Electroplating device for locally thickening copper of PCB (Printed Circuit Board)

Abstract

The utility model discloses a PCB local thickened copper electroplating device which comprises an electroplating pool, a portal frame is arranged at the top of the electroplating pool, a fixing base is arranged at the bottom of the portal frame, a PCB is arranged at the bottom of the fixing base, a clamping and fixing mechanism is arranged at the bottom of the fixing base, and the clamping and fixing mechanism comprises a top clamping assembly and a bottom clamping assembly, the top clamping assembly is used for clamping the PCB at the top; the bottom limiting assembly is arranged at the bottom of the PCB; the bottom limiting assembly comprises two connecting rods which are symmetrically arranged at the bottom of the fixed seat; the base is fixedly arranged at the bottoms of the two connecting rods; the two supporting plates are symmetrically arranged in the middle of the top of the base, the PCB is arranged between the two supporting plates, the PCB is arranged between the two supporting plates, and the bottoms of the supporting plates are limited, so that the portal frame is prevented from shaking when driving the PCB to move, the clamping plates are prevented from being separated from the PCB during electroplating, and electrolyte can be in uniform contact with the PCB.

Description

Technical Field

[0001] The present application relates to the field of electroplating, and in particular to an electroplating device for locally thickening copper on a PCB. Background Art

[0002] PCB local thickening electroplating refers to covering specific areas of the circuit board with a thicker metal film, usually made of conductive materials such as copper. The main purpose of this process is to enhance the conductivity of the circuit board in specific areas. During local thickening electroplating, the non-circuit area of ​​the PCB board needs to be covered with dry film to prevent the non-circuit area from contacting the electrolyte. Then, the circuit area is locally thickened with copper by electroplating.

[0003] However, in the process of implementing the relevant technical solutions, at least the following technical problems were found: when performing local thickening electroplating on the PCB, the top of the PCB board needs to be clamped on the gantry, and the PCB board needs to be moved into the copper plating tank for electroplating. When the gantry drives the PCB board to move up and down and forward and backward, the PCB board shakes greatly, and when it is lifted, the copper liquid tends to flow downward, resulting in uneven copper plating, and the clamping position may not be able to contact the electroplating liquid, which makes the electroplating layer at the clamping position uneven, affecting the electroplating effect. Utility Model Content

[0004] The present application solves the problem of uneven electroplating caused by shaking during movement in the prior art by providing a PCB locally thickened copper electroplating device, and achieves the effect of limiting the PCB at the top and bottom.

[0005] The present application provides an electroplating device for locally thickening copper on a PCB, comprising an electroplating pool, a gantry being provided on the top of the electroplating pool, a fixing seat being provided on the bottom of the gantry, a PCB being provided on the bottom of the fixing seat, and a clamping and fixing mechanism being provided on the bottom of the fixing seat, wherein the clamping and fixing mechanism comprises: a top clamping assembly being provided at the bottom of the fixing seat, and the top clamping assembly clamps the PCB at the top; a bottom limiting assembly being provided at the bottom of the PCB; the bottom limiting assembly comprising: two connecting rods being symmetrically provided at the bottom of the fixing seat; a base being fixedly provided at the bottoms of the two connecting rods; and two support plates being symmetrically provided at the middle of the top of the base, and the PCB being provided between the two support plates.

[0006] Furthermore, the top clamping assembly includes: a plurality of baffles, which are arranged at the bottom of the fixing seat, and the plurality of baffles are arranged in parallel and equidistantly at the bottom of the fixing seat; a fixing plate, which is arranged on one side of the baffle, and the PCB board is arranged between the baffle and the fixing plate.

[0007] Furthermore, an electric push rod is provided on the fixed plate, and the electric push rod extends into a clamping plate fixedly provided between the baffle and the fixed plate, and the clamping plate is in contact with and connected to the PCB board.

[0008] Furthermore, a stirring assembly is provided at the bottom of the electroplating pool, and the stirring assembly includes: a stirring shaft, rotatably connected to the bottom of the clamping and fixing mechanism; a stirring blade, arranged on the outside of the stirring shaft; a driving motor, fixedly installed at the bottom inside the clamping and fixing mechanism, and the output shaft of the driving motor is fixedly connected to the stirring shaft.

[0009] Furthermore, a heater is provided inside the electroplating tank.

[0010] The technical solution provided by this application has at least the following technical effects or advantages:

[0011] The electric push rod drives the clamping plate to move toward the PCB board and the baffle, so that the clamping plate and the baffle clamp the top of the PCB board and fix the PCB board on the fixed seat, so that the PCB board can move with the gantry. The PCB board is set between the two support plates to limit the bottom of the support plate, thereby preventing the gantry from shaking when driving the PCB board to move. During electroplating, the clamping plate is separated from the PCB board, and the PCB board is limited by the base and the support plates on both sides, so that the electrolyte can evenly contact the PCB board, thereby improving the electroplating effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 This is a schematic diagram of the overall structure of the electroplating device in an embodiment of the present application;

[0013] Figure 2 Schematic diagram of the cross-sectional structure of the electroplating cell in the embodiment of the present application;

[0014] Figure 3 This is a schematic structural diagram of the clamping and fixing mechanism in an embodiment of the present application;

[0015] In the figure: 10, electroplating tank; 20, gantry; 30, fixed seat; 40, clamping and fixing mechanism; 50, stirring assembly; 60, PCB board; 41, top clamping assembly; 42, bottom limit assembly; 411, baffle; 412, fixing plate; 413, electric push rod; 414, clamping plate; 421, connecting rod; 422, base; 423, support plate; 51, stirring shaft; 52, stirring blade; 53, drive motor. DETAILED DESCRIPTION

[0016] The embodiment of the application discloses a PCB local thickening copper electroplating device, through separation of the clamping plate 414 and the baffle 411, the electrolyte enters the clamping position, the support of the bottom of the PCB plate 60 is realized through cooperation of the bottom base 422 and the support plate 423, the phenomenon of uneven electroplating in the clamping position is prevented, the two sides of the PCB plate 60 are limited through the two support plates 423, the shaking of the gantry 20 when driving the PCB plate 60 to move is prevented, and the electroplating is more uniform.

[0017] In order to better understand the above technical solutions, the above technical solutions will be described in detail below in combination with the drawings of the specification and specific embodiments.

[0018] Please refer to Figure 1 and Figure 2 The embodiment provides a PCB local thickening copper electroplating device, which comprises an electroplating tank 10, a gantry 20 arranged at the top of the electroplating tank 10, a fixing seat 30 arranged at the bottom of the gantry 20, a PCB plate 60 arranged at the bottom of the fixing seat 30, a clamping fixing mechanism 40 arranged at the bottom of the fixing seat 30, a stirring assembly 50 arranged at the bottom of the electroplating tank 10, the stirring assembly 50 comprising a stirring shaft 51, stirring blades 52 and a driving motor 53, the stirring shaft 51 being rotatably connected to the bottom of the clamping fixing mechanism 40, the stirring blades 52 being arranged outside the stirring shaft 51, the driving motor 53 being fixedly installed at the bottom of the inside of the clamping fixing mechanism 40, and the output shaft of the driving motor 53 being fixedly connected with the stirring shaft 51, and a heater arranged in the inside of the electroplating tank 10, the output shaft of the driving motor 53 drives the stirring shaft 51 to rotate, so that the stirring shaft 51 drives the stirring blades 52 outside to rotate, the stirring blades 52 drive the electrolyte in the inside of the electroplating tank 10 to flow, so as to improve the flow rate of the electrolyte, the electrolyte is heated by the heater, so that the electrolyte can fully flow on the surface of the PCB plate 60 and in the clamping position, a uniform electric field is formed, and the electroplating effect is improved.

[0019] Please refer to Figure 1 、 Figure 2 and Figure 3The clamping and fixing mechanism 40 includes a top clamping component 41 and a bottom limiting component 42. The top clamping component 41 is arranged at the bottom of the fixing base 30, and the top clamping component 41 clamps the PCB board 60 at the top. The top clamping component 41 includes a baffle 411, a fixing plate 412, an electric push rod 413, and a clamping plate 414. A plurality of baffles 411 are arranged at the bottom of the fixing base 30, and a plurality of baffles 411 are arranged in parallel at an equal distance at the bottom of the fixing base 30. The fixing plate 412 is arranged on one side of the baffle 411, and the PCB board 60 is arranged between the baffle 411 and the fixing plate 412. The electric push rod 413 is arranged on the fixing plate 412. The electric push rod 413 is fixed to the fixing base 30 through a connecting piece, and the electric push rod 413 is fixed to the fixing base 30 through a connecting piece. One end of the push rod 413 extends between the baffle 411 and the fixed plate 412, and the clamping plate 414 is fixedly arranged at one end of the electric push rod 413 extending between the baffle 411 and the fixed plate 412. The clamping plate 414 is in contact with the PCB board 60. The electric push rod 413 is waterproof, so that the electric push rod 413 will not be damaged by the electrolyte. The electric push rod 413 drives the clamping plate 414 to move between the baffle 411 and the fixed plate 412, so that the movement of the clamping plate 414 can drive the PCB board 60 to contact the baffle 411, so that the PCB board 60 is clamped between the clamping plate 414 and the baffle 411, so that the PCB board 60 can move with the gantry 20 to complete the copper electroplating and subsequent processing.

[0020] Please refer to Figure 1 、 Figure 2 and Figure 3 The bottom limit assembly 42 is arranged at the bottom of the PCB board 60. The bottom limit assembly 42 includes a connecting rod 421, a base 422, and a support plate 423. The two connecting rods 421 are symmetrically arranged at the bottom of the fixing base 30. The base 422 is fixedly arranged at the bottom of the two connecting rods 421. The two support plates 423 are symmetrically arranged in the middle of the top of the base 422, and the PCB board 60 is arranged between the two support plates 423. The base 422 is fixed to the bottom of the fixing base 30 through the connecting rod 421. An electric telescopic rod is provided on the top of the connecting rod 421, so that the connecting rod 421 can drive the base 422 to move up and down, making it convenient to place the PCB board 60 on the top of the base 422 , and can also adapt to PCB boards 60 of different sizes. The base 422 supports the bottom of the PCB board 60, and a symmetrically arranged support plate 423 supports both sides of the bottom of the PCB board 60. After the clamping plate 414 and the baffle 411 clamp the PCB board 60, the support plate 423 can prevent the bottom of the PCB board 60 from shaking at will, thereby reducing the uneven electroplating caused by shaking. During electroplating, after the clamping plate 414 is separated from the PCB board 60, the base 422 and the support plate 423 can support the PCB board 60, thereby reducing the contact area between the PCB board 60 and the outside world, allowing the electrolyte to flow smoothly into the clamping position, making the electroplating more uniform.

[0021] This application can explain its functional principles through the following operation methods:

[0022] During use, the non-circuit part of the PCB board 60 is covered with a dry film, and the electric telescopic rod on the top of the connecting rod 421 is started, so that the connecting rod 421 can be moved downward, so that PCB boards 60 of different sizes can be placed on the base 422. Two support plates 423 are set on both sides of the PCB board 60. Then the electric telescopic rod is retracted, driving the bottom of the PCB board 60 to extend between the baffle 411 and the clamping plate 414. The electric push rod 413 on the fixing plate 412 is started, and the electric push rod 413 drives the clamping plate 414 to move toward the PCB board 60, so that the clamping plate 414 and the baffle 411 clamp and fix the top of the PCB board 60. After degreasing and water washing operations on the PCB board 60, the gantry 20 drives the fixing seat 30 and the PCB board 60 to move into the electroplating tank 10.

[0023] The driving motor 53 and the heater inside the electroplating tank 10 are started, so that the heater heats the electrolyte. The output shaft of the driving motor 53 drives the stirring shaft 51 and the stirring blade 52 to rotate, stirring the electrolyte and improving the fluidity of the electrolyte. When the PCB board 60 is electroplated, the electric push rod 413 can be started, so that the electric push rod 413 drives the clamping plate 414 to separate from the top of the PCB board 60. The base 422 and the support plates 423 on both sides support the bottom of the PCB board 60. The baffle 411 and the clamping plate 414 limits the top of the PCB board 60, allowing the electrolyte to enter the clamped position on the top of the PCB board 60, reducing the contact area between the PCB board 60 and the outside world, making the electroplating more uniform. When the gantry 20 drives the PCB board 60 to move, the electric push rod 413 drives the clamping plate 414 to clamp the top of the PCB board 60, and the two support plates 423 on the top of the base 422 limit the two sides of the bottom of the PCB board 60 to prevent the support plates 423 from shaking, thereby achieving a better electroplating effect.

[0024] Obviously, those skilled in the art may make various changes and modifications to this application without departing from the spirit and scope of this application. Thus, if these modifications and variations of this application fall within the scope of the claims of this application and their equivalents, this application is intended to include these modifications and variations.

[0025] The above is only a preferred specific implementation method of the embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes based on the technical solution and concept of the present application within the technical scope disclosed in the present application, and they should be covered by the scope of protection of the present application.

Claims

1. A PCB local copper thickening electroplating device, comprising an electroplating pool (10), wherein a gantry (20) is provided on the top of the electroplating pool (10), characterized in that: A fixing seat (30) is provided at the bottom of the gantry (20), a PCB board (60) is provided at the bottom of the fixing seat (30), and a clamping and fixing mechanism (40) is provided at the bottom of the fixing seat (30), and the clamping and fixing mechanism (40) comprises: A top clamping component (41) is arranged at the bottom of the fixing seat (30), and the top clamping component (41) clamps the PCB board (60) at the top; A bottom limiting component (42) is arranged at the bottom of the PCB board (60); The bottom limiting assembly (42) comprises: Two connecting rods (421) are symmetrically arranged at the bottom of the fixing seat (30); A base (422) is fixedly arranged at the bottom of the two connecting rods (421); Two support plates (423) are symmetrically arranged at the middle of the top of the base (422), and the PCB board (60) is arranged between the two support plates (423).

2. The electroplating device for locally thickening copper on a PCB as claimed in claim 1, characterized in that: The top clamping assembly (41) comprises: A plurality of baffles (411) are arranged at the bottom of the fixing seat (30), and the plurality of baffles (411) are arranged in parallel at equal distances at the bottom of the fixing seat (30); The fixing plate (412) is arranged on one side of the baffle (411), and the PCB board (60) is arranged between the baffle (411) and the fixing plate (412).

3. The electroplating device for locally thickening copper on a PCB as claimed in claim 2, characterized in that: An electric push rod (413) is provided on the fixed plate (412), and the electric push rod (413) extends into a clamping plate (414) fixedly provided between the baffle (411) and the fixed plate (412), and the clamping plate (414) is in contact with and connected to the PCB board (60).

4. The electroplating device for locally thickening copper on a PCB as claimed in claim 1, characterized in that: A stirring assembly (50) is provided at the bottom of the electroplating tank (10), and the stirring assembly (50) comprises: A stirring shaft (51) is rotatably connected to the bottom of the clamping and fixing mechanism (40); A stirring blade (52) is arranged on the outside of the stirring shaft (51); The driving motor (53) is fixedly mounted on the bottom of the clamping and fixing mechanism (40), and the output shaft of the driving motor (53) is fixedly connected to the stirring shaft (51).

5. The electroplating device for locally thickening copper on a PCB as claimed in claim 1, characterized in that: A heater is provided inside the electroplating tank (10).

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