Working platform of wafer film tearing machine and wafer film tearing machine

Abstract

The working platform is used for bearing a wafer, and comprises an adsorption ring, a working platform, a driving mechanism, a driving mechanism and a driving mechanism, the plurality of annular parts are sequentially arranged in the adsorption ring from inside to outside in a sleeving manner; and each annular part is connected with one lifting part, and the lifting parts are used for driving the annular parts connected with the lifting parts to ascend and descend. The annular parts connected with the lifting parts are driven by the lifting parts to ascend and descend, so that the adsorption ring and the annular parts can form a contact type working platform for bearing a conventional grinding wafer and can also form a non-contact type working platform for bearing a drum-shaped grinding wafer; compatibility of a contact type working platform and a non-contact type working platform is achieved, and the working requirements of conventional grinding wafers and drum-shaped grinding wafers can be met.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a working platform of a wafer tearing machine and a wafer tearing machine. Background Art

[0002] During certain wafer processing steps (such as wafer grinding and wafer dicing), a protective film is usually attached to the surface of the wafer to protect the wafer from scratches, contamination, and physical damage. After the wafer has completed the processing step, if the subsequent process no longer requires the protection of the film, the film is removed.

[0003] In related technology, wafer tearing machines have two types of work platforms: contact and non-contact. Contact work platforms are primarily used to support conventionally ground wafers (conventional grinding refers to the uniform thinning of the wafer as a whole), while non-contact work platforms are primarily used to support taiko-grinding wafers (the TAIKO process is a wafer thinning technology that preserves the outer edge of the wafer and only grinds the inner part of the wafer, leaving a Taiko ring around the edge). Contact and non-contact work platforms are incompatible.

[0004] In view of the existence of the above technical problems, the present application provides a new working platform of a wafer tearing machine and a wafer tearing machine to at least partially solve the above problems. Utility Model Content

[0005] The Summary of the Utility Model introduces a series of simplified concepts that will be further described in the Detailed Description of the Implementation Method. The Summary of the Utility Model of this application is not intended to limit the key features and essential technical features of the claimed technical solution, nor is it intended to determine the scope of protection of the claimed technical solution.

[0006] In response to the existing problems, the present application provides a working platform of a wafer film tearing machine, wherein the working platform is used to carry wafers, and the working platform includes:

[0007] Adsorption ring;

[0008] A plurality of annular parts, wherein the plurality of annular parts are sequentially arranged in the adsorption ring from the inner side to the outer side;

[0009] A plurality of lifting parts are provided, each of the annular parts is connected to a lifting part, and the lifting part is used to drive the annular part connected thereto to rise and fall.

[0010] In some embodiments of the present application, the innermost annular portion is constructed as a solid structure.

[0011] In some embodiments of the present application, a plurality of driving parts are further included, each of the lifting parts is connected to one driving part, and the driving part is used to drive the lifting part connected thereto to rise and fall.

[0012] In some embodiments of the present application, a coupling and a driving part are further included, and a plurality of the lifting parts are connected to the same driving part through the coupling, and the driving part is used to individually drive each lifting part to move up and down through the coupling.

[0013] In some embodiments of the present application, a controller is further included, which is electrically connected to the driving unit and is used to control the height of the lifting unit driven by the driving unit according to the shape of the wafer.

[0014] In some embodiments of the present application, the controller is configured as follows: when the wafer is a conventional grinding wafer, the driving unit is controlled to drive each of the lifting units to a first height, and the first height is the same as the height of the adsorption ring; when the wafer is a drum grinding wafer, the driving unit is controlled to drive each of the lifting units to a second height, and the second height is lower than the height of the adsorption ring.

[0015] In some embodiments of the present application, the plurality of lifting parts are configured as follows:

[0016] respectively driving the annular parts connected thereto to rise and fall to the same height as the adsorption ring, so that the adsorption ring and the plurality of annular parts form a planar structure; or

[0017] The annular parts connected thereto are respectively driven to rise and fall to the same height and be lower than the adsorption ring, so that the adsorption ring and the plurality of annular parts form a drum-shaped structure.

[0018] According to another aspect of the present application, a wafer tearing machine is provided, which includes a working platform of the wafer tearing machine as described in any one of the above.

[0019] According to the working platform and wafer tearing machine of the embodiment of the present application, the annular parts connected thereto are respectively driven to rise and fall by a plurality of lifting parts, so that the adsorption ring and the plurality of annular parts can constitute both a contact working platform for carrying conventional grinding wafers and a non-contact working platform for carrying drum-shaped grinding wafers, thereby achieving compatibility between the contact working platform and the non-contact working platform, and being able to meet the operating requirements of conventional grinding wafers and drum-shaped grinding wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The following drawings of the present application are used as part of the present application for understanding the present application. The drawings show embodiments of the present application and their descriptions, which are used to explain the principle of the present application.

[0021] Figure 1 A schematic structural diagram of a working platform of a wafer tearing machine according to an embodiment of the present application is shown.

[0022] Figure 2 A top view of a working platform of a wafer tearing machine according to an embodiment of the present application is shown.

[0023] Figure 3 A schematic diagram showing a planar structure composed of an adsorption ring and multiple annular parts according to an embodiment of the present application is shown.

[0024] Figure 4 A schematic diagram showing a drum-shaped structure composed of an adsorption ring and multiple annular parts according to an embodiment of the present application is shown.

[0025] Figure 5 A schematic diagram showing an adsorption ring and a plurality of annular portions forming any suitable structure according to an embodiment of the present application is shown.

[0026] In the attached figure:

[0027] 110 adsorption ring;

[0028] 120 annular part;

[0029] 130 elevator;

[0030] 140 coupling;

[0031] 150 drive unit. DETAILED DESCRIPTION

[0032] In the following description, a large number of specific details are provided to provide a more thorough understanding of the present application. However, it will be apparent to those skilled in the art that the present application can be implemented without one or more of these details. In other examples, some technical features well known in the art are not described in order to avoid confusion with the present application.

[0033] It should be understood that the present application can be implemented in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided to make the disclosure thorough and complete and to fully convey the scope of the present application to those skilled in the art. In the drawings, the dimensions and relative sizes of layers and regions may be exaggerated for clarity. Like reference numerals throughout represent like elements.

[0034] It should be understood that when an element or layer is referred to as being "on," "adjacent to," "connected to," or "coupled to" another element or layer, it may be directly on, adjacent to, connected to, or coupled to the other element or layer, or there may be intervening elements or layers. Conversely, when an element is referred to as being "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" another element or layer, there may be no intervening elements or layers. It should be understood that although the terms first, second, third, etc. may be used to describe various elements, components, regions, layers, and / or parts, these elements, components, regions, layers, and / or parts should not be limited by these terms. These terms are merely used to distinguish one element, component, region, layer, or part from another element, component, region, layer, or part. Therefore, without departing from the teachings of the present application, the first element, component, region, layer, or part discussed below may be represented as a second element, component, region, layer, or part.

[0035] Spatially relative terms such as "under," "beneath," "below," "under," "above," "above," etc., may be used herein for convenience of description to describe the relationship of one element or feature shown in the figures to other elements or features. It should be understood that the spatially relative terms are intended to include different orientations of the device in use and operation in addition to the orientations shown in the figures. For example, if the device in the drawings is flipped, then the elements or features described as "under" or "beneath" or "beneath" the other elements will be oriented as "over" the other elements or features. Thus, the exemplary terms "under" and "under" may include both the upper and lower orientations. The device may be oriented otherwise (rotated 90 degrees or in other orientations) and the spatial descriptors used herein are interpreted accordingly.

[0036] The purpose of the terms used herein is only to describe specific embodiments and is not intended to limit the present application. When used herein, the singular forms "a", "an", and "the" are intended to include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "comprising" and / or "including", when used in this specification, determine the presence of the features, integers, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups. When used herein, the term "and / or" includes any and all combinations of the relevant listed items.

[0037] In the related technology, the working platforms of wafer tearing machines include two types: contact and non-contact. The contact working platform is usually used to carry conventional grinding wafers but cannot be used to carry drum-type grinding wafers. The non-contact working platform is usually used to carry drum-type grinding wafers but cannot be used to carry conventional grinding wafers. The two are not compatible with each other. In actual production, two types of working platforms are required to meet the operating requirements of conventional grinding wafers and drum-type grinding wafers.

[0038] In order to solve at least one of the above-mentioned technical problems, the present application provides a working platform of a wafer tearing machine, wherein the working platform is used to carry wafers, and the working platform includes: an adsorption ring; a plurality of annular parts, wherein the plurality of annular parts are sequentially arranged in the adsorption ring from the inside to the outside; a plurality of lifting parts, wherein each of the annular parts is connected to a lifting part, and the lifting part is used to drive the annular part connected thereto to rise and fall.

[0039] According to the working platform of the wafer tearing machine of the present application, the annular parts connected thereto are respectively driven to rise and fall by a plurality of lifting parts, so that the adsorption ring and the plurality of annular parts can constitute both a contact working platform for carrying conventional grinding wafers and a non-contact working platform for carrying drum-shaped grinding wafers, thereby achieving compatibility between the contact working platform and the non-contact working platform, and being able to meet the operating requirements of conventional grinding wafers and drum-shaped grinding wafers.

[0040] In order to thoroughly understand the present application, detailed steps and structures will be provided in the following description to illustrate the technical solution proposed by the present application. The preferred embodiments of the present application are described in detail below. However, in addition to these detailed descriptions, the present application may also have other implementation methods.

[0041] Reference below Figures 1 to 5 The following describes a working platform for a wafer film peeling machine according to one embodiment of the present application. The working platform is used to support wafers and includes: a suction ring 110; multiple annular portions 120, which are sequentially disposed within the suction ring 110 from the innermost to the outermost portion; and multiple lifting portions 130, each of which is connected to a lifting portion 130. The lifting portions 130 are used to raise and lower the connected annular portion 120.

[0042] Specifically, the inner diameter of the outer ring portion 120 is larger than the outer diameter of the inner ring portion 120, and the outer diameter of the outermost ring portion 120 is smaller than the inner diameter of the adsorption ring 110, so that multiple ring portions 120 can be arranged in sequence from the inside to the outside in the adsorption ring 110 to form a working platform for supporting wafers.

[0043] The working platform of this embodiment can be used to carry both conventional polishing wafers and drum-shaped polishing wafers. Taking the conventional polishing wafer as an example, the multiple lifting parts 130 respectively drive the annular parts 120 connected thereto to move up and down, so that the height of each annular part 120 is the same as the height of the adsorption ring 110, and the upper surface of the adsorption ring 110 and the upper surfaces of the multiple annular parts 120 together form a flat plane structure (the plane structure can be as shown in FIG. Figure 3 As shown in FIG, the planar structure can carry conventional grinding wafers. Taking the use of the drum-shaped grinding wafer as an example, the multiple lifting parts 130 drive the ring parts 120 connected thereto to move up and down, so that the height of each ring part 120 is the same and lower than the adsorption ring 110. The upper surfaces of the multiple ring parts 120 form a flat plane, which together with the upper surface of the adsorption ring 110 above it form a TAIKO drum structure (the TAIKO drum structure can be as shown in FIG. Figure 4 As shown), the TAIKO drum structure can carry drum-shaped grinding wafers.

[0044] Of course, it can be understood that in addition to the embodiment of the present invention using multiple lifting parts 130 to drive the annular part 120 connected thereto to move up and down to form a planar structure or a TAIKO drum structure, each lifting part 130 can also drive the annular part 120 connected thereto to move up and down to any suitable height, thereby forming any suitable structure (such as Figure 5 to meet various practical needs.

[0045] Based on this, the present application provides a work platform that is compatible with carrying conventional grinding wafers and carrying drum-shaped grinding wafers. According to the working platform of the wafer tearing machine of the present application, the multiple lifting parts 130 respectively drive the annular parts 120 connected thereto to rise and fall, so that the adsorption ring 110 and the multiple annular parts 120 can constitute both a contact work platform for carrying conventional grinding wafers and a non-contact work platform for carrying drum-shaped grinding wafers, thereby achieving compatibility between the contact work platform and the non-contact work platform, and being able to meet the operation requirements of conventional grinding wafers and drum-shaped grinding wafers.

[0046] Moreover, since each lifting part 130 can drive the annular part 120 connected thereto to rise or fall to any suitable height, each annular part 120 can be raised or lowered to a suitable height according to the contour of the wafer so as to fit tightly with the wafer, thereby achieving a better adsorption effect on the wafer.

[0047] In some embodiments, after the wafer is placed on the working platform of the formed planar structure or TAIKO drum structure, the adsorption ring 110 can adsorb the wafer through adsorption effects such as vacuum adsorption to firmly fix the wafer on the working platform to prevent the wafer from moving and ensure the accuracy of the process.

[0048] In some embodiments, as Figure 2 As shown, the innermost annular portion 120 is constructed as a solid structure.

[0049] Specifically, when multiple lifting parts 130 respectively drive the annular parts 120 connected thereto to lift and lower to form a planar structure or a TAIKO drum-shaped structure, the innermost ring part 120 is constructed as a solid structure so that there is no gap in the center of the formed planar structure or TAIKO drum-shaped structure, thereby providing a larger support area for the wafer, distributing the weight of the wafer more evenly, and reducing the risk of deformation or damage of the wafer due to local uneven force during the loading process.

[0050] In some embodiments, a plurality of driving parts 150 are further included. Each lifting part 130 is connected to a driving part 150 . The driving part 150 is used to drive the lifting part 130 connected thereto to move up and down.

[0051] Among them, each driving part 150 can independently drive the lifting part 130 connected to it to move up and down, so that each lifting part 130 can separately drive the annular part 120 connected to it to move up and down, thereby realizing independent lifting control of each annular part 120, so that each annular part 120 can be lifted or lowered to any suitable height according to actual needs to form any suitable structure for carrying wafers.

[0052] In other embodiments, Figure 1 As shown, it also includes a coupling 140 and a driving part 150. Multiple lifting parts 130 are connected to the same driving part 150 through the coupling 140. The driving part 150 is used to drive each lifting part 130 to move up and down separately through the coupling 140.

[0053] Among them, the driving part 150 can drive each lifting part 130 to rise and fall individually through the coupling 140, so that each lifting part 130 can drive the annular part 120 connected thereto to rise and fall respectively, thereby realizing independent lifting control of each annular part 120, so that each annular part 120 can be raised and lowered to any suitable height according to actual needs, so as to form any suitable structure for carrying wafers.

[0054] In some embodiments, the driving unit 150 can be a stepping motor, a servo motor, a hydraulic motor, etc., which is not limited.

[0055] In some embodiments, a controller is further included, electrically connected to the drive unit 150, and configured to control the height of the lifting units 130 driven by the drive unit 150 according to the shape of the wafer. The controller is configured to: when the wafer is a conventionally polished wafer, control the drive unit 150 to drive each lifting unit 130 to a first height, which is the same as the height of the suction ring 110; and when the wafer is a drum-polished wafer, control the drive unit 150 to drive each lifting unit 130 to a second height, which is lower than the height of the suction ring 110.

[0056] Taking the wafer as a conventional polishing wafer as an example, the controller can pre-set the zero height point, and then control the driving unit 150 to drive the multiple lifting units 130 to rise and fall to the same first height relative to the zero height point, so that the multiple lifting units 130 respectively drive the annular unit 120 connected thereto to rise and fall to the same height as the adsorption ring 110, so that the adsorption ring 110 and the multiple annular units 120 form a planar structure, which can be used to carry conventional polishing wafers. Taking the wafer as a drum-shaped polishing wafer as an example, the controller can pre-set the zero height point, and then control the driving unit 150 to drive the multiple lifting units 130 to rise and fall to the same second height relative to the zero height point, so that the multiple lifting units 130 respectively drive the annular unit 120 connected thereto to rise and fall to the same height and lower than the adsorption ring 110, so that the adsorption ring 110 and the multiple annular units 120 form a drum-shaped structure, which can be used to carry drum-shaped polishing wafers.

[0057] The controller may be a central processing unit (CPU), a graphics processing unit (GPU), a digital signal processor (DSP), a field programmable gate array (FPGA), an application specific integrated circuit (ASIC), etc., without limitation.

[0058] According to another aspect of the present application, a wafer tearing machine is provided, which includes a working platform of the wafer tearing machine.

[0059] Among them, the working platform of the wafer tearing machine can be implemented as the working platform of the wafer tearing machine mentioned above. Please refer to the introduction above and will not repeat it here.

[0060] To sum up, according to the working platform and wafer tearing machine of the embodiment of the present application, the annular parts connected thereto are respectively driven to rise and fall by multiple lifting parts, so that the adsorption ring and the multiple annular parts can constitute both a contact working platform for carrying conventional grinding wafers and a non-contact working platform for carrying drum-shaped grinding wafers, thereby achieving compatibility with the contact working platform and the non-contact working platform, and being able to meet the operating requirements of conventional grinding wafers and drum-shaped grinding wafers.

[0061] Although example embodiments have been described herein with reference to the accompanying drawings, it should be understood that the above example embodiments are merely illustrative and are not intended to limit the scope of the present application. Various changes and modifications may be made therein by those skilled in the art without departing from the scope and spirit of the present application. All such changes and modifications are intended to be included within the scope of the present application as required by the appended claims.

[0062] Similarly, it should be understood that in order to streamline the present application and aid in understanding one or more of the various application aspects, in the description of the exemplary embodiments of the present application, the various features of the present application are sometimes grouped together into a single embodiment, figure, or description thereof. However, this approach of the present application should not be interpreted as reflecting the intention that the claimed application requires more features than those explicitly recited in each claim. More precisely, as reflected in the corresponding claims, the point of the application is that the corresponding technical problem can be solved with fewer features than all the features of a single disclosed embodiment. Therefore, the claims following the detailed description are hereby expressly incorporated into the detailed description, with each claim itself serving as a separate embodiment of the present application.

[0063] Furthermore, those skilled in the art will appreciate that although some embodiments described herein include certain features included in other embodiments but not other features, combinations of features from different embodiments are intended to be within the scope of this application and to form different embodiments. For example, in the claims, any of the claimed embodiments may be used in any combination.

[0064] It should be noted that the above embodiments are illustrative rather than limiting of the present application, and that those skilled in the art may devise alternative embodiments without departing from the scope of the appended claims. In the claims, any reference signs placed between parentheses should not be construed as limiting the claims. The use of the words first, second, and third, etc., does not denote any order. These words may be interpreted as designations.

Claims

1. A working platform of a wafer tearing machine, the working platform is used to carry wafers, characterized in that: The working platform comprises: Adsorption ring; A plurality of annular parts, wherein the plurality of annular parts are sequentially arranged in the adsorption ring from the inner side to the outer side; A plurality of lifting parts are provided, each of the annular parts is connected to a lifting part, and the lifting part is used to drive the annular part connected thereto to rise and fall.

2. The working platform of the wafer tearing machine according to claim 1, characterized in that: The innermost ring portion is constructed as a solid structure.

3. The working platform of the wafer tearing machine according to claim 1, characterized in that: It also includes a plurality of driving parts, each of the lifting parts is connected to a driving part, and the driving part is used to drive the lifting part connected thereto to move up and down.

4. The working platform of the wafer tearing machine according to claim 1, characterized in that: It also includes a coupling and a driving part, wherein the plurality of lifting parts are connected to the same driving part through the coupling, and the driving part is used to drive each lifting part to move up and down individually through the coupling.

5. The working platform of the wafer tearing machine according to claim 3 or 4, characterized in that: The invention also includes a controller, which is electrically connected to the driving part and is used to control the height of the lifting part driven by the driving part according to the shape of the wafer.

6. The working platform of the wafer tearing machine according to claim 5, characterized in that: The controller is configured as follows: When the wafer is a conventionally polished wafer, the driving unit is controlled to drive each of the lifting units to rise and fall to a first height, wherein the first height is the same as the height of the adsorption ring; When the wafer is a drum-shaped grinding wafer, the driving unit is controlled to drive each of the lifting units to rise and fall to a second height, where the second height is lower than the height of the adsorption ring.

7. The working platform of the wafer tearing machine according to claim 1, characterized in that: The plurality of lifting parts are configured as follows: respectively driving the annular parts connected thereto to rise and fall to the same height as the adsorption ring, so that the adsorption ring and the plurality of annular parts form a planar structure; or The annular parts connected thereto are respectively driven to rise and fall to the same height and be lower than the adsorption ring, so that the adsorption ring and the plurality of annular parts form a drum-shaped structure.

8. A wafer film tearing machine, characterized in that: The wafer tearing machine includes a working platform of the wafer tearing machine according to any one of claims 1 to 7.

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