Low-cost thin film ceramic circuit board structure

Abstract

The utility model discloses a low-cost thin-film ceramic circuit board structure, which comprises a ceramic layer and a thin-film circuit arranged on the surface of the ceramic layer. The thin film circuit comprises a metal bottom layer, a metal main body layer and a metal protection layer. The metal bottom layer is formed on the surface of the ceramic layer; the metal main body layer is formed on the surface of the metal bottom layer and is made of a non-noble metal material; the metal protection layer is made of precious metal materials, and the metal protection layer is formed and completely covers the surface of the metal body layer, the peripheral side face of the metal body layer and the peripheral side face of the metal bottom layer. The metal bottom layer is firstly arranged, then the metal main body layer is arranged on the metal bottom layer, the metal main body layer is made of the non-noble metal material, finally, the noble metal material is used as the metal protection layer, and the metal bottom layer and the metal main body layer are wrapped by the metal protection layer, so that the use amount of noble metal is greatly reduced, and the overall cost of the product is greatly reduced; and mass production can be realized.

Description

Technical Field

[0001] The utility model relates to the field of circuit boards, in particular to a low-cost thin-film ceramic circuit board structure. Background Art

[0002] Thin-film ceramic PCBs are electronic circuit boards that use thin-film technology to form thin-film circuits on a ceramic substrate. These circuit boards offer the following characteristics: 1. High reliability: Due to the stability and high-temperature resistance of the ceramic material, thin-film ceramic PCBs maintain their performance even in extreme environments. 2. High-frequency characteristics: The low dielectric constant of ceramic materials makes them suitable for high-frequency circuit applications. 3. Good thermal conductivity: The ceramic substrate conducts heat quickly, helping to dissipate heat from electronic components. 4. Miniaturization: Thin-film technology allows for complex circuit designs within a smaller space. 5. Chemical stability: Ceramic materials are not susceptible to chemical corrosion, making them suitable for use in harsh chemical environments. 6. High mechanical strength: Ceramic materials are hard and resistant to breakage. 7. Electrical insulation: Ceramic materials exhibit good electrical insulation properties.

[0003] The main structure of current thin-film ceramic circuit boards consists of a ceramic layer and thin-film circuitry, which is deposited on the surface of the ceramic layer. Prior art thin-film circuits are commonly manufactured using precious metals through evaporation or sputtering, which results in high production costs. Furthermore, since evaporation or sputtering deposits the thin-film circuitry directly onto the ceramic layer, the entire ceramic layer is coated with metal. If precious metals are used as the target material, only a small amount of metal adheres to the ceramic layer, while the remainder is wasted. Furthermore, mass production is impractical. Therefore, improvements to current thin-film ceramic circuit boards are necessary. Utility Model Content

[0004] In view of this, the present invention addresses the deficiencies in the prior art, and its main purpose is to provide a low-cost thin-film ceramic circuit board structure, which can effectively solve the problem of high cost of existing thin-film ceramic circuit boards.

[0005] To achieve the above purpose, the present invention adopts the following technical solutions:

[0006] A low-cost thin-film ceramic circuit board structure includes a ceramic layer and a thin-film circuit, wherein the thin-film circuit is arranged on the surface of the ceramic layer; the thin-film circuit includes a metal base layer, a metal main layer and a metal protective layer; the metal base layer is formed on the surface of the ceramic layer; the metal main layer is formed on the surface of the metal base layer, and the metal main layer is made of a non-precious metal material; the metal protective layer is made of a precious metal material, and the metal protective layer is formed to completely cover the surface of the metal main layer, the outer peripheral side of the metal main layer and the outer peripheral side of the metal base layer.

[0007] As a preferred solution, the metal bottom layer is made of titanium or titanium-tungsten.

[0008] As a preferred solution, the metal bottom layer is formed by sputtering low-cost metal.

[0009] As a preferred solution, the metal main body layer is made of copper or aluminum.

[0010] As a preferred solution, the metal main layer is formed by electroplating.

[0011] As a preferred solution, the metal protective layer is formed by chemical plating or electroplating.

[0012] Compared with the prior art, the present invention has obvious advantages and beneficial effects. Specifically, it can be seen from the above technical solution that:

[0013] By first setting a metal base layer, and then setting a metal main layer on the metal base layer, the metal main layer is made of non-precious metal material, and finally using precious metal material as a metal protective layer, the metal protective layer wraps the metal base layer and the metal main layer, so as to greatly reduce the use of precious metals, greatly reduce the overall cost of the product, and achieve mass production.

[0014] In order to more clearly illustrate the structural features and effects of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a cross-sectional schematic diagram of a preferred embodiment of the present utility model.

[0016] Description of the accompanying drawings:

[0017] 10. Ceramic layer 20. Metal bottom layer

[0018] 30. Metal main layer 40. Metal protective layer. DETAILED DESCRIPTION

[0019] Please refer to Figure 1 As shown, it shows the specific structure of a preferred embodiment of the present invention, including a ceramic layer 10 and a thin film circuit, which is arranged on the surface of the ceramic layer 10; the thin film circuit includes a metal bottom layer 20, a metal main layer 30 and a metal protective layer 40.

[0020] The metal bottom layer 20 is formed on the surface of the ceramic layer 10; in this embodiment, the metal bottom layer 20 is a low-cost metal material such as titanium or titanium tungsten, which is beneficial to reducing costs. At the same time, the metal bottom layer 20 is formed by sputtering low-cost metal and is easy to manufacture.

[0021] The metal main layer 30 is formed on the surface of the metal base layer 20. The metal main layer 30 is made of a non-precious metal. In this embodiment, the metal main layer 30 is made of a metal such as copper or aluminum to reduce costs. Furthermore, the metal main layer 30 is formed by electroplating, which is easy to manufacture.

[0022] The metal protective layer 40 is made of a precious metal and is formed to completely cover the surface of the metal main layer 30, the outer peripheral side surfaces of the metal main layer 30, and the outer peripheral side surfaces of the metal base layer 20 to prevent the metal main layer 30 and the metal base layer 20 from being easily oxidized. The metal protective layer 40 is formed by chemical plating or electroplating, which is easy to manufacture. Furthermore, the metal protective layer 40 can be made of gold or silver, but is not limited thereto.

[0023] The production process of this embodiment is described in detail as follows:

[0024] First, a ceramic sheet is taken, and then a thin film metal is sputtered on the ceramic sheet to form a metal bottom layer 20 in the future. Then, the entire plate is electroplated to form a metal main layer 30 in the future, and then the surface is polished. Then, masking is performed according to the needs of the circuit, and then etching is performed to form the metal bottom layer 20 and the metal main layer 30 of the circuit. Then, the film is removed, and then precious metal protection is performed to form a metal protection layer 40. Finally, cutting is performed to form a thin film circuit on the ceramic layer 10, and finally a finished product of a thin film ceramic circuit board is obtained.

[0025] The design focus of the present invention is: by first setting a metal base layer, and then setting a metal main layer on the metal base layer, the metal main layer is made of non-precious metal material, and finally using precious metal material as a metal protective layer, and the metal protective layer wraps the metal base layer and the metal main layer, so as to greatly reduce the use of precious metals, thereby greatly reducing the overall cost of the product and realizing mass production.

[0026] The above description is merely a preferred embodiment of the present invention and does not limit the technical scope of the present invention. Therefore, any minor modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A low-cost thin-film ceramic circuit board structure comprising a ceramic layer and a thin-film circuit, wherein the thin-film circuit is disposed on a surface of the ceramic layer; characterized in that: The thin film circuit includes a metal base layer, a metal main layer and a metal protective layer; the metal base layer is formed on the surface of the ceramic layer; the metal main layer is formed on the surface of the metal base layer, and the metal main layer is made of non-precious metal material; the metal protective layer is made of precious metal material, and the metal protective layer is formed and completely covers the surface of the metal main layer, the outer peripheral side of the metal main layer and the outer peripheral side of the metal base layer.

2. The low-cost thin-film ceramic circuit board structure according to claim 1, characterized in that: The metal bottom layer is made of titanium or titanium-tungsten.

3. The low-cost thin-film ceramic circuit board structure according to claim 1, characterized in that: The metal bottom layer is formed by sputtering a low-cost metal.

4. The low-cost thin-film ceramic circuit board structure according to claim 1, characterized in that: The metal main body layer is made of copper or aluminum.

5. The low-cost thin-film ceramic circuit board structure according to claim 1, characterized in that: The metal main layer is formed by electroplating.

6. The low-cost thin-film ceramic circuit board structure according to claim 1, characterized in that: The metal protective layer is formed by chemical plating or electroplating.

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