Bolt surface electroplating coating processing device

Abstract

The utility model relates to a bolt surface electroplating coating processing device, which comprises a device body, the device body comprises an electroplating pool, an electroplating frame for placing a bolt and an air lifting part for lifting the electroplating frame, the upper half part of one side of the electroplating pool is provided with a placing plate, the placing plate is arranged in an inclined manner, and the air lifting part is used for lifting the electroplating frame. The electroplating frame is placed on the placing plate; the upper edge of one side of the lowest part of the placing plate is overlapped with the upper edge of one side of the electroplating tank; a plurality of supporting plates are arranged on one side of the electroplating pool, and the other ends of the supporting plates are connected with the bottom of the containing plate. The utility model relates to the technical field of electroplating processing equipment. The electroplating device has the effects that liquid resource waste is avoided, the time for single electroplating operation is shortened, and the working efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of electroplating processing equipment, in particular to a bolt surface electroplating coating processing device. Background Art

[0002] Bolt electroplating refers to the surface treatment of combined screws, which is the process of forming a covering layer on the surface of the workpiece through a certain method. Its purpose is to give the product surface an aesthetic and corrosion-resistant effect.

[0003] Currently, a practical overhead lifting device is used to place the electroplating frame filled with bolts in the electroplating tank. After the electroplating operation is completed, the electroplating frame is lifted and placed in a safe area before another electroplating frame is lifted.

[0004] In the actual process, after a plating frame is lifted from the plating tank, the overhead crane equipment stops moving temporarily, and the plating frame is kept stationary above the plating tank for a period of time, waiting for the liquid in the plating frame to fall into the plating tank. Although this operation method avoids the waste of liquid resources, it increases the time of each plating operation and reduces work efficiency. Utility Model Content

[0005] In view of the shortcomings of the existing technology, the purpose of the utility model is to provide a bolt surface electroplating coating processing device, which avoids the waste of liquid resources while reducing the time used for a single electroplating operation and improving work efficiency.

[0006] The above technical objectives of the present invention are achieved through the following technical solutions:

[0007] A bolt surface electroplating coating processing device includes a device body, the device body includes an electroplating tank, an electroplating frame for placing bolts, and a crane for lifting the electroplating frame. A placement plate is provided on the upper half of one side of the electroplating tank. The placement plate is arranged obliquely, and the electroplating frame is placed on the placement plate.

[0008] The upper edge of the lowest part of the placement plate coincides with the upper edge of the electroplating pool;

[0009] A plurality of support plates are provided on one side of the electroplating pool, and the other ends of the plurality of support plates are connected to the bottom of the placement plate.

[0010] In a preferred example, the present invention can be further configured as follows: a blocking plate is provided on the top of the placement plate near the electroplating tank;

[0011] A rubber layer is provided on a side of the blocking plate away from the electroplating tank.

[0012] In a preferred example, the present invention can be further configured as follows: a first placement groove is provided on the top of the placement plate, and the first placement groove passes through the placement plate at one end close to the electroplating tank;

[0013] The bottom of the first placement groove is uniformly provided with a plurality of first through holes along its length direction;

[0014] A second placement groove is provided on one side of the placement plate close to the electroplating tank, and the interiors of a plurality of the first through holes are connected to the interiors of the second placement groove;

[0015] A second through hole is opened on the upper half of one side of the electroplating pool. The position of the second through hole corresponds to the position of the second placement slot, and the interior of the second through hole is connected to the interior of the second placement slot.

[0016] In a preferred example, the present invention can be further configured as follows: a third through hole is further opened on the top of the placement plate, the interior of the third through hole is connected to the interiors of several of the first through holes, and the interior of the third through hole is connected to the interior of the second placement slot;

[0017] The blocking plate is located between the electroplating tank and the third through hole;

[0018] The third through hole is located between the blocking plate and the first through hole.

[0019] In a preferred example, the present invention can be further configured as follows: a plurality of support rods are provided in the second placement slot;

[0020] Two ends of each support rod are respectively fixed to the bottom and top of the inner wall of the second placement groove.

[0021] In summary, the present invention has at least one of the following beneficial technical effects:

[0022] 1. A placement plate is set on the upper half of one side of the electroplating tank. The placement plate is set at an angle. The electroplating frame is placed on the placement plate, and the electroplating frame also presents an inclined posture. The liquid in the electroplating frame flows along the placement plate into the electroplating tank, avoiding waste of liquid resources while reducing the time used for a single electroplating operation and improving work efficiency.

[0023] 2. By setting a first placement groove on the top of the placement plate, the electroplating frame is placed in the first placement, which not only prevents the electroplating frame from losing contact with the placement plate, but also ensures that the liquid flowing out of the electroplating frame is always located on the placement plate, further preventing liquid resources from flowing to the ground and avoiding waste of liquid resources.

[0024] 3. A blocking plate is provided to prevent the electroplating frame from sliding into the electroplating tank. A rubber layer is provided on one side of the blocking plate to prevent the blocking plate from directly contacting the electroplating frame, thereby increasing the service life of the blocking plate.

[0025] 4. By arranging a plurality of support rods in the second placement groove, the surface pressure of the placement plate is relieved by the support rods, thereby further improving the service life of the placement plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is a schematic diagram of the main structure of this embodiment;

[0027] Figure 2 yes Figure 1 Schematic diagram of the structure of the center placement plate from top view;

[0028] Figure 3 yes Figure 1 Schematic diagram of the main half-section structure of the placement plate and part of the electroplating tank.

[0029] In the figure, 1. device body; 11. electroplating tank; 12. electroplating frame; 2. placement plate; 21. support plate; 3. blocking plate; 31. rubber layer; 4. first placement groove; 41. first through hole; 42. second placement groove; 43. second through hole; 5. third through hole; 6. support rod. DETAILED DESCRIPTION

[0030] The present invention will be described in further detail below with reference to the accompanying drawings.

[0031] Example:

[0032] Reference Figure 1-Figure 3 As shown, the present invention discloses a bolt surface electroplating coating processing device, comprising a device body 1. The device body 1 comprises an electroplating tank 11, an electroplating frame 12 for placing bolts, and a crane for lifting the electroplating frame 12.

[0033] A support plate 2 is positioned on the upper half of one side of the electroplating tank 11. The support plate 2 is tilted. A plating frame 12 is placed on the support plate 2. The upper edge of the lowest point of the support plate 2 coincides with the upper edge of the electroplating tank 11. The plating frame 12 rests on the support plate 2, and the liquid within the plating frame 12 flows into the electroplating tank 11 along the tilt of the support plate 2. The width of the support plate 2 is equal to the width of the electroplating tank 11.

[0034] A plurality of support plates 21 are provided on one side of the electroplating pool 11 , and the other ends of the plurality of support plates 21 are connected to the bottom of the placement plate 2 .

[0035] A first placement slot 4 is formed on the top of the placement plate 2, and the end of the first placement slot 4 near the electroplating tank 11 passes through the placement plate 2. The electroplating frame 12 is placed in the first placement slot 4 to prevent the electroplating frame 12 from losing contact with the placement plate 2 when it is affected by external forces.

[0036] The second placing groove 42 is arranged on the side of the placing plate 2 close to the electroplating tank 11, and the first through holes 41 are evenly arranged on the bottom of the first placing groove 4 along the length direction of the first placing groove 4. The first through holes 41 are in communication with the second placing groove 42. The second through hole 43 is arranged on the upper half of the side of the electroplating tank 11, and the position of the second through hole 43 corresponds to the position of the second placing groove 42. The second through hole 43 is in communication with the second placing groove 42. The second placing groove 42 is arranged along the length direction of the placing plate 2.

[0037] The liquid in the electroplating frame 12 flows into the second placing groove 42 through the first through holes 41, and then flows into the electroplating tank 11 along the inclined direction of the second placing groove 42.

[0038] The blocking plate 3 is arranged on the inner wall of the first placing groove 4. The two ends of the blocking plate 3 are fixed to the corresponding sides of the inner wall of the first placing groove 4. The rubber layer 31 is arranged on the side of the blocking plate 3 away from the electroplating tank 11.

[0039] The blocking plate 3 is located between the first through holes 41 and the electroplating tank 11.

[0040] The third through hole 5 is arranged on the top of the placing plate 2, and the third through hole 5 is in communication with the first through holes 41 and the second placing groove 42. The inner wall of the third through hole 5 is coplanar with the inner wall of the blocking plate 3.

[0041] The blocking plate 3 is located between the electroplating tank 11 and the third through hole 5. The third through hole 5 is located between the blocking plate 3 and the first through holes 41.

[0042] The second placing groove 42 is arranged on the side of the placing plate 2 close to the electroplating tank 11, and the first through holes 41 are evenly arranged on the bottom of the first placing groove 4 along the length direction of the first placing groove 4. The first through holes 41 are in communication with the second placing groove 42. The second through hole 43 is arranged on the upper half of the side of the electroplating tank 11, and the position of the second through hole 43 corresponds to the position of the second placing groove 42. The second through hole 43 is in communication with the second placing groove 42. The second placing groove 42 is arranged along the length direction of the placing plate 2.

[0043] The implementation principle of the above embodiment is as follows:

[0044] After the electroplating of the bolt is completed, the operator uses the crane to lift the electroplating frame 12 in the electroplating tank 11 and places it on the placing plate 2. After the placing frame is separated from the crane, the crane lifts another electroplating frame 12 and places it in the electroplating tank 11.

[0045] Since the placing plate 2 is in an inclined state, the electroplating frame 12 placed on the placing plate 2 is also in an inclined state.

[0046] The residual liquid flows out of the electroplating frame 12, and most of the liquid directly flows into the second placing groove 42 through the first through holes 41, and then flows into the electroplating tank 11 along the inclined direction of the second placing groove 42.

[0047] A very small portion of the liquid flows along the first placement tank 4 to the third through hole 5 , flows from the third through hole 5 into the second placement tank 42 , and finally flows into the electroplating pool 11 .

[0048] The embodiments of this specific implementation method are all preferred embodiments of the present utility model, and are not intended to limit the scope of protection of the present utility model. Therefore, any equivalent changes made based on the structure, shape, and principle of the present utility model should be included in the scope of protection of the present utility model.

Claims

1. A bolt surface electroplating coating processing device, comprising a device body (1), wherein the device body (1) comprises an electroplating pool (11), an electroplating frame (12) for placing bolts, and a crane for lifting the electroplating frame (12), characterized in that: A placement plate (2) is provided on the upper half of one side of the electroplating pool (11), the placement plate (2) is arranged at an angle, and the electroplating frame (12) is placed on the placement plate (2); The upper edge of the lowest part of the placement plate (2) coincides with the upper edge of the electroplating pool (11); A plurality of support plates (21) are provided on one side of the electroplating pool (11), and the other ends of the plurality of support plates (21) are connected to the bottom of the placement plate (2).

2. The bolt surface electroplating coating processing device according to claim 1, characterized in that: A blocking plate (3) is provided on the top of the placement plate (2) near the electroplating pool (11); A rubber layer (31) is provided on the side of the blocking plate (3) away from the electroplating tank (11).

3. The bolt surface electroplating coating processing device according to claim 2, characterized in that: A first placement groove (4) is provided on the top of the placement plate (2), and one end of the first placement groove (4) close to the electroplating pool (11) passes through the placement plate (2); The bottom of the first placement groove (4) is uniformly provided with a plurality of first through holes (41) along its length direction; A second placement groove (42) is provided on one side of the placement plate (2) close to the electroplating pool (11), and the interiors of a plurality of the first through holes (41) are connected to the interiors of the second placement groove (42); A second through hole (43) is provided on the upper half of one side of the electroplating pool (11), the position of the second through hole (43) corresponds to the position of the second placement groove (42), and the interior of the second through hole (43) is connected to the interior of the second placement groove (42).

4. The bolt surface electroplating coating processing device according to claim 3, characterized in that: A third through hole (5) is further provided on the top of the placement plate (2), the interior of the third through hole (5) being connected to the interiors of several of the first through holes (41), and the interior of the third through hole (5) being connected to the interior of the second placement groove (42); The blocking plate (3) is located between the electroplating pool (11) and the third through hole (5); The third through hole (5) is located between the blocking plate (3) and the first through hole (41).

5. The bolt surface electroplating coating processing device according to claim 4, characterized in that: A plurality of support rods (6) are provided in the second placement groove (42); The two ends of each support rod (6) are respectively fixed to the bottom and top of the inner wall of the second placement groove (42).

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