Combined splitting device and transmission equipment

Abstract

The utility model relates to a combination and splitting device, transmission equipment and a combination and splitting method, the device is used for combination and splitting of a plate carrying disc, a plate carrying ring and a base plate, the device comprises a ring carrying table and a lifting table, a through hole is formed in the ring carrying table, and the lifting table can movably penetrate through the through hole in the vertical direction; the size of the through hole is larger than that of the carrier plate, smaller than that of the outer ring of the carrier ring and smaller than that of the substrate; the size of the substrate is larger than the inner ring size of the carrier ring. The assembling and disassembling device can realize high-precision and accurate automatic assembling and disassembling of the carrier plate disc, the carrier plate ring and the substrate.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing technology, and in particular to a combination and splitting device, a transmission device, and a combination and splitting method. Background Art

[0002] Silicon carbide epitaxial growth involves growing epitaxial material of a specific thickness and concentration on a crystalline substrate under a process environment. This process typically utilizes a graphite plate as a support and heat transfer platform. Typically, a carrier ring and plate support the substrate, which is then placed into the epitaxial reaction chamber for epitaxial growth. During this process, any misalignment between the ring, plate, and substrate can compromise epitaxial growth quality, resulting in defective products.

[0003] Existing assembly and disassembly methods include manual assembly and automated assembly and disassembly mechanisms. Manual assembly can cause contamination of the substrate and can easily cause damage during transportation. Existing automated assembly and disassembly mechanisms only disclose automated assembly but do not mention how to improve assembly accuracy. Summary of the Invention

[0004] The present application proposes a combination and splitting device, a transmission device and a combination and splitting method to solve the problem of low and inaccurate splitting and combination precision of a carrier plate, a carrier ring and a substrate in the prior art.

[0005] In order to solve the above problems, the present application proposes a combination and disassembly device for the combination and disassembly of a carrier plate, a carrier ring and a substrate, including: a carrier ring platform and a lifting platform, the carrier ring platform is formed with a through hole, and the lifting platform can be movably arranged in the vertical direction through the through hole; the size of the through hole is larger than the size of the carrier plate, smaller than the outer ring size of the carrier ring, and smaller than the size of the substrate; the size of the substrate is larger than the inner ring size of the carrier ring.

[0006] In one embodiment, the combination and disassembly device also includes a position identifier, which is arranged relative to the ring-carrying platform and the lifting platform in the vertical direction, and is used to identify the center position of the ring-carrying platform and the lifting platform, and is also used to identify the center position of the plate carrier, plate carrier ring or substrate on the ring-carrying platform and the lifting platform.

[0007] In one embodiment, the assembly and separation device further includes a height measuring sensor, which is arranged relative to the ring carrier platform and the lifting platform in the vertical direction and is used to identify the upper surface height of the carrier ring and the upper surface height of the substrate.

[0008] In order to solve the above problems, the present application proposes a transmission device, including the above-mentioned combined splitting device and a transport robot, wherein the transport robot is used to transport the carrier plate, carrier ring and substrate to the carrier ring platform or the lifting platform, and is also used to adjust the posture position of the carrier plate, carrier ring or substrate on the carrier ring platform and the lifting platform.

[0009] In one embodiment, the transport device further includes a substrate calibrator, and the substrate calibrator is used to adjust the position and posture of the substrate.

[0010] In order to solve the above problems, the present application proposes a combination and disassembly method, which is used to combine and disassemble the carrier plate, carrier ring and substrate through a combination and disassembly device, and the combination and disassembly device includes: a carrier ring platform and a lifting platform, the carrier ring platform is formed with a through hole, and the lifting platform can be movably arranged in the through hole in the vertical direction; the size of the through hole is larger than the size of the carrier plate, smaller than the outer ring size of the carrier ring, and smaller than the size of the substrate; the size of the substrate is larger than the inner ring size of the carrier ring; the combination and disassembly method includes: controlling the lifting platform to pass through the through hole and rise on the carrier ring platform ; Place the combination of the carrier plate and the carrier ring on the lifting platform; control the lifting platform to descend to the carrier ring platform through the through hole, the carrier ring remains on the carrier ring platform, and the carrier plate follows the lifting platform to descend; move the carrier plate out, control the lifting platform to rise to the carrier ring platform through the through hole; place the substrate on the lifting platform; control the lifting platform to descend to the carrier ring platform through the through hole, and the substrate remains on the carrier ring; place the carrier plate on the lifting platform, control the lifting platform to rise to the carrier ring platform through the through hole to combine the carrier plate, the carrier ring and the substrate.

[0011] In one embodiment, the combination and disassembly device also includes a position identifier, which is arranged relative to the carrier ring platform and the lifting platform in the vertical direction. The combination and disassembly method also includes: before placing the combination of the carrier plate and the carrier ring on the lifting platform, identifying the through-hole center coordinates of the through hole by the position identifier; after placing the combination of the carrier plate and the carrier ring on the lifting platform, identifying the combination center coordinates of the combination of the carrier plate and the carrier ring by the position identifier; adjusting the position of the combination of the carrier plate and the carrier ring to control the deviation of the through-hole center coordinate and the combination center coordinate to be within an allowable range.

[0012] In one embodiment, the combination and splitting device is also associated with a transport robot and a substrate calibrator. The transport robot is also connected to the position identifier, and is used to transport the carrier plate, carrier ring and substrate to the carrier ring table or the lifting platform, and is used to adjust the posture position of the carrier plate, carrier ring or substrate on the carrier ring table and the lifting platform according to the identification information of the position identifier; the combination and splitting method also includes: before placing the substrate on the lifting platform, calibrating the position and posture of the substrate by using the substrate calibrator.

[0013] In one embodiment, the combination and disassembly device also includes a height measuring sensor, which is arranged relative to the carrier ring table and the lifting platform in the vertical direction. The combination and disassembly method also includes: after controlling the lifting platform to pass through the through hole and descend to the carrier ring table, and the substrate remains on the carrier ring, identifying the center coordinates of the carrier ring and the center coordinates of the substrate through a position identifier; identifying the upper surface height of the carrier ring and the upper surface height of the substrate through a height measuring sensor; if the deviation of the center coordinates of the carrier ring and the center coordinates of the substrate is within an allowable range, and the height difference between the upper surfaces of the carrier ring and the substrate is within an allowable range; then placing the carrier plate on the lifting platform, and controlling the lifting platform to pass through the through hole and rise to the carrier ring table to combine the carrier plate, the carrier ring and the substrate.

[0014] In one embodiment, if the deviation between the center coordinates of the carrier ring and the center coordinates of the substrate is not within the allowable range, or the height difference between the carrier ring and the upper surface of the substrate is not within the allowable range, the substrate is placed back into the substrate calibrator by a transport robot to re-calibrate the position and posture.

[0015] The assembly and splitting device of the present invention includes: a ring-carrying platform and a lifting platform. The ring-carrying platform is formed with a through hole, and the lifting platform can be movably arranged in the through hole in the vertical direction; the size of the through hole is larger than the size of the carrier plate, smaller than the outer ring size of the carrier ring, and smaller than the size of the substrate; the size of the substrate is larger than the inner ring size of the carrier ring. The assembly and splitting device of the present application can utilize the relative movable relationship between the ring-carrying platform and the lifting platform. After the carrier ring is placed on the ring-carrying platform, the lifting platform can be lifted to the upper and lower sides of the ring-carrying platform respectively to realize the assembly of the substrate and the carrier plate on the upper and lower sides of the carrier ring. Under this assembly structure, the carrier plate, carrier ring and substrate can be adjusted separately based on the ring-carrying platform and the lifting platform to improve the precision and accuracy of the assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The above and other objects, features and advantages of the exemplary embodiments of the present disclosure will become readily understood by reading the following detailed description with reference to the accompanying drawings. In the accompanying drawings, several embodiments of the present disclosure are shown in an illustrative and non-limiting manner, and the same or corresponding reference numerals represent the same or corresponding parts, wherein:

[0017] Figure 1This is a structural diagram of an embodiment of the assembly and separation device of the present application;

[0018] Figure 2 This is a schematic structural diagram of an embodiment of the transmission device of the present application;

[0019] Figure 3 This is a schematic diagram of the combined structure of the carrier plate, carrier ring and base plate in this application;

[0020] Figure 4 This is a schematic structural diagram of a first working state of an embodiment of the assembly and separation device of the present application;

[0021] Figure 5 This is a schematic structural diagram of the second working state of an embodiment of the assembly and separation device of the present application;

[0022] Figure 6 This is a structural diagram of the third working state of an embodiment of the combination and separation device of the present application. DETAILED DESCRIPTION

[0023] The following will be combined with the accompanying drawings in the embodiments of the present disclosure to clearly and completely describe the technical solutions in the embodiments of the present disclosure. Obviously, the embodiments described are part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments of the present disclosure, all other embodiments obtained by those skilled in the art without making any creative efforts shall fall within the scope of protection of the present disclosure.

[0024] The specific embodiments of the present disclosure are described in detail below with reference to the accompanying drawings.

[0025] The assembly and disassembly device of the present application is used to assemble and disassemble the carrier plate 23, the carrier ring 22 and the base plate 21, such as Figure 3 The three are detachable independent structures. After the three are assembled, the carrier plate 23 is embedded in the lower side of the carrier ring 22, and the substrate 21 is embedded in the upper side of the carrier ring 22. In the epitaxial reaction process, the substrate 21 is the workpiece to be reacted, which is a crystalline silicon material; the carrier plate 23 and the carrier ring 22 are used to carry the substrate 21. The carrier plate 23 is a graphite material and can be used as a heat conductor. The carrier ring 22 is a quartz material to improve the bearing stability. In this embodiment, all three are circular, and a step is formed in the carrier ring 22 for embedding the substrate 21 and the carrier plate 23. Among them, the size of the substrate 21 is larger than the inner ring size of the carrier ring 22, and the outer ring diameter of the substrate 21 is larger than the inner ring diameter of the carrier ring 22.

[0026] like Figure 1The assembly and disassembly device 49 includes a ring carrier 133 and a lifting platform 140. The ring carrier 133 is formed with a through hole, and the lifting platform 140 can be movably installed in the vertical direction through the through hole. The size of the through hole is larger than the size of the carrier plate 23, smaller than the outer ring size of the carrier ring 22, and smaller than the size of the substrate 21. Corresponding to the circular carrier plate 23, carrier ring 22, and substrate 21, the through hole is also designed to be circular. The diameter of the through hole is larger than the outer ring diameter of the carrier plate 23, smaller than the outer ring diameter of the carrier ring 22, and smaller than the outer ring diameter of the substrate 21.

[0027] This embodiment can utilize the relative movable relationship between the ring carrier platform 133 and the lifting platform 140. After the carrier ring 22 is placed on the ring carrier platform 133, the lifting platform 140 can be lifted to the upper and lower sides of the ring carrier platform 133 respectively to realize the assembly of the substrate 21 and the carrier plate 23 on the upper and lower sides of the carrier ring 22. Under this assembly structure, the carrier plate 23, the carrier ring 22 and the substrate 21 can be adjusted separately based on the ring carrier platform 133 and the lifting platform 140 to improve the precision and accuracy of the combination.

[0028] Specifically, the assembly and disassembly device 49 also includes a position identifier 48, which is arranged vertically relative to the ring-carrying platform 133 and the lifting platform 140. It is used to identify the center position of the ring-carrying platform 133 and the lifting platform 140, and is also used to identify the center position of the plate carrier 23, the plate carrier ring 22, and the substrate 21 on the ring-carrying platform 133 and the lifting platform 140. The position identifier 48 determines the center position, and then the position and posture of the plate carrier 23, the plate carrier ring 22, and the substrate 21 can be controlled and adjusted. In this embodiment, the position identifier 48 is an industrial camera that obtains position coordinates by photographing.

[0029] The combined splitting device 49 also includes a height measuring sensor 131, which is also arranged in the vertical direction relative to the carrier ring platform 133 and the lifting platform 140, and is used to identify the upper surface height of the carrier ring 22 and the upper surface height of the substrate 21. When the substrate 21 is embedded and installed on the upper side of the carrier ring 22, it can be judged whether the substrate 21 and the carrier ring 22 are installed accurately. Installation positioning parts, such as installation notches or installation protrusions, can be set on the substrate 21 and the carrier ring 22. Since it is automatically installed, it is easy for the positioning part to be inaccurately positioned. At this time, the height of the upper surfaces of the two can be detected to determine whether the positioning is accurate. If the height difference between the two upper surfaces is large, it means that the positioning is not accurate. If the height difference is small and within the preset range, it means that the positioning is accurate.

[0030] The assembly and disassembly device 49 is primarily used to assemble and disassemble the carrier plate 23, carrier ring 22, and base plate 21. In addition to the aforementioned structures, the assembly and disassembly device 49 also includes a ring light source 132, which illuminates the industrial camera during positioning and improves the accuracy of the positioning; a linear module 134, a linear module fixing plate 135, and a linear module drive motor 137, which drives the lifting platform 140 in the vertical direction; and a disassembly and assembly mechanism base plate 136 and an exhaust fan 10 mounted on the base plate for extracting air and dissipating heat to ensure a stable environment.

[0031] During the assembly process, it is also necessary to carry and adjust the carrier plate 23, the carrier ring 22 and the substrate 21. Therefore, the present application also proposes a transmission device 100 including a combination and separation device 49, and the transmission device 100 includes a handling robot 30, such as Figure 2 The transport robot 30 is used to transport the plate carrier 23, plate carrier ring 22, and substrate 21 to the ring carrier platform 133 or the lifting platform 140, and is also used to adjust the position of the plate carrier 23, plate carrier ring 22, or substrate 21 on the ring carrier platform 133 and the lifting platform 140. The transport robot 30 can specifically perform transport and position adjustment based on the position identifier 48.

[0032] The handling robot 30 can be a 4-axis, single-arm, single-finger, horizontal, multi-jointed SCARA (Selective Compliance Assembly Robot Arm) robot, equipped with one linear joint in the Z direction for lifting and lowering, three rotary joints with axes of rotation perpendicular to the horizontal plane, and four degrees of freedom of movement in all directions. Alternatively, it can be a 5-axis, single-arm, dual-finger, horizontal, multi-jointed SCARA (Selective Compliance Assembly Robot Arm) robot, equipped with one linear joint in the Z direction for lifting and lowering, four rotary joints with axes of rotation perpendicular to the horizontal plane, and two freely rotatable end grippers, each with four degrees of freedom of movement in all directions.

[0033] The transfer device 100 also includes a substrate calibrator 41, which is used to adjust the position and posture of the substrate 21 so that the substrate 21 can be accurately assembled on the carrier ring 22. The function of the substrate calibrator 41 is to calibrate the center position and angle of the substrate 21. It has an identification module that can accurately calculate and identify the center position (x, y) and angle θ of the substrate 21; it has a substrate fixing part and a rotation mechanism that can fix the substrate 21 and rotate with the substrate 21. It can cooperate with the identification module to calculate and identify the center position (x, y) and angle θ of the substrate, and can also adjust the angle θ of the substrate to a specified angle; it has a substrate center position positioning module that can drive the substrate to move and adjust the center position (x, y) of the substrate to a specified position. The substrate center position positioning module can be replaced by a handling robot. The handling robot 30 adjusts the center position (x, y) of the substrate 21 to a specified value based on the recognition result of the center position (x, y) of the substrate 21.

[0034] The transport device 100 also includes a magazine 42 for placing substrates, a hopper 44 for placing the carrier ring 22 and carrier plate 23, a reaction chamber 46 for reacting the assembled carrier plate 23, carrier ring 22, and substrate 21, a dust suction device 45, and a monitoring camera 47. The transport device 100 primarily uses a transport robot 30 to transport the carrier plate 23, carrier ring 22, and substrate 21, and cooperates with the assembly and disassembly device 49 to assemble and disassemble the three. Therefore, the transport device 100 is centered around the transport robot 30, and the other components are arranged around the transport robot 30.

[0035] Based on the above structure, the combination and splitting method of this embodiment includes the following steps.

[0036] S1: Calibrate the relative position and attitude angle relationship between the transport robot 30 and the substrate aligner 41 , and calibrate the relative position and attitude angle relationship between the transport robot 30 and the position identifier 48 .

[0037] S2: Calibrate the relative position and attitude angle relationship between the substrate calibrator 41 and the position identifier 48.

[0038] In steps S1 and S2, the positions of the components are confirmed, and accurate transportation can then be achieved.

[0039] S3: Identify the through-hole center coordinates of the through-hole through the position identifier.

[0040] In this step, the ring carrier 133 is photographed by an industrial camera to identify the center coordinates (x1, y1) of the through hole.

[0041] S4: Control the lifting platform to pass through the through hole and rise to the ring-carrying platform.

[0042] Generally, the lifting platform 140 is raised to a height higher than the top surface of the ring-carrying platform 133 by a certain distance, such as Figure 4 .

[0043] S5: Place the assembly of the carrier plate and the carrier ring on the lifting platform.

[0044] Specifically, according to the pre-calibrated and taught points, the handling robot 30 takes out the carrier ring 22 and carrier plate 23 assembly that was pre-assembled manually and placed in the silo 44 from the silo 44 and places it on the lifting platform 140 of the assembly and separation device 49.

[0045] S6: Identify the combined center coordinates of the combination of the carrier plate and the carrier ring through the position identifier.

[0046] Specifically, the industrial camera 48 takes a picture of the combination of the carrier ring 22 and the carrier plate 23 on the lifting platform 140, identifies the coordinates (x2, y2) of the camera coordinate system of the center of the center hole of the carrier ring 22, and the posture angle θ2 of the carrier ring 22.

[0047] S7: Adjust the position of the assembly of the carrier plate and the carrier ring to control the deviation between the center coordinate of the through hole and the center coordinate of the assembly to be within an allowable range.

[0048] Calculate the deviation between the coordinates (x1, y1) and the coordinates (x2, y2), dx1 = x1-x2, dy1 = y1-y2, according to the previously taught point position and the deviation calculation result (dx1, dy1, the handling robot 30 picks up the carrier ring 22 and the carrier plate 23 assembly from the lifting platform 140, and after the handling robot 30 adjusts the placement point of the assembly according to the deviation calculation result (dx1, dy1), the carrier ring 22 and the carrier plate 23 assembly is placed back on the lifting platform 140, so that the deviation (dx1, dy1) between the coordinates of the center point of the center hole of the carrier ring 22 (x2, y2) and the coordinates of the center point of the center hole of the ring carrier platform 133 (x1, y1) is within the allowable error range.

[0049] S8: Control the lifting platform to pass through the through hole and descend to the ring-carrying platform, the plate-carrying ring remains on the ring-carrying platform, and the plate-carrying plate descends along with the lifting platform.

[0050] The lifting platform 140 is lowered until the height of the lifting platform is lower than the top surface of the ring-carrying platform 133 by a certain distance. Figure 5 Since the outer diameter of the plate carrier ring 22 is larger than the diameter of the center hole of the ring carrier platform 133 and the outer diameter of the plate carrier plate 22 is smaller than the diameter of the center hole of the ring carrier platform 133 , the plate carrier plate 22 descends with the lifting platform 140 and the plate carrier ring 22 remains on the ring carrier platform 133 .

[0051] S9: Move the plate carrier out, and control the lifting platform to pass through the through hole and rise to the ring carrier.

[0052] According to the pre-taught points, the handling robot 30 takes the plate carrier 22 from the lifting platform 140 and puts it into the hopper 44. The lifting platform 140 rises until the height of the lifting platform is higher than the top surface of the ring carrier 133 by a distance, as shown in FIG. Figure 6 .

[0053] S10: Place the substrate into the substrate calibrator to calibrate its position and posture.

[0054] According to the pre-taught points, the handling robot 30 removes the substrate 21, which has been manually placed in the substrate magazine 42, and places it into the substrate calibrator 41. According to the pre-set center position and attitude angle θ3 of the substrate 42, the substrate calibrator 41 identifies and adjusts the center position and attitude angle θ3 of the substrate 42 to the set values ​​to ensure that when the substrate 21 and the carrier ring 22 are combined in the subsequent steps, the deviation between the center coordinates (x3, y3) of the substrate 21 and the center coordinates (x2, y2) of the center hole of the carrier ring 22 are within the allowable range, and the deviation between the attitude angle θ3 of the substrate 21 and the attitude angle θ2 of the carrier ring 22 are within the allowable range.

[0055] S11: Place the substrate on the lifting platform, control the lifting platform to pass through the through hole and descend to the carrier ring platform, and the substrate remains on the carrier ring.

[0056] Following the pre-programmed positioning, the transport robot 30 removes the substrate 21 from the substrate aligner 41 and places it on the lift 140. The lift 140 descends until its height is a certain distance below the top surface of the carrier ring 133. Because the outer diameter of the substrate 21 is larger than the diameter of the center hole of the carrier ring 22, the substrate 21 lands on the carrier ring 22, completing the assembly of the substrate 21 and the carrier ring 22.

[0057] S12: Identify the center coordinates of the carrier ring and the center coordinates of the substrate through the position identifier, and identify the upper surface height of the carrier ring and the upper surface height of the substrate through the height measuring sensor.

[0058] If the deviation between the center coordinates of the carrier ring and the center coordinates of the substrate is within the allowable range, and the height difference between the upper surfaces of the carrier ring and the substrate is within the allowable range; then the carrier plate is placed on the lifting platform, and the lifting platform is controlled to rise through the through hole to the carrier ring platform to combine the carrier plate, the carrier ring and the substrate.

[0059] If the deviation between the center coordinates of the carrier ring and the center coordinates of the substrate is not within the allowable range, or the height difference between the carrier ring and the upper surface of the substrate is not within the allowable range, the substrate is placed back into the substrate calibrator by the handling robot to re-calibrate the position and posture.

[0060] If multiple calibrations are unsuccessful, the clearing action is executed. According to the pre-taught points, the transport robot 30 takes the plate carrier 22 from the lifting platform 140 and puts it into the hopper 44, and an alarm is triggered.

[0061] Specifically, the industrial camera 48 takes a picture of the combination of the substrate 21 and the carrier ring 22 on the carrier ring table 133, identifies the center coordinates (x3, y3) and the attitude angle θ3 of the substrate 21, identifies the center coordinates (x2, y2) and the attitude angle θ2 of the center hole of the carrier ring 22, and determines whether the deviation between the center coordinates (x3, y3) of the substrate 21 and the center coordinates (x2, y2) of the center hole of the carrier ring 22 is within the allowable range, and whether the deviation between the attitude angle θ3 of the substrate 21 and the attitude angle θ2 of the carrier ring 22 is within the allowable range. At the same time, a laser altimeter is used to detect whether the deviation between the upper surface plane height h3 of the substrate 21 and the upper surface plane height h2 of the carrier ring 22 is within the allowable range.

[0062] S13: placing the carrier plate on the lifting platform, and controlling the lifting platform to rise to the carrier ring platform through the through hole to combine the carrier plate, the carrier ring and the substrate.

[0063] Following the pre-programmed positioning, the handling robot 30 removes the carrier plate 23 from the hopper 44 and places it on the lifting platform 140. The lifting platform 140 of the assembly and disassembly device 49 rises until it is a certain distance above the top surface of the ring-carrying platform 133. Because the outer diameter of the carrier plate 22 is smaller than the diameter of the central hole of the ring-carrying platform 133, the carrier plate 22 lifts the combined substrate 21 and carrier ring 22 as the lifting platform 140 rises, thus completing the assembly of the substrate 21, carrier ring 22, and carrier plate 23.

[0064] The transport robot 30 transports the assembled carrier plate 23, carrier ring 22 and substrate 21 to the reaction chamber 46 for reaction. After the reaction is completed, they are transported to the assembly and disassembly device 49 for disassembly. The specific disassembly steps are as follows.

[0065] S14: The lifting platform 140 of the combined splitting device 49 rises until the height of the lifting platform is a certain distance higher than the top surface of the carrier ring platform 133. According to the pre-taught points, the transport robot 30 takes the combination of the substrate 21, the carrier ring 22 and the carrier plate 23 from the reaction chamber 46 and places it on the lifting platform 140.

[0066] S15: The lifting platform 140 of the combined splitting device 49 descends until the height of the lifting platform is a certain distance lower than the top surface of the ring-carrying platform 133. Since the outer diameter of the carrier ring 22 is larger than the diameter of the central circular hole of the ring-carrying platform 133, and the outer diameter of the carrier plate 22 is smaller than the diameter of the central circular hole of the ring-carrying platform 133, the carrier plate 22 descends with the lifting platform 140, and the combination of the substrate 21 and the carrier ring 22 remains on the ring-carrying platform 133, thereby completing the splitting of the combination of the carrier plate 22, the substrate 21 and the carrier ring 22.

[0067] S16 : According to the previously taught points, the transport robot 30 takes the plate carrier 22 from the lifting platform 140 and puts it into the hopper 44 .

[0068] S17: The lifting platform 140 of the combined splitting device 49 rises until the height of the lifting platform is a certain distance higher than the top surface of the carrier ring platform 133. As the lifting platform 140 rises, the substrate 21 is pushed away from the carrier ring 22, thereby completing the splitting of the substrate 21 and the carrier ring 22.

[0069] S18: The industrial camera 48 detects whether the substrate 21 on the lifting platform 140 has successfully separated from the substrate carrier ring 22. If so, step S19 is executed; otherwise, an alarm is issued to prompt manual intervention.

[0070] S19 : According to the previously taught points, the transport robot 30 takes the substrate 21 from the lifting platform 140 and puts it into the substrate material box 42 .

[0071] The present application includes multiple embodiments of simple structures and relatively complex structures. The above-mentioned splitting method is based on the steps of the relatively complex structure. For the combined splitting device of the simple structure, the process of the splitting method is similar and can be directly determined based on the above-mentioned splitting method. It also falls within the scope of protection of the present application and will not be repeated here.

[0072] This application uses vision to accurately locate the center position and angular direction of the carrier plate, carrier ring, and substrate. Through vision and robot hand-eye calibration, the robot can perform position correction based on the visually identified positions of the carrier plate, carrier ring, and substrate, and complete the alignment of the carrier plate, carrier ring, and substrate with high precision, thereby ensuring that the assembly accuracy of the combination is improved.

[0073] In the foregoing description of this specification, unless otherwise expressly specified or limited, terms such as "fixed," "mounted," "connected," or "connected" should be understood broadly. For example, the term "connected" can refer to a fixed connection, a removable connection, or an integral connection; a mechanical connection or an electrical connection; a direct connection or an indirect connection through an intermediary; or the internal connection between two components or the interaction between two components. Therefore, unless otherwise expressly defined in this specification, those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0074] According to the above description of this specification, those skilled in the art may also understand that the terms used below, such as "up", "down", "front", "back", "left", "right", "length", "width", "thickness", "vertical", "horizontal", "top", "bottom", "inside", "outside", "axial", "radial", "circumferential", "center", "longitudinal", "transverse", "clockwise" or "counterclockwise", etc., which indicate orientation or positional relationships, are based on the orientation or positional relationships shown in the drawings of this specification, and are only for the purpose of facilitating the explanation of the scheme of the present invention and simplifying the description, rather than explicitly or implicitly indicating that the device or element involved must have the specific orientation, be constructed and operate in a specific orientation. Therefore, the above-mentioned orientation or positional relationship terms cannot be understood or interpreted as limitations on the scheme of the present invention.

[0075] In addition, the terms "first" or "second" used in this specification to refer to numbers or ordinal numbers are used for descriptive purposes only and should not be understood as explicitly or implicitly indicating relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of this specification, "plurality" means at least two, such as two, three or more, etc., unless otherwise clearly specified.

[0076] Although this specification has shown and described a number of embodiments of the present invention, it will be apparent to those skilled in the art that such embodiments are provided by way of example only. Those skilled in the art will conceive of many modifications, variations, and alternatives without departing from the concept and spirit of the present invention. It should be understood that in practicing the present invention, various alternatives to the embodiments of the present invention described herein may be employed. The appended claims are intended to define the scope of protection of the present invention and therefore cover modular compositions, equivalents, or alternatives within the scope of these claims.

Claims

1. A combination and separation device, characterized in that: The combination and disassembly device is used for the combination and disassembly of a carrier plate, a carrier ring and a substrate, and includes: a carrier ring platform and a lifting platform, the carrier ring platform is formed with a through hole, and the lifting platform can be movably arranged in the vertical direction through the through hole; the size of the through hole is larger than the size of the carrier plate, smaller than the outer ring size of the carrier ring, and smaller than the size of the substrate; the size of the substrate is larger than the inner ring size of the carrier ring.

2. The assembly and disassembly device according to claim 1, characterized in that: The combination and separation device also includes a position identifier, which is arranged relative to the ring-carrying platform and the lifting platform in the vertical direction, and is used to identify the center position of the ring-carrying platform and the lifting platform, and is also used to identify the center position of the plate-carrying plate, plate-carrying ring or substrate on the ring-carrying platform and the lifting platform.

3. The assembly and disassembly device according to claim 1, characterized in that: The assembly and separation device further comprises a height measuring sensor, which is arranged relative to the ring carrier platform and the lifting platform in the vertical direction and is used to identify the upper surface height of the carrier ring and the upper surface height of the substrate.

4. A transmission device, characterized in that: The transmission equipment includes a combined splitting device and a handling robot as described in any one of claims 1 to 3, and the handling robot is used to transport the carrier plate, carrier ring and substrate to the carrier ring platform or the lifting platform, and is also used to adjust the posture position of the carrier plate, carrier ring or substrate on the carrier ring platform and the lifting platform.

5. The transmission device according to claim 4, characterized in that The transport device further includes a substrate aligner configured to adjust a position and posture of the substrate.

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