Cleaning device and etching equipment

Abstract

The utility model relates to the technical field of semiconductor manufacturing, and provides a cleaning device and etching equipment, the cleaning device comprises a cleaning tank and a posture adjusting assembly; the cleaning tank is provided with a cleaning cavity; the posture adjusting assembly comprises an adjusting piece, and the adjusting piece is movably arranged in the cleaning cavity. The adjusting piece is configured to be used for being supported on a wafer in the cleaning tank, and when the adjusting piece moves relative to the cleaning cavity, the wafer is driven to rotate. According to the cleaning device, the wafer in the cleaning cavity can be driven to rotate through the posture adjusting assembly so as to adjust the circumferential position of the wafer, and then the position of an uneven etching area on the wafer relative to the wafer frame is changed. After the wafer rotates, when the wafer enters the chemical tank to be etched, as the circumferential position of the wafer is changed, the non-uniform etching area of the wafer is changed, and the non-uniform etching phenomenon of the wafer can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to a cleaning device and etching equipment. Background Art

[0002] There are two basic etching processes in semiconductor manufacturing: dry etching and wet etching.

[0003] Wet etching plays an important role in silicon oxide stripping, residue removal, surface stripping, and large-scale pattern etching applications.

[0004] Wet etching typically involves placing a batch of wafers in a chemical bath, which is then filled with a chemical solution. The wafers are then exposed to the chemical solution by immersion or spraying. During the wet etching process, the etching rate varies across the wafer due to factors such as the bath structure, the chemical solution's circulation flow rate, temperature, and concentration, leading to uneven etching.

[0005] During the wet etching process, to ensure the best etching results, the wafers need to be removed from the chemical bath after a certain period of immersion. This cleaning process is mainly used to remove particulate impurities and residual chemical liquid from the wafer surface, making the wafer surface clean. The cleaned wafers are then returned to the chemical bath for immersion. This process is repeated to ensure good etching results. The existing cleaning method usually removes a batch of wafers as a whole, cleans them, and then places them back into the chemical bath. Although this cleaning process can remove impurities from the surface of the batch of wafers, the posture of the wafers in the batch remains consistent before and after cleaning, and it cannot improve the uneven etching rate of the wafers.

[0006] To this end, the utility model provides a cleaning device and an etching device. During the cleaning process, the cleaning device can adjust the placement angle of the wafer, thereby improving the phenomenon of uneven wafer etching rate. Utility Model Content

[0007] The purpose of the utility model is to provide a cleaning device and an etching device. During the cleaning process, the cleaning device can adjust the placement angle of the wafer, thereby changing the angle of the cleaned wafer after it is placed back in the chemical tank, thereby improving the uneven wafer etching rate.

[0008] The utility model provides a cleaning device, comprising a cleaning tank and a posture adjustment component; the cleaning tank has a cleaning cavity; the posture adjustment component comprises an adjustment member, and the adjustment member is movably arranged in the cleaning cavity;

[0009] The adjustment member is configured as follows: the adjustment member is used to support the wafer in the cleaning tank, and when the adjustment member moves relative to the cleaning chamber, it drives the wafer to rotate.

[0010] Optionally, the adjusting member is rotatably disposed in the cleaning chamber.

[0011] Optionally, the adjustment member includes a first adjustment shaft and a second adjustment shaft, the first adjustment shaft is arranged in the cleaning chamber and rotates around its own central axis, the second adjustment shaft is arranged in the cleaning chamber and rotates around its own central axis, and the first adjustment shaft and the second adjustment shaft are arranged in parallel.

[0012] Optionally, the posture adjustment component further includes a posture maintaining component, at least a portion of which is disposed in the cleaning chamber and is used to keep the wafer upright when the wafer rotates.

[0013] Optionally, the posture maintaining assembly includes a first holding member disposed in the cleaning chamber, the first holding member is provided with a first holding groove, and the first holding groove is at least used to accommodate the edge of the wafer.

[0014] Optionally, the posture maintaining assembly further includes a second holding member disposed in the cleaning chamber; the second holding member is provided with a second holding groove, and the second holding groove is at least used to accommodate the edge of the wafer.

[0015] Optionally, the first retaining groove and the second retaining groove are arranged opposite to each other, and the first retaining groove and the second retaining groove are respectively used to accommodate edges of the wafer on both sides along a radial direction thereof.

[0016] Optionally, the first retaining member has a first retaining end, the first retaining groove is provided at the first retaining end, the second retaining member has a second retaining end, and the second retaining groove is provided at the second retaining end;

[0017] The first holding member and the second holding member are rotatably arranged relative to the cleaning tank, so that the first holding end and the second holding end can be relatively close to or away from each other.

[0018] Optionally, when the adjusting member is rotatably disposed in the cleaning chamber,

[0019] The rotation center axis of the first holding member, the rotation center axis of the second holding member, and the rotation center axis of the adjusting member are arranged in parallel.

[0020] The utility model also provides an etching device, comprising the above-mentioned cleaning device.

[0021] So configured, the cleaning device can drive the wafer to rotate within the cleaning chamber via the posture adjustment assembly to adjust the wafer's circumferential position, thereby changing the position of the unevenly etched area on the wafer relative to the wafer rack. After the wafer rotates and enters the chemical bath for etching, the unevenly etched area is altered due to the change in the wafer's circumferential position. In actual operation, the wafer's rotation angle within the cleaning chamber can be set based on the location of the unevenly etched area on the wafer, thereby improving the uneven etching phenomenon on the wafer.

[0022] In addition, the posture adjustment component drives the wafer to rotate by rotating. On the one hand, it can adapt to the shape of the existing wafer and facilitate the adjustment of the circumferential position of the wafer. On the other hand, it is also beneficial to improve the accuracy of the wafer posture adjustment. The wafer is supported on the first adjustment axis and the second adjustment axis, which also improves the stability of the wafer when the wafer rotates. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a schematic diagram of the three-dimensional structure of a cleaning device according to an embodiment of the present invention;

[0024] Figure 2 This is a schematic cross-sectional view of a cleaning device according to an embodiment of the present invention;

[0025] Figure 3 This is a schematic diagram of the three-dimensional structure of a posture adjustment assembly according to an embodiment of the present invention;

[0026] Figure 4 This is a schematic diagram of the three-dimensional structure of a posture maintaining assembly according to one embodiment of the present invention;

[0027] Figure 5 This is a schematic diagram of the three-dimensional structure of the posture maintaining drive structure according to one embodiment of the present invention.

[0028] Among them, in the accompanying drawings:

[0029] 10-cleaning tank; 11-cleaning chamber;

[0030] 20-posture adjustment assembly; 21-adjustment member; 211-first adjustment shaft; 212-second adjustment shaft; 22-sealing ring; 23-first bearing seat; 24-second bearing seat; 25-first pulley; 26-second pulley; 27-adjustment drive member; 28-driving pulley; 29-belt;

[0031] 30-posture holding assembly; 31-first retaining member; 32-first retaining groove; 33-second retaining member; 34-second retaining groove; 35-first rotating shaft; 36-second rotating shaft; 37-third bearing seat; 38-fourth bearing seat;

[0032] 40-wafer;

[0033] 50-posture maintaining drive structure; 51-first slider group; 511-first adapter block; 512-first slider; 513-first track; 52-first connecting rod; 53-first crank; 54-first rotating wheel; 55-second slider group; 551-second adapter block; 552-second slider; 553-second track; 56-second connecting rod; 57 second crank; 58-second rotating wheel; 591-cylinder; 592-drive block; 593-reset elastic member. DETAILED DESCRIPTION

[0034] The cleaning device and etching apparatus proposed in the present invention are further described in detail below with reference to the accompanying drawings and specific embodiments. The advantages and features of the present invention will become more apparent from the following description. It should be noted that the accompanying drawings are highly simplified and not to exact scale, and are intended solely to facilitate and clearly illustrate the embodiments of the present invention.

[0035] As used in the present invention, the singular forms "a", "an", and "the" include plural objects, the term "or" is generally used to include the meaning of "and / or", the term "several" is generally used to include the meaning of "at least one", and the terms "at least two" or "a plurality" are generally used to include the meaning of "two or more". In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features specified as "first", "second", and "third" may explicitly or implicitly include one or at least two of the features. In addition, as used in the present invention, "installed", "connected", "connected", and one element is "set" on another element should be understood in a broad sense, usually only indicating that there is a connection, coupling, cooperation or transmission relationship between the two elements, and the connection, coupling, cooperation or transmission between the two elements can be direct or indirect through an intermediate element, and cannot be understood as indicating or implying the spatial position relationship between the two elements, that is, one element can be in any orientation such as inside, outside, above, below or on one side of another element, unless the content clearly indicates otherwise. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. In addition, directional terms such as above, below, up, down, upward, downward, left, right, etc. are used relative to the exemplary embodiments as they are shown in the figures, with the upward or upper direction toward the top of the corresponding figure, and the downward or lower direction toward the bottom of the corresponding figure.

[0036] The utility model provides a cleaning device, comprising a cleaning tank 10 and a posture adjustment component 20;

[0037] Combine Figure 1 and Figure 2 As shown, the cleaning tank 10 is a rectangular parallelepiped structure and can be made of quartz or polyvinylidene fluoride (PVDF). The cleaning tank 10 has a cleaning chamber 11 inside, with one side of the cleaning chamber 11 open. During normal use, the cleaning tank 10 should be placed so that the open side of the cleaning chamber 11 faces upward. Wafers are transferred into the cleaning chamber 11 through the opening. After the wafers are cleaned, they are transported out of the cleaning chamber through the opening.

[0038] like Figure 1 As shown, wafers 40 are typically placed upright on a wafer rack (not shown). The wafer rack typically has multiple slots arranged vertically, each of which can accommodate a wafer in an upright position. The wafer rack can accommodate a batch of wafers at the same time. When the wafer rack is transported by a robotic arm, a batch of wafers can be transferred between the chemical tank and the cleaning tank 10.

[0039] In addition, the wafer rack is located in the middle of the slot and has a hollow structure. That is, when the wafer 40 is inserted into the slot, the two sides of the bottom of the wafer 40 are located in the slot, and the bottom of the wafer 40 is facing the hollow area, so the bottom of the wafer is exposed.

[0040] like Figure 1 and Figure 2 As shown, when the wafer is cleaned, the wafer rack is placed at the bottom of the cleaning chamber 11, and the wafer is in an upright state.

[0041] Similarly, when the wafer rack is placed in the chemical tank for etching, the wafer is also in an upright position. Usually, the etching effect of a batch of wafers in the same chemical tank is relatively uniform, so the location of the unevenly etched areas of a batch of wafers is also relatively uniform. When the wafer rack is transported back and forth between the chemical tank and the cleaning tank 10, if the posture of each wafer on the wafer rack remains unchanged (the position of the wafer periphery relative to the wafer rack remains unchanged), the unevenly etched areas on the wafer remain unchanged relative to the wafer rack. Therefore, during repeated immersion etching, the unevenly etched areas on the wafer will produce a superposition effect and become more uneven.

[0042] Based on this, in this embodiment, a posture adjustment component 20 is introduced.

[0043] The posture adjustment assembly 20 is mainly used to adjust the position of the periphery of the wafer relative to the wafer rack, so as to change the position of the unevenly etched area on the wafer relative to the wafer rack, thereby improving the uneven etching phenomenon.

[0044] Specifically, the posture adjustment assembly 20 includes an adjustment member 21 , and the adjustment member 21 is movably disposed in the cleaning chamber 11 ;

[0045] The adjusting member 21 is configured as follows: the adjusting member 21 is used to support the wafer in the cleaning tank 10 , and when the adjusting member 21 moves relative to the cleaning chamber 11 , it drives the wafer to rotate.

[0046] Please refer to Figure 1 and Figure 2 As shown, in this embodiment, the movement mode of the adjusting member 21 is rotational movement, that is, the adjusting member 21 is rotatably disposed in the cleaning chamber 11 .

[0047] Furthermore, the adjustment member 21 includes a first adjustment shaft 211 and a second adjustment shaft 212. The first adjustment shaft 211 is arranged in the cleaning chamber 11 and rotates around its own central axis. The second adjustment shaft 212 is arranged in the cleaning chamber 11 and rotates around its own central axis. The first adjustment shaft 211 and the second adjustment shaft 212 are arranged in parallel.

[0048] When the cleaning device is in normal use, the first adjustment shaft 211 and the second adjustment shaft 212 should be arranged horizontally. When the wafer rack is placed in the cleaning chamber 11, the first adjustment shaft 211 and the second adjustment shaft 212 should be upwardly facing the hollowed-out area in the middle of the wafer rack, so that the first adjustment shaft 211 and the second adjustment shaft 212 can be supported at the position where the bottom of the wafer 40 is exposed outside the wafer rack. At this time, the outer peripheral surface of the first adjustment shaft 211 and the outer peripheral surface of the second adjustment shaft 212 are engaged with the outer peripheral surface of the wafer. The bottom of the wafer 40 should be located between the first adjustment shaft 211 and the second adjustment shaft 212. The horizontal distance between the first adjustment shaft 211 and the second adjustment shaft 212 should be less than the size of the exposed area in the middle of the wafer rack to avoid interference between the first adjustment shaft 211 and the second adjustment shaft 212 and the wafer rack. The specific installation position of the first adjustment shaft 211 and the second adjustment shaft 212 can be adjusted based on the position of the wafer rack placed in the cleaning chamber 11.

[0049] When the first adjustment shaft 211 and the second adjustment shaft 212 are supported on the bottom of the wafer 40, the wafer 40 should be lifted so that the wafer 40 is separated from the bottom of the slot on the wafer rack or the contact force between the wafer 40 and the bottom of the slot is reduced, so as to eliminate or reduce the friction between the wafer 40 and the bottom of the slot when the wafer 40 rotates. Therefore, the setting height of the first adjustment shaft 211 and the second adjustment shaft 212 can be adjusted based on the specific structure of the wafer rack. The installation height should meet the following requirements: when the wafer 40 is supported on the first adjustment shaft 211 and the second adjustment shaft 212, the wafer 40 is lifted and completely separated from or slightly contacted with the bottom of the slot on the wafer rack, and the edge of the wafer 40 should still be located in the slot on the wafer rack (not completely out of the slot).

[0050] When the wafer 40 needs to be adjusted, the first adjustment shaft 211 and the second adjustment shaft 212 can be driven to rotate in the same direction and at the same speed to drive the wafer 40 to rotate, thereby adjusting the position of the unevenly etched area on the wafer relative to the wafer rack.

[0051] The above-mentioned cleaning device can drive the wafer in the cleaning chamber 11 to rotate by means of the posture adjustment component 20 to adjust the circumferential position of the wafer, thereby changing the position of the unevenly etched area on the wafer relative to the wafer rack. After the wafer rotates and enters the chemical bath for etching, the unevenly etched area is changed due to the change in the circumferential position of the wafer. In actual operation, the rotation angle of the wafer in the cleaning chamber can be set based on the position of the unevenly etched area of ​​the wafer, thereby improving the phenomenon of uneven wafer etching.

[0052] In addition, the posture adjustment component 20 drives the wafer to rotate by rotating. On the one hand, it can adapt to the shape of the existing wafer and facilitate the adjustment of the circumferential position of the wafer. On the other hand, it is also beneficial to improve the accuracy of the wafer posture adjustment. The wafer is supported on the first adjustment shaft 211 and the second adjustment shaft 212, which also improves the stability of the wafer when the wafer rotates.

[0053] In this embodiment, the posture adjustment component 20 adopts a dual roller method to adjust the wafer posture. In other alternative embodiments, a single roller, multiple rollers or a single drum can also be used to adjust the wafer posture.

[0054] In this embodiment, the posture adjustment component 20 uses a rotational method to drive the wafer to rotate to achieve adjustment of the wafer posture. In other alternative embodiments, the posture adjustment component 20 can also use a linear motion method. For example, the posture adjustment component 20 has a support plane, and the support plane is supported on the bottom of the wafer. When the posture adjustment component 20 moves horizontally and linearly in a direction parallel to the support plane, it can drive the wafer to rotate within the slot of the wafer rack to achieve adjustment of the wafer posture. The posture adjustment component 20 can also use other known motion methods to achieve adjustment of the wafer posture, which will not be repeated here.

[0055] In this embodiment, the wafer is positioned upright within the cleaning tank, so the first adjustment shaft 211 and second adjustment shaft 212 of the posture adjustment assembly 20 are supported on the outer circumference of the wafer. In alternative embodiments, if the wafer is positioned horizontally, the posture adjustment assembly 20 can be supported on one axial side of the wafer, with the posture adjustment assembly 20 rotating to drive the wafer's rotation. The manner in which the posture adjustment assembly 20 supports the wafer and drives its rotation can be adjusted to suit the wafer's position within the cleaning tank.

[0056] Please continue to refer to Figure 2 and Figure 3As shown, first and second adjustment shafts 211, 212 are mounted on opposite sidewalls of the cleaning chamber 11. The first and second adjustment shafts 211, 212 are positioned near the bottom of the cleaning chamber 11. The bottom of the cleaning chamber has a triangular recessed structure, with the center of the bottom being the lowest point. This structure allows for the wafer to avoid interference with the bottom of the cleaning chamber 11.

[0057] In addition, the cleaning tank 10 is also provided with an injection structure and a drainage structure. The injection structure is, for example, an injection port provided in the cleaning tank 10 or an injection tube provided in the cleaning chamber 11, and the injection port or the injection tube is externally connected to an injection pump. The drainage structure is, for example, a drainage port provided at the bottom of the cleaning tank 10, and the drainage port is externally connected to a suction pump.

[0058] The first adjustment shaft 211 and the second adjustment shaft 212 are installed in the same manner. In this embodiment, the installation structure is described by taking the first adjustment shaft 211 as an example.

[0059] Combine Figure 3 As shown, the posture adjustment assembly 20 further includes a first bearing seat 23 , a second bearing seat 24 and a first pulley 25 .

[0060] One end of the first adjustment shaft 211 is rotatably mounted on a first bearing seat 23 via a bearing. The first bearing seat 23 is fixed to a side wall of the cleaning tank 10. The other end of the first adjustment shaft 211 is rotatably mounted on a second bearing seat 24 via a bearing. The second bearing seat 24 is fixed to the other opposite side wall of the cleaning tank 10.

[0061] The first bearing seat 23 and the second bearing seat 24 are both installed on the outer wall of the cleaning tank 10, so a through hole for the first adjustment shaft 211 to pass through needs to be opened on the corresponding side wall of the cleaning tank 10, and a rotating seal is formed between the first adjustment shaft 211 and the corresponding through hole through the sealing ring 22.

[0062] One end of the first adjustment shaft 211 passes through the second bearing seat 24 and then engages with the first pulley 25 for transmission.

[0063] The first bearing seat 23 , the second bearing seat 24 and the first pulley 25 are all located outside the cleaning tank 10 to avoid contact with the cleaning liquid in the cleaning tank 10 .

[0064] Combine Figure 3 As shown, similarly, the second adjustment shaft 212 is also rotatably mounted on the two side walls of the cleaning tank 10 through a structure similar to the first adjustment shaft 211. The second adjustment shaft 212 is in transmission engagement with the second pulley 26. The first pulley 25 and the second pulley 26 have the same specifications.

[0065] Combine Figure 3As shown, the posture adjustment assembly 20 further includes an adjustment drive member 27, a driving pulley 28, and a belt 29. The adjustment drive member 27 is fixedly mounted to the outer wall of the cleaning tank 10 via a mounting bracket. The output shaft of the adjustment drive member 27 engages with the driving pulley 28. The belt 29 engages with the first pulley 25, the second pulley 26, and the driving pulley 28. The adjustment drive member 27 drives the driving pulley 28 to rotate. The driving pulley 28, via the belt 29, drives the first pulley 25 and the second pulley 26 to rotate in the same direction and at a constant speed. This in turn drives the first adjustment shaft 211 and the second adjustment shaft 212 to rotate in the same direction and at a constant speed.

[0066] In this embodiment, the first adjustment shaft 211 and the second adjustment shaft 212 are synchronously driven by a belt drive. In other alternative embodiments, the first adjustment shaft 211 and the second adjustment shaft 212 can also be synchronously driven by a gear drive, a friction drive, a sprocket drive, etc. Alternatively, the first adjustment shaft 211 and the second adjustment shaft 212 can be directly driven by a motor.

[0067] In this embodiment, the adjustment drive member 27 is directly connected to the driving pulley 28. In other alternative embodiments, the adjustment drive member 27 can be directly connected to the input shaft of the reducer, and the driving pulley 28 can be directly connected to the output shaft of the reducer to achieve the effect of reducing speed and increasing torque.

[0068] In this embodiment, the adjustment drive member 27 is a servo motor. In other alternative embodiments, the adjustment drive member 27 can also be a known drive structure such as a fuel engine or a gas engine.

[0069] In this embodiment, the first adjustment shaft 211 and the second adjustment shaft 212 are made of aluminum alloy. In alternative embodiments, the first adjustment shaft 211 and the second adjustment shaft 212 may be made of polyurethane, alumina ceramic, or other materials. The materials of the first adjustment shaft 211 and the second adjustment shaft 212 can be selected based on temperature and corrosion resistance requirements.

[0070] Please continue to refer to Figure 1 and Figure 2 As shown, the posture adjustment component 20 also includes a posture maintaining component 30, at least a portion of which is disposed in the cleaning chamber 11 and is used to keep the wafer upright when the wafer rotates, so as to prevent the wafer 30 from being offset during rotation, causing adjacent wafers to contact and cause overlap.

[0071] Combine Figure 3As shown, in this embodiment, the posture holding assembly 30 includes a first holding member 31 and a second holding member 33 disposed in the cleaning chamber 11. The first holding member 31 defines a first holding groove 32 for accommodating the edge of the wafer. The second holding member 33 defines a second holding groove 34 for accommodating the edge of the wafer.

[0072] The first holding member 31 and the second holding member 33 are arranged horizontally opposite to each other, that is, when the wafer 30 is placed in the cleaning tank 10 , the first holding member 31 and the second holding member 33 are horizontally located on both sides of the wafer 30 along its radial direction.

[0073] Combine Figure 4 As shown, the upper ends of the first retaining member 31 and the second retaining member 33 are used for mounting with other components, the lower end of the first retaining member 31 serves as the first retaining end, and the lower end of the second retaining member 33 serves as the second retaining end. The middle portions of the first retaining member 31 and the second retaining member 33 are hollowed out. Specifically, a rectangular hollow area is defined between the upper and lower ends of the first retaining member 31, and a rectangular hollow area is defined between the upper and lower ends of the second retaining member 33. This achieves a lightweight design for the first and second retaining members 31 and 33, reducing material costs.

[0074] The first retaining groove 32 is opened on the side of the lower end (first retaining end) of the first retaining member 31 close to the second retaining member 33, and the first retaining groove 32 is opened vertically; similarly, the second retaining groove 34 is opened on the side of the lower end (second retaining end) of the second retaining member 33 close to the first retaining member 31, and the second retaining groove 34 is opened vertically. That is, the first retaining groove 32 and the second retaining groove 34 are arranged opposite to each other. Therefore, the first retaining groove 32 and the second retaining groove 34 are respectively used to accommodate the two side edges of the wafer along the horizontal radial direction. Therefore, the first retaining member 31 and the second retaining member 33 are similar to clamping the wafer. The two side walls of the first retaining groove 32 are respectively located on both sides of the wafer along its axial direction, and the two side walls of the second retaining groove 34 are respectively located on both sides of the wafer along its axial direction, thereby limiting the wafer from swinging in the axial direction, so as to prevent the wafer 30 from being offset during rotation, causing adjacent wafers to contact and cause stacking.

[0075] Please continue to refer to Figure 4 As shown, the lower end (first holding end) of the first retaining member 31 defines a plurality of first retaining grooves 32, each arranged horizontally. Similarly, the lower end (second holding end) of the second retaining member 33 defines a plurality of second retaining grooves 34, each arranged horizontally. Furthermore, a first retaining groove 32 and a second retaining groove 34 are arranged horizontally opposite each other to form a clamping groove group. Therefore, multiple clamping groove groups are formed on the first retaining member 31 and the second retaining member 33 to accommodate the posture and holding of multiple wafers.

[0076] In this embodiment, the connection between the bottom and the sidewall of the first and second retaining grooves 32, 34 is an arc structure to avoid damaging the wafer surface. The first and second retaining grooves 32, 34 can be U-shaped grooves or involute grooves, etc. The specific shapes of the first and second retaining grooves 32, 34 can be adaptively adjusted based on actual usage requirements.

[0077] In this embodiment, the first retaining member 31 and the second retaining member 33 are made of polyetheretherketone (PEEK), which has physical and chemical properties such as high temperature resistance and chemical corrosion resistance. In other alternative embodiments, the materials of the first retaining member 31 and the second retaining member 33 can also be selected based on factors such as their high temperature resistance and corrosion resistance.

[0078] In this embodiment, the bottoms of the first and second retaining grooves 32, 34 are flat. In other alternative embodiments, the bottoms of the first and second retaining grooves 32, 34 may be arcuate surfaces that match the periphery of the wafer, so that the periphery of the wafer is better adapted and fits the first and second retaining grooves 32, 34.

[0079] In this embodiment, it is preferred that the first holding groove 32 and the second holding groove 34 are located directly opposite the middle of the wafer height, so as to provide a better straightening and posture-maintaining effect on the wafer.

[0080] In this embodiment, two retaining members, a first retaining member 31 and a second retaining member 33, are provided. The two retaining members are in a clamping state to limit the radial displacement of the wafer, so that the wafer 30 can rotate with the posture adjustment assembly 20 and will not roll relative to the cleaning tank 10 and cause displacement. In other alternative embodiments, the posture maintenance assembly 30 may include only one retaining member, for example, only one first retaining member. In this case, the groove depth of the first retaining groove 32 can be appropriately increased to increase the size that can accommodate the edge of the wafer, thereby achieving the function of straightening the wafer. In this case, by setting an appropriate distance between the first adjustment shaft 211 and the second adjustment shaft 212 (for example, appropriately increasing the distance between the first adjustment shaft 211 and the second adjustment shaft 212), the wafer 30 can only rotate with the posture adjustment assembly 20 and will not roll relative to the cleaning tank 10 and cause displacement.

[0081] In this embodiment, the first retaining groove 32 and the second retaining groove 34 are used only to accommodate the edge of the wafer 30. In other alternative embodiments, the first retaining groove 32 and the second retaining groove 34 can accommodate not only the edge of the wafer, but also the center of the wafer. For example, the groove depth of the first retaining groove 32 and the second retaining groove 34 is approximately equal to the radius of the wafer, so that the area from the edge to the center of the wafer can be accommodated within the first retaining groove 32 and the second retaining groove 34. In this case, one of the first retaining member 31 and the second retaining member 33 can be retained for posture maintenance.

[0082] Combine Figure 4 As shown, further, the first holding member 31 and the second holding member 33 are rotatably arranged relative to the cleaning tank 10, so that the first holding end and the second holding end can be relatively close to or away from each other.

[0083] The rotation center axis of the first holding member 31 , the rotation center axis of the second holding member 33 and the rotation center axis of the adjusting member 21 are arranged in parallel.

[0084] Please continue to refer to Figure 4 As shown, the top of the first retaining member 31 is mounted on the first rotating shaft 35, and the top of the first retaining member 21 is thicker to facilitate cooperation with the first rotating shaft 35. Similarly, the top of the second retaining member 33 is mounted on the second rotating shaft 36, and the top of the second retaining member 33 is thicker to facilitate cooperation with the second rotating shaft 36.

[0085] The installation structures of the first rotating shaft 35 and the second rotating shaft 36 are the same. In this embodiment, the installation structure is described by taking the first rotating shaft 35 as an example.

[0086] One end of the first rotating shaft 35 is rotatably installed in the third bearing seat 37 through a bearing, and the other end of the first rotating shaft 35 is rotatably installed in the fourth bearing seat 38 through a bearing. The third bearing seat 37 and the fourth bearing seat 38 are installed on components outside the cleaning tank 10 (such as the outer shell of the etching equipment or other components of the etching equipment). This installation method can reduce the space occupied inside the cleaning tank 10, and since the first rotating shaft 35 and the second rotating shaft 36 are located outside the cleaning tank 10, the driving structure for driving the first rotating shaft 35 and the second rotating shaft 36 can also be located outside the cleaning tank 10 to avoid contact with the cleaning liquid inside the cleaning tank 10.

[0087] In addition, the cleaning device further includes a posture maintaining driving structure 50 to synchronously drive the first rotating shaft 35 and the second rotating shaft 36 to rotate in opposite directions at a constant speed, thereby driving the first retaining member 31 and the second retaining member 33 to rotate in opposite directions at a constant speed.

[0088] Please refer to Figure 5As shown, the posture-maintaining drive structure 50 is primarily a multi-link structure. It comprises two multi-link mechanisms (a first multi-link mechanism and a second multi-link mechanism) and a drive mechanism. The first multi-link mechanism engages with the first rotating shaft 35, while the second multi-link mechanism engages with the second rotating shaft 36. The drive mechanism simultaneously drives the sliders in both multi-link mechanisms, thereby transmitting the linear motion to the first rotating shaft 35 and the second rotating shaft 36, driving the first and second rotating shafts 35, 36 to move synchronously in opposite directions.

[0089] Please combine Figure 5 As shown, taking the first multi-link mechanism as an example, the first multi-link mechanism includes a first slider group 51, a first connecting rod 52, a first crank 53 and a first rotating wheel 54, wherein the first slider group 51 includes a first adapter block 511, a first slider 512 and a first track 513.

[0090] The first track 513 is fixedly mounted on an external device (e.g., the housing of the etching apparatus or other components of the etching apparatus). The first track 513 can be an I-shaped track or other known track. The first slider 512 is provided with a sliding groove that matches the shape of the first track 513. The first slider 512 is mounted on the first track 513 for linear sliding. The first slider 512 is rectangular in shape, and the first adapter block 511 is approximately diamond-shaped. A diamond-shaped side surface of the first adapter block 511 is fixedly connected to the side of the first slider 512 away from the sliding groove. In other words, the first slider 512 is located between the first adapter block 511 and the first track 513.

[0091] One end of the first adapter block 511, which has an acute angle and a rounded corner, is rotatably connected to one end of the first connecting rod 52. The other end of the first connecting rod 52 is connected to one end of the first crank 53, and the other end of the first crank 53 is fixedly connected to the first rotating shaft 35. Therefore, when the first slider 512 moves linearly along the first track 513, it drives the first adapter block 511 to move linearly, and the linear motion is converted into rotational motion of the first crank 53 through the first connecting rod 52. The first crank 53 then drives the first rotating shaft 35 to rotate.

[0092] Please continue to refer to Figure 4 The first rotating wheel 54 is rotatably mounted on the other end of the acute angle of the first adapter block 511. The rotational axis of the first rotating wheel 54, the rotational axis of the connection between the first adapter block 511 and the first connecting rod 52, the rotational axis of the connection between the first connecting rod 52 and the first crank 53, and the rotational axis of the first rotating shaft 35 are parallel. The rotational axis of the first rotating shaft 35 is arranged horizontally.

[0093] Similarly, the second multi-link mechanism in the posture maintaining drive structure 50 includes a second slider group 55, a second connecting rod 56, a second crank 57 and a second rotating wheel 58, wherein the structure of the second slider group 55 is similar to that of the first slider group 51, and the second slider group 55 includes a second adapter block 551, a second slider 552 and a second track 553.

[0094] The structure of the second multi-link mechanism is similar to that of the first multi-link mechanism, and the two multi-link mechanisms are symmetrically arranged. A plane perpendicular to the axes of the first and second rotating shafts 35, 36 is used as a symmetry reference plane. The first and second rotating shafts 35, 36 are symmetrically arranged about this symmetry reference plane. The structures of the first and second multi-link mechanisms are also symmetrically arranged about this symmetry reference plane.

[0095] Combine Figure 5 As shown, there is a set distance between the first rotating wheel 54 in the first multi-link mechanism and the second rotating wheel 58 in the second multi-link mechanism along the horizontal direction. The set distance is used to reserve an installation position for the driving mechanism of the posture maintaining driving structure 50.

[0096] The driving mechanism of the posture maintaining driving structure 50 includes a cylinder 591 , a driving block 592 and a reset elastic member 593 .

[0097] The output end of the cylinder 591 is vertically disposed, meaning that it moves vertically and linearly. The drive block 592 is connected to the output end of the cylinder 591 and can be driven by the output end of the cylinder 591 for vertical linear motion. The drive block 592 is an equilateral trapezoidal block, larger at the top and smaller at the bottom. The first rotating wheel 54 and the second rotating wheel 58 respectively abut against the two slanted side walls of the drive block 592. When the drive block 592 moves downward, the width of the area between the first rotating wheel 54 and the second rotating wheel 58 increases, thereby driving the first rotating wheel 54 and the second rotating wheel 58 horizontally away from each other, thereby driving the first slider 512 of the first slider group 51 and the second slider 552 of the second slider group 55 to slide horizontally along their corresponding tracks. As the drive block 592 moves downward, the first rotating wheel 54 and the second rotating wheel 58 adaptively roll against the inclined surfaces on both sides of the drive block 592 to reduce friction.

[0098] When the driving block 592 moves upward, the width of the area between the first rotating wheel 54 and the second rotating wheel 58 becomes smaller. At this time, a reset elastic member 593 is added to ensure that the first rotating wheel 54 and the second rotating wheel 58 are close to the inclined surfaces on both sides of the driving block 592.

[0099] like Figure 5As shown, the reset elastic member 593 is a cylindrical coil spring. Its two ends are connected between the first adapter block 511 and the second adapter block 551, respectively, and the reset elastic member 593 is in a pulled-up state. Connecting rods are connected to the middle portions of the first adapter block 511 and the second adapter block 551, connecting the two ends of the reset elastic member 593. Due to the arrangement of the reset elastic member 593, when the driving block 592 moves upward, the reset elastic member 593 pulls the first adapter block 511 and the second adapter block 551 closer together, thereby achieving reverse rotation and reset of the first rotating shaft 35 and the second rotating shaft 36.

[0100] In this embodiment, the above-mentioned one embodiment of the posture maintaining drive structure 50 is provided. In other alternative embodiments, the posture maintaining drive structure 50 may adopt other multi-link structures, such as a crank rocker structure. Alternatively, the posture maintaining drive structure 50 may adopt gear transmission, belt transmission, sprocket transmission, friction transmission, etc. to achieve synchronous reverse and constant speed drive of the first rotating shaft 35 and the second rotating shaft 36. Alternatively, in other alternative embodiments, the posture maintaining drive structure 50 may also adopt two sets of drive structures to respectively drive the first rotating shaft 35 and the second rotating shaft 36 to rotate, such as using two motors to respectively drive the first rotating shaft 35 and the second rotating shaft 36 to rotate, in which case the rotations of the first rotating shaft 35 and the second rotating shaft 36 are independent of each other.

[0101] In this embodiment, the first retaining member 31 and the second retaining member 33 are mounted in a rotating manner. In other alternative embodiments, the first retaining member 31 and the second retaining member 33 may be mounted in a linear motion manner. For example, the first retaining member 31 and the second retaining member 33 may be arranged to move horizontally and linearly relative to the cleaning tank 10. When the first retaining member 31 and the second retaining member 33 are relatively close to each other, the wafer can be accommodated in the first retaining groove 32 and the second retaining groove 34 to form a posture retention function for the wafer; when the first retaining member 31 and the second retaining member 33 are relatively far away from each other, the distance between them increases, facilitating the transfer of the wafer. In this case, the first retaining member 31 and the second retaining member 33 may adopt a drive structure such as a cylinder or a linear motor, or may be driven by a rotating drive structure in conjunction with a transmission mechanism, for example, by rotating a motor in conjunction with a transmission mechanism such as a gear rack, a crank slider, a screw nut, etc. to achieve linear drive of the first retaining member 31 and the second retaining member 33.

[0102] This embodiment also provides an etching apparatus including the cleaning device described above. The etching apparatus also includes a housing, a chemical tank, and a transfer device. The chemical tank and the cleaning tank are placed within the housing. The transfer device, for example, employs an existing robotic arm to transfer wafers between the chemical tank and the cleaning tank. The structure of the etching apparatus differs from that of existing wet etching apparatuses in that the cleaning apparatus is improved. The remaining structure remains consistent with that of existing wet etching apparatuses and will not be further described here.

[0103] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0104] The above description is only a description of the preferred embodiment of the present invention and does not limit the scope of the present invention. Any changes and modifications made by ordinary technicians in the field of the present invention based on the above disclosure shall fall within the scope of protection of the claims.

Claims

1. A cleaning device, characterized in that: It includes a cleaning tank, a posture adjustment component and a posture holding component; The cleaning tank has a cleaning chamber; The posture adjustment assembly includes an adjustment member, and the adjustment member is movably arranged in the cleaning chamber; The adjustment member is configured as follows: the adjustment member is used to support the wafer in the cleaning tank, and when the adjustment member moves relative to the cleaning chamber, the wafer is driven to rotate; At least a portion of the posture maintaining assembly is disposed in the cleaning chamber and is used to maintain the wafer upright when the wafer rotates; The posture holding assembly includes a first holding member and a second holding member disposed in the cleaning chamber, wherein the first holding member is provided with a first holding groove, the first holding groove being used to accommodate at least the edge of the wafer; the second holding member is provided with a second holding groove, the second holding groove being used to accommodate at least the edge of the wafer; The first retaining member has a first retaining end, the first retaining groove is arranged at the first retaining end, the second retaining member has a second retaining end, and the second retaining groove is arranged at the second retaining end; the first retaining member and the second retaining member are arranged to rotate relative to the cleaning tank so that the first retaining end and the second retaining end can be relatively close to or far away from each other.

2. The cleaning device according to claim 1, wherein The adjusting member is rotatably arranged in the cleaning chamber.

3. The cleaning device according to claim 2, wherein: The adjustment member includes a first adjustment shaft and a second adjustment shaft. The first adjustment shaft is arranged in the cleaning chamber and rotates around its own central axis. The second adjustment shaft is arranged in the cleaning chamber and rotates around its own central axis. The first adjustment shaft and the second adjustment shaft are arranged in parallel.

4. The cleaning device according to claim 1, wherein: The first holding groove and the second holding groove are arranged opposite to each other, and the first holding groove and the second holding groove are respectively used to accommodate edges of the wafer on both sides along a radial direction thereof.

5. The cleaning device according to claim 1, wherein: When the adjusting member is rotatably arranged in the cleaning chamber, The rotation center axis of the first holding member, the rotation center axis of the second holding member, and the rotation center axis of the adjusting member are arranged in parallel.

6. The cleaning device according to claim 1, wherein: The middle parts of the first retaining member and the second retaining member are hollow structures.

7. The cleaning device according to claim 1, wherein: The first retaining end of the first retaining member is provided with a plurality of first retaining grooves, each of which is arranged in a horizontal direction; the second retaining end of the second retaining member is provided with a plurality of second retaining grooves, each of which is arranged in a horizontal direction.

8. The cleaning device according to claim 1, wherein: The first retaining member and the second retaining member are made of polyetheretherketone.

9. The cleaning device according to claim 1, wherein: The cleaning device also includes a posture maintaining drive structure; The first retaining member is mounted on the first rotating shaft, the second retaining member is mounted on the second rotating shaft, and the posture maintaining driving structure is used to synchronously drive the first rotating shaft and the second rotating shaft to rotate at a constant speed in opposite directions, thereby driving the first retaining member and the second retaining member to rotate at a constant speed in opposite directions.

10. An etching device, characterized in that: Comprising the cleaning device according to any one of claims 1 to 9.

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