Rapid cooling mechanism for plastic suction mold

Abstract

The rapid cooling mechanism comprises a bottom plate, four evenly-distributed supporting rods are fixedly connected to the bottom of the bottom plate, a fixing rod is fixedly connected to the top of the bottom plate, a lower mold is fixedly connected to the top of the fixing rod, a heating cavity is formed in the lower mold, and a cooling cavity is formed in the heating cavity. And the lower end of the bottom plate is fixedly connected with a fixed box. By designing the heat conduction pad, heat in the lower die can be absorbed, meanwhile, heat of the heat conduction pad can be absorbed and transferred through the heat conduction block, the heat conduction pad and the heat conduction block make contact with external air, self-heat dissipation can be achieved, and therefore the purpose of heat dissipation of the lower die is achieved; the water pump can pump out water in the water tank, then the water can be input into the lower die to flow, heat in the lower die can be taken away, the heat dissipation effect on the lower die can be further improved, the heat dissipation efficiency is higher, and the rapid cooling effect of the lower die is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of cooling mechanisms, in particular to a rapid cooling mechanism for a blister mould. Background Art

[0002] The utility model patent with the patent authorization announcement number CN221089938U discloses a blister mold that is easy to disassemble, which relates to the field of blister mold technology, including: a base, a lower mold is arranged on the top of the base, a plurality of support rods are connected to the top of the base, a plurality of support rods are provided with movable rods at the top, a top plate is provided on the top of the movable rods, a clamping assembly is arranged between the base and the lower mold, and is used to disassemble and assemble the lower mold, and a heating assembly is arranged inside the lower mold and is used to heat the plastic on the lower mold. This blister mold can be disassembled and assembled more conveniently through the clamping assembly, so that the mold does not need to be installed with bolts. Secondly, the heating assembly can heat the plastic sheet, which is convenient for shaping the plastic sheet.

[0003] In the above-mentioned prior art, during the use of the blister mold, the mold lacks corresponding heat dissipation means, resulting in low heat dissipation efficiency of the mold, which affects the product molding efficiency. Therefore, improvement is needed. Utility Model Content

[0004] The purpose of the utility model is to provide a rapid cooling mechanism for a blister mold, which solves the problem of low heat dissipation efficiency of the mold.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a rapid cooling mechanism for a blister mold, comprising a base plate, the bottom of the base plate is fixedly connected to four evenly distributed support rods, the top of the base plate is fixedly connected to a fixing rod, the top of the fixing rod is fixedly connected to a lower mold, a heating chamber is provided inside the lower mold, the lower end of the base plate is fixedly connected to a fixing box, the top of the base plate and the left side of the lower mold are fixedly connected to a water tank, a heat dissipation mechanism is provided on the lower mold, and a hair dryer mechanism is provided on the base plate.

[0006] Preferably, the number of the fixing rods is four, and the four fixing rods are evenly distributed at the bottom of the lower mold. By designing the fixing rods, the lower mold can be supported.

[0007] Preferably, the heat dissipation mechanism includes a thermal pad, which is slidably sleeved inside the lower mold. A thermal block is fixedly connected to the bottom of the thermal pad, and a clamping block is fixedly connected to the outside of the thermal block. The clamping block is clamped to the lower mold. A water pump is fixedly connected to the inside of the water tank, and a water inlet is provided at the left end of the water pump. A drain pipe is provided on the top of the water pump. The drain pipe is fixedly connected to the water tank and the lower mold respectively. A flow channel is opened inside the lower mold, and the flow channel is connected to the drain pipe. By designing a heat dissipation mechanism, the heat dissipation efficiency of the mold can be improved.

[0008] Preferably, the thermal pad and the thermal block are an integrated structure, and both the thermal pad and the thermal block are made of thermally conductive silicone. By designing the thermal pad and the thermal block, the heat of the lower mold can be absorbed and transferred.

[0009] Preferably, a card slot is provided inside the lower mold, and a card block is clamped inside the card slot. By designing the clamping connection between the card slot and the card block, the thermal pad can be fixed.

[0010] Preferably, a water outlet pipe is fixedly connected to the interior of the lower mold, and the water outlet pipe is communicated with the flow channel. By designing the water outlet pipe, cooling water inside the flow channel can be discharged through the water outlet pipe.

[0011] Preferably, the blower mechanism includes a dust screen, the bottom plate is provided with a dust screen inside, the bottom plate is fixedly connected to a deflector hood at the lower end, the deflector hood is fixedly connected to a fixed box, an air pump is fixedly connected to the inside of the fixed box, an exhaust port is provided at the left end of the air pump, an air inlet is provided at the right end of the air pump, the air inlet is fixedly connected to the fixed box, an air collection hood is fixedly connected to the right end of the air inlet, a filter is provided inside the air collection hood. By designing the blower mechanism, air can be blown to cool the thermal pad and the thermal block.

[0012] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0013] 1. The utility model can absorb the heat inside the lower mold by designing the function of the thermal pad. At the same time, the heat of the thermal pad can be absorbed and transferred through the function of the thermal block. The thermal pad and the thermal block are in contact with the external air and can dissipate heat by themselves, thereby achieving the purpose of heat dissipation of the lower mold. At the same time, through the function of the water pump, the water pump can pump out the water inside the water tank, and then input the water into the lower mold for flow, which can take away the heat inside the lower mold, further improving the heat dissipation effect of the lower mold, and achieving higher heat dissipation efficiency, thereby achieving a rapid cooling effect of the lower mold.

[0014] 2. The utility model is designed with the function of an air pump, which can suck the outside through the air collecting hood and filter the air under the action of the filter. The filtered air is then discharged into the fixed box through the exhaust port. The gas is then blown upward through the guide hood, which can blow air to the thermal pad and the thermal block, accelerate the heat dissipation efficiency of the thermal pad, and further improve the heat dissipation effect of the mold. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a three-dimensional diagram of the overall structure of the utility model;

[0016] Figure 2 For this utility model Figure 1 A three-dimensional cross-sectional view of the local structure;

[0017] Figure 3 For this utility model Figure 2 A magnified view of point A;

[0018] Figure 4 For this utility model Figure 1 Front sectional view of the fixed box.

[0019] In the figure: 1. Base plate; 2. Support rod; 3. Fixing rod; 4. Lower mold; 5. Heating chamber; 6. Fixing box; 7. Water sink; 8. Heat dissipation mechanism; 9. Blower mechanism; 81. Thermal pad; 82. Thermal block; 83. Block; 84. Slot; 85. Water pump; 86. Water inlet; 87. Drain pipe; 88. Flow channel; 89. Water outlet pipe; 91. Dust net; 92. Air deflector; 93. Air pump; 94. Exhaust port; 95. Air inlet; 96. Air collecting hood; 97. Filter. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0021] See also Figure 1 、 Figure 2A rapid cooling mechanism for a blister mold comprises a bottom plate 1, the bottom of the bottom plate 1 is fixedly connected to four evenly distributed support rods 2, the top of the bottom plate 1 is fixedly connected to a fixing rod 3, the top of the fixing rod 3 is fixedly connected to a lower mold 4, the number of the fixing rods 3 is four, and the four fixing rods 3 are evenly distributed at the bottom of the lower mold 4. By designing the fixing rods 3, the lower mold 4 can be supported, and a heating chamber 5 is provided inside the lower mold 4. The lower end of the bottom plate 1 is fixedly connected to a fixing box 6, and the top of the bottom plate 1 and the left side of the lower mold 4 are fixedly connected to a water tank 7. The lower mold 4 is provided with a heat dissipation mechanism 8, and the bottom plate 1 is provided with a hair dryer mechanism 9.

[0022] See also Figure 1 、 Figure 2 、 Figure 3 The heat dissipation mechanism 8 includes a thermal pad 81, the inner sliding sleeve of the lower mold 4 is connected with the thermal pad 81, the bottom of the thermal pad 81 is fixedly connected with a thermal block 82, the thermal pad 81 and the thermal block 82 are an integrated structure, the thermal pad 81 and the thermal block 82 are made of thermal conductive silicone material, by designing the thermal pad 81 and the thermal block 82, the heat of the lower mold 4 can be absorbed and transferred, the outer side of the thermal block 82 is fixedly connected with a card block 83, the card block 83 is clamped with the lower mold 4, the lower mold 4 is provided with a card slot 84, the card slot 84 is clamped with the card block 83, by designing the card slot 84 and the card block 83 The thermal pad 81 can be fixed by snapping, and the inside of the water tank 7 is fixedly connected to a water pump 85, and a water inlet 86 is provided at the left end of the water pump 85. A drain pipe 87 is provided on the top of the water pump 85, and the drain pipe 87 is fixedly connected to the water tank 7 and the lower mold 4 respectively. A flow channel 88 is opened inside the lower mold 4, and the flow channel 88 is connected to the drain pipe 87. The inside of the lower mold 4 is fixedly connected to a water outlet pipe 89, and the water outlet pipe 89 is connected to the flow channel 88. By designing the water outlet pipe 89, the cooling water inside the flow channel 88 can be discharged through the water outlet pipe 89. By designing the heat dissipation mechanism 8, the heat dissipation efficiency of the mold can be improved.

[0023] See also Figure 1 、 Figure 4 The air blowing mechanism 9 includes a dustproof net 91, a dustproof net 91 is provided inside the bottom plate 1, a guide cover 92 is fixedly connected to the lower end of the bottom plate 1, the guide cover 92 is fixedly connected to the fixed box 6, an air pump 93 is fixedly connected to the inside of the fixed box 6, an exhaust port 94 is provided at the left end of the air pump 93, an air inlet 95 is provided at the right end of the air pump 93, the air inlet 95 is fixedly connected to the fixed box 6, an air collecting cover 96 is fixedly connected to the right end of the air inlet 95, a filter screen 97 is provided inside the air collecting cover 96, and by designing the air blowing mechanism 9, the thermal pad 81 and the thermal block 82 can be cooled by blowing air.

[0024] The specific implementation process of the present invention is as follows: when in use, the heat inside the lower mold 4 can be absorbed by the action of the thermal pad 81, and at the same time, the heat of the thermal pad 81 can be absorbed and transferred by the action of the thermal block 82, and the thermal pad 81 and the thermal block 82 are in contact with the external air and can dissipate heat by themselves, thereby achieving the purpose of heat dissipation of the lower mold 4.

[0025] While the lower mold 4 is dissipating heat, the water pump 85 sucks the inside of the water tank 7 through the water inlet 86, and then the water is input into the flow channel 88 through the drain pipe 87, which can take away the heat inside the lower mold 4, further improving the heat dissipation effect of the lower mold 4, and achieving higher heat dissipation efficiency, thereby achieving a rapid cooling effect of the lower mold 4.

[0026] During heat dissipation, the air pump 93 sucks the outside through the air inlet 95, and then the gas enters through the air collecting cover 96. The air can be filtered under the action of the filter 97. The filtered air is input into the fixed box 6 through the exhaust port 94, and the gas is then blown upward through the guide cover 92, which can blow air to the thermal pad 81 and the thermal block 82, thereby accelerating the heat dissipation efficiency of the thermal pad 81 and further improving the heat dissipation effect of the mold.

[0027] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A rapid cooling mechanism for a blister mold, comprising a bottom plate (1), characterized in that: The bottom of the base plate (1) is fixedly connected to four evenly distributed support rods (2), the top of the base plate (1) is fixedly connected to a fixing rod (3), the top of the fixing rod (3) is fixedly connected to a lower mold (4), a heating chamber (5) is provided inside the lower mold (4), the lower end of the base plate (1) is fixedly connected to a fixing box (6), the top of the base plate (1) and located on the left side of the lower mold (4) is fixedly connected to a water tank (7), a heat dissipation mechanism (8) is provided on the lower mold (4), and a blower mechanism (9) is provided on the base plate (1).

2. A rapid cooling mechanism for a blister mold according to claim 1, characterized in that: The number of the fixing rods (3) is four, and the four fixing rods (3) are evenly distributed on the bottom of the lower mold (4).

3. The rapid cooling mechanism for a blister mold according to claim 1, characterized in that: The heat dissipation mechanism (8) includes a heat-conducting pad (81), the interior of the lower mold (4) is slidably sleeved with the heat-conducting pad (81), the bottom of the heat-conducting pad (81) is fixedly connected to a heat-conducting block (82), the outer side of the heat-conducting block (82) is fixedly connected to a clamping block (83), the clamping block (83) is clamped with the lower mold (4), the interior of the water tank (7) is fixedly connected to a water pump (85), the left end of the water pump (85) is provided with a water inlet (86), the top of the water pump (85) is provided with a drain pipe (87), the drain pipe (87) is fixedly connected to the water tank (7) and the lower mold (4), respectively, the interior of the lower mold (4) is provided with a flow channel (88), and the flow channel (88) is communicated with the drain pipe (87).

4. A rapid cooling mechanism for a blister mold according to claim 3, characterized in that: The thermal pad (81) and the thermal block (82) are an integrated structure, and both the thermal pad (81) and the thermal block (82) are made of thermally conductive silica gel.

5. The rapid cooling mechanism for a blister mold according to claim 1, characterized in that: A card slot (84) is provided inside the lower die (4), and a card block (83) is connected inside the card slot (84).

6. The rapid cooling mechanism for a blister mold according to claim 1, characterized in that: A water outlet pipe (89) is fixedly connected to the interior of the lower mold (4), and the water outlet pipe (89) is communicated with the flow channel (88).

7. The rapid cooling mechanism for a blister mold according to claim 1, characterized in that: The blower mechanism (9) includes a dustproof net (91), the interior of the base plate (1) is provided with a dustproof net (91), the lower end of the base plate (1) is fixedly connected to a guide cover (92), the guide cover (92) is fixedly connected to the fixed box (6), the interior of the fixed box (6) is fixedly connected to an air pump (93), the left end of the air pump (93) is provided with an exhaust port (94), the right end of the air pump (93) is provided with an air inlet (95), the air inlet (95) is fixedly connected to the fixed box (6), the right end of the air inlet (95) is fixedly connected to an air collecting cover (96), and the interior of the air collecting cover (96) is provided with a filter screen (97).

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