Etching device and carrier structure

Abstract

The utility model provides an etching device and a carrier structure, and relates to the field of carrier structures, the carrier structure comprises a bearing piece and a heat conduction piece, the bearing piece comprises a containing cavity and an opening part, the heat conduction piece can penetrate through the opening part to be inserted into the containing cavity, and at least part of the heat conduction piece is attached to the bearing piece. The temperature of the sample on the bearing piece is adjusted by adjusting the position of the heat conduction piece, fine adjustment of the etching temperature can be achieved, the temperature of the sample does not need to be adjusted by adjusting temperature setting of an equipment cavity, energy consumption in the etching working process is reduced, cost is reduced, and the etching efficiency is improved. In addition, the efficiency of sample temperature adjustment in the etching working process is improved, the convenience of sample temperature adjustment is improved, and the efficiency of etching working is improved.

Description

Technical Field

[0001] The present application relates to the field of carrier structures, and in particular to an etching device and a carrier structure. Background Art

[0002] Compared to OLED, Micro LEDs can support higher brightness, a higher dynamic range, and a wider color gamut, while also achieving faster refresh rates, wider viewing angles, and lower power consumption. During dry etching of Micro LED products, a tray is typically used to carry the sample onto the stage in the process chamber. During the etching process, the temperature of the sample and tray approaches the temperature set on the stage, and the sample temperature directly affects the sample's etching rate and surface morphology.

[0003] In related technologies, it is necessary to adjust the temperature setting of the equipment chamber to achieve temperature control of the dry etching process of Micro LED products. However, the temperature rise and fall time cycle of the equipment chamber is relatively long, which affects the etching efficiency. Utility Model Content

[0004] To overcome the deficiencies in the prior art, the present application provides an etching device and a carrier structure.

[0005] In a first aspect, the present application provides a carrier structure comprising: a carrier and a heat conducting member, wherein the carrier comprises a receiving cavity and an opening, and the heat conducting member can be inserted into the receiving cavity through the opening and at least partially fit with the carrier.

[0006] In combination with the first aspect, in a possible embodiment, the supporting member includes: a first supporting portion, a first enclosure portion and a second supporting portion, one side of the first supporting portion is provided with a mounting portion adapted to the shape of the sample, and the second supporting portion and the first supporting portion form the accommodating cavity.

[0007] In combination with the first aspect, in a possible implementation manner, when the heat conducting member is inserted into the accommodating cavity, the heat conducting member is at least partially in contact with the first bearing portion and / or the second bearing portion.

[0008] In combination with the first aspect, in a possible embodiment, the heat conductive member includes: a first contact surface and a second contact surface, and when the heat conductive member is inserted into the accommodating cavity, the first bearing portion is at least partially in contact with the first contact surface, and the second bearing portion is at least partially in contact with the second contact surface.

[0009] In combination with the first aspect, in a possible implementation manner, the heat conducting member has a first preset length, the accommodating cavity has a second preset length, and the first preset length is greater than the second preset length.

[0010] In combination with the first aspect, in a possible implementation manner, the mounting portion is recessed toward a direction close to the second supporting portion, and the sample is disposed in the mounting portion.

[0011] In combination with the first aspect, in a possible implementation manner, the heat conducting member is at least partially located outside the accommodating cavity, and the heat conducting member is inserted into the accommodating cavity along a first preset direction.

[0012] In combination with the first aspect, in a possible implementation, the heat conducting member includes: a plug end and a handle end, the plug end can pass through the opening and be inserted into the accommodating cavity, and the handle end is provided with a groove.

[0013] In combination with the first aspect, in a possible implementation manner, when the plug end is inserted into the accommodating cavity, the handle end is at least partially located outside the accommodating cavity.

[0014] In a second aspect, the present application provides an etching device comprising the above-mentioned carrier structure.

[0015] Compared with the prior art, the present invention has the following advantages:

[0016] The carrier structure provided by the present application comprises a carrier including a receiving cavity and an opening portion, and a heat conductor can be inserted into the receiving cavity through the opening portion and at least partially fit with the carrier. Placing the sample to be etched on the carrier and inserting the heat conductor into the receiving cavity can increase the heat conduction speed between the carrier and the heat conductor, and pulling the heat conductor out of the receiving cavity can reduce the heat conduction speed between the carrier and the heat conductor, that is, by adjusting the position of the heat conductor relative to the receiving cavity, the heat conduction speed between the carrier and the heat conductor can be adjusted, so that the temperature of the sample on the carrier can be fine-tuned. On the one hand, there is no need to adjust the temperature of the sample by adjusting the temperature setting of the equipment chamber, which reduces the energy consumption during the etching process and reduces the cost. On the other hand, by adjusting the temperature of the sample by adjusting the position of the heat conductor, the fine adjustment of the etching temperature can be achieved, and the efficiency of sample temperature regulation during the etching process is improved, the convenience of sample temperature regulation is improved, and the efficiency of etching work is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0018] Figure 1 shows a schematic diagram of the overall structure of the carrier structure;

[0019] Figure 2 shows a schematic diagram of the exploded structure of the carrier structure;

[0020] Figure 3 A schematic structural diagram showing another angle of the carrier structure;

[0021] Figure 4 A schematic structural diagram showing a carrier of a carrier structure;

[0022] Figure 5 A schematic structural diagram of a heat conducting member of a carrier structure is shown;

[0023] Figure 6 shows a schematic diagram of a top view of a carrier structure;

[0024] Figure 7 A schematic cross-sectional view of the carrier structure is shown.

[0025] Description of main component symbols:

[0026] 1000 - bearing member; 1110 - first bearing portion; 1120 - first enclosure portion; 1130 - second bearing portion; 1140 - accommodating cavity; 1150 - opening portion; 1160 - mounting portion; 1161 - open cavity; 1162 - open opening; 1170 - third bearing portion; 1180 - second enclosure portion;

[0027] 2000-heat conducting element; 2100-first contact surface; 2200-second contact surface; 2300-plug end; 2400-handle end. DETAILED DESCRIPTION

[0028] The following describes in detail embodiments of the present application. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and are not to be construed as limiting the present application.

[0029] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0030] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. Throughout the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0031] In this application, unless otherwise expressly specified or limited, terms such as "mounted," "connected," "connect," and "fixed" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components or interactions between two components. Those skilled in the art will understand the specific meanings of these terms in this application based on specific circumstances.

[0032] In this application, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0033] Example 1

[0034] See also Figure 1 , the embodiment of the present application provides a carrier structure, the carrier structure comprising: a carrier 1000 and a heat conducting member 2000. Figure 2 and Figure 7The carrier 1000 has a receiving cavity 1140 and an opening 1150. A mounting portion 1160 adapted to the shape of the sample is provided on a side of the carrier 1000 facing away from the receiving cavity 1140. The thermal conductive member 2000 can be inserted through the opening 1150 and inserted into the receiving cavity 1140, at least partially affixing to the carrier 1000. The thermal conductive member 2000 can also be at least partially removed from the opening 1150. The sample to be etched is placed in the mounting portion 1160, and the heat conducting member 2000 is inserted into the accommodating cavity 1140 to increase the heat conduction speed between the carrier 1000 and the mounting portion 1160. The heat conducting member 2000 is pulled out of the accommodating cavity 1140 to reduce the heat conduction speed between the carrier 1000 and the mounting portion 1160. That is, by adjusting the position of the heat conducting member 2000 relative to the accommodating cavity 1140, the heat conduction speed between the carrier 1000 and the mounting portion 1160 can be adjusted. The heat conduction speed between the heat conducting parts 2000 and the sample can be adjusted to achieve fine adjustment of the temperature of the sample on the mounting portion 1160. On the one hand, there is no need to adjust the temperature of the sample by adjusting the temperature setting of the equipment chamber, which reduces the energy consumption during the etching process and reduces the cost. On the other hand, by adjusting the position of the heat conducting part 2000 to adjust the temperature of the sample, the etching temperature can be finely adjusted, and the efficiency of the sample temperature adjustment during the etching process is improved, the convenience of the sample temperature adjustment is improved, and the efficiency of the etching work is improved.

[0035] In some embodiments, the carrier 1000 is made of any one of aluminum, stainless steel, and silicon carbide.

[0036] In some embodiments, the material of the heat conducting element 2000 is the same as that of the supporting element 1000 .

[0037] It can be understood that the carrier 1000 and the heat conducting member 2000 both have good thermal conductivity and high hardness characteristics. On the one hand, they can accelerate the heat conduction speed between the carrier 1000 and the mounting portion 1160, thereby increasing the speed of adjusting the sample temperature. On the other hand, they can provide a stable supporting structure for the sample, thereby improving the structural stability of the carrier structure.

[0038] In some embodiments, the heat conducting member 2000 is inserted into the accommodating cavity 1140 along a first preset direction, and the sample is inserted into the mounting portion 1160 along a second preset direction. The first preset direction is perpendicular to the second preset direction.

[0039] See also Figure 3 and Figure 4In some embodiments, the supporting member 1000 is cylindrical and includes a first supporting portion 1110, a first enclosure portion 1120, and a second supporting portion 1130. The mounting portion 1160 is disposed on the first supporting portion 1110. The first enclosure portion 1120 is disposed around the periphery of the first supporting portion 1110 and is connected to the first supporting portion 1110. The opening portion 1150 is disposed on the first enclosure portion 1120. The second supporting portion 1130 is disposed opposite to the first supporting portion 1110 and is connected to the first enclosure portion 1120. The second supporting portion 1130, the first supporting portion 1110, and the first enclosure portion 1120 define the accommodating cavity 1140.

[0040] In other embodiments, the supporting member 1000 may be adjusted to a quadrangular prism, a pentagonal prism, a hexagonal prism, etc. according to actual needs, which will not be listed here one by one.

[0041] In some embodiments, the first supporting portion 1110 is integrally formed with the first enclosure portion 1120, the second supporting portion 1130, the mounting portion 1160 and the opening portion 1150. On the one hand, no assembly is required, which eliminates the assembly steps and improves the loading efficiency of the sample. On the other hand, the structural stability of the supporting component 1000 can be improved.

[0042] In some embodiments, the first supporting portion 1110 is disposed along the first preset direction, the second supporting portion 1130 is disposed along the first preset direction, the opening portion 1150 is disposed along the first preset direction, and the first blocking portion 1120 is disposed along the second preset direction.

[0043] In some embodiments, when the thermal conductive member 2000 is inserted into the accommodating cavity 1140, the thermal conductive member 2000 is at least partially adhered to the first carrier part 1110 and the second carrier part 1130, so as to increase the speed of heat conduction between the first carrier part 1110 and the second carrier part 1130, thereby improving the efficiency of the sample temperature regulation.

[0044] In other embodiments, when the heat conducting member 2000 is inserted into the accommodating cavity 1140 , the heat conducting member 2000 is at least partially in contact with the first supporting portion 1110 or the second supporting portion 1130 .

[0045] See also Figure 2 and Figure 5In some embodiments, the heat conducting member 2000 includes a first contact surface 2100 and a second contact surface 2200 disposed opposite to each other. When the heat conducting member 2000 is inserted into the accommodating cavity 1140, a portion of the first supporting portion 1110 is in contact with the first contact surface 2100, and a portion of the second supporting portion 1130 is in contact with the second contact surface 2200.

[0046] In other embodiments, when the heat conducting member 2000 is inserted into the accommodating cavity 1140 , the first supporting portion 1110 is completely in contact with the first contact surface 2100 , and the second supporting portion 1130 is completely in contact with the second contact surface 2200 .

[0047] In some embodiments, the mounting portion 1160 is disposed on the first supporting portion 1110 along the second preset direction. The mounting portion 1160 is in contact with the first contact surface 2100. The mounting portion 1160 is recessed toward the second supporting portion 1130. An open cavity 1161 matching the shape of the sample is disposed within the mounting portion 1160. The sample is inserted into the open cavity 1161.

[0048] See also Figure 7 In some embodiments, the carrier 1000 further includes a third carrier portion 1170 and a second enclosing portion 1180. The third carrier portion 1170 is in contact with the first contact surface 2100 and is disposed along the first predetermined direction. The second enclosing portion 1180 is disposed along the second predetermined direction and surrounds the periphery of the third carrier portion 1170. The second enclosing portion 1180 and the third carrier portion 1170 form the open cavity 1161.

[0049] In some embodiments, the first supporting portion 1110 includes a first inner surface and a first outer surface. The mounting portion 1160 is disposed on the first outer surface along the second predetermined direction, and when the thermal conductive member 2000 is inserted into the accommodating cavity 1140, the first inner surface is partially aligned with the first contact surface 2100, thereby enabling the first contact surface 2100 to be aligned with the third supporting portion 1170.

[0050] In some embodiments, the second supporting portion 1130 includes a second inner surface and a second outer surface. When the heat conducting member 2000 is inserted into the accommodating cavity 1140 , the second inner surface is in contact with the second contact surface 2200 .

[0051] In some embodiments, the open cavity 1161 is cylindrical, and the central axis of the open cavity 1161 coincides with the central axis of the first bearing portion 1110 .

[0052] In other embodiments, the open cavity 1161 can also be adjusted to a quadrangular prism, a pentagonal prism, a hexagonal prism, etc. according to the shape of the sample, which will not be listed here one by one.

[0053] In some embodiments, the sample is inserted into the open cavity 1161 through the opening 1162, and the sample is at least partially exposed from the mounting portion 1160 to provide a space for taking and placing the sample, thereby improving the convenience of taking and placing the sample, thereby further improving the efficiency of the etching work.

[0054] See also Figure 2 and Figure 4 In some embodiments, the opening 1150 is provided on the first enclosure portion 1120 , and the shape of the opening 1150 matches the shape of the heat conducting member 2000 . When the heat conducting member 2000 is inserted into the accommodating cavity 1140 , the heat conducting member 2000 can block the opening 1150 .

[0055] In some embodiments, the opening 1150 faces the first preset direction, and the opening 1150 is arranged in an arc shape around the central axis of the open cavity 1161 .

[0056] See also Figure 5 and Figure 6 In some embodiments, the heat conducting member 2000 includes a plug end 2300 and a handle end 2400. The plug end 2300 can be inserted through the housing 1150 and inserted into the accommodating cavity 1140, and the end of the plug end 2300 is arc-shaped. The handle end 2400 is at least partially located outside the accommodating cavity 1140, and the end of the handle end 2400 is arc-shaped.

[0057] In some embodiments, the handle end 2400 is provided with a groove (not shown in the figure), which provides a handle position for removing and placing the thermal conductive member 2000. When the plug end 2300 is inserted into the accommodating cavity 1140, the handle end 2400 is at least partially located outside the accommodating cavity 1140, so that the groove is located outside the accommodating cavity 1140.

[0058] It can be understood that the groove is always located outside the accommodating cavity 1140 , so as to facilitate the extraction of the heat conducting member 2000 .

[0059] The carrier structure is placed in the chamber of the etching equipment, and the sample is inserted into the open cavity 1161. The relative position of the heat conductive member 2000 and the accommodating cavity 1140 can be adjusted to achieve fine-tuning of the sample temperature. When the heat conductive member 2000 is inserted into the accommodating cavity 1140, the first contact surface 2100 is in contact with the third bearing portion 1170, and the second contact surface 2200 is in contact with the second inner surface, thereby accelerating the heat conduction speed between the first bearing portion 1110 and the second bearing portion 1130. When the heat conductive member 2000 is removed from the accommodating cavity 1140, the heat conduction effect between the first bearing portion 1110 and the second bearing portion 1130 can be weakened. The present application achieves fine-tuning of the sample temperature by adjusting the relative position of the heat conductor 2000 and the accommodating cavity 1140, eliminating the step of adjusting the temperature setting of the equipment chamber, reducing energy consumption during the etching process, lowering costs, and improving the efficiency of the sample temperature regulation during the etching process, thereby improving the convenience of the sample temperature regulation and improving the efficiency of the etching work.

[0060] Example 2

[0061] An embodiment of the present application provides an etching device (not shown in the figure), which includes the carrier structure in any one of the above embodiments, and therefore has all the beneficial effects of the carrier structure in any one of the above embodiments, which will not be described here one by one.

[0062] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and features of different embodiments or examples without contradiction.

[0063] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. A carrier structure, characterized in that: include: A carrier, the carrier comprising a receiving cavity and an opening; A heat conducting member can be inserted into the accommodating cavity through the opening portion and at least partially fit with the supporting member.

2. The carrier structure according to claim 1, characterized in that: The carrier comprises: a first carrying portion, wherein a mounting portion adapted to the shape of the sample is provided on one side of the first carrying portion; A second bearing portion, wherein the second bearing portion and the first bearing portion form the accommodating cavity.

3. The carrier structure according to claim 2, characterized in that: When the heat conducting member is inserted into the accommodating cavity, at least a portion of the heat conducting member is in contact with the first bearing portion and / or the second bearing portion.

4. The carrier structure according to claim 3, characterized in that: The heat conducting member includes a first contact surface and a second contact surface. When the heat conducting member is inserted into the accommodating cavity, the first bearing portion at least partially fits the first contact surface, and the second bearing portion at least partially fits the second contact surface.

5. The carrier structure according to any one of claims 1 to 4, characterized in that: The heat conducting member has a first preset length, the accommodating cavity has a second preset length, and the first preset length is greater than the second preset length.

6. The carrier structure according to claim 2, characterized in that: The mounting portion is recessed in a direction close to the second supporting portion, and the sample is disposed in the mounting portion.

7. The carrier structure according to claim 2, characterized in that: The heat conducting member is at least partially located outside the accommodating cavity, and the heat conducting member is inserted into the accommodating cavity along a first preset direction.

8. The carrier structure according to claim 1, characterized in that: The heat conducting member comprises: a plug-in end, the plug-in end being capable of passing through the opening and being inserted into the accommodating cavity; The handle end is provided with a groove.

9. The carrier structure according to claim 8, characterized in that: When the plug end is inserted into the accommodating cavity, the handle end is at least partially located outside the accommodating cavity.

10. An etching device, characterized in that: The carrier structure comprises the carrier structure according to any one of claims 1 to 9.

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