Hard board connected temperature and pressure sensor

Abstract

The utility model discloses a temperature and pressure sensor connected by a hard board, which relates to the technical field of sensors and comprises a shell base, a thermistor, a ceramic capacitor, a PCBA (printed circuit board assembly) control board and a connecting plug. Wherein the end face of the other end of the shell base is provided with a drainage through hole and a probe, the probe is arranged close to the periphery of the shell base, and a lead groove is formed in the edge of the ceramic capacitor, so that a lead of a thermistor mounted in the probe can pass through the lead groove in a straight line; according to the utility model, the lead wire penetrates through the lead wire groove of the ceramic capacitor and is directly welded with the PCBA control panel, so that the materials of a plurality of sub-parts and a sealing ring and the procedure of bending a flat cable which needs a thermistor originally are omitted, and an FPC (Flexible Printed Circuit Board) used by the thermistor originally is replaced by the PCBA, so that the temperature and pressure integrated structure is simplified, and the manufacture procedure and the assembly process are reduced; the problems that an existing temperature and pressure sensor is complex in temperature and pressure integrated structure, complex in manufacturing procedure and tedious in assembly technology are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of sensors, in particular to a temperature and pressure sensor connected with a hard board. Background Art

[0002] The temperature and pressure sensor is an integrated comprehensive sensor that integrates temperature detection and pressure detection. The product is mainly used in automotive air conditioning and energy storage refrigeration industries, and is widely used in the new energy industry. With the improvement and maturity of technology, the temperature and pressure sensor is gradually developing towards miniaturization and micro-miniaturization. It is still composed of a control circuit board, a ceramic pressure capacitor sensor and a temperature sensor.

[0003] But with the latest existing technology:

[0004] For example, in patent CN201810575009.3, the NTC (thermistor temperature sensor) is connected to the FPC (flexible circuit board) through a flexible cable. During assembly, the flexible cable needs to be bent and bypassed around the edge of the ceramic capacitor before connecting to the FPC. Therefore, there are more matching sub-parts, the structure is more complex, and the process cost is higher. In addition, the assembly process of the FPC is complicated, which further increases the assembly cost.

[0005] For example, in patent EP2749855A2, the sensor assembly has a protective cover formed by plastic injection molding, which is used to install the sensor assembly and expose it to the medium measured by the sensor. This makes the installation size of the sensor assembly larger and limits its application occasions.

[0006] For example, in patent US7762140B2, the ceramic capacitor core adopts a printed circuit method, the temperature probe is injection-molded in the plastic part, and the temperature signal is contacted with the circuit of the ceramic capacitor core through a spring. However, the coupling link of this solution is not reliable, and the printed circuit of the ceramic capacitor core is easily worn out in vibration environments, resulting in poor signal contact.

[0007] In summary, it is found that the existing technology has at least the following technical problems:

[0008] Existing temperature and pressure sensors have the problems of relatively complex temperature and pressure integrated structures, complicated manufacturing processes and cumbersome assembly techniques. Utility Model Content

[0009] The purpose of the utility model is to provide a temperature and pressure sensor with a hard board connection to solve the problems of the existing temperature and pressure sensors, such as the complex temperature and pressure integrated structure, the complicated manufacturing process and the cumbersome assembly process.

[0010] The various technical effects that can be produced by the preferred technical solution among the various technical solutions provided by the present invention are described in detail below.

[0011] In order to solve the above technical problems, the present invention provides the following technical solutions:

[0012] The utility model provides a temperature and pressure sensor with hard board connection, comprising a housing base, a thermistor, a ceramic capacitor, a PCBA control board and a plug connector; one end of the housing base is provided with a receiving cavity for housing the thermistor, the ceramic capacitor and the PCBA control board; the plug connector is stacked on the PCBA control board and is engaged with the side card slot of the ceramic capacitor, and the PCBA control board is electrically connected to the conductive element in the plug connector; a drainage hole and a probe are provided on the end surface of the other end of the housing base, the drainage hole is arranged with respect to the axis of the housing base, and the probe is arranged adjacent to the outer periphery of the housing base; The reaction diaphragm of the ceramic capacitor is installed toward the bottom surface of the accommodating cavity, and an inner sealing ring is installed between the reaction diaphragm and the bottom surface of the accommodating cavity, and the inner sealing ring surrounds the drainage hole; the ceramic capacitor is used to measure the pressure of the medium introduced by the drainage hole; the PCBA control board is stacked on the ceramic base of the ceramic capacitor, and the ceramic capacitor is electrically connected to the PCBA control board; the edge of the ceramic capacitor is provided with a lead groove; the thermistor is installed in the cavity of the probe, and is used to detect the temperature of the medium to be measured; the wire of the thermistor passes through the lead groove and is electrically connected to the PCBA control board.

[0013] In one embodiment, the housing base is a metal component; the PCBA control board is provided with a grounding contact, and when installed in the accommodating cavity, the grounding contact naturally bends upward, and the plug connector is inserted and squeezes the grounding contact against the inner wall of the accommodating cavity, so that the grounding contact is grounded to the housing base.

[0014] In one embodiment, the ground contact is a PCB flexible spring.

[0015] In one embodiment, a plurality of contact springs are installed in the plug connector; a plurality of fixing through holes are provided in the plug connector; one end of the plurality of contact springs is electrically connected to the contacts of the PCBA control board, and the other end of the plurality of contact springs extends outward through the fixing through holes for electrically connecting with external electronic components to transmit electrical signals.

[0016] In one embodiment, a buckle is provided on the end surface of the plug connector facing the accommodating cavity, and the buckle is clamped and fastened with the side slot of the ceramic capacitor through interference.

[0017] In one embodiment, there is a gap between the reaction diaphragm and the bottom surface of the accommodating cavity, and a medium retention cavity is formed under the sealing enclosure of the inner sealing ring; the medium retention cavity is used to accommodate the introduced medium whose pressure is to be measured by the ceramic capacitor.

[0018] In one embodiment, the drainage hole is provided with a chamfer on one side edge of the medium retention cavity; the chamfer and the drainage hole form a funnel-shaped structure for forming a buffer zone to gradually increase the introduced medium and expand the surface area.

[0019] In one embodiment, the pins on the back of the ceramic base of the ceramic capacitor are inserted into the pin holder or pinhole of the PCBA control board and welded to form an electrical connection; the PCBA control board is provided with a flange plate, the flange plate is provided with a lead coupling hole, and the flange plate covers the lead groove; the wire of the thermistor is inserted into the lead coupling hole and welded to form an electrical connection.

[0020] In one embodiment, the probe is filled with thermal grease, which wraps the thermistor. The thermal grease is used to transfer heat from the probe to the thermistor.

[0021] In one embodiment, the outer sealing ring is provided on the end face of the housing base on which the probe is provided, and the outer sealing ring surrounds the probe and the drainage hole; the outer sealing ring is installed in the sealing groove of the docking interface to be docked, and abuts against the end face of the housing base to form a sealed installation.

[0022] The beneficial effects of the utility model are as follows:

[0023] 1. The probe is placed near the outer periphery of the housing base, and a lead groove is provided on the edge of the ceramic capacitor. This allows the wire of the thermistor installed in the probe to pass through the lead groove of the ceramic capacitor in a straight line and be electrically connected to the PCBA control board, eliminating the need to bend the thermistor wire at the axis of the housing base. As a result, the FPC (flexible circuit board) originally used for the thermistor can be replaced with a PCBA (rigid board), facilitating direct welding of the thermistor wire to the corresponding wire hole of the PCBA control board, which is conducive to the automated assembly of the thermistor.

[0024] 2. The lead groove designed on the edge of the ceramic capacitor can avoid the air path of the thermistor wire, simplify the matching structure of the thermistor and ceramic capacitor, reduce the number of sub-parts, and at least eliminate one mid-plate component or disc component and redundant sealing ring, saving material costs.

[0025] 3. The use of PCBA (hard board) control board has lower material cost than the FPC (flexible circuit board) used in the original design.

[0026] In summary, by streamlining the connection structure between the thermistor and the PCBA control board, the number of sub-components in the temperature and pressure sensor can be reduced, the integrated structure of temperature and pressure can be simplified, thereby reducing the volume of the temperature and pressure sensor, realizing the miniaturization of the sensor, and simplifying the process and assembly process. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solution of the present invention, the following is a brief introduction to the drawings required for use in the implementation. Obviously, the drawings described below are only some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0028] Figure 1 This is a schematic diagram of the axonometric structure of the temperature and pressure sensor of the utility model;

[0029] Figure 2 This is a schematic diagram of the cross-sectional structure of the temperature and pressure sensor of the utility model;

[0030] Figure 3 This is an assembly diagram showing the thermistor, ceramic capacitor, PCBA control board and probe of the utility model;

[0031] Figure 4 It is an assembly diagram of some components of the temperature and pressure sensor of the utility model.

[0032] The accompanying drawings are numerals as follows:

[0033] 1. Shell base; 11. Accommodation cavity; 111. Inner sealing groove; 12. Drainage hole; 121. Chamfer;

[0034] 2. Thermistor;

[0035] 3. Ceramic capacitor; 31. Ceramic base; 32. Reaction diaphragm; 33. Side slot; 34. Lead groove;

[0036] 4. PCBA control board; 41. Ground contact; 42. Flange plate;

[0037] 5. Plug connector; 51. Fixing hole; 52. Buckle;

[0038] 6. Probe;

[0039] 71. Inner sealing ring; 72. Outer sealing ring;

[0040] 8. Contact spring;

[0041] 9. Medium retention cavity. DETAILED DESCRIPTION

[0042] The technical solutions in the embodiments of the present invention will be described clearly and completely below with reference to the accompanying drawings in the embodiments of the present invention.

[0043] In a specific embodiment, a temperature and pressure sensor with a hard board connection is provided. By placing a probe near the outer periphery of a housing base and providing a lead groove on the edge of a ceramic capacitor, the wire of a thermistor installed in the probe can pass through the lead groove of the ceramic capacitor in a straight line and be directly soldered to the PCBA control board. The FPC originally used for the thermistor is replaced with a PCBA. The materials of multiple sub-components and sealing rings, as well as the process of bending the thermistor wiring, are eliminated, thereby simplifying the integrated structure of temperature and pressure and reducing the process and assembly technology. The problem of existing temperature and pressure sensors having a relatively complex integrated structure of temperature and pressure, and a complex process and cumbersome assembly technology is effectively solved.

[0044] In addition, all the contents of the configurations shown in the following embodiments are not necessarily essential as the solutions of the utility model described in the claims.

[0045] The first embodiment of the temperature and pressure sensor is as follows Figures 1 to 4 As shown, it includes a housing base 1, a thermistor 2, a ceramic capacitor 3, a PCBA control board 4 and a plug connector 5; one end of the housing base 1 is provided with a receiving cavity 11 for loading the thermistor 2, the ceramic capacitor 3 and the PCBA control board 4; the plug connector 5 is stacked on the PCBA control board 4 and is engaged with the side card slot 33 of the ceramic capacitor 3, and the PCBA control board 4 is electrically connected to the conductive element in the plug connector 5; a drainage hole 12 and a probe 6 are provided on the end surface of the other end of the housing base 1, the drainage hole 12 is arranged with the axis of the housing base 1, and the probe 6 is arranged near the outer periphery of the housing base 1; the reaction of the ceramic capacitor 3 The diaphragm 32 is installed toward the bottom surface of the accommodating cavity 11. An inner sealing ring 71 is installed between the reaction diaphragm 32 and the bottom surface of the accommodating cavity 11, and the inner sealing ring 71 surrounds the drainage hole 12; the ceramic capacitor 3 is used to measure the pressure of the medium introduced by the drainage hole 12; the PCBA control board 4 is stacked on the ceramic base 31 of the ceramic capacitor 3, and the ceramic capacitor 3 is electrically connected to the PCBA control board 4; the edge of the ceramic capacitor 3 is provided with a lead groove 34; the thermistor 2 is installed in the cavity of the probe 6 for detecting the temperature of the medium to be measured; the wire of the thermistor 2 passes through the lead groove 34 and is electrically connected to the PCBA control board 4.

[0046] By designing the lead groove 34 on the ceramic capacitor 3, the position of the probe 6, and the application of the PCBA control board 4, it is possible to achieve the following: (1) the probe 6 is arranged near the periphery of the housing base 1, and the lead groove 34 is provided on the edge of the ceramic capacitor 3, so that the wire of the thermistor 2 installed in the probe 6 can pass through the lead groove 34 of the ceramic capacitor 3 in a straight line and be electrically connected to the PCBA control board 4, eliminating the need to bend the wire of the thermistor 2 located at the axis of the housing base 1; thereby, the FPC (flexible circuit board) originally used for the thermistor 2 can be replaced with a PCBA (hard board), which facilitates the direct welding connection of the wire of the thermistor 2 with the corresponding wire hole of the PCBA control board 4, and is conducive to the realization of the automated assembly of the thermistor 2.

[0047] (2) The lead groove 34 designed on the edge of the ceramic capacitor 3 realizes the avoidance of the wire path of the thermistor 2, simplifies the matching structure of the thermistor 2 and the ceramic capacitor 3, reduces the number of sub-components, and at least eliminates one mid-plate component or disc component and redundant sealing ring, saving material costs.

[0048] (3) The use of PCBA (hard board) control board has lower material cost than the FPC (flexible circuit board) used in the original design.

[0049] In summary, by streamlining the connection structure between the thermistor 2 and the PCBA control board 4, the number of sub-components in the temperature and pressure sensor can be reduced, the integrated structure of temperature and pressure can be simplified, thereby reducing the volume of the temperature and pressure sensor, realizing the miniaturization of the sensor, and simplifying the process and assembly process.

[0050] As an optional implementation method,

[0051] Regarding the specific structure of the housing base 1 and the matching of the plug connector 5, this embodiment is as follows: Figure 3 and Figure 4 As shown, the housing base 1 is a metal component; the PCBA control board 4 is provided with a grounding contact 41. When installed in the accommodating cavity 11, the grounding contact 41 naturally bends upward. The plug connector 5 is inserted and presses the grounding contact 41 against the inner wall of the accommodating cavity 11, so that the grounding contact 41 is grounded to the housing base 1.

[0052] Specifically, the ground contact piece 41 is a PCB flexible spring piece.

[0053] Regarding the specific structure of the above-mentioned plug connector 5 being electrically connected to the PCBA control board 4 to transmit the electrical signal to the external electronic components, this embodiment is as follows. Figures 2 to 4As shown, multiple contact springs 8 are installed in the plug connector 5; multiple fixing through holes 51 are provided in the plug connector 5; one end of the multiple contact springs 8 is electrically connected to the contacts of the PCBA control board 4, and the other end of the multiple contact springs 8 extends outward through the fixing through holes 51 for electrically connecting with external electronic components to transmit electrical signals.

[0054] The PCBA (hard board) control board can be designed with a wire contact on the end face of the ceramic base 31 facing away from the ceramic capacitor 3. By using the cooperation of the contact spring 8 and the plug connector 5, the contact spring 8 can be directly connected to the conductive contact on the PCBA control board 4, reducing the welding process.

[0055] Regarding the assembly structure of the plug connector 5 and the ceramic capacitor 3, this embodiment is as follows: Figure 3 and Figure 4 As shown, a buckle 52 is provided on the end surface of the plug connector 5 facing the accommodating cavity 11 , and the buckle 52 is clamped and fastened with the side slot 33 of the ceramic capacitor 3 by interference.

[0056] There is a channel structure for the ceramic capacitor 3 to sense pressure. Figure 2 As shown, there is a gap between the reaction diaphragm 32 and the bottom surface of the accommodating cavity 11, and a medium storage cavity 9 is formed under the sealing enclosure of the inner sealing ring 71; the medium storage cavity 9 is used to accommodate the medium introduced to be measured by the ceramic capacitor 3.

[0057] An inner sealing groove 111 is provided on the bottom surface of the housing cavity 11 of the housing base. The inner sealing groove 111 surrounds the drainage hole 12. The inner sealing ring 71 is installed in the inner sealing groove 111. The ceramic capacitor 3 is installed. The inner sealing ring 71 abuts the reaction diaphragm 32 of the ceramic capacitor 3 and the inner sealing groove 111 to form a sealed contact, thereby sealing the medium to be measured pressure flowing into the drainage hole 12 within the medium retention cavity 9. This prevents the medium from leaking into the thermistor 2 or the PCBA control board 4, avoids causing a short circuit in the temperature and pressure sensor circuit, and improves the reliability of the temperature and pressure sensor.

[0058] During use, an air-avoiding groove is provided on the bottom surface of the accommodating cavity 11 of the housing base 1 to prevent the reaction diaphragm 32 of the ceramic capacitor 3 from being crushed.

[0059] Furthermore, the drainage hole 12 is provided with a chamfer 121 on one side edge of the medium storage cavity 9; the chamfer 121 and the drainage hole 12 form a funnel-shaped structure for forming a buffer zone to gradually increase the introduced medium and gradually expand the surface area.

[0060] Regarding the electrical connection assembly of the ceramic capacitor 3, thermistor 2 and PCBA control board 4, this embodiment is as follows. Figures 2 to 4As shown, the pins on the back of the ceramic base 31 of the ceramic capacitor 3 are inserted into the pin socket or pinhole of the PCBA control board 4 and welded to form an electrical connection; the PCBA control board 4 is provided with a flange plate 42, which is provided with a lead coupling hole, and the flange plate 42 covers the lead groove 34; the wires of the thermistor 2 are inserted into the lead coupling hole and welded to form an electrical connection.

[0061] In order to better transfer the heat of the medium whose temperature is being detected from the probe 6 to the thermistor 2, the probe 6 is filled with thermal grease, and the thermal grease wraps the thermistor 2. The thermal grease is used to transfer the heat from the probe 6 to the thermistor 2.

[0062] The probe 6 is made of stainless steel, and a temperature detection through hole is provided on the outer end surface of the housing base 1 , and the probe is pressed into the temperature detection through hole in an interference fit manner.

[0063] Regarding the sealing structure of the temperature and pressure sensor when in use, this embodiment is as follows: Figure 1 and Figure 2 As shown, the outer sealing ring 72 is provided on the end face of the shell base 1 on which the probe 6 is provided. The outer sealing ring 72 surrounds the probe 6 and the drainage hole 12; the outer sealing ring 72 is installed in the sealing groove of the docking interface to be docked, and abuts against the end face of the shell base 1 to form a sealed installation.

[0064] The technical features of the above embodiments may be combined arbitrarily. To simplify the description, not all possible combinations of the technical features in the above embodiments are described.

Claims

1. A temperature and pressure sensor connected to a hard board, characterized in that: Includes housing base, thermistor, ceramic capacitor, PCBA control board and plug connector; One end of the housing base is provided with a receiving cavity for housing the thermistor, the ceramic capacitor and the PCBA control board; the plug connector is stacked on the PCBA control board and engages with the side slot of the ceramic capacitor, and the PCBA control board is electrically connected to the conductive element in the plug connector; A drainage hole and a probe are provided on the end surface of the other end of the shell base, the drainage hole is arranged at the axis of the shell base, and the probe is arranged adjacent to the outer periphery of the shell base; The reaction diaphragm of the ceramic capacitor is installed toward the bottom surface of the accommodating cavity. An inner sealing ring is installed between the reaction diaphragm and the bottom surface of the accommodating cavity, and the inner sealing ring surrounds the drainage hole. The ceramic capacitor is used to measure the pressure of the medium introduced into the drainage hole. The PCBA control board is stacked on the ceramic base of the ceramic capacitor, and the ceramic capacitor is electrically connected to the PCBA control board; A lead groove is provided on the edge of the ceramic capacitor; the thermistor is installed in the cavity of the probe for detecting the temperature of the medium to be measured; the wire of the thermistor passes through the lead groove and is electrically connected to the PCBA control board.

2. The temperature and pressure sensor according to claim 1, characterized in that: The housing base is a metal component; The PCBA control board is provided with a grounding contact. When installed in the accommodating cavity, the grounding contact is naturally bent upward. The plug connector is inserted and presses the grounding contact against the inner wall of the accommodating cavity, so that the grounding contact is grounded to the housing base.

3. The temperature and pressure sensor according to claim 2, characterized in that: The grounding contact piece is a PCB flexible spring piece.

4. The temperature and pressure sensor according to claim 1, characterized in that: Multiple contact springs are installed in the plug connector; multiple fixed through holes are provided in the plug connector; one end of the multiple contact springs is electrically connected to the contacts of the PCBA control board, and the other end of the multiple contact springs extends outward through the fixed through holes, and is used to electrically connect to external electronic components to transmit electrical signals.

5. The temperature and pressure sensor according to claim 1, characterized in that: A buckle is provided on the end surface of the plug connector facing the accommodating cavity, and the buckle is clamped and fastened with the side slot of the ceramic capacitor through interference.

6. The temperature and pressure sensor according to claim 1, characterized in that: There is a gap between the reaction diaphragm and the bottom surface of the accommodating cavity, and a medium storage cavity is formed under the sealing enclosure of the inner sealing ring; the medium storage cavity is used to accommodate the introduced medium to be measured by the ceramic capacitor.

7. The temperature and pressure sensor according to claim 6, characterized in that: The drainage hole is provided with a chamfer on one side edge of the medium retention cavity; the chamfer and the drainage hole form a funnel-shaped structure for forming a buffer zone to gradually increase the introduced medium and gradually expand the surface area.

8. The temperature and pressure sensor according to claim 1, characterized in that: The pins on the back of the ceramic base of the ceramic capacitor penetrate into the pin holder or pinhole of the PCBA control board and are welded and coupled to form an electrical connection; The PCBA control board is provided with a flange plate, the flange plate is provided with a lead coupling hole, and the flange plate covers the lead groove; the wire of the thermistor is inserted into the lead coupling hole and welded to form an electrical connection.

9. The temperature and pressure sensor according to claim 1, characterized in that: The probe is filled with thermal grease, which wraps the thermistor and is used to transfer heat from the probe to the thermistor.

10. The temperature and pressure sensor according to claim 1, characterized in that: An outer sealing ring is provided on the end face of the shell base on which the probe is provided, and the outer sealing ring surrounds the probe and the drainage hole; the outer sealing ring is installed in the sealing groove of the docking interface to be docked, and abuts against the end face of the shell base to form a sealed installation.

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