuring is introduced between the upper polyamide wax layer and the lower calcium carbonate material, such as forming a tiny concave and convex structure on the material surface. This structure is achieved through methods such as machining or laser etching, which can increase the surface area between the two layers and improve adhesion.

[0018] Furthermore, the buffer glue also includes non-silicon-based thermal conductive materials.

[0019] Furthermore, the thermal conductive material is graphene or carbon fiber to enhance its thermal conductivity, and the shape of the buffer glue is optimized to improve the thermal management effect.

[0020] Another aspect of the present invention further provides a display module, which includes the above-mentioned interlayer structure of the display module.

[0021] Another aspect of the present invention provides a display panel, which includes the interlayer structure of the display module.

[0022] Another aspect of the present invention provides a display device, which includes the above-mentioned display panel.

[0023] Compared with the prior art, the present invention has at least the following advantages:

[0024] By using non-silicon-based materials as thixotropic agents, such as polyamide wax or calcium carbonate, the problem of small silicon molecules diffusing at high temperatures in existing buffer glue is solved, preventing these small molecules from penetrating into the ink layer, thereby maintaining the shear force of the ink layer and the mechanical strength of the module, and improving the long-term reliability of the display module.

[0025] By adopting non-silicone-based thixotropic agent materials, not only the thixotropic properties of the buffer glue are improved, but also the chemical stability of the display module is enhanced, so that the display module exhibits better performance under high-temperature aging or long-term storage conditions, thereby extending the service life of the module.

[0026] In some embodiments, by adding thermally conductive materials such as graphene or carbon fiber to the buffer glue, the thermal conductivity of the module is further improved, the thermal management effect of the module is optimized, and the display performance degradation problem caused by temperature changes is effectively prevented.

[0027] In some embodiments, the utility model designs a multi-layer structure of a buffer glue with an upper layer of polyamide wax and a lower layer of calcium carbonate. Combined with special interface design, such as microstructuring treatment, the adhesion and coordination between the buffer glue and the substrate layer and the ink layer are enhanced, thereby improving the overall mechanical properties and impact resistance of the module.

[0028] In some embodiments, the present invention provides a variety of non-silicone-based thixotropic agents and thermally conductive materials for combination selection, giving the display module greater design flexibility and enabling customized optimization according to different usage environments and performance requirements, thereby meeting the application requirements of different display devices.

[0029] It should be understood that the above general description and the following detailed description are merely exemplary and explanatory and are not restrictive of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The accompanying drawings are incorporated into and constitute a part of the specification, illustrate embodiments consistent with the present invention, and together with the specification, are used to explain the principles of the present invention. Obviously, the drawings described below are only some embodiments of the present invention, and those skilled in the art can derive other drawings based on these drawings without inventive effort.

[0031] Figure 1 A schematic diagram showing the interlayer structure of a display module provided in a specific embodiment of the present invention is shown;

[0032] Figure 2 A partially enlarged schematic diagram of the interlayer structure of a display module provided in a specific embodiment of the present invention is shown.

[0033] Among them, 100-ink layer, 200-substrate layer, 300-buffer glue. DETAILED DESCRIPTION

[0034] Example embodiments will now be described more fully with reference to the accompanying drawings. However, the example embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that the present disclosure will be comprehensive and complete and will fully convey the concepts of the example embodiments to those skilled in the art. Identical reference numerals in the figures represent identical or similar structures, and thus repetitive descriptions thereof will be omitted.

[0035] The terms "upper" and "lower" used in the specific description to indicate the orientation or position relationship are based on the orientation or position relationship shown in the drawings. They are only for the convenience of description and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, they should not be understood as limiting the present invention.

[0036] The buffer glue 300 has excellent thixotropy, effectively improving the mechanical strength and chemical stability of the display module. Specifically, the main function of the buffer glue 300 is to provide additional cushioning and protection between the substrate layer 200 and the ink layer 100, enabling the module to better absorb energy when subjected to external impact, reducing the concentration of mechanical stress and preventing damage. In addition, the use of non-silicon-based materials as thixotropic agents in the buffer glue 300, such as polyamide wax or calcium carbonate, further prevents the diffusion of small silicon molecules at high temperatures, preventing them from penetrating into the ink layer 100, maintaining the shear force of the ink layer 100, and thus improving the long-term reliability of the module.

[0037] Combine Figures 1 to 2As shown, a display module interlayer structure of the present invention includes a substrate layer 200 and an ink layer 100, and a single layer area is included between the substrate layer 200 and the ink layer 100. The single layer area is provided with a buffer glue 300, and the thixotropic agent of the buffer glue 300 is a non-silicon-based material. This technical solution solves the problem that traditional silicon-based thixotropic agents are easily diffused into the ink layer 100 in a high temperature environment or after long-term storage, thereby causing the shear force of the ink layer 100 to decrease by introducing a buffer glue 300 with excellent thixotropic properties between the substrate layer 200 and the ink layer 100 of the display module. In actual use, the non-silicon-based material selected for the thixotropic agent in the buffer glue 300 can effectively prevent the diffusion of small silicon molecules, ensuring that the structural stability and shear force of the ink layer 100 will not be affected by long-term high-temperature use or long-term storage. The display module interlayer structure provided by the present invention significantly improves the heat resistance and long-term reliability of the module by adopting a buffer glue 300 with a non-silicon-based thixotropic agent, and avoids the risk of small silicon molecules diffusing into the ink layer 100. This structure effectively improves the overall mechanical properties and chemical stability of the display module, extends the service life of the equipment, and is suitable for complex application scenarios such as high temperature and high stress.

[0038] In some embodiments, the thixotropic agent is polyamide wax. Polyamide wax as a thixotropic agent has excellent thixotropy and mechanical properties. The use of this material solves the problem that traditional silicone-based thixotropic agents may cause the shear force of the ink layer 100 to decrease in high temperature environments. Polyamide wax in the buffer glue 300 can not only effectively improve the mechanical strength of the colloid and enhance the bonding force between the substrate layer 200 and the ink layer 100, but also maintain good thixotropic properties, ensuring that the display module can be evenly buffered between the structural layers when subjected to external stress or vibration, thereby avoiding irreversible damage to the module structure due to external forces. In the overall structure of the present utility model, polyamide wax as a non-silicone-based thixotropic agent is combined with the above-mentioned substrate layer 200, ink layer 100 and single-layer area design to provide an interlayer structure with both chemical stability and mechanical strength. The use of polyamide wax not only avoids the diffusion problem of silicone-based materials at high temperatures, but also ensures that it can provide a stable buffering effect when the pressure between the module layers changes through its thixotropic properties, further enhancing the long-term stability and reliability of the display module.

[0039] In some embodiments, the thixotropic agent is calcium carbonate. As a non-silicon-based material, calcium carbonate has good dispersibility and chemical stability, especially in high-temperature environments, it will not decompose or produce harmful small molecules, which makes it an ideal thixotropic agent material. The application of calcium carbonate solves the problem of small molecule silicon diffusion that may be caused by traditional silicon-based thixotropic agents at high temperatures, thereby avoiding the decrease in the shear force of the ink layer 100 and ensuring the long-term stability of the interlayer structure of the display module. In the present invention, calcium carbonate plays an important role as a thixotropic agent in combination with the substrate layer 200, the ink layer 100 and the single-layer area design. First, calcium carbonate can be effectively dispersed in the buffer glue 300, providing stable thixotropy, so that when the display module is subjected to external force, it can evenly disperse stress, reduce interfacial stress concentration, and prevent structural damage to the module. Secondly, the chemical stability of calcium carbonate ensures the reliability of the module under high-temperature operating conditions and avoids damage to the ink layer 100 and its performance due to high temperature. Through this design, the interlayer structure of the display module can remain stable under the action of mechanical stress and thermal stress, thereby extending the service life of the display module and improving the performance of the module in various complex environments.

[0040] In some embodiments, the non-silicon-based material is nanoparticles. As an advanced material, nanoparticles possess a high specific surface area and excellent dispersion properties, enabling them to be evenly distributed within the adhesive buffer 300 and providing a significant enhancement effect. Compared to traditional silicon-based materials, the use of nanoparticles in this utility model, combined with non-silicon-based materials, effectively addresses the performance degradation of the ink layer 100 caused by the diffusion of small silicon molecules in traditional display module structures. In this utility model, nanoparticles, as non-silicon-based materials, are introduced into the adhesive buffer 300 and, combined with the structural design of the substrate layer 200, ink layer 100, and monolayer region, play a key role. First, the nanoparticles significantly improve the mechanical properties and thermal stability of the adhesive buffer 300, enabling the display module to better disperse and buffer stress when subjected to external stress, thereby reducing interfacial stress concentration and preventing damage to the module structure. Second, the nanoparticles' high specific surface area enables them to tightly bond with other components in the adhesive buffer 300, enhancing the uniformity and stability of the overall material. Furthermore, the thermal conductivity of the nanoparticles helps improve the thermal management capabilities of the display module, ensuring module reliability in high-temperature operating environments. Through this design, the interlayer structure of the display module can effectively resist the influence of external mechanical and thermal stresses during use, extending the service life of the module and improving its performance in various complex operating environments.

[0041] In some embodiments, the thixotropic agent also includes a non-silicon-based surfactant or dispersant. The introduction of surfactants and dispersants is intended to solve the problem of uniform dispersion of the thixotropic agent in the buffer glue 300 and to improve the stability of the overall material. In the prior art, the uneven distribution of the thixotropic agent in the buffer glue 300 may lead to inconsistent material properties, thereby affecting the overall performance of the display module. By adding a non-silicon-based surfactant or dispersant to the thixotropic agent, the present invention can effectively improve the dispersion effect of the thixotropic agent, ensure its uniform distribution in the buffer glue 300 matrix, thereby improving the mechanical properties and chemical stability of the display module. Specifically, surfactants such as polyethylene glycol (PEG) or polyvinyl pyrrolidone (PVP) can reduce the surface tension of the thixotropic agent and enhance its dispersibility in the buffer glue 300. On the other hand, dispersants such as polyurethane dispersants can further enhance the stability of the thixotropic agent, prevent particle aggregation, and thus ensure the uniformity of the buffer glue 300 during use. Through this design, the buffer glue 300 can provide more stable mechanical and thermal properties in the display module. Especially under high-temperature operating conditions, this evenly dispersed thixotropic agent can effectively reduce stress concentration caused by material unevenness and reduce the risk of failure of the display module. By adding a non-silicone-based surfactant or dispersant to the thixotropic agent, the dispersion uniformity and stability of the thixotropic agent in the buffer glue 300 are significantly improved, allowing the buffer glue 300 to better exert its buffering effect in the actual application of the display module. This improvement not only effectively solves the problem of material performance degradation caused by uneven dispersion of the thixotropic agent, but also further enhances the overall mechanical properties and chemical stability of the display module, especially in high-temperature and high-stress environments, ensuring the long-term reliability and durability of the display module.

[0042] In some embodiments, the buffer glue 300 is composed of at least two layers. This multi-layer structure design is intended to address the limitations of a single material in mechanical properties and chemical stability, ensuring that the buffer glue 300 can provide more comprehensive protection and performance optimization in the display module. By arranging materials with different functions in layers, the present invention can achieve functional complementarity of each layer of materials, thereby enhancing the overall performance of the buffer glue 300. Specifically, the upper layer material is usually made of polyamide wax with good thixotropy and mechanical properties. This layer is mainly responsible for enhancing the mechanical strength and thixotropy of the buffer glue 300, so that the display module can effectively absorb and disperse stress when subjected to external force, avoiding structural failure caused by stress concentration. The lower layer material is made of calcium carbonate with high chemical stability, which can effectively prevent the diffusion of small silicon molecules at high temperatures and firmly bond with LTPS Glass to ensure that the display module maintains good chemical stability and structural integrity during long-term use. In order to further improve the bonding strength between the two layers of materials, the present invention introduces microstructuring between the upper layer of polyamide wax and the lower layer of calcium carbonate material, such as forming a tiny concave and convex structure on the surface of the material. This microstructure is achieved through methods such as mechanical processing or laser etching, which can increase the contact area between the two layers of material, thereby improving the adhesion and consistent deformation coordination between them. Through this design, the buffer glue 300 can not only provide effective mechanical support under high temperature and high stress environments, but also prevent delamination or detachment between materials, further improving the overall performance and reliability of the display module. By adopting a buffer glue 300 with at least two layers of structure, the present invention effectively solves the problem of insufficient mechanical properties and chemical stability of a single material in display module applications. The design of the multi-layer structure realizes the complementary functions of the materials, so that the buffer glue 300 can better adapt to various environmental conditions in actual use, and provide more reliable buffering and protection. Especially in high temperature and high stress environments, the multi-layer buffer glue 300 can prevent delamination and detachment of materials, ensure the long-term stability and durability of the display module, thereby significantly improving the service life and performance of the display device.

[0043] In some embodiments, the adhesive buffer 300 also includes a non-silicon-based thermally conductive material. This design aims to address performance degradation or failures caused by heat accumulation in the display module. In particular, the inclusion of a thermally conductive material effectively improves the heat dissipation capability of the adhesive buffer 300 in areas of concentrated heat generation, thereby ensuring the stability and performance of the display module. Specifically, non-silicon-based materials such as graphene or carbon fiber can be used as the thermally conductive material. These materials have excellent thermal conductivity and can form an efficient heat conduction path within the adhesive buffer 300, quickly dissipating heat generated during display module operation and preventing localized overheating. Furthermore, the addition of this thermally conductive material does not significantly affect the mechanical properties or chemical stability of the adhesive buffer 300, ensuring that the other excellent properties of the adhesive buffer 300 are maintained while improving thermal management capabilities. In practical applications, the addition of a thermally conductive material to the adhesive buffer 300 allows heat to be more evenly distributed throughout the interlayer structure of the display module, particularly between the cover glass and the LTPS glass, achieving better thermal management. This improvement is particularly suitable for high-temperature environments or high-power applications, effectively preventing display module failures or shortened service life due to excessive temperatures. By incorporating a non-silicon-based thermally conductive material into the rubber buffer 300, the present invention significantly improves the thermal management capabilities of the display module. The thermally conductive material's efficient heat dissipation path rapidly conducts heat away, preventing localized overheating within the display module and thereby enhancing the module's stability and reliability in high-temperature or high-power environments. This design also maintains the mechanical and chemical stability of the rubber buffer 300, ensuring optimized overall performance and extending the display module's service life.

[0044] The present invention also provides a display module, which includes the interlayer structure of the display module mentioned above. The display module mainly solves the problem of unstable performance in the prior art due to the diffusion of silicon-based materials and high-temperature environments, especially under long-term use or high-temperature and high-stress conditions, the structure of the traditional display module is prone to deformation or failure, affecting the display quality and module life. The present invention introduces a single-layer area between the substrate layer 200 and the ink layer 100 in the display module, and sets a buffer glue 300 containing non-silicon-based materials in the single-layer area, especially using thixotropic materials such as polyamide wax and calcium carbonate, thereby further improving the thixotropy and mechanical properties of the buffer glue 300, and significantly enhancing the stability of the display module in extreme environments. At the same time, the addition of non-silicon-based thermal conductive materials such as graphene or carbon fiber greatly improves the thermal management capability of the display module, so that it can maintain a good thermal balance even in high-power and high-frequency usage scenarios.

[0045] For example, in one specific embodiment, the display module is suitable for electronic devices such as smart phones and tablet computers that require ultra-thin design and high display quality. Through the above-mentioned interlayer structure design, the display module can not only prevent the reduction of shear force caused by the diffusion of silicon-based materials in the ink layer 100, but also effectively prevent deformation at high temperatures, ensuring display stability during long-term use. In addition, the two-layer structure of the buffer glue 300 - the upper layer uses polyamide wax to enhance mechanical strength, and the lower layer uses calcium carbonate to prevent the diffusion of silicon-based materials - further improves the overall performance of the display module. In another embodiment, the display module can also be applied to display devices that require high heat dissipation performance, such as car displays, industrial control panels, etc. By introducing graphene or carbon fiber with high thermal conductivity, the display module can quickly dissipate heat, avoid local overheating, and extend the service life of the equipment.

[0046] The present invention also provides a display panel, which includes the interlayer structure of the display module mentioned above. The display panel mainly solves the reliability problem of display panels in high temperature and high stress environments in the prior art. The interlayer structure of traditional display panels often uses silicon-based materials, which may cause the interlayer adhesion to decrease due to the diffusion of silicon-based materials after long-term use, thereby affecting the display quality. In addition, silicon-based materials are prone to deformation at high temperatures, affecting the flatness and optical properties of the display panel. The present invention significantly enhances the mechanical strength and durability of the display panel in extreme environments by adopting a buffer glue 300 containing non-silicon-based materials, especially using thixotropic agents such as polyamide wax and calcium carbonate. The buffer glue 300 in the display panel can not only effectively prevent the diffusion of interlayer materials, but also maintain good structural stability under high temperature conditions. This display panel is suitable for application scenarios that require high reliability and high display quality.

[0047] The present invention also provides a display device, which includes the above-mentioned display panel. The display device solves the problem of insufficient reliability of display devices in high temperature and high stress environments in the prior art, and is particularly suitable for fields such as smart phones, tablet computers, car displays and industrial control equipment that have extremely high requirements for display effects. The display device adopts a layer of buffer glue 300 containing non-silicon-based materials. The buffer glue 300 layer can effectively reduce the stress concentration between layers and avoid interlayer peeling or cracking caused by thermal expansion mismatch, thereby improving the durability and stability of the display device. At the same time, the application of non-silicon-based materials such as nanoparticles and calcium carbonate enhances the thixotropy of the buffer glue 300, so that the display device can quickly restore its shape when impacted by external forces, reducing impact damage. In addition, the use of thermally conductive materials effectively improves the thermal management performance of the display device, ensures the normal operation of the display device in a high temperature environment, and extends its service life.

[0048] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in different embodiments may be combined with each other.

[0049] The above content is a further detailed description of the present invention in conjunction with specific preferred embodiments, and the specific implementation of the present invention cannot be considered to be limited to these descriptions. For those skilled in the art of the present invention, without departing from the concept of the present invention, several simple deductions or substitutions can be made, which should be considered to fall within the scope of protection of the present invention.

Claims

1. A display module interlayer structure, comprising a substrate layer and an ink layer, characterized in that: A single-layer area is included between the substrate layer and the ink layer. A buffer glue is provided in the single-layer area. The buffer glue consists of at least two layers. The thixotropic agent of the buffer glue is a non-silicon-based material.

2. The display module interlayer structure according to claim 1, characterized in that: The thixotropic agent is polyamide wax.

3. The display module interlayer structure according to claim 1, wherein: The thixotropic agent is calcium carbonate.

4. The display module interlayer structure according to claim 1, wherein: The non-silicon-based material is nanoparticles.

5. The display module interlayer structure according to claim 1, wherein: The thixotropic agent also includes a non-silicon-based surfactant or dispersant.

6. The display module interlayer structure according to claim 1, wherein: The buffer glue also includes a non-silicon-based thermal conductive material.

7. A display module, characterized in that: The display module includes the display module interlayer structure according to any one of claims 1 to 6.

8. A display panel, characterized in that: The display panel includes the display module interlayer structure according to any one of claims 1 to 6.

9. A display device, characterized in that: The display device includes the display panel according to claim 8.

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