Semiconductor laser side pump device

Abstract

The utility model discloses a semiconductor laser side pump device, in the semiconductor laser side pump device, a laser array and a light-transmitting tube are arranged in a first cavity, and a laser crystal is arranged in the light-transmitting tube in a penetrating manner. The second cavity is communicated with an internal liquid path of the laser array, so that the temperature adjusting liquid enters the internal liquid path of the laser array through the second cavity to adjust the temperature of the laser array; and the third cavity is communicated with the light-transmitting tube, so that the temperature adjusting liquid enters the light-transmitting tube through the third cavity to adjust the temperature of the laser crystal in the light-transmitting tube. Water channels of the laser array and the laser crystal are separated, the working water temperature and the water flow of the laser crystal and the laser array can be respectively regulated and controlled, the two devices respectively work under proper conditions, thermal crosstalk does not occur, the convenience and the accuracy of wavelength control of the laser array are improved, and the working efficiency of the laser array is improved. The absorption bandwidth of the laser crystal is better matched, and the gain effect of the semiconductor laser side pump device is improved.

Description

Technical Field

[0001] The present application relates to the technical field of solid-state lasers, and in particular to a semiconductor laser side pump device. Background Art

[0002] Semiconductor-pumped solid-state lasers have a large amount of heat loss, with heat primarily deposited in the laser working material and the semiconductor laser. Therefore, both the semiconductor laser and the laser working material need to be cooled simultaneously. Existing technologies generally use liquid cooling to dissipate heat in side-pumped solid-state laser systems. The initial temperature and flow rate of the cooling water affect the operating temperature of the semiconductor laser, and thus the laser's output wavelength. For the laser working material, good heat dissipation and a lower operating temperature can mitigate thermal effects, while a suitable pump wavelength is more easily absorbed by the crystal. Both can effectively improve the module's overall conversion efficiency and achieve higher output power.

[0003] In existing water-cooled semiconductor laser side pump modules, the semiconductor laser and the laser working material share the same cooling water, which makes it difficult to perfectly balance the appropriate cooling water temperature and water flow of the laser working material with the appropriate cooling water temperature and water flow of the semiconductor laser, resulting in a loss of one while focusing on the other. Utility Model Content

[0004] In order to solve the above technical problems, the present application provides a semiconductor laser side pump device, comprising:

[0005] a housing having a first cavity, at least one second cavity, and at least one third cavity;

[0006] a laser array, disposed in the first cavity;

[0007] A light-transmitting tube is disposed in the first cavity, and the laser arrays are spaced around the light-transmitting tube;

[0008] a laser crystal, disposed in the light-transmitting tube;

[0009] The second cavity is connected to the internal liquid path of the laser array, so that the temperature-regulating liquid enters the internal liquid path through the second cavity to regulate the temperature of the laser array; the third cavity is connected to the light-transmitting tube, so that the temperature-regulating liquid enters the light-transmitting tube through the third cavity to regulate the temperature of the laser crystal in the light-transmitting tube.

[0010] The shell has two second cavities and two third cavities, the two third cavities are respectively arranged on two opposite sides of the first cavity, and the second cavity is arranged around the third cavity at intervals.

[0011] Wherein, the housing comprises an outer shell, a bottom plate, a first side plate, a second side plate, a first cover plate and a second cover plate;

[0012] The first side plate and the second side plate are arranged parallel to the bottom plate, and the outer shell cover is arranged on the bottom plate and forms the first cavity with the first side plate and the second side plate;

[0013] The first cover plate is detachably arranged on a side of the first side plate away from the first cavity, and the second cover plate is detachably arranged on a side of the second side plate away from the first cavity, and a first groove and a second groove are provided on a side of the first cover plate and the second cover plate close to the first cavity, and the first groove is arranged around the second groove, so that the first cover plate is connected to the first side plate to form the second cavity and the third cavity, and the second cover plate is connected to the second side plate to form the second cavity and the third cavity.

[0014] Wherein, one end of the laser array is provided on the first side panel, and the other end of the laser array is provided on the second side panel; one end of the light-transmitting tube is provided on the first side panel, and the other end of the light-transmitting tube is provided on the second side panel;

[0015] The first side panel and the second side panel are respectively provided with a first mounting through hole, and the first mounting through hole is arranged corresponding to the light-transmitting tube, and the bottom of the second groove of the first cover plate and the bottom of the second groove of the second cover plate are provided with a second mounting through hole, and the first mounting through hole and the second mounting through hole are arranged correspondingly;

[0016] One end of the laser crystal is passed through the first mounting hole of the first side plate and the second mounting hole of the first cover plate, so that one end of the laser crystal is exposed in the third cavity formed by the first side plate and the first cover plate, and the other end of the laser crystal is passed through the first mounting hole of the second side plate and the second mounting hole of the second cover plate, so that the other end of the laser crystal is exposed in the third cavity formed by the second side plate and the second cover plate.

[0017] Wherein, each of the first side panel and the second side panel is provided with at least one third mounting through hole, one end of the laser array is mounted on the first side panel through the third mounting through hole, and a water inlet of a laser unit of the laser array is communicated with the second cavity formed by the first side panel and the first cover panel through the third mounting through hole on the first side panel; the other end of the laser array is mounted on the second side panel through the third mounting through hole, and a water outlet of the laser unit of the laser array is communicated with the second cavity formed by the second side panel and the second cover panel through the third mounting through hole on the second side panel.

[0018] Wherein, the laser array includes a plurality of laser units, and the first side plate and the second side plate include a plurality of the third mounting through holes;

[0019] Wherein, the plurality of laser units are located in the first cavity and are surrounded by the light-transmitting tube; each laser unit is installed through the third mounting through hole of the first side panel and the third mounting through hole of the second side panel, respectively, so that each laser unit is connected to two second cavities, and the temperature-control liquid in the second cavity enters the laser unit through the laser unit water inlet of each laser unit, and the temperature-control liquid in the laser unit enters the other second cavity through the laser unit water outlet.

[0020] Wherein, the side of the first cover plate is provided with a first water inlet and a second water inlet, and the side of the second cover plate is provided with a first water outlet and a second water outlet;

[0021] The first water inlet is communicated with the second cavity formed by the first cover plate and the first side plate, the second water inlet is communicated with the third cavity formed by the first cover plate and the first side plate, the first water outlet is communicated with the second cavity formed by the second cover plate and the second side plate, and the second water outlet is communicated with the third cavity formed by the second cover plate and the second side plate.

[0022] The present invention provides the following beneficial effects: Unlike the prior art, the semiconductor laser side-pump device of the present invention includes a housing, a laser array, a light-transmitting tube, and a laser crystal. The housing comprises a first cavity, at least one second cavity, and at least one third cavity. The laser array is disposed within the first cavity, the light-transmitting tube is disposed within the first cavity, and the laser arrays are spaced apart around the light-transmitting tube. The laser crystal is disposed within the light-transmitting tube. The second cavity communicates with the internal fluid path of the laser array, allowing a temperature-regulating liquid to enter the internal fluid path of the laser array through the second cavity to regulate the temperature of the laser array. The third cavity communicates with the light-transmitting tube, allowing a temperature-regulating liquid to enter the light-transmitting tube through the third cavity to regulate the temperature of the laser crystal within the light-transmitting tube. The semiconductor laser side-pump device of the present invention separates the water paths for the laser array and the laser crystal, allowing the operating water temperature and water flow of the laser crystal and the laser array to be controlled separately, ensuring that the two devices each operate under appropriate conditions without thermal crosstalk. This improves the convenience and accuracy of wavelength control of the laser array, better matches the absorption bandwidth of the laser crystal, and enhances the gain effect of the semiconductor laser side-pump device. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0024] in:

[0025] Figure 1 This is a schematic structural diagram of an embodiment of a semiconductor laser side pump device of the present application;

[0026] Figure 2 yes Figure 1 A schematic cross-sectional view of the semiconductor laser side pump device along section line II';

[0027] Figure 3 yes Figure 1 A schematic cross-sectional view of the semiconductor laser side pump device along section line II-II';

[0028] Figure 4 yes Figure 1 Schematic diagram of the cross-sectional structure of the semiconductor laser side pump device along the section line III-III'.

[0029] Figure 1: Semiconductor laser side pump device A; shell 1; first cavity 111; second cavity 112; third cavity 113; outer shell 12; bottom plate 13; first side plate 141; second side plate 142; first cover plate 151; second cover plate 152; first mounting through hole 161; second mounting through hole 162; third mounting through hole 163; first water inlet 171; second water inlet 172; first water outlet 181; second water outlet 182; first cover body 191; second cover body 192; laser array 2; laser unit 21; laser unit water inlet 211; laser unit water outlet 212; light tube 3; laser crystal 4; first electrode 51; second electrode 52. DETAILED DESCRIPTION

[0030] The following describes the embodiments of the present application in detail with reference to the accompanying drawings.

[0031] In the following description, for the purpose of explanation rather than limitation, specific details such as specific system structures, interfaces, and technologies are provided to facilitate a thorough understanding of the present application.

[0032] References to "embodiments" in this application mean that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0033] The term "and / or" in this application is merely a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can represent three situations: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the objects associated before and after are in an "or" relationship. In addition, "many" in this article means two or more than two. In addition, the term "at least one" in this article means any combination of at least two of any one or more of a plurality of, for example, including at least one of A, B, and C, can mean including any one or more elements selected from the set consisting of A, B, and C. In addition, the terms "first", "second", and "third" in this application are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated.

[0034] In the prior art, the laser and the laser working medium use the same liquid cooling system. This means that the water temperature and flow rate they contact are the same. The operating wavelength emitted by the laser is related to this water temperature and flow rate, and the operating efficiency of the laser working medium is also related to this water temperature, flow rate, and the wavelength of light transmitted from the laser to the laser working medium. However, the water temperature and flow rate required by the laser are generally different from those required by the laser working medium. Therefore, the water temperature and flow rate in the liquid cooling system must be adjusted. This can lead to situations where the laser's water temperature and flow rate are not optimal, affecting the laser's operating wavelength, while the laser working medium's water temperature and flow rate are optimal, but the wavelength of light received is not the optimal pump wavelength, reducing the pumping efficiency of the laser working medium. Alternatively, the laser's water temperature and flow rate may be optimal, ensuring that the wavelength of light emitted by the laser to the laser working medium is the optimal pumping wavelength for the laser working medium, but the water temperature and flow rate are not optimal, also affecting the pumping efficiency of the laser working medium. This makes it difficult to perfectly balance the laser working material between the appropriate water temperature, water flow and laser wavelength selection, resulting in a loss of one while focusing on the other.

[0035] In order to solve the above technical problems, the present application provides a semiconductor laser side pump device, such as Figure 1 and Figure 2 As stated, Figure 1 This is a schematic structural diagram of an embodiment of the semiconductor laser side pump device of the present application. Figure 2 yes Figure 1 Schematic diagram of the cross-sectional structure of the semiconductor laser side pump device along the section line II', wherein the semiconductor laser side pump device A includes a housing 1, a laser array 2, a light-transmitting tube 3 and a laser crystal 4.

[0036] The laser array 2 is used to emit laser light, and the laser crystal 4 is used to receive the laser light emitted by the laser array 2 and convert it into laser light with high parallelism and monochromaticity.

[0037] The housing 1 comprises a first cavity 111, at least one second cavity 112, and at least one third cavity 113. The laser array 2 is disposed within the first cavity 111, and the light-transmitting tube 3 is disposed within the first cavity 111. The laser array 2 is spaced apart around the light-transmitting tube 3. The rod-shaped laser crystal 4 is inserted within the light-transmitting tube 3. The second cavity 112 communicates with the internal fluid path of the laser array 2, allowing a temperature-regulating fluid to enter the internal fluid path of the laser array 2 through the second cavity 112 to regulate the temperature of the laser array 2. The third cavity 113 communicates with the light-transmitting tube 3, allowing a temperature-regulating fluid to enter the light-transmitting tube 3 through the third cavity 113 to regulate the temperature of the laser crystal 4 within the light-transmitting tube 3. In one embodiment, the temperature-regulating fluid can be water.

[0038] Specifically, since the laser crystal 4 is arranged in the light-transmitting tube 3, the light-transmitting tube 3 separates the laser crystal 4 from the laser array 2, and then the temperature-control liquid in the second cavity 112 enters the internal liquid path of the laser array 2, and the temperature-control liquid in the third cavity 113 enters the light-transmitting tube 3 and contacts the laser crystal 4. The two will not affect each other, so that the temperature-control liquid is passed through the laser array 2 and the laser crystal 4 separately, and they are temperature-controlled by different liquid cooling devices respectively. The water temperature and flow rate of the laser array 2 and the laser crystal 4 are independently regulated, so that the laser array 2 is at a suitable operating temperature, and the wavelength of its output is exactly at the absorption peak of the laser crystal 4, thereby increasing the pumping efficiency; while adjusting the water temperature and flow rate of the laser array 2, the water temperature and flow rate of the laser crystal 4 are not affected, so that the laser crystal 4 works under suitable conditions and can receive the most suitable light wavelength, thereby improving the operating efficiency of the semiconductor laser side pump device A.

[0039] At the same time, since the temperature adjustment process of the laser array 2 does not need to consider the laser crystal 4, and the working wavelength emitted by the laser array 2 is related to the temperature of the temperature adjustment liquid, the user can set the temperature of the temperature adjustment liquid based on the initial wavelength of the laser array 2 based on the needs, so that the laser array 2 emits a suitable wavelength. Among them, the higher the temperature of the temperature adjustment liquid, the longer the working wavelength emitted by the laser array 2. This avoids the current situation in which the adjustment temperature of the laser array 2 is limited due to the need to consider the adjustment temperature of the laser crystal 4, thereby limiting the selection of the initial wavelength of the laser array 2. In this application, the temperature adjustment system of the laser array 2 is separated from the temperature adjustment system of the laser crystal 4, which can further relax the selection of the initial wavelength of the laser array 2, reduce material costs, and improve the user experience of the semiconductor laser side pump device A.

[0040] Optionally, see Figure 2 and Figure 3 , Figure 3 yes Figure 1 A schematic cross-sectional structure diagram of the semiconductor laser side pump device along the section line II-II' is shown, wherein the housing 1 has two second cavities 112 and two third cavities 113, the two third cavities 113 are respectively arranged on two sides opposite to the first cavity 111, and the second cavity 112 is spaced around the third cavity 113.

[0041] Among them, the internal liquid path of the laser array 2 is connected to the second cavity 112, and the light transparent tube 3 is connected to the second cavity 112. Therefore, one second cavity 112 and one third cavity 113 are arranged on one side of the first cavity 111, and another second cavity 112 and another third cavity 113 are arranged on the other side opposite to the first cavity 111. This helps the temperature-control liquid in the second cavity 112 to enter the internal liquid path of the laser array 2, and after temperature-controlling the laser array 2, enter the other second cavity 112 and be discharged; the temperature-control liquid in the third cavity 113 enters the light transparent tube 3, and after temperature-controlling the laser crystal 4 in the light transparent tube 3, enter the other third cavity 113 and be discharged, thereby ensuring that the liquid path of the temperature control system for controlling the temperature of the laser array 2 and the laser crystal 4 is smooth, thereby improving the efficiency of temperature control of the laser array 2 and the laser crystal 4.

[0042] And because the laser array 2 is surrounded by the light-transmitting tube 3, the second cavity 112 can also be arranged around the third cavity 113 at intervals, so that the second cavity 112 and the laser array 2 are arranged correspondingly, and the third cavity 113 is arranged correspondingly to the light-transmitting tube 3, thereby improving the rationality of the arrangement of the second cavity 112 and the third cavity 113 and further improving the temperature control efficiency of the laser array 2 and the laser crystal 4.

[0043] Optionally, see Figure 1 and Figure 2The housing 1 provided in the embodiment of the present application includes a shell 12 , a bottom plate 13 , a first side plate 141 , a second side plate 142 , a first cover plate 151 and a second cover plate 152 .

[0044] The first side plate 141 and the second side plate 142 are arranged parallel to each other on the bottom plate 13, and the housing 12 is covered on the bottom plate 13, and a first cavity 111 is formed between the first side plate 141 and the second side plate 142. The first cover plate 151 is detachably arranged on a side of the first side plate 141 away from the first cavity 111, and the second cover plate 152 is detachably arranged on a side of the second side plate 142 away from the first cavity. The first and second cover plates 151 and 152 are each provided with a first groove and a second groove on a side close to the first cavity 111, and the first groove is arranged around the second groove, so that the first cover plate 151 is connected to the first side plate 141 to form the second cavity 112 and the third cavity 113, and the second cover plate 152 is connected to the second side plate 142 to form the second cavity 112 and the third cavity 113.

[0045] Among them, the outer shell 12, the first side plate 141, the second side plate 142 and the bottom plate 13 form the first cavity 111, and the second cavity 112 and the third cavity 113 are formed by connecting the first cover plate 151 and the first side plate 141, the second cover plate 152 and the second side plate 142, which simplifies the production steps of the first cavity 111, the second cavity 112 and the third cavity 113 and reduces the difficulty of installing the laser array 2, the light-transmitting tube 3 and the laser crystal 4.

[0046] And because the first groove is arranged around the second groove, the formed second cavity 112 is arranged around the third cavity 113, and is arranged corresponding to the laser array 2 and the laser crystal 4, so that the temperature-control liquid in the second cavity 112 can enter the internal liquid path of the laser array 2, and the temperature-control liquid in the third cavity 113 can enter the transparent tube 3, thereby improving the temperature control efficiency of the laser array 2 and the laser crystal 4; at the same time, the second cavity 112 and the third cavity 113 are arranged in a centralized manner, which reduces the setting space of the second cavity 112 and the third cavity 113, can effectively reduce the volume of the semiconductor laser side pump device A, and improve the user experience of the semiconductor laser side pump device A.

[0047] Optionally, one end of the laser array 2 is disposed on the first side plate 141, and the other end of the laser array 2 is disposed on the second side plate 142. One end of the light-transmitting tube 3 is disposed on the first side plate 141, and the other end of the light-transmitting tube 3 is disposed on the second side plate 142. Furthermore, the location where the laser array 2 connects to the first and second side plates 141, 142 can correspond to the second cavity 112, facilitating the entry of the temperature-control liquid in the second cavity 112 into the internal fluid path of the laser array 2, reducing the flow path of the temperature-control liquid entering the laser array 2 from the second cavity 112, and simplifying the internal structure of the semiconductor laser side pump device A. Furthermore, the location where the light-transmitting tube 3 connects to the first and second side plates 141, 142 can correspond to the third cavity 113, facilitating the entry of the temperature-control liquid in the third cavity 113 into the light-transmitting tube 3, reducing the flow path of the temperature-control liquid entering the light-transmitting tube 3 from the third cavity 113, further simplifying the internal structure of the semiconductor laser side pump device A and reducing the manufacturing cost and difficulty of the semiconductor laser side pump device A.

[0048] In one embodiment, first mounting holes 161 are respectively provided on the first side plate 141 and the second side plate 142. The first mounting holes 161 are corresponding to the light-transmitting tube 3. Second mounting holes 162 are also provided at the bottom of the second groove of the first cover plate 151 and the bottom of the second groove of the second cover plate 152. The first mounting holes 161 and the second mounting holes 162 are corresponding to each other. One end of the laser crystal 4 is inserted through the first mounting hole 161 of the first side plate 141 and the second mounting hole 162 of the first cover plate 151, so that one end of the laser crystal 4 is exposed in the third cavity 113 formed by the first side plate 141 and the first cover plate 151. The other end of the laser crystal 4 is inserted through the first mounting hole 161 of the second side plate 142 and the second mounting hole 162 of the second cover plate 152, so that the other end of the laser crystal 4 is exposed in the third cavity 113 formed by the second side plate 142 and the second cover plate 152. When the semiconductor laser side pump device A is in operation, both ends of the laser crystal 4 can be in contact with the outside world, thereby ensuring the operating efficiency of the semiconductor laser side pump device A.

[0049] The user can also remove the laser crystal 4 from the semiconductor laser side pump device A through the exposed end of the laser crystal 4 to replace it with a new laser crystal 4, thereby improving the convenience of replacing the laser crystal 4.

[0050] In another embodiment, the diameters of the first mounting through hole 161 and the light-transmitting tube 3 may be larger than the diameter of the laser crystal 4 to ensure that the temperature-regulating liquid in the third cavity 113 can enter the light-transmitting tube 3 .

[0051] Optionally, both the first side panel 141 and the second side panel 142 are provided with at least one third mounting through hole 163, one end of the laser array 2 is mounted on the first side panel 141 through the third mounting through hole 163, and the laser unit water inlet 211 of the laser array 2 is communicated with the second cavity 112 formed by the first side panel 141 and the first cover plate 151 through the third mounting through hole 163 on the first side panel 141; the other end of the laser array 2 is mounted on the second side panel 142 through the third mounting through hole 163, and the laser unit water outlet 212 of the laser array 2 is communicated with the second cavity 112 formed by the second side panel 142 and the second cover plate 152 through the third mounting through hole 163 on the second side panel 142.

[0052] During operation of the semiconductor laser side pump device A, the temperature-regulating liquid in the second cavity 112 enters the internal fluid path of the laser array 2 through the laser unit water inlet 211, regulating the temperature of the laser array 2 to maintain a suitable operating temperature and emit the operating wavelength required by the laser crystal 4. The temperature-regulating liquid in the internal fluid path of the laser array 2 then enters the other second cavity 112 through the laser unit water outlet 212 and is discharged. Since the laser crystal 4 is partially located in the third cavity 113, the temperature-regulating liquid in the third cavity 113 contacts a portion of the laser crystal 4, regulating its temperature. Simultaneously, the temperature-regulating liquid in the third cavity 113 enters the light-transmitting tube 3 through the first mounting hole 161, contacting the laser crystal 4 therein and regulating its temperature. The temperature-regulating liquid in the light-transmitting tube 3 then enters the other third cavity 113 through the first mounting hole 161 on the second side plate 142 and is discharged, maintaining the laser crystal 4 at a suitable operating temperature.

[0053] By separating the liquid path for regulating the temperature of the laser array 2 from the liquid path for regulating the temperature of the laser crystal 4, the laser array 2 and the laser crystal 4 can be kept at appropriate operating temperatures respectively, without having to adjust the operating temperatures of the laser array 2 and the laser crystal 4. When the laser crystal 4 is kept at an appropriate operating temperature, it receives the most appropriate pump wavelength, thereby improving the operating efficiency of the semiconductor laser side pump device A.

[0054] In one embodiment, the joints between the components can be sealed to prevent leakage of the temperature-control liquid within the semiconductor laser side pump device A. For example, but not limited to, multiple sealing rings (not shown) can be added between the first cover plate 151 and the first side plate 141. The multiple sealing rings are respectively disposed at the edges of the second cavity 112 and the third cavity 113 to prevent the temperature-control liquid in the second cavity 112 and the third cavity 113 from leaking through the joints between the first side plate 141 and the first cover plate 151, thereby affecting the safety of the semiconductor laser side pump device A.

[0055] Optionally, see Figure 4 , Figure 4 yes Figure 1 Schematic diagram of the cross-sectional structure of the semiconductor laser side pump device along the section line III-III', the laser array 2 includes a plurality of laser units 21, and the first side plate 141 and the second side plate 142 include a plurality of third mounting through holes 163.

[0056] Among them, multiple laser units 21 are located in the first cavity 111 and surrounded by the light-transmitting tube 3. Each laser unit 21 is installed through a third mounting hole 163 on a first side panel 141 and a third mounting hole 163 on a second side panel 142, so that each laser unit 21 is connected to two second cavities 112. The temperature-control liquid in the second cavity 112 enters the laser unit 21 through the laser unit water inlet 211 of each laser unit 21, and the temperature-control liquid in the laser unit 21 enters the other second cavity 112 through the laser unit water outlet 212.

[0057] In one embodiment, if Figure 3 As shown, third mounting holes 163 on the first side plate 141 and the second side plate 142 can be arranged around the first mounting holes 161, and the number of third mounting holes 163 corresponds to the number of laser units 21, so that each laser unit 21 corresponds to one third mounting hole 163 on the first side plate 141 and one third mounting hole 163 on the second side plate 142. This allows the temperature control liquid in the third cavity 113 to enter each laser unit 21 to control the temperature of the laser unit 21, thereby improving the temperature control efficiency of the laser units 21.

[0058] Optionally, a first water inlet 171 and a second water inlet 172 are provided on a side of the first cover plate 151 , and a first water outlet 181 and a second water outlet 182 are provided on a side of the second cover plate 152 .

[0059] like Figure 3 As shown, the first water inlet 171 is in communication with the second cavity 112 formed by the first cover plate 151 and the first side plate 141, and the second water inlet 172 is in communication with the third cavity 113 formed by the first cover plate 151 and the first side plate 141. The first water outlet 181 is in communication with the second cavity 112 formed by the second cover plate 152 and the second side plate 142, and the second water outlet 182 is in communication with the third cavity 113 formed by the second cover plate 152 and the second side plate 142.

[0060] Among them, the first water inlet 171 and the second water inlet 172 can be connected to a temperature regulating liquid supply device (not shown) together, or the first water inlet 171 and the second water inlet 172 can be connected to a temperature regulating liquid supply device respectively, so as to supply temperature regulating liquid to the second cavity 112 through the first water inlet 171 and to the third cavity 113 through the second water inlet 172, and the water temperature and water flow of the temperature regulating liquid provided through the first water inlet 171 are different from the water temperature and water flow of the temperature regulating liquid provided through the second water inlet 172, so as to adjust the working temperature of the laser array 2 and the laser crystal 4 respectively, thereby improving the operating efficiency of the semiconductor laser side pump device A.

[0061] Furthermore, the first water outlet 181 and the second water outlet 182 can be connected to a waste liquid tank (not shown), so that the temperature-control liquid in the laser array 2 can be discharged into the waste liquid tank through the first water outlet 181 after entering the second cavity 112, and the temperature-control liquid in the light-transmitting tube 3 can be discharged into the waste liquid pipe through the second water outlet 182 after entering the third cavity 113. Alternatively, the first water outlet 181 and the second water outlet 182 are connected to a temperature-control liquid supply device to re-input the temperature-control liquid after temperature-controlling the laser array 2 and the laser crystal 4 into the temperature-control liquid supply device. The temperature-control liquid supply device re-processes the water temperature and water flow of the temperature-control liquid and re-inputs it into the laser array 2 and the light-transmitting tube 3, thereby realizing the recycling of the temperature-control liquid and reducing the temperature-control cost of the laser array 2 and the laser crystal 4.

[0062] Optionally, see Figure 1 and Figure 2 The shell 1 also includes a first cover body 191 and a second cover body 192. The first cover body 191 is detachably arranged on a side of the first cover plate 151 away from the first cavity 111, and the first cover body 191 is corresponding to the second mounting through hole 162 on the first cover plate 151; the second cover body 192 is detachably arranged on a side of the second cover plate 152 away from the first cavity 111, and the second cover body 192 is corresponding to the second mounting through hole 162 on the second cover plate 152.

[0063] Specifically, during transportation or when the semiconductor laser side pump device A is not in operation, the first cover 191 can be placed on the first cover plate 151, and the second cover 192 can be placed on the second cover plate 152 to shield the exposed end of the laser crystal 4, thereby preventing the laser crystal 4 from coming into contact with external environmental factors, such as moisture and dust, which could damage the laser crystal 4. This improves the safety of the laser crystal 4 and the stability of the semiconductor laser side pump device A. During operation of the semiconductor laser side pump device A, the first cover 191 can be removed from the first cover plate 151, and the second cover 192 can be removed from the second cover plate 152, so that the end of the laser crystal 4 is exposed to the environment, ensuring the operating performance of the laser crystal 4 and improving the operating efficiency of the semiconductor laser side pump device A.

[0064] Optionally, see Figure 1 The semiconductor laser side pump device A also includes a first electrode 51 and a second electrode 52. One end of the first electrode 51 and the second electrode 52 is located in the first cavity 111 and is connected to the laser array 2. The other end of the first electrode 51 and the second electrode 52 is exposed to the first cavity 111 to power the laser array 2 through the first electrode 51 and the second electrode 52.

[0065] The first electrode 51 and the second electrode 52 can be connected to the positive and negative electrodes of the laser array 2, and then an external power supply (not shown) can be connected to the positive and negative electrodes of the laser array 2 through the first electrode 51 and the second electrode 52 to power the laser array 2.

[0066] In summary, in the semiconductor laser side pump device A provided in the embodiment of the present application, the temperature control liquid transport path for the laser array 2 and the temperature control liquid transport path for the laser crystal 4 are separated, so that the water temperature and flow rate of the temperature control liquid for temperature control of the laser array 2 and the laser crystal 4 can be separately regulated, so that the laser array 2 can be kept at a suitable operating temperature, so that the wavelength of its output is exactly at the absorption peak of the laser crystal 4, thereby increasing the pumping efficiency; and while adjusting the water temperature and flow rate of the laser array 2, the water temperature and flow rate of the laser crystal 4 are not affected, so that the laser crystal 4 works under suitable conditions and can receive the most suitable light wavelength, thereby improving the operating efficiency of the semiconductor laser side pump device A.

[0067] The above description is only an implementation method of the present application and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the description and drawings of this application, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A semiconductor laser side pump device, characterized in that: include: a housing having a first cavity, at least one second cavity, and at least one third cavity; a laser array, disposed in the first cavity; A light-transmitting tube is disposed in the first cavity, and the laser arrays are spaced around the light-transmitting tube; a laser crystal, disposed in the light-transmitting tube; The second cavity is connected to the internal liquid path of the laser array, so that the temperature-regulating liquid enters the internal liquid path through the second cavity to regulate the temperature of the laser array; the third cavity is connected to the light-transmitting tube, so that the temperature-regulating liquid enters the light-transmitting tube through the third cavity to regulate the temperature of the laser crystal in the light-transmitting tube.

2. The device according to claim 1, characterized in that The shell has two second cavities and two third cavities. The two third cavities are respectively arranged on two opposite sides of the first cavity, and the second cavity is arranged around the third cavity at intervals.

3. The device according to claim 2, characterized in that The housing comprises an outer shell, a bottom plate, a first side plate, a second side plate, a first cover plate and a second cover plate; The first side plate and the second side plate are arranged parallel to the bottom plate, and the outer shell cover is arranged on the bottom plate and forms the first cavity with the first side plate and the second side plate; The first cover plate is detachably arranged on a side of the first side plate away from the first cavity, and the second cover plate is detachably arranged on a side of the second side plate away from the first cavity, and a first groove and a second groove are provided on a side of the first cover plate and the second cover plate close to the first cavity, and the first groove is arranged around the second groove, so that the first cover plate is connected to the first side plate to form the second cavity and the third cavity, and the second cover plate is connected to the second side plate to form the second cavity and the third cavity.

4. The device according to claim 3, characterized in that One end of the laser array is provided on the first side panel, and the other end of the laser array is provided on the second side panel; one end of the light-transmitting tube is provided on the first side panel, and the other end of the light-transmitting tube is provided on the second side panel; The first side panel and the second side panel are respectively provided with a first mounting through hole, and the first mounting through hole is arranged corresponding to the light-transmitting tube, and the bottom of the second groove of the first cover plate and the bottom of the second groove of the second cover plate are provided with a second mounting through hole, and the first mounting through hole and the second mounting through hole are arranged correspondingly; One end of the laser crystal is passed through the first mounting hole of the first side plate and the second mounting hole of the first cover plate, so that one end of the laser crystal is exposed in the third cavity formed by the first side plate and the first cover plate, and the other end of the laser crystal is passed through the first mounting hole of the second side plate and the second mounting hole of the second cover plate, so that the other end of the laser crystal is exposed in the third cavity formed by the second side plate and the second cover plate.

5. The device according to claim 4, characterized in that The first side panel and the second side panel are both provided with at least one third mounting through hole, one end of the laser array is mounted on the first side panel through the third mounting through hole, and a water inlet of a laser unit of the laser array is communicated with the second cavity formed by the first side panel and the first cover panel through the third mounting through hole on the first side panel; the other end of the laser array is mounted on the second side panel through the third mounting through hole, and a water outlet of the laser unit of the laser array is communicated with the second cavity formed by the second side panel and the second cover panel through the third mounting through hole on the second side panel.

6. The device according to claim 5, characterized in that The laser array includes a plurality of laser units, and the first side plate and the second side plate include a plurality of the third mounting through holes; Wherein, the plurality of laser units are located in the first cavity and are surrounded by the light-transmitting tube; each laser unit is installed through the third mounting through hole of the first side panel and the third mounting through hole of the second side panel, respectively, so that each laser unit is connected to two second cavities, and the temperature-control liquid in the second cavity enters the laser unit through the laser unit water inlet of each laser unit, and the temperature-control liquid in the laser unit enters the other second cavity through the laser unit water outlet.

7. The device according to claim 3, characterized in that The first cover plate has a first water inlet and a second water inlet on its side, and the second cover plate has a first water outlet and a second water outlet on its side; The first water inlet is communicated with the second cavity formed by the first cover plate and the first side plate, the second water inlet is communicated with the third cavity formed by the first cover plate and the first side plate, the first water outlet is communicated with the second cavity formed by the second cover plate and the second side plate, and the second water outlet is communicated with the third cavity formed by the second cover plate and the second side plate.

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