Heating uncovering device for IC chip

Abstract

The utility model discloses a heating uncovering device for an IC chip, which comprises a main machine body, the front end of the main machine body is provided with chutes at the left side and the right side of the inner wall, the left side and the right side of the inner wall of the main machine body are provided with chutes at the left side and the right side of the inner wall of the main machine body, and clamping blocks are sleeved at the inner positions of fixing columns. During adjustment, a button at the front end of a fixed handle is pressed, a stainless steel spring is compressed by a connecting plate, compression energy is gathered, and meanwhile, a clamping block is retracted into the inner position of a fixed column through movement of the connecting plate, so that the movable door is kept at the position where the movable door is located. At the moment, the movable door can move up and down along the sliding groove, after the movable door is adjusted to a proper height, the button is loosened to enable the stainless steel spring to release compression energy, the clamping block is clamped to the inner position of the clamping groove, the movable door is kept at the position where the movable door is located, and adjustment is more convenient through the mode.

Description

Technical Field

[0001] The utility model belongs to the technical field related to a heating cover opening device for an IC chip, and particularly relates to a heating cover opening device for an IC chip. Background Art

[0002] The IC chip heating cover removal device is a specially designed device that heats the integrated circuit packaging material to soften it, thereby facilitating the removal of the package cover for chip testing, analysis, or repair. This device is widely used in the semiconductor industry, especially in reverse engineering and fault analysis, and can effectively protect the chip from damage while improving disassembly efficiency.

[0003] When the heated cover opening device for IC chips is in use, the traditional movable door moves up and down through the slide, and the slide cannot keep the movable door in position for a long time, so the market needs a new device to solve the current problems. Utility Model Content

[0004] The purpose of the present utility model is to provide a heating cover opening device for IC chips, so as to solve the problem that when the heating cover opening device for IC chips proposed in the above background technology is used, the traditional movable door moves up and down through the slide, and the slide cannot keep the movable door in the position for a long time. Therefore, the market needs a new device to solve the current problem.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a heating cover opening device for IC chip, comprising a main body, wherein the front end of the main body is provided with a slide groove at positions on the left and right sides of the inner wall, and a plurality of card slots are distributed at the front end position of the slide groove, and the main body is provided with a movable door that can slide up and down at the front end position through the slide groove, and the movable door is fixed to the fixed columns at the left and right end positions and is clamped at the inner position of the slide groove, and the front end of the movable door is fixed with a fixed handle at the lower position, and the front end of the fixed handle is sleeved with a pressable button at the inner position, and a connecting plate is fixed at the lower end position of the button, and a plurality of stainless steel springs are fixed at the lower end position of the connecting plate, and clamping blocks are fixed at the left and right end positions of the connecting plate, and the clamping blocks are sleeved at the inner lower position of the fixed column;

[0006] A right-angle plate is fixed at the lower middle position of the right end of the main body, and a support plate is sleeved at the upper end of the right-angle plate. The support plate is connected to the right-angle plate through a ball rotating shaft at the lower end. A connecting plate is installed at the upper end of the support plate at the right position, and the connecting plate is connected to the support plate through a ball rotating shaft fixed at the lower end. A display screen is fixed at the upper position of the front end of the support column, and the display screen transmits signals to the main body through a signal line at the rear end.

[0007] Preferably, the main body is supported by fixed bases at the four corners of the lower end, and a high-resolution camera is provided at an upper position inside the main body.

[0008] Preferably, a magnifying glass is provided at an inner position of the main body, and a working platform for placing IC chips is provided at an inner position of the main body.

[0009] Preferably, when the movable door is in a closed state, the interior of the main body can be observed through a glass window at a lower position of the front end, and the movable door can slide up and down along a sliding groove.

[0010] Preferably, a button needs to be pressed when the movable door moves, and the button is pressed by an external force to cause the connecting plate to move.

[0011] Preferably, the movement of the connecting plate causes the engaging block to retract from the engaging slot into an inner position of the fixing column, and the movement of the connecting plate causes compression on the stainless steel spring.

[0012] Preferably, the snap-in block is retracted into the internal position of the fixed column so that the movable door can move up and down. When the button is released, the stainless steel spring releases its elastic force, and the stainless steel spring releases its elastic force so that the snap-in block is snapped into the internal position of the slot.

[0013] Preferably, the support plate and the support column can both rotate via a ball-bearing rotating shaft fixed at the lower end.

[0014] Preferably, the support plate and the ball rotation axis are the central axis and rotate at the upper end of the right-angle plate, and the support column is rotated at the upper end of the support plate with the ball rotation axis as the central axis.

[0015] Compared with the prior art, the present invention provides a heating cover opening device for IC chips, which has the following beneficial effects:

[0016] 1. This device is provided with slide grooves on the left and right sides of the inner wall of the main body, and a plurality of card slots are distributed at the front end of the slide groove. The sliding door moves up and down along the slide groove through the fixed columns at the left and right end positions, and is clamped in the inner position of the card slot by the clamping block sleeved at the inner position of the fixed column, so that the sliding door is maintained at its height. When adjusting, the button at the front end position of the fixed handle is pressed, and the connecting plate compresses the stainless steel spring to accumulate compression energy. At the same time, the movement of the connecting plate causes the clamping block to retract into the inner position of the fixed column. At this time, the sliding door can move up and down along the slide groove. When adjusted to the appropriate height, release the button to allow the stainless steel spring to release the compression energy, clamping the clamping block in the inner position of the card slot, so that the sliding door is maintained at its height. Adjustment is more convenient in this way.

[0017] 2. A support column is fixed at the rear end of the display screen. Both the support column and the support plate can be rotated through a ball bearing shaft. The ball bearing shaft makes the rotation more flexible. At the same time, the display screen can be adjusted to a direction that is convenient for staff to observe through multi-angle rotation. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a structural schematic diagram of a heating cover-opening device for IC chips according to the present invention.

[0019] Figure 2 The utility model is a schematic diagram of the opening structure of a movable door of a heating cover opening device for IC chips.

[0020] Figure 3 This is a partially enlarged structural diagram of a heating cover-opening device for IC chips according to the present invention.

[0021] Figure 4 The utility model is a schematic diagram of the cross-sectional structure of a movable door of a heating cover opening device for IC chips.

[0022] Figure 5 The utility model is a schematic diagram of the cross-sectional structure of a support plate of a heating cover opening device for IC chips.

[0023] In the figure: 1. Main body; 2. Sliding door; 3. Glass window; 4. Fixed handle; 5. Button; 6. Fixed base; 7. Right-angle plate; 8. Support plate; 9. Signal line; 10. Support column; 11. Display screen; 12. Fixed column; 13. Slide; 14. High-resolution camera; 15. Magnifying glass; 16. Working platform; 17. Card slot; 18. Card block; 19. Stainless steel spring; 20. Connecting plate; 21. Ball bearing shaft. DETAILED DESCRIPTION

[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0025] The utility model provides Figure 1-5 The IC chip heating cover opening device shown in the figure includes a main body 1, the front end of the main body 1 is provided with a slide groove 13 at the left and right sides of the inner wall, and a plurality of card slots 17 are distributed at the front end of the slide groove 13. The main body 1 is installed with a movable door 2 that can slide up and down at the front end through the slide groove 13. The movable door 2 is fixed to the fixed columns 12 at the left and right ends and is clamped in the inner position of the slide groove 13. The front end of the movable door 2 is fixed with a fixed handle 4 at the lower position. The front end of the fixed handle 4 is sleeved with a pressable button 5 at the inner position. The lower end of the button 5 is fixed with a connecting plate 20, and the lower end of the connecting plate 20 is fixed with a plurality of stainless steel Spring 19, the left and right ends of the connecting plate 20 are fixed with clamping blocks 18, and the clamping block 18 is sleeved on the inner lower position of the fixed column 12. A right-angle plate 7 is fixed at the lower middle position of the right end of the main body 1, and a support plate 8 is sleeved on the upper end of the right-angle plate 7. The support plate 8 is connected to the right-angle plate 7 through the ball rotating shaft 21 at the lower end. The upper end of the support plate 8 is installed with a connecting plate 20 at the right position, and the connecting plate 20 is connected to the support plate 8 through the ball rotating shaft 21 fixed at the lower end. The front end of the support column 10 is fixed with a display screen 11 at the upper position, and the display screen 11 transmits signals with the main body 1 through the signal line 9 at the rear end.

[0026] The operator places the IC chip to be processed on the work platform 16, ensuring that the package surface is facing upward, and prepares for heating and disassembly. The heating element inside the work platform 16 starts heating. Once the packaging material softens, the operator can use tools such as tweezers to easily remove the packaging cover to expose the chip inside. When removing the package, the high-resolution camera 14 passes through the magnifying glass 15 and transmits the magnified image to the display screen 11 in real time for the operator to observe.

[0027] like Figure 1 and Figure 5As shown, the main body 1 is supported by fixed bases 6 at the four corners of the lower end, a high-resolution camera 14 is provided at the upper position inside the main body 1, a magnifying glass 15 is provided at the internal position of the main body 1, and a working platform 16 for placing IC chips is provided at the internal position of the main body 1. The support plate 8 and the support column 10 can rotate through the ball rotating shaft 21 fixed at the lower end position, and the support plate 8 and the ball rotating shaft 21 are the central axis and rotate at the upper end position of the right-angle plate 7, and the support column 10 rotates at the upper end position of the support plate 8 with the ball rotating shaft 21 as the central axis.

[0028] A support column 10 is fixed at the rear end of the display screen 11. The support column 10 and the support plate 8 can be rotated through the ball rotating shaft 21. The ball rotating shaft 21 makes the rotation more flexible. At the same time, through multi-angle rotation, the display screen 11 can be adjusted to a direction that is convenient for staff to observe.

[0029] like Figure 3 and Figure 4 As shown, when the sliding door 2 is in the closed state, the interior of the main body 1 can be observed through the glass window 3 at the lower front end. The sliding door 2 can slide up and down along the slide groove 13. The button 5 needs to be pressed when the sliding door 2 moves. The button 5 is pressed by an external force to cause the connecting plate 20 to move. The movement of the connecting plate 20 causes the clamping block 18 to retract from the clamping slot 17 to the internal position of the fixed column 12. The movement of the connecting plate 20 causes compression on the stainless steel spring 19. The clamping block 18 retracts to the internal position of the fixed column 12, allowing the sliding door 2 to move up and down. After the button 5 is released, the stainless steel spring 19 releases its elastic force. The stainless steel spring 19 releases its elastic force, causing the clamping block 18 to be clamped at the internal position of the clamping slot 17.

[0030] When adjusting, press the button 5 at the front end of the fixed handle 4, and the connecting plate 20 compresses the stainless steel spring 19, causing it to accumulate compression energy. At the same time, the movement of the connecting plate 20 causes the clamping block 18 to retract into the internal position of the fixed column 12. At this time, the movable door 2 can move up and down along the slide groove 13. When it is adjusted to the appropriate height, release the button 5 to allow the stainless steel spring 19 to release the compression energy, and clamp the clamping block 18 into the internal position of the clamping groove 17, so that the movable door 2 remains at its height.

[0031] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent replacements for some of the technical features therein. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A heating cover opening device for IC chip, characterized in that: The invention comprises a support column (10) and a main body (1). The front end of the main body (1) is provided with a slide groove (13) at the left and right sides of the inner wall. A plurality of card slots (17) are distributed at the front end of the slide groove (13). The main body (1) is provided with a movable door (2) that can slide up and down at the front end through the slide groove (13). The movable door (2) is fixed to the fixed columns (12) at the left and right ends and is carded at the inner position of the slide groove (13). The movable door (2) 2) is fixed with a fixed handle (4) at a lower position of the front end, a push button (5) is sleeved on the front end of the fixed handle (4) at an inner position, a connecting plate (20) is fixed at the lower end of the button (5), a plurality of stainless steel springs (19) are fixed at the lower end of the connecting plate (20), and clamping blocks (18) are fixed at the left and right ends of the connecting plate (20), and the clamping blocks (18) are sleeved on the inner lower position of the fixed column (12); A right-angle plate (7) is fixed at the lower middle position of the right end of the main body (1); a support plate (8) is sleeved at the upper end of the right-angle plate (7); the support plate (8) is connected to the right-angle plate (7) via a ball rotating shaft (21) at the lower end; a connecting plate (20) is installed at the upper end of the support plate (8) at the right position; the connecting plate (20) is connected to the support plate (8) via a ball rotating shaft (21) fixed at the lower end; a display screen (11) is fixed at the upper front end of the support column (10); the display screen (11) transmits signals to the main body (1) via a signal line (9) at the rear end.

2. The IC chip heating cover opening device according to claim 1, characterized in that: The main body (1) is supported by fixed bases (6) at the four corners of the lower end, and a high-resolution camera (14) is provided at an upper position inside the main body (1).

3. The IC chip heating cover opening device according to claim 1, characterized in that: A magnifying glass (15) is provided at an inner position of the main body (1), and a working platform (16) for placing an IC chip is provided at an inner position of the main body (1).

4. The IC chip heating cover opening device according to claim 1, characterized in that: When the movable door (2) is in a closed state, the interior of the main body (1) can be observed through the glass window (3) at the lower front end, and the movable door (2) can slide up and down along the sliding groove (13).

5. The IC chip heating cover opening device according to claim 4, characterized in that: The movable door (2) needs to press the button (5) when it moves, and the button (5) is pressed by an external force so that the connecting plate (20) moves.

6. The IC chip heating cover opening device according to claim 5, characterized in that: The movement of the connecting plate (20) causes the clamping block (18) to retract from the clamping slot (17) to the inner position of the fixed column (12), and the movement of the connecting plate (20) causes compression on the stainless steel spring (19).

7. The IC chip heating cover opening device according to claim 6, characterized in that: The clamping block (18) is retracted into the inner position of the fixed column (12), so that the movable door (2) can move up and down. After the button (5) is released, the stainless steel spring (19) releases its elastic force, and the stainless steel spring (19) releases its elastic force, so that the clamping block (18) is clamped into the inner position of the clamping slot (17).

8. The IC chip heating cover opening device according to claim 1, characterized in that: The support plate (8) and the support column (10) can both rotate via a ball rotating shaft (21) fixed at the lower end.

9. The IC chip heating cover opening device according to claim 8, characterized in that: The support plate (8) and the ball rotating shaft (21) are used as the central axis to rotate at the upper end of the right-angle plate (7), and the support column (10) is used as the ball rotating shaft (21) to rotate at the upper end of the support plate (8).

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