Cleaning and drying device for silicon wafers

Abstract

The utility model discloses a cleaning and drying device for a silicon wafer, which belongs to the technical field of silicon wafer cleaning and comprises a device body, a clamping unit for clamping the silicon wafer, a drying unit and a cleaning unit are arranged in the device body, and the drying unit is arranged at the upper end of the cleaning unit. The cleaning unit comprises a cleaning liquid pipe and a rotating nozzle connected with the cleaning liquid pipe, the drying unit comprises a drying assembly and a driving assembly for driving the drying assembly to move, the clamping unit comprises clamping blocks arranged at the two ends of a silicon wafer, the outer portion of the clamping block on one side is connected with a moving assembly through a micro electric rotator, and the moving assembly is connected with the drying assembly through a micro electric rotator. The clamping block on the other side is rotationally connected with the driven assembly. According to the utility model, the micro electric rotator is arranged outside the clamping block of the silicon wafer, and then the micro electric rotator is connected with the moving assembly and the driven assembly, so that during the cleaning work, the micro electric rotator is used for changing the surface of the silicon wafer after one surface is cleaned, and the double surfaces of the silicon wafer are cleaned.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of silicon wafer cleaning, especially to a cleaning and drying device for silicon wafer. BACKGROUND

[0002] In the process of silicon wafer processing, after each thinning process, a single wafer cleaning machine is used to clean the residual liquid and impurities on the surface of the silicon wafer. When the single wafer cleaning machine is used to clean the silicon wafer, the silicon wafer is placed horizontally, and the upper and lower brushes and the sprayed liquid are used to clean the silicon wafer.

[0003] Due to the effect of gravity, the cleaning liquid on the back of the silicon wafer cannot be evenly distributed on the back of the silicon wafer, which affects the cleaning effect of the back of the silicon wafer, and the uncleaned back may contaminate the front of the silicon wafer in the subsequent process.

[0004] Based on the above problems, a cleaning and drying device for silicon wafer is provided. UTILITY MODEL

[0005] The utility model aims to provide a cleaning and drying device for silicon wafer, which comprises a device body, a clamping unit, a drying unit and a cleaning unit arranged in the device body for clamping the silicon wafer, the drying unit is arranged at the upper end of the cleaning unit, the cleaning unit comprises a cleaning liquid pipe and a rotating spray head connected with the cleaning liquid pipe, the drying unit comprises a drying assembly and a driving assembly for driving the movement of the drying assembly, the clamping unit comprises clamping blocks arranged at both ends of the silicon wafer, the outer part of the clamping block on one side is connected with a moving assembly through a micro electric rotary actuator, and the clamping block on the other side is rotationally connected with a driven assembly.

[0006] To achieve the above purpose, the utility model provides a cleaning and drying device for silicon wafer, which comprises a device body, a clamping unit, a drying unit and a cleaning unit arranged in the device body for clamping the silicon wafer, the drying unit is arranged at the upper end of the cleaning unit, the cleaning unit comprises a cleaning liquid pipe and a rotating spray head connected with the cleaning liquid pipe, the drying unit comprises a drying assembly and a driving assembly for driving the movement of the drying assembly, the clamping unit comprises clamping blocks arranged at both ends of the silicon wafer, the outer part of the clamping block on one side is connected with a moving assembly through a micro electric rotary actuator, and the clamping block on the other side is rotationally connected with a driven assembly.

[0007] Preferably, the rotating spray head is arranged on a filter plate, the lower end of the filter plate is a liquid collecting tank, the lower end of the liquid collecting tank is provided with a liquid supply tank, the liquid supply tank is provided with a cleaning liquid pipe, one end of the cleaning liquid pipe is connected with a pump through an electromagnetic valve, the pump is connected with an external cleaning liquid storage tank through a water pipe, and the other end of the cleaning liquid pipe is connected with the rotating spray head through a rotary joint.

[0008] Preferably, the driving assembly includes a driving motor, a screw rod and a fixed rod, one end of the screw rod extends out of the side wall of the device body and is connected to the output shaft of the driving motor, the other end of the screw rod is rotatably connected to the inner wall of the device body, the fixed rod is arranged at the upper end of the screw rod, and both ends of the fixed rod are fixed to the inner wall of the device body.

[0009] Preferably, a moving block is provided on the screw rod, the upper end of the moving block is slidably connected to the fixed rod, and the lower end of the moving block is connected to the drying device.

[0010] Preferably, the moving assembly includes a fixed frame, a cylinder and a positioning block, the fixed frame is arranged on the left inner wall of the device body and is located at the lower end of the screw rod, the fixed end of the cylinder is connected to the bottom of the fixed frame, the free end of the cylinder is connected to the positioning block, the positioning block is connected to the fixed side of the micro electric rotator, and the rotating part of the micro electric rotator is connected to the clamping block.

[0011] Preferably, the driven component includes a slide groove and a slider, the slide groove is arranged on the right inner wall of the device body, and the slider is slidably connected to the slide groove.

[0012] Preferably, a rotary bearing is embedded in the sliding block, a rotating shaft is provided in the inner ring of the rotary bearing, and the rotating shaft is fixedly connected to the clamping block on the right side.

[0013] Therefore, the present invention adopts a silicon wafer cleaning and drying device with the above structure, which has the following features:

[0014] Beneficial effects:

[0015] (1) In this device, a micro electric rotator is set on the outside of the clamping block on one side of the silicon wafer, and the other side is connected to the slider through a rotary bearing. After the rotary nozzle at the bottom rinses the bottom of the entire silicon wafer, the micro electric rotator is used to control the clamping block to drive the silicon wafer to rotate, turn the silicon wafer over, and clean the side that has not been rinsed. In addition, the rotary nozzle in this device is set at the bottom. After one side of the silicon wafer is rinsed clean, it is turned to the upper end. When rinsing the other side, it will not cause pollution to the rinsed side, thereby ensuring the cleaning effect.

[0016] (2) In this device, a rotary nozzle for cleaning is set on the ground, and a drying device is set on the upper end. After the silicon wafer is cleaned, the positioning block is driven upward by the cylinder. Because one end of the clamping unit is connected to the positioning block and the other end is connected to the slider, when the positioning block drives the clamping unit to move upward, it will drive the slider to slide on the slide rail, thereby realizing the upward movement of the entire silicon wafer, which is convenient for drying.

[0017] The technical solution of the present invention is further described in detail below through the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic structural diagram of an embodiment of a silicon wafer cleaning and drying device according to the present invention;

[0019] Figure 2 This is an overall schematic diagram of an embodiment of a silicon wafer cleaning and drying device according to the present invention;

[0020] Among them, 1. Device body; 2. Silicon wafer; 3. Cleaning liquid pipe; 4. Rotating nozzle; 5. Filter plate; 6. Liquid collecting tank; 7. Solenoid valve; 8. Pump; 9. Drive motor; 10. Fixed rod; 11. Screw; 12. Moving block; 13. Drying device; 14. Clamping block; 15. Micro electric rotator; 16. Fixed frame; 17. Cylinder; 18. Positioning block; 19. Slide; 20. Slider; 21. Rotating bearing. DETAILED DESCRIPTION

[0021] The technical solution of the present utility model is further described below through the accompanying drawings and embodiments.

[0022] Unless otherwise defined, the technical or scientific terms used in this utility model shall have the usual meanings understood by persons of ordinary skill in the field to which this utility model belongs. The words "first", "second" and similar terms used in this utility model do not indicate any order, quantity or importance, but are only used to distinguish different components. Words such as "include" or "comprise" mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Words such as "connect" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0023] Example

[0024] like Figure 1-Figure 2 As shown, the present invention provides a silicon wafer cleaning and drying device, comprising a device body 1, which is provided with a clamping unit for clamping a silicon wafer 2, a drying unit, and a cleaning unit. The drying unit is located above the cleaning unit. After cleaning, the silicon wafer 2 is directly raised to the drying unit for drying. The drying unit of the device body 1 is provided with an external door that can be opened to install the silicon wafer.

[0025] The cleaning unit includes a cleaning liquid pipe 3 and a rotating nozzle 4 connected to the cleaning liquid pipe 3. The rotating nozzle 4 is arranged on a filter plate 5. The lower end of the filter plate 5 is a liquid collecting tank 6. The waste liquid is filtered and flushed through the filter plate 5 and collected in the liquid collecting tank 6. A drain port is provided on one side of the bottom of the liquid collecting tank 6 to collect the waste liquid.

[0026] A liquid supply tank is provided at the lower end of the liquid collecting tank 6, and a cleaning liquid pipe 3 is provided in the liquid supply tank. One end of the cleaning liquid pipe 3 is connected to the pump 8 through the solenoid valve 7, and the pump 8 is connected to the external cleaning liquid storage tank through a water pipe. The other end of the cleaning liquid pipe 3 passes through the liquid collecting tank 6 and is connected to the rotary nozzle 4 through a rotary joint, and the rotary joint is provided on the filter plate 5.

[0027] The drying unit includes a drying assembly and a drive assembly for driving the drying assembly. The drive assembly includes a drive motor 9, a screw 11, and a fixed rod 10. One end of the screw 11 extends out of the side wall of the device body 1 and is connected to the output shaft of the drive motor 9 via a coupling. The other end of the screw 11 is rotatably connected to a screw seat on the inner wall of the device body 1. The fixed rod 10 is disposed at the upper end of the screw 11, and both ends of the fixed rod 10 are fixed to the inner wall of the device body 1. A moving block 12 is provided on the screw 11. The upper end of the moving block 12 is slidably connected to the fixed rod 10. The fixed rod 10 provides stability to the moving block and ensures that the moving block 12 can move linearly on the screw 11. The lower end of the moving block 12 is connected to the drying device 13. During the drying process, the drive motor 9 turns on the screw 11 to drive the screw, causing the moving block 12 to move left and right on the fixed rod 10, thereby driving the drying device 13 at the lower end to dry the silicon wafers 2.

[0028] The clamping unit includes clamping blocks 14 positioned at both ends of the silicon wafer 2. One clamping block 14 is externally connected to a moving assembly via a micro-electric rotator 15. The moving assembly comprises a fixed frame 16, a cylinder 17, and a positioning block 18. The fixed frame 16 is positioned on the left inner wall of the device body 1 and below the screw 11. The fixed end of the cylinder 17 is connected to the bottom of the fixed frame 16, and the free end of the cylinder 17 is connected to the positioning block 18. The positioning block 18 is connected to the fixed side of the micro-electric rotator 15, and the rotating portion of the micro-electric rotator 15 is connected to the clamping block 14. The clamping block 14 on the other side is rotationally connected to a driven assembly. The driven assembly comprises a slide 19 and a slider 20. The slide 19 is positioned on the right inner wall of the device body 1, and the slider 20 is slidably connected to the slide 19. The slider 20 is embedded in a rotary bearing 21. The inner ring of the rotary bearing 21 contains a rotating shaft, which is fixedly connected to the right clamping block 14.

[0029] In this setting, the cylinder 17 drives the positioning block 18 to move up and down, driving the micro-electric rotator 15 connected to the positioning block 18 to move in the same direction, thereby driving the silicon wafer 2 fixed by the clamping block 14 to move. While moving on the left side, the clamping block 14 on the right side for clamping the silicon wafer 2 will also move with the silicon wafer, thereby driving the slider 20 connected to it to slide on the slide rail, realizing the up and down movement of the entire silicon wafer.

[0030] In this device, the connections between the components are all connected by conventional connection methods, such as bolt connection. In this device, the cylinder 17, the drive motor 9, the drying device 13, the pump 8, the electromagnetic valve 7, the micro electric rotator 15, etc. are all connected to the controller by conventional connection methods.

[0031] When cleaning the silicon wafer 2, the clamping block 14 is used to fix it, and the cylinder 17 is controlled to move the silicon wafer 2 to a suitable rinsing position. The controller controls to open the pump 8 and the solenoid valve 7, and the rotating nozzle 4 cleans the bottom of the silicon wafer 2. The cleaning waste liquid is filtered by the filter plate 5 and collected in the liquid collecting tank 6; after the bottom surface of the silicon wafer 2 is rinsed, the position of the silicon wafer 2 is adjusted by the cylinder 17, and the micro-electric rotator 15 is used to drive the clamping block 14 and the silicon wafer 2 to turn over, and the cylinder 17 is used again to move the silicon wafer 2 to a suitable rinsing position for rinsing the other side; after the entire silicon wafer 2 is rinsed, the cylinder 17 is controlled to drive the silicon wafer 2 to move to a suitable drying position, and the drive motor 9 and the drying device 13 are turned on to dry the entire silicon wafer by moving it back and forth.

[0032] Therefore, the utility model adopts a silicon wafer cleaning and drying device with the above structure, by arranging a micro electric rotator outside the clamping block of the silicon wafer, and then connecting the micro electric rotator with the moving component and the driven component. During the cleaning work, after cleaning one side, the micro electric rotator is used to change the silicon wafer to achieve double-sided cleaning of the silicon wafer.

[0033] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that they can still modify or replace the technical solution of the present invention with equivalents, and these modifications or equivalent replacements cannot cause the modified technical solution to deviate from the spirit and scope of the technical solution of the present invention.

Claims

1. A silicon wafer cleaning and drying device, characterized in that: The device comprises a main body, wherein a clamping unit for clamping a silicon wafer, a drying unit, and a cleaning unit are provided within the main body. The drying unit is provided at the upper end of the cleaning unit. The cleaning unit comprises a cleaning liquid pipe and a rotating nozzle connected to the cleaning liquid pipe. The drying unit comprises a drying assembly and a driving assembly for driving the drying assembly to move. The clamping unit comprises clamping blocks provided at both ends of the silicon wafer. The exterior of one clamping block is connected to the moving assembly via a micro-electric rotator, and the clamping block on the other side is rotationally connected to the driven assembly. The rotating nozzle is arranged on the filter plate, the lower end of the filter plate is a liquid collecting tank, the lower end of the liquid collecting tank is provided with a liquid supply tank, a cleaning liquid pipe is provided in the liquid supply tank, one end of the cleaning liquid pipe is connected to the pump through a solenoid valve, the pump is connected to the external cleaning liquid storage tank through a water pipe, and the other end of the cleaning liquid pipe passes through the liquid collecting tank and is connected to the rotating nozzle through a rotary joint.

2. The silicon wafer cleaning and drying device according to claim 1, wherein: The driving assembly includes a driving motor, a screw rod and a fixed rod. One end of the screw rod extends out of the side wall of the device body and is connected to the output shaft of the driving motor. The other end of the screw rod is rotatably connected to the inner wall of the device body. The fixed rod is arranged at the upper end of the screw rod, and both ends of the fixed rod are fixed to the inner wall of the device body.

3. The silicon wafer cleaning and drying device according to claim 2, wherein: A moving block is provided on the screw rod, the upper end of the moving block is slidably connected to the fixed rod, and the lower end of the moving block is connected to the drying device.

4. The silicon wafer cleaning and drying device according to claim 3, wherein: The moving assembly includes a fixed frame, a cylinder and a positioning block. The fixed frame is arranged on the left inner wall of the device body and is located at the lower end of the screw rod. The fixed end of the cylinder is connected to the bottom of the fixed frame, and the free end of the cylinder is connected to the positioning block. The positioning block is connected to the fixed side of the micro electric rotator, and the rotating part of the micro electric rotator is connected to the clamping block.

5. The silicon wafer cleaning and drying device according to claim 4, characterized in that: The driven component includes a slide groove and a slider. The slide groove is arranged on the right inner wall of the device body, and the slider is slidably connected to the slide groove.

6. The silicon wafer cleaning and drying device according to claim 5, characterized in that A rotary bearing is embedded in the sliding block, a rotating shaft is provided in the inner ring of the rotary bearing, and the rotating shaft is fixedly connected to the clamping block on the right side.

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