Degumming frame and silicon wafer processing device

Abstract

The utility model relates to a degumming frame and a silicon wafer processing device.The degumming frame comprises a first supporting plate, a second supporting plate, a first stop lever and a transmission mechanism, the second supporting plate and the first supporting plate are arranged in a spaced mode, a clamping space is formed between the first supporting plate and the second supporting plate, and the clamping space is used for containing a silicon wafer arranged on a wafer holder; the two ends of each first stop lever are movably connected to the first supporting plate and the second supporting plate respectively, the first stop levers are arranged on the two sides of the silicon wafer in the clamping space respectively, and when the wafer holder and the silicon wafer are placed in the clamping space, the transmission mechanism is used for abutting against the first stop levers under the acting force of the wafer holder. According to the degumming frame and the silicon wafer processing device, the first blocking rods on the two sides of the silicon wafer are driven by the transmission mechanism to achieve automatic clamping of the silicon wafer, and then the degumming frame can conveniently clamp the silicon wafers of different specifications; and the operation convenience and the working efficiency are improved.

Description

Technical Field

[0001] The present application relates to the field of photovoltaic technology, and in particular to a debonding rack and a silicon wafer processing device. Background Art

[0002] After the silicon ingots are cut into wafers, they need to undergo a degumming and cleaning process to soften the glue and release the wafers from the wafer tray. The degummed wafers are then placed into the wafer insertion equipment for insertion. During the degumming and cleaning process, a degumming rack is typically used to clamp and position the wafers on the wafer tray to ensure they remain stable after being separated from the wafer tray, thus preventing breakage. Since silicon wafers come in a variety of sizes, a corresponding degumming rack is required for each size of wafer to provide clamping and positioning.

[0003] In the related art, when clamping silicon wafers of different specifications, the operator needs to replace the debonding rack corresponding to the silicon wafer specifications, or the operator needs to adjust the clamping structure of the debonding rack to adapt to the clamping needs of silicon wafers of other specifications.

[0004] However, whether it is replacing the bracket feet or adjusting by the operator to adapt to the clamping of silicon wafers of other specifications, it will affect the convenience of operation and lead to reduced work efficiency. Utility Model Content

[0005] Based on this, the present application provides a degumming rack and a silicon wafer processing device to solve the technical problem of how to achieve automatic adjustment of the degumming rack to improve operational convenience and operating efficiency.

[0006] In one aspect, the present application provides a degumming rack, comprising:

[0007] a first support plate;

[0008] a second support plate, the second support plate being spaced apart from the first support plate, a clamping space being formed between the first support plate and the second support plate, the clamping space being used for placing a silicon wafer on a wafer support;

[0009] a first blocking rod, wherein both ends of the first blocking rod are movably connected to the first support plate and the second support plate, and the first blocking rod is disposed on both sides of the silicon wafer in the clamping space;

[0010] The transmission mechanism is provided on the first support plate and / or the second support plate. When the crystal tray and the silicon wafer are placed in the clamping space, the transmission mechanism is used to press the first baffle under the force of the crystal tray, so that the first baffles located on both sides of the silicon wafer are close to each other to clamp the two sides of the silicon wafer.

[0011] In one embodiment, the first support plate and the second support plate are both provided with a first mounting plate, the first mounting plate is provided with a first guide groove, the first blocking rod is passed through the first guide groove, and when the crystal tray together with the silicon wafer are placed in the clamping space, the transmission mechanism drives the first blocking rod to move along the corresponding first guide groove respectively, and the first blocking rods located on both sides of the silicon wafer are close to each other.

[0012] In one embodiment, the first guide groove is an arc-shaped groove or a strip-shaped groove.

[0013] In one embodiment, the installation position of at least one of the first installation plates on the first support plate and the second support plate is adjustable;

[0014] Alternatively, the first mounting plate connected to the first support plate is integrally formed with the first support plate, and / or the first mounting plate connected to the second support plate is integrally formed with the second support plate.

[0015] In one embodiment, the first blocking rod is connected to a first reset member, and the first reset member is used to drive the corresponding first blocking rod to reset when the transmission mechanism releases the pressing force on the first blocking rod, so that the first blocking rods on both sides of the silicon wafer move away from each other;

[0016] And / or, the transmission mechanism is connected to a second restoring member, and when the crystal holder is removed from the clamping space, the second restoring member drives the transmission mechanism to perform a restoring movement to release the pressing force on the first blocking rod.

[0017] In one embodiment, the degumming rack further includes two second baffles, which are connected to the first support plate and the second support plate, and are located below the two first baffles. The two second baffles are used to support and limit the bottom of the silicon wafer in the clamping space.

[0018] In one embodiment, the first support plate and the second support plate are both provided with a second mounting plate, the second mounting plate is provided with a second guide groove, the second blocking rod is passed through the second guide groove, and the two second blocking rods can move along the corresponding second guide grooves respectively, and when the two second blocking rods move along the corresponding second guide grooves toward the bottom of the degumming rack, the two second blocking rods move away from each other and release the support limit on the silicon wafer.

[0019] In one embodiment, the second guide groove is an arc-shaped groove or a strip-shaped groove.

[0020] In one embodiment, the installation position of at least one of the second installation plates on the first support plate and the second support plate is adjustable;

[0021] Alternatively, the second mounting plate connected to the first support plate is integrally formed with the first support plate, and / or the second mounting plate connected to the second support plate is integrally formed with the second support plate.

[0022] On the other hand, the present application provides a silicon wafer processing device, comprising a shelf, a degumming device, a wafer inserting device, a transport mechanism, and a degumming rack as described above, wherein the shelf is used to place the degumming rack, and limit plates are provided at both ends of the shelf corresponding to the degumming rack. When the degumming rack is placed on the shelf, the limit plates abut against two second baffles and cause the two second baffles to move along corresponding second guide grooves toward the top of the degumming rack to support and limit the bottom of the silicon wafer located in the clamping space; the degumming device has a degumming trough, and the wafer inserting device has a water trough and a slide groove located at the bottom of the water trough;

[0023] In which, the conveying mechanism is used to lift the end of the second baffle and transfer the degumming rack from the shelf to the degumming trough, and / or, the conveying mechanism is used to lift the end of the second baffle and transfer the degumming rack after degumming to the water trough, and when the lifting of the end of the second baffle is released, the two second baffles move along the corresponding second guide groove toward the bottom of the degumming rack to release the support limit of the silicon wafer, so that the silicon wafer slides into the corresponding slide groove for insertion.

[0024] The above-mentioned silicon wafer processing device and debonding rack can adapt to the clamping and limiting needs of silicon wafers of different specifications because the first baffles on both sides of the silicon wafer can be movable relative to the first support plate and the second support plate. In addition, since the transmission mechanism can press the first baffles under the force of the crystal tray when the crystal tray together with the silicon wafer is placed in the clamping space, the first baffles on both sides of the silicon wafer are close to each other to clamp the silicon wafer, thereby realizing automatic clamping of the silicon wafer, and then the debonding rack can conveniently clamp silicon wafers of different specifications, thereby improving operational convenience and work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present application or related technologies, the following briefly introduces the drawings required for use in the embodiments or related technical descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, without paying any creative work, they can also obtain drawings of other embodiments based on these drawings.

[0026] Figure 1This is a structural schematic diagram of a degumming rack according to one embodiment of the present application.

[0027] Figure 2 for Figure 1 Schematic diagram of the cross-section structure of the degumming rack is shown.

[0028] Figure 3 for Figure 2 A schematic structural diagram of a debonding rack with silicon wafers clamped therein is shown.

[0029] Figure 4 This is a structural schematic diagram of an embodiment of the present application when the degumming rack is placed on a shelf so that the second barrier rod abuts against the limiting plate of the shelf.

[0030] Figure 5 This is a structural schematic diagram of an embodiment of the present application when the degumming rack leaves the shelf so that the second barrier rod leaves the limiting plate.

[0031] Figure 6 This is a structural schematic diagram of a degumming rack according to one embodiment of the present application when placed on a shelf.

[0032] Description of reference numerals:

[0033] 10. Debonding rack; 100. Clamping space; 101. Crystal support; 102. Silicon wafer; 11. First support plate; 12. Second support plate; 13. First stop bar; 131. Flexible covering; 14. Transmission mechanism; 15. First mounting plate; 151. First guide groove; 16. Second stop bar; 17. Second mounting plate; 171. Second guide groove; 20. Shelf; 21. Limit plate. DETAILED DESCRIPTION

[0034] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0035] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element.

[0036] The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions are for illustrative purposes only and do not represent the only implementations.

[0037] It should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0038] In the embodiments of this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0039] Combine Figures 1 to 3 As shown, a degumming rack 10 provided in one embodiment of the present application includes a first support plate 11, a second support plate 12, a first baffle 13 and a transmission mechanism 14. The second support plate 12 is spaced apart from the first support plate 11, and a clamping space 100 is formed between the first support plate 11 and the second support plate 12. The clamping space 100 is used to place a silicon wafer 102 provided on a crystal support 101. The two ends of the first baffle 13 are movably connected to the first support plate 11 and the second support plate 12 respectively. The first baffle 13 is provided on both sides of the silicon wafer 102 in the clamping space 100. In this way, the first baffles 13 on both sides of the silicon wafer 102 can be used to clamp the silicon wafer 102. In some embodiments, the first baffles 13 for clamping the silicon wafer 102 are arranged parallel to each other to improve the clamping stability of the silicon wafer 102.

[0040] It should be noted that the number of transmission mechanisms 14 can be 1 or 2. For example, in some embodiments, the first support plate 11 is provided with a transmission mechanism 14, or the second support plate 12 is provided with a transmission mechanism 14. In some embodiments, both the first support plate 11 and the second support plate 12 are provided with a transmission mechanism 14. There is no limitation on the number of transmission mechanisms 14, as long as the transmission mechanism 14 can realize the transmission of the force of the crystal support 101 to the first baffles 13 on both sides of the silicon wafer 102. That is to say, in the embodiment of the present application, when the crystal support 101 is placed on the degumming rack 10, the gravity of the crystal support 101 acts on the transmission mechanism, and the transmission mechanism can drive the first baffles 13 on both sides of the silicon wafer 102 to move under the force of the crystal support 101. Specifically, when the wafer tray 101 and the silicon wafer 102 are placed in the clamping space 100, the transmission mechanism 14 is used to press the first blocking rods 13 under the force of the wafer tray 101, so that the first blocking rods 13 on both sides of the silicon wafer 102 are close to each other to clamp the two sides of the silicon wafer 102. The structure of the transmission mechanism 14 is not limited here. The transmission mechanism 14 may include a pressure rod or a pressure block for pressing the first blocking rods 13 downward, and the pressure rod or pressure block can be subjected to the pressure of the wafer tray 101 and drive the first blocking rods 13 towards each other based on the pressure of the wafer tray 101.

[0041] In the debonding rack 10 of the present application, since the first baffles 13 on both sides of the silicon wafer 102 can move relative to the first support plate 11 and the second support plate 12, it can adapt to the clamping and limiting needs of silicon wafers 102 of different specifications. In addition, since the transmission mechanism 14 can press the first baffles 13 under the force of the crystal tray 101 when the crystal tray 101 and the silicon wafer 102 are placed in the clamping space 100, the first baffles 13 on both sides of the silicon wafer 102 are close to each other to clamp the silicon wafer 102, thereby realizing automatic clamping of the silicon wafer 102, and then making the debonding rack 10 convenient for clamping silicon wafers 102 of different specifications, thereby improving the convenience and efficiency of operation.

[0042] The first support plate 11 and the second support plate 12 can be connected by a connecting plate or a connecting frame, or by a rod. The connection method between the first support plate 11 and the second support plate 12 is not limited here, as long as the silicon wafer 102 can enter the clamping space 100 between the first support plate 11 and the second support plate 12, and when the silicon wafer 102 needs to be released, the silicon wafer 102 in the clamping space 100 can be moved out from the bottom of the degumming rack (10).

[0043] Combine Figure 2 and Figure 3As shown, the outer surface of the first blocking rod 13 can be provided with a flexible covering member 131 such as sponge or silicone, so as to utilize the flexible covering member 131 to improve the stability of clamping and limiting the silicon wafer 102 and reduce the risk of clamping and damaging the silicon wafer 102.

[0044] Combine Figure 4 As shown, in some embodiments, both the first support plate 11 and the second support plate 12 are provided with a first mounting plate 15, each of which is provided with a first guide groove 151, through which the first blocking rod 13 is disposed. In this embodiment, when the wafer holder 101 and the silicon wafer 102 are placed into the clamping space 100, the transmission mechanism 14 drives the first blocking rods 13 to move along the corresponding first guide grooves 151, and the first blocking rods 13 on both sides of the silicon wafer 102 approach each other. Because the first blocking rods 13 on both sides of the silicon wafer 102 move relative to the first support plate 11 and the second support plate 12 when the wafer holder 101 is placed into the clamping space 100, driven by the transmission mechanism 14, to clamp and limit the silicon wafer 102, the spacing between the first blocking rods 13 on both sides of the silicon wafer 102 can be adaptively adjusted to clamp and limit the silicon wafer 102 located therebetween, thereby meeting the clamping and limiting requirements of silicon wafers 102 of various specifications.

[0045] It should be noted that one or two first blocking rods 13 may be provided on each side of the silicon wafer 102. The number of first blocking rods 13 is not limited herein. As long as there are first blocking rods 13 on both sides of the silicon wafer 102 when the wafer holder 101 is placed in the clamping space 100 and the first blocking rods 13 are driven by the transmission mechanism 14 to move closer to each other to clamp the silicon wafer 102, the silicon wafer 102 can be clamped.

[0046] For example, combined with Figure 3 As shown, a first barrier rod 13 is provided on each side of the silicon wafer 102. In some embodiments, a silicon wafer 102 with a width of 210 mm is placed in the clamping space 100. The two first barrier rods 13 can be driven by the transmission mechanism 14 to abut against both sides of the silicon wafer 102. In this case, the clamping width between the two first barrier rods 13 can be considered to be 210 mm. Correspondingly, in some embodiments, a silicon wafer 102 with a width of 182 mm is placed in the clamping space 100. The two first barrier rods 13 can be driven by the transmission mechanism 14 to abut against both sides of the silicon wafer 102. In this case, the clamping width between the two first barrier rods 13 can be considered to be 182 mm.

[0047] The first guide slot 151 can be an arc-shaped slot or a strip-shaped slot, which is not limited herein. It can be understood that the two ends of the first guide slot 151 are staggered with each other in a direction perpendicular to the first stopper 13, so that the movement of the first stopper 13 along the first guide slot 151 has a displacement in a direction perpendicular to the first stopper 13, and then the two first stoppers 13 can approach each other to clamp and limit the silicon wafer 102 when moving along the corresponding first guide slot 151.

[0048] It should be noted that the installation position of the mounting plate can be fixed or adjustable. For example, in some embodiments, the installation position of the at least one first mounting plate 15 on the first support plate 11 and the second support plate 12 is adjustable. In this way, by adjusting the installation position of the mounting plate at the two ends of the first stopper 13, the clamping stroke between the two first stoppers 13 can be adjusted, thereby further widening the adaptation range of the two first stoppers 13 to meet the clamping needs of silicon wafers 102 of more specifications. The first mounting plate 15 can be connected to the first support plate 11 or the second support plate 12 by bolts to realize adjustable installation position, or can be installed at different positions of the first support plate 11 or the second support plate 12 by clamping.

[0049] It can be understood that the installation position of the first mounting plate 15 can also be fixed, i.e., the installation position of the first mounting plate 15 is not adjustable. On this basis, the first mounting plate 15 can be a part of the first support plate 11 or the second support plate 12. For example, in some embodiments, the first mounting plate 15 connected to the first support plate 11 is integrally formed with the first support plate 11, and / or the first mounting plate 15 connected to the second support plate 12 is integrally formed with the second support plate 12. It can be understood that when the first mounting plate 15 is integrally formed with the first support plate 11 or the second support plate 12, the first guide slot 151 is opened in the first support plate 11 or the second support plate 12.

[0050] In some embodiments, each first baffle 13 is connected to a first return member (not shown). This first return member is used to reset the corresponding first baffle 13 when the transmission mechanism 14 releases the compressive force on the first baffle 13, causing the first baffles 13 on either side of the silicon wafer 102 to move away from each other. For example, if one first baffle 13 is provided on each side of the silicon wafer 102, when the transmission mechanism 14 is not acting on the first baffles 13, the first return member will maintain the two first baffles 13 in a position away from each other. In this case, the distance between the two first baffles 13 is large, so that when the wafer holder 101 and the silicon wafer 102 are placed into the clamping space 100, the two first baffles 13 are less likely to interfere with the silicon wafer 102. This makes it easier for the silicon wafer 102 to fit between the two first baffles 13 and reduces the chance of damage from impact with the first baffles 13. It can be understood that under the action of the crystal support 101, the transmission mechanism 14 presses the two first bars 13 so that the two first bars 13 are close to each other. The distance between the two first bars 13 can adapt to the need of clamping both sides of the silicon wafer 102, that is, the two first bars 13 are clamped on both sides of the silicon wafer 102 to achieve clamping and limiting of both sides of the silicon wafer 102.

[0051] In some embodiments, the transmission mechanism 14 is connected to a second reset member (not shown). When the wafer holder 101 is removed from the clamping space 100, the second reset member causes the transmission mechanism 14 to reset, releasing the compressive force on the first retaining bars 13. In this embodiment, the second reset member enables the reset movement of the transmission mechanism 14. When the wafer holder 101 is removed from the clamping space 100, the transmission mechanism 14 no longer applies a compressive force to the two first retaining bars 13, thereby allowing the two first retaining bars 13 to move away from each other. At this point, the silicon wafer 102 clamped between the two first retaining bars 13 can be easily released from between the two first retaining bars 13, and accordingly, a new silicon wafer 102 can be easily placed between the two first retaining bars 13.

[0052] In the above embodiment, the first blocking bars 13 on both sides of the silicon wafer 102 achieve a widthwise clamping and limiting effect on the silicon wafer 102 located therebetween. In some embodiments of the present application, the debonding rack 10 is further provided with a structure for supporting and limiting the bottom of the silicon wafer 102 to further enhance the stability of the silicon wafer 102 in the debonding rack 10.

[0053] Recombination Figures 1 to 3 As shown, the debonding rack 10 also includes two second baffles 16, which are connected to the first support plate 11 and the second support plate 12. The two second baffles 16 are located below the two first baffles 13, and the two second baffles 16 are used to support and limit the bottom of the silicon wafer 102 located in the clamping space 100.

[0054] It should be noted that the second lever 16 may be directly connected to the first support plate 11 and the second support plate 12, or may be indirectly connected to the first support plate 11 and the second support plate 12. Figure 4 and Figure 5 As shown, the first support plate 11 and the second support plate 12 are both provided with a second mounting plate 17, and the second mounting plate 17 is provided with a second guide groove 171. The second guide groove 171 can be an arc groove or a strip groove.

[0055] The second blocking rods 16 are disposed in the second guide grooves 171, and the two second blocking rods 16 can move along the corresponding second guide grooves 171. When the two second blocking rods 16 move toward the bottom of the degumming rack 10 along the corresponding second guide grooves 171, the two second blocking rods 16 move away from each other and release the support and limit for the silicon wafer 102. In this embodiment, since the two second blocking rods 16 adjust the distance between each other by moving along the corresponding second guide grooves 171, the two second blocking rods 16 can both meet the support and limit requirements for the silicon wafer 102; when the support and limit for the bottom of the silicon wafer 102 is no longer needed, the two second blocking rods 16 move away from each other to release the support and limit for the silicon wafer 102, thereby facilitating the silicon wafer 102 to pass between the two second limit rods and then be removed from the degumming rack 10. After the degumming rack 10 is completed, the entire rack can be transferred to the subsequent wafer insertion process for wafer insertion, thereby improving the overall automation efficiency.

[0056] For ease of understanding, the structure of the debonding rack 10 will be further described below in conjunction with its application in a silicon wafer processing device.

[0057] Another embodiment of the present application provides a silicon wafer processing device, comprising a shelf 20 (see Figure 6 As shown), degumming equipment (not shown), inserting equipment (not shown), transport mechanism (not shown) and the degumming rack 10 as described above. The shelf 20 is used to place the degumming rack 10, and the shelf 20 is provided with a limit plate 21 at both ends of the degumming rack 10. Figure 4 and Figure 6 As shown, when the degumming rack 10 is placed on the shelf 20, the limiting plate 21 abuts against the two second baffles 16 and causes the two second baffles 16 to move toward the top of the degumming rack 10 along the corresponding second guide grooves 171, so that the two second baffles 16 can support and limit the bottom of the silicon wafer 102 located in the clamping space 100 to prevent the silicon wafer 102 from falling out of the degumming rack 10.

[0058] The degumming device has a degumming trough, and the wafer inserting device has a water trough and a chute located at the bottom of the water trough. In this embodiment, the transport mechanism is used to pull the end of the second baffle 16 and transfer the degumming rack 10 from the shelf 20 to the degumming trough, and / or the transport mechanism is used to pull the end of the second baffle 16 and transfer the degumming rack 10 after degumming to the water trough, and when the lifting of the end of the second baffle 16 is released, the two second baffles 16 move along the corresponding second guide grooves 171 toward the bottom of the degumming rack 10 to release the support limit for the silicon wafer 102, allowing the silicon wafer 102 to slide into the corresponding chute for wafer insertion.

[0059] It can be understood that when the transport mechanism pulls up the end of the second blocking rod 16, the second blocking rod 16 is kept at the top of the second guide groove 171, so that the two second blocking rods 16 maintain a minimum distance between each other to support and limit the bottom of the silicon wafer 102. Figure 5 As shown, when the second baffle 16 is not subjected to the upward force of the transport mechanism or the limit plate 21, the second baffle 16 will move along the second guide groove 171 toward the bottom of the degumming rack 10, so that the distance between the two second baffles 16 increases to release the support limit for the silicon wafer 102, so that the silicon wafer 102 can pass between the two second baffles 16 and then move out of the degumming rack 10.

[0060] Since in the silicon wafer processing device of this embodiment, the degumming rack 10 can transfer the degummed silicon wafer 102 as a whole to the inserting device, and use the second baffle 16 to move along the corresponding second guide groove 171 toward the bottom of the degumming rack 10 to release the support limit for the silicon wafer 102, so that the silicon wafer 102 loses the support of the second baffle 16 and is released into the slide groove of the inserting device. Therefore, after the degumming is completed, there is no need for the operator to remove the silicon wafer 102 from the degumming rack 10 and then put the silicon wafer 102 into the inserting device. Therefore, the silicon wafer processing device of the present application improves the efficiency of the streamlined operation from degumming the silicon wafer 102 to inserting the silicon wafer 102.

[0061] It should be noted that the transport mechanism may include multiple transport robots. Among these transport robots, at least one transport robot is used to lift the end of the second gear bar 16 and transfer the degumming rack 10 from the shelf 20 to the degumming tank; at least another transport robot is used to lift the end of the second gear bar 16 and transfer the degumming rack 10 that has been degummed to the water tank. In some embodiments, the transport mechanism may also have only one transport robot, which is used to complete the transfer operation of the degumming rack 10. The structure and number of the transport mechanism are not limited here.

[0062] In some embodiments, the mounting position of at least one second mounting plate 17 on the first support plate 11 and the second support plate 12 is adjustable to facilitate adjustment of the clamping stroke of the two second blocking rods 16 during relative movement, so that the second blocking rods 16 are properly mounted on the first support plate 11 and the second support plate 12. The second mounting plate 17 can be connected to the first support plate 11 or the second support plate 12 by bolts to achieve adjustable mounting position, or it can be mounted at different positions on the first support plate 11 or the second support plate 12 by a snap-fit ​​connection.

[0063] The second mounting plate 17 may also be a part of the first support plate 11 or the second support plate 12. For example, the second mounting plate 17 connected to the first support plate 11 is integrally formed with the first support plate 11, and / or the second mounting plate 17 connected to the second support plate 12 is integrally formed with the second support plate 12. It is understood that when the second mounting plate 17 is integrally formed with the first support plate 11 or the second support plate 12, the second guide groove 171 is defined in the first support plate 11 or the second support plate 12.

[0064] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0065] The above embodiments merely illustrate several implementation methods of the present application, and while their descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art would be able to make various modifications and improvements without departing from the inventive concept of the present application, all of which fall within the scope of protection of the present application. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. A degumming rack (10), characterized in that: The degumming rack (10) comprises: A first support plate (11); a second support plate (12), the second support plate (12) being spaced apart from the first support plate (11), a clamping space (100) being formed between the first support plate (11) and the second support plate (12), the clamping space (100) being used for placing a silicon wafer (102) provided on a wafer support (101); a first baffle (13), wherein both ends of the first baffle (13) are movably connected to the first support plate (11) and the second support plate (12), and the first baffle (13) is provided on both sides of the silicon wafer (102) in the clamping space (100); A transmission mechanism (14), wherein the first support plate (11) and / or the second support plate (12) are provided with the transmission mechanism (14), and when the crystal holder (101) together with the silicon wafer (102) are placed in the clamping space (100), the transmission mechanism (14) is used to press the first blocking rod (13) under the action of the crystal holder (101), so that the first blocking rods (13) located on both sides of the silicon wafer (102) are close to each other to clamp the silicon wafer (102).

2. The degumming rack (10) according to claim 1, characterized in that: The first support plate (11) and the second support plate (12) are both provided with a first mounting plate (15), the first mounting plate (15) is provided with a first guide groove (151), the first blocking rod (13) is passed through the first guide groove (151), and when the crystal holder (101) together with the silicon wafer (102) are placed in the clamping space (100), the transmission mechanism (14) drives the first blocking rod (13) to move along the corresponding first guide groove (151), and the first blocking rods (13) located on both sides of the silicon wafer (102) are close to each other.

3. The degumming rack (10) according to claim 2, characterized in that: The first guide groove (151) is an arc-shaped groove or a strip-shaped groove.

4. The degumming rack (10) according to claim 2, characterized in that: The installation position of at least one of the first installation plates (15) on the first support plate (11) and the second support plate (12) is adjustable; Alternatively, the first mounting plate (15) connected to the first support plate (11) is integrally formed on the first support plate (11), and / or the first mounting plate (15) connected to the second support plate (12) is integrally formed on the second support plate (12).

5. The degumming rack (10) according to claim 1, characterized in that: The first baffle rod (13) is connected to a first reset member, and the first reset member is used to drive the corresponding first baffle rod (13) to reset when the transmission mechanism (14) releases the pressing force on the first baffle rod (13), so that the first baffle rods (13) located on both sides of the silicon wafer (102) move away from each other; And / or, the transmission mechanism (14) is connected to a second reset member, and when the crystal holder (101) is removed from the clamping space (100), the second reset member drives the transmission mechanism (14) to reset to release the pressing force on the first blocking rod (13).

6. The degumming rack (10) according to any one of claims 1 to 5, characterized in that: The debonding rack (10) further includes two second baffles (16), the two second baffles (16) being connected to the first support plate (11) and the second support plate (12), the two second baffles (16) being located below the two first baffles (13), and the two second baffles (16) being used to support and limit the bottom of the silicon wafer (102) located in the clamping space (100).

7. The degumming rack (10) according to claim 6, characterized in that: The first support plate (11) and the second support plate (12) are both provided with a second mounting plate (17), the second mounting plate (17) is provided with a second guide groove (171), the second blocking rod (16) is passed through the second guide groove (171), the two second blocking rods (16) can move along the corresponding second guide groove (171), and when the two second blocking rods (16) move along the corresponding second guide groove (171) toward the bottom of the degumming rack (10), the two second blocking rods (16) move away from each other and release the support limit for the silicon wafer (102).

8. The degumming rack (10) according to claim 7, characterized in that: The second guide groove (171) is an arc-shaped groove or a strip-shaped groove.

9. The degumming rack (10) according to claim 7, characterized in that: The installation position of at least one of the second installation plates (17) on the first support plate (11) and the second support plate (12) is adjustable; Alternatively, the second mounting plate (17) connected to the first support plate (11) is integrally formed with the first support plate (11), and / or the second mounting plate (17) connected to the second support plate (12) is integrally formed with the second support plate (12).

10. A silicon wafer processing device, characterized in that: The invention comprises a shelf (20), a degumming device, a wafer inserting device, a transport mechanism and a degumming rack (10) as claimed in any one of claims 7 to 9, wherein the shelf (20) is used to place the degumming rack (10), and the shelf (20) is provided with limit plates (21) at both ends corresponding to the degumming rack (10), and when the degumming rack (10) is placed on the shelf (20), the limit plates (21) abut against two second baffles (16) and make the two second baffles (16) move toward the top of the degumming rack (10) along the corresponding second guide grooves (171) to support and limit the bottom of the silicon wafer (102) located in the clamping space (100); the degumming device has a degumming groove, and the wafer inserting device has a water trough and a slide groove located at the bottom of the water trough; The transport mechanism is used to lift the end of the second baffle (16) and transfer the degumming rack (10) from the shelf (20) to the degumming trough, and / or the transport mechanism is used to lift the end of the second baffle (16) and transfer the degumming rack (10) that has been degummed to the water trough, and when the lifting of the end of the second baffle (16) is released, the two second baffles (16) move along the corresponding second guide grooves (171) toward the bottom of the degumming rack (10) to release the support limit of the silicon wafer (102), so that the silicon wafer (102) slides into the corresponding slide groove for insertion.

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