External heat dissipation device for high-power switching power supply
Through phase change heat dissipation, the hollow structure of the condenser and cold plate and the circulation of refrigerant are utilized to solve the low efficiency problem of traditional heat dissipation methods, achieve efficient and rapid heat dissipation effects, reduce temperature rise, and save space and maintenance costs.
Patent Information
- Application Number
- CN202422630503.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-30
- Publication Date
- 2025-10-03
- Estimated Expiration
- 2034-10-30
AI Technical Summary
Traditional heat dissipation methods are inefficient in high-power switching power supplies, consume extra energy, and may cause noise and mechanical failures, making it difficult to meet the heat dissipation requirements of high power density.
The phase change heat transfer method is adopted, and the hollow structure of the condenser and the cold plate is utilized. The refrigerant evaporates and condenses inside the cold plate, and is connected by the evaporation tube and the return tube. Combined with the turbulence structure and the cooling fan, heat dissipation is achieved without external power.
It achieves efficient and rapid heat dissipation, reduces temperature rise, saves space and maintenance costs, and improves equipment reliability.
Smart Images
Figure CN223415155U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of electrical heat dissipation equipment, in particular to an external heat dissipation device for a high-power switching power supply. Background Art
[0002] High-power switching devices are key components of switching power supplies. The switching losses during power conversion generate significant heat within a confined space. The efficiency of the heat dissipation system directly affects the temperature rise of the internal power devices, which in turn affects their lifespan and reliability. With the continuous advancement of power electronics technology, device power density is increasing, placing ever-higher demands on heat dissipation. Therefore, the design and selection of heat dissipation devices are crucial factors affecting device reliability. A reasonable heat dissipation method and device structure are crucial for improving heat dissipation efficiency.
[0003] Traditional heat dissipation methods, such as forced air cooling and circulating water cooling, typically mount power devices on aluminum heat sinks, place the heat sinks in air ducts, or install water circulation pipes on the heat sinks. Heat is dissipated from the devices through convection heat transfer between the aluminum substrate and the fins on the back and the cooling medium. These methods not only consume additional energy but can also cause noise, vibration, or mechanical failure. Furthermore, the heat transfer efficiency often fails to meet the cooling requirements of high-power devices. Utility Model Content
[0004] Aiming at the problem of insufficient heat dissipation capacity of power electronic power devices in a limited structural space, the utility model proposes a device that uses phase change heat dissipation as a heat dissipation means. The system has the characteristics of simple structure, no need for external power, low maintenance cost, and good heat dissipation effect.
[0005] In order to achieve the above-mentioned purpose, the technical solution of the present utility model is as follows:
[0006] An external heat sink for a high-power switching power supply, used to cool power devices, includes a condenser and a cold plate, wherein the cold plate is a hollow structure, arranged vertically, and the power devices are mounted on the cold plate;
[0007] The hollow structure of the cold plate is filled with refrigerant, and the boiling point of the refrigerant is within the temperature control range of the corresponding power device; the upper part of the cold plate is connected to the steam inlet of the condensing unit at the upper part of the condenser through an evaporation tube, which is used to allow the evaporated refrigerant to enter the condenser; the lower part of the cold plate is connected to the reflux outlet of the condensing unit at the lower part of the condenser through a condensation return pipe, which is used to allow the condensed refrigerant to flow back into the cold plate.
[0008] Preferably, the hollow structure of the cold plate is specifically as follows: a top gas evaporation channel is provided at the upper part of the cold plate for collecting evaporated refrigerant, and a bottom reflux channel is provided at the lower part of the cold plate for collecting refrigerant refluxed after condensation; the top gas evaporation channel and the bottom reflux channel are connected by multiple hollow vertical pipes.
[0009] Preferably, a flow-disturbing structure is provided inside the hollow vertical pipe.
[0010] Preferably, the spoiler structure is a transverse groove.
[0011] Preferably, the upper and lower parts of the condenser are respectively provided with an upper main pipe and a lower main pipe, wherein the upper main pipe is connected to the steam inlet of the condensing unit, and the lower main pipe is connected to the reflux outlet of the condensing unit; the upper main pipe and the lower main pipe are connected through multiple vertically arranged condensing pipes.
[0012] Preferably, the condenser tube is a finned tube.
[0013] Preferably, a cooling fan is also installed on the condenser to dissipate heat from the condenser tube.
[0014] Preferably, the installation position of the condenser satisfies that the bottom surface of the condenser is higher than the upper surface of the cold plate.
[0015] Preferably, the installation position of the condenser satisfies that the bottom surface of the condenser is 50 cm higher than the upper surface of the cold plate.
[0016] Beneficial effects:
[0017] 1. The cooling efficiency of this phase-change heat sink is much higher than that of traditional air-cooling and water-cooling methods. It can quickly cool down power devices with high heat generation in a short period of time, effectively reducing temperature rise, which is beneficial to the life of power devices and the stable operation of switching power supply equipment.
[0018] 2. The cold plate is a flat plate structure with a small thickness and no heat dissipation ribs are required on the back of the base plate. Power devices can be installed and arranged in a centralized manner, saving installation space.
[0019] 3. Except for the cooling fan of the condensing unit, no other external circulation power is required, and the additional power consumption is very low;
[0020] 4. Once the refrigerant is added, it can be used for several years without replenishment, with reliable operation and low maintenance. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] Figure 1 It is a schematic diagram of the structural principle of the utility model;
[0022] Figure 2 It is a side view of the condensing and cooling unit;
[0023] Figure 3 Schematic diagram of the cold plate structure.
[0024] Figure markings: 1-top gas evaporation channel; 3-hollow vertical pipe; 4-bottom reflux channel; 5-cold plate; 6-evaporation tube; 7-condensation reflux tube; 8-condensation unit steam inlet; 9-condensation unit reflux outlet; 10-condenser; 11-cooling fan; 12-refrigerant; 13-power device. DETAILED DESCRIPTION
[0025] In order to make the purpose, features, and advantages of the present invention more obvious and easy to understand, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described below are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.
[0026] like Figures 1 to 3 As shown, an external heat dissipation device for a high-power switching power supply is used to cool power devices 13. The power devices 13 include IGBTs, rectifier bridges, etc., which are the main heat-generating components. The phase-change heat dissipation device for switching power devices includes a condenser 10 and a cold plate 5. The cold plate 5 is a hollow structure and is arranged vertically. The power devices 13 are installed on the cold plate 5. Figure 1 The red frame in the figure is the installation position of the power device 13 in this embodiment.
[0027] The hollow structure of the cold plate 5 is filled with refrigerant 12, and the boiling point of the refrigerant 12 is within the temperature control range of the corresponding power device 13; the upper part of the cold plate 5 is connected to the steam inlet 8 of the condensing unit at the upper part of the condenser 10 through the evaporation tube 6, so as to allow the evaporated refrigerant 12 to enter the condenser 10; the lower part of the cold plate 5 is connected to the condensing unit reflux outlet 9 at the lower part of the condenser 10 through the condensation reflux tube 7, so as to allow the condensed refrigerant 12 to flow back into the cold plate 5.
[0028] In a possible embodiment, the hollow structure of the cold plate 5 is specifically as follows: a top gas evaporation channel 1 is provided on the upper part of the cold plate 5 for collecting the evaporated refrigerant 12, and a bottom reflux channel 4 is provided on the lower part of the cold plate 5 for collecting the refrigerant 12 that refluxes after condensation; the top gas evaporation channel 1 and the bottom reflux channel 4 are connected by multiple hollow vertical pipes 3; in a further embodiment, the hollow vertical pipe 3 is provided with a turbulent flow structure such as a transverse groove to increase the disturbance of the heat exchange medium and improve the heat exchange efficiency.
[0029] In a possible embodiment, the upper and lower parts of the condenser 10 are respectively provided with an upper main pipe and a lower main pipe, wherein the upper main pipe is connected to the steam inlet 8 of the condensing unit, and the lower main pipe is connected to the reflux outlet 9 of the condensing unit; the upper main pipe and the lower main pipe are connected by multiple vertically arranged condensing tubes; in a further embodiment, the condensing tubes are finned tubes; a cooling fan 11 is also installed on the condenser 10 for dissipating heat from the condensing tubes.
[0030] The installation position of the condenser 10 satisfies that the bottom surface of the condenser 10 is higher than the upper surface of the cold plate 5. In a further embodiment, the installation position of the condenser 10 satisfies that the bottom surface of the condenser 10 is 50 cm higher than the upper surface of the cold plate 5 to ensure the reflux speed of the refrigerant 12. In this embodiment, the refrigerant 12 is specifically tetrafluoroethane;
[0031] When the power device 13 to be cooled is operating, the heat it generates raises the temperature of the cold plate 5 to the boiling point of the refrigerant 12. The refrigerant 12 then undergoes a phase change, changing from liquid to gas. It rapidly absorbs heat, cooling the cold plate 5 and controlling the temperature rise of the power device 13 within a safe range, thereby achieving rapid cooling of the power device 13. The volume of the gaseous refrigerant 12, which is generated by the phase change of the refrigerant 12, continues to expand, rising along the hollow vertical pipe 3 and converging into the horizontal top gas evaporation channel 1. The boiling gaseous refrigerant 12 increases in pressure and enters the condenser 10 through the evaporation tube 6 connecting the cold plate 5 and the condenser 10. The condenser 10 has multiple vertical condensation tubes and horizontally arranged aluminum fins that intersect with each other, providing a large heat dissipation area. Aluminum has a high thermal conductivity. Combined with the forced air cooling of the cooling fan 11, the gaseous refrigerant 12 in the internal pipes of the condenser 10 is rapidly cooled and undergoes a phase change, exchanging the heat it carries with the air. After phase change, refrigerant 12 exits condenser 10 through condensing unit reflux outlet 9. Due to the pressure head generated by the height difference, liquid refrigerant 12 continues to flow back into the cold plate 5 through condenser reflux pipe 7. A horizontal bottom reflux channel 4 is provided below the cold plate 5. After this diversion, the liquid refrigerant refills the hollow vertical pipe 3, completing the entire process of heat absorption, phase change evaporation, heat dissipation, and phase change reflux. This achieves rapid cooling of the power devices 13 mounted on the cold plate 5 and effectively controls the temperature rise of these devices.
[0032] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as within the scope of protection of the present invention.
Claims
1. A high-power switching power supply external heat sink for cooling power devices, characterized in that: It includes a condenser and a cold plate, wherein the cold plate is a hollow structure, arranged vertically, and the power devices are installed on the cold plate; The hollow structure of the cold plate is filled with refrigerant, and the boiling point of the refrigerant is within the temperature control range of the corresponding power device; the upper part of the cold plate is connected to the steam inlet of the condensing unit at the upper part of the condenser through an evaporation tube, which is used to allow the evaporated refrigerant to enter the condenser; the lower part of the cold plate is connected to the reflux outlet of the condensing unit at the lower part of the condenser through a condensation return pipe, which is used to allow the condensed refrigerant to flow back into the cold plate.
2. The external heat dissipation device for a high-power switching power supply according to claim 1, characterized in that: The hollow structure of the cold plate is as follows: a top gas evaporation channel is provided at the upper part of the cold plate to collect the evaporated refrigerant, and a bottom reflux channel is provided at the lower part of the cold plate to collect the refrigerant that returns after condensation; the top gas evaporation channel and the bottom reflux channel are connected by multiple hollow vertical pipes.
3. The external heat dissipation device for a high-power switching power supply according to claim 2, characterized in that: A flow-disturbing structure is provided inside the hollow vertical pipe.
4. The external heat dissipation device for a high-power switching power supply according to claim 3, characterized in that: The spoiler structure is a transverse groove.
5. The external heat dissipation device for a high-power switching power supply according to claim 1, characterized in that: The upper and lower parts of the condenser are respectively provided with an upper main pipe and a lower main pipe, wherein the upper main pipe is connected to the steam inlet of the condensing unit, and the lower main pipe is connected to the reflux outlet of the condensing unit; the upper main pipe and the lower main pipe are connected by multiple vertically arranged condensing pipes.
6. The external heat dissipation device for a high-power switching power supply according to claim 5, characterized in that: The condenser tube is a finned tube.
7. The external heat dissipation device for a high-power switching power supply according to claim 5, characterized in that: A cooling fan is also installed on the condenser to dissipate heat from the condenser tube.
8. The external heat dissipation device for a high-power switching power supply according to claim 1, characterized in that: The installation position of the condenser satisfies that the bottom surface of the condenser is higher than the upper surface of the cold plate.
9. The external heat dissipation device for a high-power switching power supply according to claim 1, characterized in that: The installation position of the condenser meets the requirement that the bottom surface of the condenser is 50 cm higher than the upper surface of the cold plate.