Ultra-wideband SIP down-conversion module

Abstract

The utility model relates to an ultra wide band SIP down-conversion module, which adopts system-level packaging to realize miniaturization, and comprises a shielding box and a down-conversion module circuit arranged in the shielding box, and the down-conversion module circuit comprises a microwave circuit unit and a power supply control circuit unit; the microwave circuit unit comprises a front-end circuit, a primary frequency mixing circuit, a secondary frequency mixing circuit, an intermediate-frequency circuit, a local oscillator frequency doubling circuit I and a local oscillator driving circuit II; the front-end circuit, the primary frequency mixing circuit, the secondary frequency mixing circuit and the intermediate-frequency circuit are connected in sequence; a frequency multiplier is arranged in the local oscillator frequency multiplier circuit I; the power supply control circuit unit adopts a power supply voltage-stabilizing filter circuit; a microwave local oscillator signal input terminal, a microwave radio frequency signal input terminal, an enabling control direct current bias voltage input terminal and a microwave radio frequency intermediate frequency signal output terminal are arranged on the side face of the shielding box. And the enabling control direct current bias voltage input terminal is connected with the microwave circuit unit through the power supply control circuit unit.

Description

Technical Field

[0001] The utility model relates to the technical field of microwave communications, in particular to an ultra-wideband SIP down-conversion module. Background Art

[0002] With the advancement of semiconductor and digital communication technologies, a variety of wireless communication technologies have emerged in recent years. Among these new technologies, UWB (ultra-wideband) offers significant advantages for high-speed data transmission over short distances. As a key component of UWB wireless transmitters, research on ultra-wideband up- and down-conversion components has garnered significant attention. Utility Model Content

[0003] The utility model has the advantages of small size, rich functions, good performance index and high reliability.

[0004] In order to solve the problems existing in the background technology, the utility model adopts the following technical solutions: an ultra-wideband SIP down-conversion module, comprising a shielding box and a down-conversion module circuit arranged inside the shielding box, the down-conversion module circuit module including a microwave circuit unit and a power control circuit unit; the microwave circuit unit includes a front-end circuit, a primary mixing circuit, a secondary mixing circuit, an intermediate frequency circuit, a I local oscillator frequency multiplication circuit and a II local oscillator driving circuit, and the front-end circuit, the primary mixing circuit, the secondary mixing circuit and the intermediate frequency circuit are connected in sequence; the power control circuit unit adopts a power supply voltage stabilizing filter circuit, and the power supply voltage stabilizing filter circuit is respectively connected to the front-end circuit, the primary mixing circuit, the secondary mixing circuit, the intermediate frequency circuit, the I local oscillator frequency multiplication circuit and the II local oscillator driving circuit; the side of the shielding box is provided with a microwave local oscillator signal input terminal, a microwave radio frequency signal input terminal, an enable control DC bias voltage input terminal and a microwave radio frequency intermediate frequency signal output terminal; the enable control DC bias voltage input terminal is connected to the microwave circuit unit through the power control circuit unit.

[0005] As a further improvement of the present invention, the volume is much smaller than similar products.

[0006] As a further improvement of the present invention, the I local oscillator has a built-in frequency multiplier, which reduces the requirement for the local oscillator signal frequency.

[0007] As a further improvement of the present invention, the power control circuit unit adopts a power voltage stabilizing filter circuit, which is respectively connected to the enable control DC bias voltage input terminal and the internal microwave circuit.

[0008] As a further improvement of the present invention, a two-stage mixer is adopted, and the chip of the mixing circuit module is a low frequency conversion loss chip.

[0009] As a further improvement of the present invention, the enabling control DC bias voltage input terminal adopts a multi-core pin header.

[0010] As a further improvement of the present invention, the microwave local oscillator signal input terminal, the microwave radio frequency signal input terminal and the microwave intermediate frequency signal output terminal all adopt detachable SMP connectors.

[0011] As a further improvement of the present invention, the shielding box is made of aluminum alloy and the inner surface is silver-plated.

[0012] After adopting the above technical solution, the utility model has the following beneficial effects:

[0013] 1. Using SIP technology, it can realize the miniaturization of modules while achieving rich functions;

[0014] 2. Adopting SIP technology, with excellent performance indicators;

[0015] 3. The built-in frequency multiplier of the local oscillator circuit reduces the frequency requirement of the external local oscillator signal;

[0016] 4. The detachable SMP joint design is adopted for easy assembly and use. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0018] Figure 1 A schematic diagram of the external structure of an embodiment provided by the utility model;

[0019] Figure 2 A circuit diagram of an embodiment provided by the utility model;

[0020] Reference numerals:

[0021] F—front-end circuit; MX1—first-stage mixing circuit; MX2—second-stage mixing circuit; I—intermediate frequency circuit; L1-Ⅰ local oscillator frequency multiplication circuit; L2-Ⅱ local oscillator drive circuit; C—power supply control circuit unit. DETAILED DESCRIPTION

[0022] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0023] See also Figure 1-Figure 2 This specific embodiment adopts the following technical solution: an ultra-wideband SIP down-conversion module, comprising a shielding box and a down-conversion module circuit arranged inside the shielding box, the down-conversion module circuit module includes a microwave circuit unit and a power control circuit unit; the microwave circuit unit includes a front-end circuit F, a primary mixing circuit M1, a secondary mixing circuit M2, an intermediate frequency circuit I, a I local oscillator frequency multiplication circuit L1 and a II local oscillator driving circuit L2, the front-end circuit F, the primary mixing circuit M1, the secondary mixing circuit M2 and the intermediate frequency circuit I are connected in sequence; the power control circuit unit C adopts a power supply voltage stabilization filter circuit The power supply voltage stabilizing filter circuit is respectively connected to the front-end circuit F, the primary mixing circuit M1, the secondary mixing circuit M2, the intermediate frequency circuit I, the I local oscillator frequency multiplication circuit L1 and the II local oscillator driving circuit L2; the side of the shielding box is provided with a microwave local oscillator signal input terminal LOin, a microwave radio frequency signal input terminal RFin, an enable control DC bias voltage input terminal and a microwave radio frequency intermediate frequency signal output terminal; the enable control DC bias voltage input terminal is connected to the microwave circuit unit through the power supply control circuit unit; the utility model has the advantages of small size, rich functions, good performance indicators and high reliability.

[0024] The power control circuit unit C adopts a power supply voltage stabilizing filter circuit, which is respectively connected to the enable control DC bias voltage input terminal DCin and the front-end circuit F, the primary mixing circuit M1, the secondary mixing circuit M2, the intermediate frequency circuit I, the I local oscillator frequency multiplication circuit L1, and the II local oscillator driving circuit L2.

[0025] The enabling control DC bias voltage input terminal DCin adopts a multi-core pin header. The signal input by the enabling control DC bias voltage input terminal DCin is processed by the power supply voltage stabilization filter circuit in the power supply control circuit unit C and directly provides a DC bias voltage to the microwave circuit unit.

[0026] The microwave local oscillator signal input terminal, the radio frequency signal input terminal, and the intermediate frequency signal output terminal all adopt SMP connectors, and the existing SMP connector SMP-JHFD can be used.

[0027] The ultra-wideband SIP down-conversion module circuit consists of a front-end circuit F, a first-stage mixing circuit M1, a second-stage mixing circuit M2, an intermediate frequency circuit I, a local oscillator frequency multiplication circuit L1, and a local oscillator driving circuit L2. A microwave local oscillator signal is input into the local oscillator frequency multiplication circuit L1 and the local oscillator driving circuit L2, and a radio frequency intermediate frequency signal is input into the front-end circuit F. After passing through the first-stage mixing circuit M1 and the second-stage mixing circuit M2, an intermediate frequency signal is generated.

[0028] When the utility model is in operation, a DC supply voltage signal (DCin) is input to the enable control DC bias voltage input terminal DCin, and the power supply voltage stabilization and filtering circuit includes an LDO voltage regulator and an LC filtering circuit. The LDO voltage regulator adopts DC+5V, and the LC filtering circuit outputs a signal to the DC supply input terminals such as the front-end circuit F, the first-stage mixing circuit M1, the second-stage mixing circuit M2, the intermediate frequency circuit I, the I local oscillator frequency multiplication circuit L1, and the II local oscillator driving circuit L2 to provide electric energy. After the 0.8-18 GHz microwave radio frequency signal enters the front-end circuit F, it passes through the first-stage mixing circuit M1, the second-stage mixing circuit M2, and then passes through the intermediate frequency circuit I to output a 1.8 GHz intermediate frequency signal (IFout).

[0029] Practice has proven that the ultra-wideband SIP down-conversion module of this embodiment can achieve the following technical indicators:

[0030] (1) RF input frequency range: 0.8-18GHz;

[0031] (2) IF output center frequency: 1.8 GHz (default frequency, can be customized according to customer needs);

[0032] (3) IF bandwidth: 1GHz / 200MHz switchable (default value, customizable);

[0033] (4) Local oscillator frequency input range: 11.4~20GHz;

[0034] (5) Local oscillator power input range: 3~6dBm;

[0035] (6) Second local oscillator frequency input range: 20.2GHz or 23.8GHz;

[0036] (7) Second local oscillator power input range: 0~3dBm;

[0037] (8) Input burnout resistance power: ≥4W (continuous wave, 5 minutes test);

[0038] (9) Receive gain: 65dB±1.5dB, no attenuation (default value, customizable);

[0039] (10) In-band flatness: ≤2dB, within 1GHz instantaneous bandwidth;

[0040] (11) Output spurious suppression: ≥50dBc;

[0041] (12) Receiver noise coefficient: ≤6.5dB;

[0042] (13) Intermediate frequency output P-1: ≥13dBm;

[0043] (14) RF digital controlled attenuation: 0~31dB, step 1dB;

[0044] (15) Intermediate frequency digital controlled attenuation: 0~31.5dB, step 0.5dB;

[0045] (16) Port standing wave: ≤2.0;

[0046] (17) Power supply: +5V: ≤0.5A; -5V: ≤0.05A;

[0047] (18) Environmental adaptability: Working temperature: -40℃~+70℃;

[0048] The utility model has the advantages of small size, rich functions, good performance index and high reliability.

[0049] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations that come within the meaning and range of equivalents of the claims be embraced within the present invention.

[0050] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. An ultra-wideband SIP down-conversion module, characterized in that: The down-conversion module adopts a system-level package, including a shielding box and a down-conversion module circuit arranged inside the shielding box, the down-conversion module circuit module includes a microwave circuit unit and a power control circuit unit; the microwave circuit unit includes a front-end circuit, a primary mixing circuit, a secondary mixing circuit, an intermediate frequency circuit, a I local oscillator circuit and a II local oscillator circuit, and the front-end circuit, the primary mixing circuit, the secondary mixing circuit and the intermediate frequency circuit are connected in sequence; the I local oscillator circuit has a built-in frequency multiplier; the power control circuit unit adopts a power supply voltage stabilizing filter circuit, and the power supply voltage stabilizing filter circuit is respectively connected to the front-end circuit, the primary mixing circuit, the secondary mixing circuit, the intermediate frequency circuit, the I local oscillator frequency multiplication circuit and the II local oscillator drive circuit; the side of the shielding box is provided with a microwave local oscillator signal input terminal, a microwave radio frequency signal input terminal, an enable control DC bias voltage input terminal and a microwave radio frequency intermediate frequency signal output terminal; the enable control DC bias voltage input terminal is connected to the microwave circuit unit through the power control circuit unit.

2. The ultra-wideband SIP down-conversion module according to claim 1, characterized in that: A two-stage mixer is used, and the chip of the mixing circuit module is a low-frequency conversion loss chip.

3. The ultra-wideband SIP down-conversion module according to claim 1, characterized in that: The power supply control circuit unit adopts a power supply voltage stabilizing and filtering circuit.

4. The ultra-wideband SIP down-conversion module according to claim 1, characterized in that: The enable control DC bias voltage input terminal adopts a multi-core pin header.

5. The ultra-wideband SIP down-conversion module according to claim 1, characterized in that: The microwave local oscillator signal input terminal, microwave radio frequency signal input terminal, and microwave intermediate frequency signal output terminal all adopt detachable SMP connectors.

6. The ultra-wideband SIP down-conversion module according to claim 1, characterized in that: The shielding box is made of aluminum alloy and its inner surface is silver-plated.

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