Semiconductor device processing device
By designing impurity scraping and grabbing mechanisms for semiconductor device processing equipment, impurities in tin liquid can be automatically cleaned, solving the problem of time-consuming and labor-intensive manual cleaning and improving the degree of automation and efficiency of the equipment.
Patent Information
- Application Number
- CN202421888844.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-06
- Publication Date
- 2025-10-03
- Estimated Expiration
- 2034-08-06
AI Technical Summary
Existing tinning equipment requires manual operation to clean impurities in the tin liquid, which is time-consuming and labor-intensive, resulting in inconvenience in use.
A semiconductor device processing device is designed, which includes an impurity scraping mechanism. Impurities in the tin liquid are automatically scraped by a hook plate and collected in a collection box. Combined with a gripping mechanism, automatic loading and unloading and tinning operations are realized.
It realizes the automatic cleaning of tin liquid impurities, improves the practicality and efficiency of the device, and reduces the time and labor intensity of manual operation.
Smart Images

Figure CN223414037U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor device processing, in particular to a semiconductor device processing device. Background Art
[0002] Semiconductor devices are electronic devices manufactured through different processes and structures using the unique electrical properties of semiconductor materials (such as silicon, germanium, or gallium arsenide). They have electrical conductivity between good conductors and insulators, enabling them to perform specific electronic functions. During semiconductor device processing, the pins are tinned to ensure a uniform, smooth layer of solder on the pin surface, thereby improving soldering reliability and stability.
[0003] When the existing hot tinning equipment is used, impurities will be present in the tin liquid. Manually cleaning the impurities in the tin liquid using tools is time-consuming and labor-intensive, causing inconvenience to the user. Therefore, a semiconductor device processing device is proposed to solve the above problem. Utility Model Content
[0004] In response to the shortcomings of the existing technology, the utility model provides a semiconductor device processing device with the advantages of automatically cleaning tin liquid impurities, etc., which solves the problem that the manual cleaning method of tin liquid impurities using tools is time-consuming and labor-intensive, causing inconvenience to users.
[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a semiconductor device processing device, comprising a frame, a first anti-static conveyor belt is fixedly installed on the top left end of the frame, a second anti-static conveyor belt is fixedly installed on the top of the frame and located on the right side of the first anti-static conveyor belt, a first top plate is fixedly installed on the top of the frame and located above the first anti-static conveyor belt, a first linear module is fixedly installed on the top of the first top plate, a second top plate is fixedly installed on the output end of the first linear module, a tinning mechanism is provided at the top center of the second top plate, a grabbing mechanism is provided at the top rear end of the frame and located on the right side of the second anti-static conveyor belt, and a tin liquid storage mechanism and an impurity scraping mechanism are provided at the top right end of the frame.
[0006] Furthermore, a track frame is fixedly installed on the top of the frame and above the first anti-static conveyor belt and the second anti-static conveyor belt. A slide rail is fixedly installed at the top center of the track frame. The slide rail is provided with a sliding block with one end fixedly connected to the bottom of the second top plate.
[0007] Furthermore, the tinning mechanism includes a frame, a second linear module, a mounting plate, a cylinder frame, a cylinder, a suction cup frame, a contact plate and a suction cup. The frame is fixedly installed on the top center of the second top plate, the second linear module is fixedly installed on the left side of the frame, the output end of the second linear module is fixedly installed on the mounting plate, the cylinder frame is fixedly installed on the left side of the mounting plate, the cylinder is embedded in the top of the cylinder frame, the movable plate is fixedly installed on the output end of the cylinder, the suction cup frame is fixedly installed on the left center of the movable plate, the contact plate is fixedly installed on the left side of the movable plate and below the suction cup frame, and the top of the suction cup frame is embedded with a suction cup with one end passing through and extending to the bottom of the contact plate.
[0008] Furthermore, a limiting groove is provided on the left side of the mounting plate, and a limiting block having one end fixedly connected to the mounting plate is slidably installed inside the limiting groove.
[0009] The cam is secured to the rear of the L-shaped frame by a lever, and the cam is secured to the rear of the L-shaped frame by a lever, and the cam is secured to the rear of the L-shaped frame by a lever.
[0010] Furthermore, the tin liquid storage mechanism includes a heating box, a containing box, a first mounting rack, a first hydraulic push rod and a connecting rack. The heating box is fixedly installed at the top right end of the rack and located between the first anti-static conveyor belt and the second anti-static conveyor belt. The first mounting rack is fixedly installed at the top of the rack and located on the left side of the heating box. The first hydraulic push rod is embedded in the bottom center of the first mounting rack. The output end of the first hydraulic push rod is fixedly installed with a connecting rack having one end extending to the top of the heating box. The containing box is fixedly installed on the right side of the connecting rack. The heating wire is fixedly installed at the bottom end of the heating box.
[0011] Furthermore, the impurity scraping mechanism includes a collecting box, a second mounting bracket, a second hydraulic push rod, a third mounting bracket, a vertical plate, a third hydraulic push rod and a hook plate. The collecting box is fixedly installed on the top right side of the heating box, and the second mounting bracket is fixedly installed on the top of the frame and on the right side of the heating box. The second hydraulic push rod is embedded in the bottom center of the second mounting bracket, and the output end of the second hydraulic push rod is fixedly installed on the third mounting bracket. A vertical plate is fixedly installed on the top left side of the third mounting bracket, and a third hydraulic push rod is fixedly installed on the top center of the third mounting bracket. The output end of the third hydraulic push rod passes through the third mounting bracket and extends to above the collection box, and the output end of the third hydraulic push rod is fixedly installed with a hook plate.
[0012] Compared with the existing technology, the technical solution of this application has the following beneficial effects:
[0013] 1. The semiconductor device processing device is provided with an impurity scraping mechanism. When in use, the hook plate can be operated to scrape impurities in the tin liquid into a collection box, thereby achieving the purpose of automatically cleaning impurities in the tin liquid and solving the problem that the manual cleaning method of the tin liquid impurities using tools is time-consuming and labor-intensive, causing inconvenience to the user.
[0014] 2. The semiconductor device processing device, through the provided grasping mechanism and tinning mechanism, can realize automatic loading and unloading and automatic tinning of semiconductor devices during use, thereby improving the practicality of the device. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 This is a schematic diagram of the structure of the utility model;
[0016] Figure 2 This is a schematic diagram of the hot tinning mechanism structure of the utility model;
[0017] Figure 3 This is a schematic diagram of the structure of the grabbing mechanism of the utility model;
[0018] Figure 4 This is a schematic diagram of the structure of the impurity scraping mechanism of the utility model.
[0019] In the figure: 1 frame, 2 first anti-static conveyor belt, 3 second anti-static conveyor belt, 4 first top plate, 5 first linear module, 6 second top plate, 7 tinning mechanism, 71 frame, 72 second linear module, 73 mounting plate, 74 cylinder frame, 75 cylinder, 76 suction cup frame, 77 contact plate, 78 suction cup, 8 tin liquid storage mechanism, 81 heating box, 82 containing box, 83 first mounting frame, 84 first hydraulic push rod, 85 connecting frame, 9 grabbing mechanism, 91 L-shaped frame, 92 side plate, 93 push rod frame, 94 electric push rod, 95 clamping jaw frame, 96 pneumatic clamping jaw, 97 rectangular hole, 98 threaded rod, 99 threaded slider, 10 impurity scraping mechanism, 101 collecting box, 102 second mounting frame, 103 second hydraulic push rod, 104 third mounting frame, 105 vertical plate, 106 third hydraulic push rod, 107 hook plate. DETAILED DESCRIPTION
[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0021] See also Figure 1-4 A semiconductor device processing device in this embodiment includes a frame 1, a first anti-static conveyor belt 2 is fixedly installed on the top left end of the frame 1, a second anti-static conveyor belt 3 is fixedly installed on the top of the frame 1 and located on the right side of the first anti-static conveyor belt 2, a first top plate 4 is fixedly installed on the top of the frame 1 and above the first anti-static conveyor belt 2, a first linear module 5 is fixedly installed on the top of the first top plate 4, a second top plate 6 is fixedly installed on the output end of the first linear module 5, a tinning mechanism 7 is provided at the top center of the second top plate 6, a grabbing mechanism 9 is provided at the top rear end of the frame 1 and located on the right side of the second anti-static conveyor belt 3, and a tin liquid storage mechanism 8 and an impurity scraping mechanism 10 are provided at the top right end of the frame 1.
[0022] In this embodiment, a track frame is fixedly installed on the top of the rack 1 and above the first anti-static conveyor belt 2 and the second anti-static conveyor belt 3. A slide rail is fixedly installed at the top center of the track frame, and a sliding block is provided on the slide rail, one end of which is fixedly connected to the bottom of the second top plate 6.
[0023] In this embodiment, the grabbing mechanism 9 includes an L-shaped frame 91, a side plate 92, a push rod frame 93, an electric push rod 94, a clamping claw frame 95, a pneumatic clamping claw 96, a rectangular hole 97, a threaded rod 98, and a threaded slider 99. Two L-shaped frames 91 are fixedly installed at the top rear end of the frame 1. The top of the L-shaped frame 91 extends above the second anti-static conveyor belt 3. The left side of the L-shaped frame 91 is fixedly installed with a side plate 92. The left side of the side plate 92 is movably installed with a push rod frame 93. The top of the push rod frame 93 is embedded with an electric push rod 94. The output end of the electric push rod 94 is fixedly installed. There is a clamping jaw frame 95, and a pneumatic clamping jaw 96 is fixedly installed on the left side of the clamping jaw frame 95. A rectangular hole 97 is opened in the center of the left side of the side plate 92. A driving motor is fixedly installed on the front of the front L-shaped frame 91. The output end of the driving motor passes through the front L-shaped frame 91. A threaded rod 98 is fixedly installed on the output end of the driving motor. One end of the threaded rod 98 is rotatably connected to the rear L-shaped frame 91. The outer peripheral wall of the threaded rod 98 is threadedly connected to a threaded slider 99. The threaded slider 99 passes through the rectangular hole 97 and is fixedly connected to the push rod frame 93. The threaded slider 99 is slidably connected to the rectangular hole 97.
[0024] Specifically, the device that needs to be tinned is introduced onto the second anti-static conveyor belt 3, the electric push rod 94 is operated to move the pneumatic clamp 96 downward, the pneumatic clamp 96 is operated to clamp the device, the electric push rod 94 is operated to lift the device upward, the drive motor is started to rotate the threaded rod 98, the threaded rod 98 drives the threaded slider 99 to move the device backward, after the device moves to the target position, the electric push rod 94 and the pneumatic clamp 96 are operated to stack the device on the second anti-static conveyor belt 3, and the cycle is repeated until multiple devices are stacked side by side, and the second anti-static conveyor belt 3 is operated to move the device to the tinning loading problem.
[0025] In this embodiment, the tin liquid storage mechanism 8 includes a heating box 81, a containing box 82, a first mounting frame 83, a first hydraulic push rod 84 and a connecting frame 85. The heating box 81 is fixedly installed at the top right end of the frame 1 and located between the first anti-static conveyor belt 2 and the second anti-static conveyor belt 3. The first mounting frame 83 is fixedly installed at the top of the frame 1 and located on the left side of the heating box 81. The first hydraulic push rod 84 is embedded in the bottom center of the first mounting frame 83. The output end of the first hydraulic push rod 84 is fixedly installed with a connecting frame 85 having one end extending to the top of the heating box 81. The containing box 82 is fixedly installed on the right side of the connecting frame 85, and the heating wire is fixedly installed at the bottom end of the interior of the heating box 81.
[0026] Specifically, place the tin block into the containing box 82, operate the first hydraulic push rod 84 to move the containing box 82 downward close to the heating wire, start the heating wire to melt the tin block in the containing box 82, operate the first hydraulic push rod 84 to move the containing box 82 upward, so that the edge of the containing box 82 is parallel to the edge of the heating box 81, which is convenient for subsequent tinning of components and cleaning of impurities.
[0027] In this embodiment, the impurity scraping mechanism 10 includes a collecting box 101, a second mounting frame 102, a second hydraulic push rod 103, a third mounting frame 104, a vertical plate 105, a third hydraulic push rod 106 and a hook plate 107. The collecting box 101 is fixedly installed on the top right side of the heating box 81, and the second mounting frame 102 is fixedly installed on the top of the frame 1 and on the right side of the heating box 81. The second hydraulic push rod 103 is embedded in the bottom center of the second mounting frame 102, and the output end of the second hydraulic push rod 103 is fixedly installed with the third mounting frame 104, and the vertical plate 105 is fixedly installed on the top left side of the third mounting frame 104. The third hydraulic push rod 106 is fixedly installed at the top center of the third mounting frame 104, and the output end of the third hydraulic push rod 106 passes through the third mounting frame 104 and extends to the top of the collecting box 101. The output end of the third hydraulic push rod 106 is fixedly installed with a hook plate 107.
[0028] Specifically, the second hydraulic push rod 103 and the third hydraulic push rod 106 are operated to drive the hook plate 107 to move to the left end of the tin liquid surface of the holding box 82, and the third hydraulic push rod 106 is operated to drive the hook plate 107 to scrape impurities on the tin liquid surface. When the impurities are scraped to the right side of the holding box 82, the second hydraulic push rod 103 is operated to drive the hook plate 107 to pull the impurities upward. When the impurities move to the edge of the holding box 82, the third hydraulic push rod 106 is operated to drive the hook plate 107 to move to the right with the impurities and drop them into the collection box 101. In this way, the purpose of automatically cleaning the impurities in the tin liquid is achieved.
[0029] In this embodiment, the tinning mechanism 7 includes a frame 71, a second linear module 72, a mounting plate 73, a cylinder frame 74, a cylinder 75, a suction cup frame 76, a contact plate 77 and a suction cup 78. The frame 71 is fixedly installed at the top center of the second top plate 6, the second linear module 72 is fixedly installed on the left side of the frame 71, the output end of the second linear module 72 is fixedly installed, the left side of the mounting plate 73 is fixedly installed with the cylinder frame 74, the top of the cylinder frame 74 is embedded with the cylinder 75, the output end of the cylinder 75 is fixedly installed with a moving plate, the suction cup frame 76 is fixedly installed at the left center of the moving plate, the contact plate 77 is fixedly installed on the left side of the moving plate and below the suction cup frame 76, and the top of the suction cup frame 76 is embedded with a suction cup 78 with one end passing through and extending to the bottom of the contact plate 77;
[0030] A limiting groove is defined on the left side of the mounting plate 73 , and a limiting block having one end fixedly connected to the mounting plate 73 is slidably mounted inside the limiting groove.
[0031] Specifically, operate the first linear module 5 to drive the suction cup 78 to move to the top of the stacked components, operate the cylinder 75 to carry the contact plate 77 to fit the upper surface of the component, and suck the component through the suction cup 78, operate the cylinder 75 to lift the component, operate the first linear module 5 to move the component adsorbed by the suction cup 78 to the hot tinning area, operate the second linear module 72 to drive the pins of the component to be immersed in the tin liquid in the holding box 82, and perform the hot tinning operation on the component. After the hot tinning of the component is completed, operate the second linear module 72 to lift the component, operate the first linear module 5 to carry the device to the top of the first anti-static conveyor belt 2, operate the cylinder 75 to make the device fit the first anti-static conveyor belt 2, release the attraction of the suction cup 78, and operate the first anti-static conveyor belt 2 to perform the device unloading operation.
[0032] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply the existence of any such actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or device comprising the element.
[0033] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A semiconductor device processing device, comprising a frame (1), characterized in that: A first anti-static conveyor belt (2) is fixedly installed at the left end of the top of the frame (1), a second anti-static conveyor belt (3) is fixedly installed at the top of the frame (1) and located on the right side of the first anti-static conveyor belt (2), a first top plate (4) is fixedly installed at the top of the frame (1) and located above the first anti-static conveyor belt (2), a first linear module (5) is fixedly installed at the top of the first top plate (4), a second top plate (6) is fixedly installed at the output end of the first linear module (5), a tinning mechanism (7) is provided at the top center of the second top plate (6), a grabbing mechanism (9) is provided at the rear end of the top of the frame (1) and located on the right side of the second anti-static conveyor belt (3), and a tin liquid storage mechanism (8) and an impurity scraping mechanism (10) are provided at the right end of the top of the frame (1).
2. A semiconductor device processing apparatus according to claim 1, characterized in that: A track frame is fixedly installed on the top of the frame (1) and above the first anti-static conveyor belt (2) and the second anti-static conveyor belt (3), and a slide rail is fixedly installed at the top center of the track frame. A sliding block is provided on the slide rail, one end of which is fixedly connected to the bottom of the second top plate (6).
3. The semiconductor device processing apparatus according to claim 1, wherein: The tinning mechanism (7) comprises a frame (71), a second linear module (72), a mounting plate (73), a cylinder frame (74), a cylinder (75), a suction cup frame (76), a contact plate (77) and a suction cup (78), wherein the frame (71) is fixedly mounted on the top center of the second top plate (6), the second linear module (72) is fixedly mounted on the left side of the frame (71), the output end of the second linear module (72) is fixedly mounted on the mounting plate (73), the cylinder frame (74) is fixedly mounted on the left side of the mounting plate (73), the cylinder (75) is embedded on the top of the cylinder frame (74), the output end of the cylinder (75) is fixedly mounted on the movable plate, the suction cup frame (76) is fixedly mounted on the left center of the movable plate, the contact plate (77) is fixedly mounted on the left side of the movable plate and below the suction cup frame (76), and the suction cup (78) is embedded on the top of the suction cup frame (76) with one end passing through and extending to the bottom of the contact plate (77).
4. The semiconductor device processing apparatus according to claim 3, wherein: A limiting groove is provided on the left side of the mounting plate (73), and a limiting block having one end fixedly connected to the mounting plate (73) is slidably installed inside the limiting groove.
5. The semiconductor device processing apparatus according to claim 1, wherein: The gripping mechanism (9) comprises an L-shaped frame (91), a side plate (92), a push rod frame (93), an electric push rod (94), a clamping claw frame (95), a pneumatic clamping claw (96), a rectangular hole (97), a threaded rod (98), and a threaded slider (99). Two L-shaped frames (91) are fixedly mounted on the top rear end of the frame (1). The top end of the L-shaped frame (91) extends above the second anti-static conveyor belt (3). The left side of the L-shaped frame (91) is fixedly mounted with a side plate (92). The left side of the side plate (92) is movably mounted with a push rod frame (93). The top of the push rod frame (93) is embedded with an electric push rod (94). The output end of the electric push rod (94) is fixedly mounted with a clamping claw. The pneumatic clamp (96) is fixedly installed on the left side of the clamp frame (95), a rectangular hole (97) is opened in the center of the left side of the side plate (92), a driving motor is fixedly installed on the front side of the front L-shaped frame (91), the output end of the driving motor passes through the front L-shaped frame (91), a threaded rod (98) is fixedly installed on the output end of the driving motor, one end of the threaded rod (98) is rotatably connected to the rear L-shaped frame (91), the outer peripheral wall of the threaded rod (98) is threadedly connected to a threaded slider (99), the threaded slider (99) passes through the rectangular hole (97) and is fixedly connected to the push rod frame (93), and the threaded slider (99) is slidably connected to the rectangular hole (97).
6. The semiconductor device processing apparatus according to claim 1, wherein: The tin liquid storage mechanism (8) includes a heating box (81), a containing box (82), a first mounting frame (83), a first hydraulic push rod (84) and a connecting frame (85). The heating box (81) is fixedly installed at the top right end of the frame (1) and located between the first antistatic conveyor belt (2) and the second antistatic conveyor belt (3). The first mounting frame (83) is fixedly installed at the top of the frame (1) and located on the left side of the heating box (81). The first hydraulic push rod (84) is embedded in the bottom center of the first mounting frame (83). The output end of the first hydraulic push rod (84) is fixedly installed with a connecting frame (85) with one end extending to the top of the heating box (81). The containing box (82) is fixedly installed on the right side of the connecting frame (85). The bottom end of the heating box (81) is fixedly installed with a heating wire.
7. The semiconductor device processing apparatus according to claim 6, wherein: The impurity scraping mechanism (10) comprises a collecting box (101), a second mounting frame (102), a second hydraulic push rod (103), a third mounting frame (104), a vertical plate (105), a third hydraulic push rod (106) and a hook plate (107); the collecting box (101) is fixedly mounted on the top right side of the heating box (81); the second mounting frame (102) is fixedly mounted on the top of the frame (1) and on the right side of the heating box (81); the second hydraulic push rod (103) is embedded in the bottom center of the second mounting frame (102); Rod (103), the output end of the second hydraulic push rod (103) is fixedly mounted with a third mounting frame (104), a vertical plate (105) is fixedly mounted on the left side of the top of the third mounting frame (104), a third hydraulic push rod (106) is fixedly mounted at the center of the top of the third mounting frame (104), the output end of the third hydraulic push rod (106) passes through the third mounting frame (104) and extends above the collection box (101), and a hook plate (107) is fixedly mounted on the output end of the third hydraulic push rod (106).