Paster welding structure of flexible circuit board

Abstract

The utility model discloses a patch welding structure of a flexible circuit board, a welding element is welded on the flexible circuit board, the flexible circuit board comprises an effective area and a waste area, a gap is arranged between the effective area and the waste area along a first direction, and the height of the effective area is flush with that of the waste area; the effective area is used for bearing a first section of a welding element, the width of the gap is L, and the waste area is used for bearing at least part of the remaining section, connected with the first section, of the welding element; the width of the part, exceeding the effective area, of the welding element is L1, and L is smaller than L1 / 2.

Description

Technical Field

[0001] The utility model relates to the technical field of electronics, in particular to a patch welding structure of a flexible circuit board. Background Art

[0002] Flexible printed circuits (FPCs) are highly reliable and flexible printed circuits made from polyimide or polyester film. They feature high wiring density, light weight, thinness, and excellent bendability.

[0003] FPC stands for flexible printed circuit board (FPC), also known as flexible printed circuit board (FPC), or simply FPC. As time goes by, FPCs are becoming smaller and more sophisticated. Many connector components are larger than the FPC form factor. Furthermore, these connectors are becoming increasingly sophisticated, with components being smaller in the X direction and taller in the Z direction. These components are slender and tall, which can cause them to fall during assembly, leading to cold solder joints and component dropout after curing. These defects significantly increase operating costs. Furthermore, cold solder joints are difficult to detect and can potentially spread to the assembly line or even to the customer's end, posing a significant risk of product defects.

[0004] The above content is only used to assist in understanding the technical solution of the present invention and does not constitute an admission that the above content is prior art. Utility Model Content

[0005] The main purpose of the utility model is to provide a patch welding structure for a flexible circuit board, aiming to solve the problem in the prior art that slender and tall welding components are easily tilted during welding, resulting in poor solder joints.

[0006] To achieve the above objectives, the present invention provides a patch welding structure for a flexible circuit board, wherein a welding element is provided on the flexible circuit board, and the flexible circuit board includes an active area and a waste area, wherein a gap is provided between the active area and the waste area along a first direction, and the heights of the active area and the waste area are flush;

[0007] The effective area is used to support the first section of the welding element, the width of the gap is L, and the waste area is used to support at least part of the remaining section of the welding element connected to the first section;

[0008] The width of the portion of the welding element exceeding the effective area is L1, where L<L1 / 2.

[0009] Preferably, in the patch welding structure of the flexible circuit board, 0.5 mm ≤ L < L1 / 2.

[0010] Preferably, in the patch welding structure of the flexible circuit board, the height of the effective area is H, the height of the waste area is H1, and H-0.05mm≤H1≤H+0.05mm.

[0011] Preferably, in the patch welding structure of the flexible circuit board, the thickness of the waste area is the same as or similar to the thickness of the effective area below the welding element.

[0012] Preferably, in the patch welding structure of the flexible circuit board, the waste area is provided with a first reinforcement structure, and the effective area below the welding element is provided with a second reinforcement structure.

[0013] Preferably, in the patch welding structure of the flexible circuit board, the first reinforcement structure is provided at the bottom layer of the waste area; and the second reinforcement structure is provided at the bottom layer of the effective area below the welding element.

[0014] Preferably, in the patch welding structure of the flexible circuit board, no reinforcement structure is provided in the waste area and the effective area below the welding element.

[0015] Preferably, in the patch welding structure of the flexible circuit board, a pad is provided in the overlapping area of ​​the effective area and the welding element for welding the effective area and the welding element through the pad, and the pad is spaced apart from the gap.

[0016] Preferably, in the patch welding structure of the flexible circuit board, the end of the soldering pad away from the gap is used to be flush with the end edge of the soldering element.

[0017] Preferably, in the patch welding structure of the flexible circuit board, the effective area is penetrated by an insertion hole, and the first section covers the insertion hole when it is arranged on the effective area.

[0018] The utility model has at least the following beneficial effects:

[0019] The present invention provides a patch soldering structure for a flexible circuit board, wherein a soldering element is provided on the flexible circuit board. The flexible circuit board includes an effective area and a waste area, wherein a gap is provided between the effective area and the waste area along a first direction, and the effective area and the waste area are flush with each other. The effective area is used to support a first section of the soldering element, and the width of the gap is L. The waste area is used to support at least a portion of the remaining section of the soldering element connected to the first section. The width of the portion of the soldering element that extends beyond the effective area is L1, where L is less than L1 / 2. This prevents tall and slender elements from falling over during soldering, thereby preventing poor solder joints. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1A schematic diagram of an embodiment of a patch welding structure of a flexible circuit board provided by the present invention;

[0021] Figure 2 for Figure 1 Enlarged schematic diagram of the X in the middle.

[0022]

[0023]

[0024] The purpose, features and advantages of the present invention will be further described with reference to the accompanying drawings and in conjunction with the embodiments. DETAILED DESCRIPTION

[0025] The technical solution of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. The present invention will be described in detail below with reference to the accompanying drawings and in conjunction with the embodiments. It should be noted that the embodiments of the present invention and the features in the embodiments may be combined with each other unless there is a conflict.

[0026] In the embodiments of the present invention, the term "and / or" describes the relationship between associated objects, indicating that three relationships can exist. For example, A and / or B can represent three situations: A exists alone, A and B exist simultaneously, and B exists alone. The character " / " generally indicates that the associated objects are in an "or" relationship.

[0027] It should be noted that the terms "first", "second", etc. in the specification and claims of the present utility model and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.

[0028] In the embodiments of the present invention, the term "plurality" refers to two or more than two, and other quantifiers are similar.

[0029] In the present invention, unless otherwise specified, directional words such as "up, down, top, bottom" are usually used with reference to the directions shown in the drawings, or with reference to the components themselves in the vertical, perpendicular or gravity direction; similarly, for ease of understanding and description, "inside and outside" refer to the inside and outside relative to the outline of each component itself, but the above directional words are not used to limit the present invention.

[0030] The utility model provides a patch welding structure 100 of a flexible circuit board. Figure 1 and Figure 2The flexible circuit board is provided with a soldering element 200, and the flexible circuit board includes an active area 1 and a waste area 2. A gap 21 is provided between the active area 1 and the waste area 2 along a first direction, and the heights of the active area 1 and the waste area 2 are aligned; the active area 1 is used to support a first section of the soldering element 200, and the width of the gap 21 is L. The waste area 2 is used to support at least a portion of the remaining section of the soldering element 200 connected to the first section; the width of the portion of the soldering element 200 that extends beyond the active area 1 is L1, and L<L1 / 2.

[0031] The present invention provides a patch soldering structure 100 for a flexible circuit board. A soldering element 200 is provided on the flexible circuit board. The flexible circuit board includes an active area 1 and a waste area 2. A gap 21 is provided between the active area 1 and the waste area 2 along a first direction. The active area 1 and the waste area 2 are flush with each other. The active area 1 is used to support a first section of the soldering element 200. The width of the gap 21 is L. The waste area 2 is used to support at least a portion of the remaining section of the soldering element 200 connected to the first section. The width of the portion of the soldering element 200 that extends beyond the active area 1 is L1, where L is less than L1 / 2. This prevents tall and slender components from falling over during soldering, preventing poor solder joints.

[0032] By setting the width of the gap 21 to be less than half the width of the portion of the welding element 200 extending beyond the active area 1, thin and tall welding elements 200 are less likely to fall over and can remain standing in the active area 1. If the gap 21 is too large, the contact area between the bottom of the welding element 200 and the active area 1 or the waste area 2 will be reduced, making it more difficult for thin and tall welding elements 200 to remain standing. Therefore, it is necessary to ensure that L is less than L1 / 2 to ensure that the contact area between the bottom of the welding element 200 and the active area 1 or the waste area 2 is sufficient.

[0033] Furthermore, gap 21 cannot be too narrow, as punching is impossible if it is too narrow. Therefore, in this embodiment, 0.5 mm ≤ L < L 1 / 2. It is worth noting that while ensuring that gap 21 can be punched, gap 21 in waste area 2 should be as small as possible, so that waste area 2 provides more support for welding component 200.

[0034] To facilitate the vertical positioning of the welding element 200, the height of the waste area 2 must be consistent with the height of the active area 1, ensuring a flat area for the welding element 200. In this embodiment, the height of the active area 1 is H, and the height of the waste area 2 is H1, where H-0.05mm≤H1≤H+0.05mm.

[0035] The thickness of the waste area 2 is the same as or similar to the thickness of the active area 1 below the soldering element 200. This further ensures the stability of the soldering element 200 on the active and waste areas 1 and 2 of the flexible circuit board. Specifically, if the waste area 2 below the soldering element 200 is reinforced, the active area 1 also needs to be reinforced; if the waste area 2 below the soldering element 200 is not reinforced, the active area 1 also needs to be unreinforced.

[0036] In this embodiment, the waste area 2 is provided with a first reinforcement structure, and the active area 1 below the welding element 200 is provided with a second reinforcement structure. The first reinforcement structure is provided at the bottom of the waste area 2; the second reinforcement structure is provided at the bottom of the active area 1 below the welding element 200.

[0037] In other embodiments, no reinforcement structure is provided in the waste area 2 and the effective area 1 below the welding element 200 , which can further reduce costs.

[0038] In addition, a pad 11 is provided in the overlapping area between the active area 1 and the welding element 200, for welding the active area 1 and the welding element 200 via the pad 11. The pad 11 is spaced apart from the gap 21. An end of the pad 11 away from the gap 21 is configured to be flush with an end edge of the welding element 200.

[0039] The effective area 1 is provided with an insertion hole 12, and the first section covers the insertion hole 12 when it is provided on the effective area 1. In this way, the welding element 200 can be initially positioned through the insertion hole 12.

[0040] Here are some examples:

[0041] The total width of the welding element 200 is A, which is 3.14 mm. The width of the portion extending beyond the flexible plate is L1, which is 1.59 mm. Nearly 50% of the area of ​​the welding element 200 is exposed externally. Therefore, the gap in the waste area 2 needs to be as small as possible to provide more support for the waste. The width of the gap 21 is L. In this embodiment, L is 0.67 mm.

[0042] The width L1 of the protruding portion of the welding element 200 is greater than twice the width L of the gap 21 (the protruding portion is 1.59>1.34=2*0.67).

[0043] When manufacturing the flexible circuit board, a gap 21 is punched out, for example, a gap 21 of 1.59 mm is punched out; then solder paste is printed on the pad 11; a thin, tall and long soldering component 200 is punched onto the pad 11; a cover strip is placed on the soldering component 200 to ensure that it will not be blown down by wind during operation between workstations and in the furnace, resulting in poor solder joints; and the solder paste is solidified by high temperature in the furnace, and the component and the flexible circuit board are welded.

[0044] Obviously, the embodiments described above are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, those skilled in the art can make other variations or modifications without creative work, which should fall within the scope of protection of the present invention.

Claims

1. A patch welding structure of a flexible circuit board, wherein a welding element is provided on the flexible circuit board, characterized in that: The flexible circuit board includes an active area and a waste area, a gap is provided between the active area and the waste area along a first direction, and the active area and the waste area are flush with each other; The effective area is used to support the first section of the welding element, the width of the gap is L, and the waste area is used to support at least part of the remaining section of the welding element connected to the first section; The width of the portion of the welding element exceeding the effective area is L1, where L<L1 / 2.

2. The patch welding structure of the flexible circuit board according to claim 1, characterized in that: 0.5mm≤L<L1 / 2.

3. The patch welding structure of the flexible circuit board according to claim 2, characterized in that: The height of the effective area is H, the height of the waste area is H1, and H-0.05mm≤H1≤H+0.05mm.

4. The patch welding structure of the flexible circuit board according to claim 1, characterized in that: The thickness of the waste area is the same as or similar to the thickness of the effective area below the welding element.

5. The patch welding structure of the flexible circuit board according to claim 4, characterized in that: The waste area is provided with a first reinforcement structure, and the effective area below the welding element is provided with a second reinforcement structure.

6. The patch welding structure of the flexible circuit board according to claim 5, characterized in that: The first reinforcement structure is arranged at the lowest layer of the waste area; the second reinforcement structure is arranged at the lowest layer of the effective area below the welding element.

7. The patch welding structure of the flexible circuit board according to claim 4, characterized in that: The waste area and the effective area below the welding element are not provided with a reinforcement structure.

8. The patch welding structure of the flexible circuit board according to claim 1, characterized in that: A welding pad is provided in the overlapping area between the effective area and the welding element, and is used to weld the effective area and the welding element through the welding pad. The welding pad is spaced apart from the gap.

9. The patch welding structure of the flexible circuit board according to claim 8, characterized in that: One side end of the soldering pad away from the gap is used to be flush with the end edge of the soldering element.

10. The patch welding structure of the flexible circuit board according to claim 1, characterized in that: The effective area is penetrated by an insertion hole, and the first section covers the insertion hole when it is arranged on the effective area.

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