Small heat dissipation and heat conduction testing mechanism
By designing a small heat dissipation and thermal conductivity testing mechanism and using a thermocouple sensing group and a vacuum generator to simulate the actual environment, the shortcomings of the heat dissipation and thermal conductivity performance testing of optical modules are solved, ensuring product quality.
Patent Information
- Application Number
- CN202422463021.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-12
- Publication Date
- 2025-10-10
- Estimated Expiration
- 2034-10-12
AI Technical Summary
The existing technology lacks effective means to test the heat dissipation and thermal conductivity of optical modules, which affects product quality assurance.
A small heat dissipation and thermal conductivity testing mechanism was designed, which includes a panel, a base, a thermocouple sensing group, a vacuum generator, and a temperature data display box. The surface temperature data of the optical module is detected by the thermocouple sensing group, and the thermal conductivity and heat dissipation effect is tested by simulating the actual usage environment.
The heat dissipation and thermal conductivity performance test of the optical module is realized, and performance data is provided to support product quality assurance.
Smart Images

Figure CN223426564U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of heat conduction and heat dissipation of electric module components, in particular to a small heat dissipation and heat conduction testing mechanism. Background Art
[0002] An optical module usually consists of a light emitting device (TOSA, including a laser), a light receiving device (ROSA, including a photodetector), functional circuits, and optical (electrical) interfaces.
[0003] In order to ensure the quality of the final product, it is necessary to conduct quality inspection on the optical module during the production process. Since the optical module will generate heat during use, it is also necessary to test its heat dissipation and thermal conductivity performance during production. Therefore, this design introduces a small heat dissipation and thermal conductivity testing mechanism. Utility Model Content
[0004] In order to overcome the above-mentioned shortcomings, the present invention aims to provide a technical solution that can solve the above-mentioned problems.
[0005] A small heat dissipation and thermal conductivity testing mechanism includes a panel, a base is provided on the panel, a protrusion is provided on the upper end of the base, a placement groove is provided on the protrusion, and the placement groove is provided with an opening along one side of the protrusion, and the opening connects the placement groove with the outside; wherein, the upper surface array of the base is provided with slots connected to the placement groove, and each slot is provided with a thermocouple sensing group; a support frame is also provided on the panel, a horizontal bar is provided on the upper end of the support frame, a vertical bar is provided at the end of the horizontal bar, a pressure block is provided at the end of the vertical bar, and the pressure block is located above the placement groove; the panel is also provided with a power box electrically connected to the thermocouple sensing group.
[0006] Furthermore, a slot is formed at the lower end of the vertical rod, a spring is provided in the slot, and a connecting shaft rod assembled with the pressing block is provided below the spring.
[0007] Furthermore, an interface is provided on the opposite wall of the protrusion and the opening, and the interface penetrates the protrusion to connect the placement groove and the outside; a vacuum generator is also provided on the panel, and the vacuum generator and the interface can be assembled to connect the air pipe.
[0008] Furthermore, a temperature data display box is provided on the panel, and the temperature data display box is electrically connected to the thermocouple sensing group.
[0009] The beneficial effect of the utility model is that it is used to test the heat dissipation and thermal conductivity performance of the optical module group to obtain the performance data of the optical module product finally produced.
[0010] Additional aspects and advantages of the present invention will be given in part in the following description and will become apparent from the following description or learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS
[0011] Figure 1It is a structural diagram of the present utility model.
[0012] Figure 2 Schematic diagram of the base structure.
[0013] Figure 3 Schematic diagram of the support frame structure.
[0014] The accompanying drawings in the figure are marked as follows: panel-1, base-2, protrusion-3, placement groove-4, opening-5, slot-6, thermocouple sensing group-7, support frame-8, horizontal bar-9, vertical bar-10, pressure block-11, power box-12, connecting shaft-13, interface-14, vacuum generator-15, temperature data display box-16. DETAILED DESCRIPTION
[0015] The following is a clear and complete description of the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only a part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0016] See also Figures 1 to 3 The utility model includes a panel 1, a base 2 is provided on the panel 11, a protrusion 3 is provided on the upper end of the base 2, a placement groove 4 is provided on the protrusion 3, and the placement groove 4 is provided with an opening 5 along one side of the protrusion 3, and the opening 5 connects the placement groove 4 with the outside; wherein, the upper surface array of the base 2 is provided with a slot 6 connected to the placement groove 4, and each slot 6 is provided with a thermocouple sensing group 7; a support frame 8 is also provided on the panel 1, and a horizontal rod 9 is provided at the upper end of the support frame 8, and a vertical rod 10 is provided at the end of the horizontal rod, and a pressure block 11 is provided at the end of the vertical rod 10, and the pressure block 11 is located above the placement groove 4; a power box 12 electrically connected to the thermocouple sensing group 7 is also provided on the panel 1.
[0017] This technology uses a panel 11 as a carrier to assemble the corresponding base 2, power box 12 and thermocouple sensing group 7 as three parts for distribution.
[0018] The function of the base 2 is to place optical module components. The specific structure of the base 2 is as follows: a protrusion 3 is provided at the upper end of the base 2, and a placement groove 4 is provided on the protrusion 3. The optical module components are placed through the placement groove 4. At the same time, a slot 6 connected to the placement groove 4 is provided on the surface array of the base 2. A thermocouple sensing group 7 is provided in each slot 6. That is, after the optical module component is placed and conducts electricity, its surface temperature data can be detected by the thermocouple sensing group 7.
[0019] In order to stabilize the placement of the optical module, a support frame 8 is further provided on the panel 1. The upper end of the support frame 8 is provided with a horizontal rod 9, and the end of the horizontal rod is provided with a vertical rod 10 along the bottom. The end of the vertical rod 10 is provided with a pressure block 11, and the pressure block 11 is located above the placement slot 4. There is a slot 6 at the lower end of the vertical rod 10, and a spring (not shown) is provided in the slot 6. The spring is provided with a connecting shaft 13 assembled with the pressure block 11 along the bottom. The connecting shaft 13 can be pulled up and down to drive the pressure block 11 so that it can press the optical module in the placement slot 4.
[0020] At the same time, in order to test the actual heat conduction and heat dissipation effect of the optical module, it is necessary to simulate the actual use environment during the test. Therefore, an opening 5 is provided along one side of the protrusion 3 in the placement groove 4, connecting the placement groove 4 with the outside. An interface 14 is provided on the wall of the protrusion 3 opposite the opening 5. The interface 14 penetrates the protrusion 3 and connects the placement groove 4 with the outside. A vacuum generator 15 is also provided on the panel 1. The vacuum generator 15 and the interface 14 can be assembled and connected to an air pipe (not shown). By activating the vacuum generator 15, airflow is provided toward the surface of the optical module placed in the placement groove 4. This simulates the heat conduction and heat dissipation effect of the optical module in the actual environment.
[0021] The panel 1 is provided with a power supply box 12 and a temperature data display box 16 to provide power and detected data.
[0022] The above description is only a preferred embodiment of the present invention and does not constitute any form of limitation to the present invention. Although the present invention is disclosed as a preferred embodiment as above, it is not intended to limit the present invention. Any technician familiar with the profession can make some changes or modifications to equivalent embodiments of the above-disclosed technical contents without departing from the scope of the technical solution of the present invention. However, any simple modifications, equivalent changes and modifications made to the above embodiments according to the technology of the present invention, which do not depart from the content of the technical solution of the present invention, are within the scope of the technical solution of the present invention.
Claims
1. Small heat dissipation and thermal conductivity testing mechanism, characterized by: comprising a panel (1), A base (2) is provided on the panel (1), a convex block (3) is provided on the upper end of the base (2), a placement groove (4) is provided on the convex block (3), an opening (5) is provided along one side of the convex block (3), and the opening (5) communicates with the placement groove (4) and the outside; The upper surface array of the base (2) is provided with slots (6) connected to the placement slots (4), and each slot (6) is provided with a thermocouple sensing group (7); A support frame (8) is further provided on the panel (1), a horizontal bar (9) is provided at the upper end of the support frame (8), a vertical bar (10) is provided along the end of the horizontal bar, a pressing block (11) is provided at the end of the vertical bar (10), and the pressing block (11) is located above the placement groove (4); The panel (1) is also provided with a power supply box (12) electrically connected to the thermocouple induction group (7).
2. The small heat dissipation and thermal conductivity testing mechanism according to claim 1, characterized in that: A slot (6) is formed at the lower end of the vertical rod (10), a spring is provided in the slot (6), and a connecting shaft (13) is provided below the spring and assembled with the pressing block (11).
3. The small heat dissipation and thermal conductivity testing mechanism according to claim 1, characterized in that: An interface (14) is provided on the wall of the protrusion (3) opposite to the opening (5), and the interface (14) penetrates the protrusion (3) to communicate with the placement groove (4) and the outside; A vacuum generator (15) is also provided on the panel (1), and the vacuum generator (15) and the interface (14) can be assembled to connect the air pipe.
4. The small heat dissipation and thermal conductivity testing mechanism according to claim 1, characterized in that: A temperature data display box (16) is also provided on the panel (1), and the temperature data display box (16) is electrically connected to the thermocouple sensing group (7).