Ion selective electrode comprising carrier plate type structure

Abstract

The utility model provides an ion selective electrode comprising a carrier plate type structure, which comprises a substrate electrode and a carrier plate structure, and the carrier plate structure can be mounted on the back surface of the substrate electrode and is attached to the back surface of the substrate electrode; a front conducting circuit (2) and an electrode loading area (1) are arranged on the front surface of the substrate electrode, a conducting hole (24) is formed in the front conducting circuit (2), and the electrode loading area (1) comprises an electrode detection layer and a hollow hole (13) penetrating through the substrate; the carrier plate structure comprises a working electrode layer (41) and a carrier plate conducting circuit (42), the carrier plate conducting circuit (42) is in contact and fit with an area, corresponding to the back surface of the substrate, of the front conducting circuit (2), and the front conducting circuit (2) and the carrier plate conducting circuit (42) are conducted and interconnected through a conducting hole (24); and the working electrode layer (41) completely covers the position of the hollow hole (13), and the working electrode layer (41) is connected and conducted with the carrier plate conducting circuit (42).

Description

Technical Field

[0001] The utility model belongs to the field of electrochemical sensors and relates to an ion selective electrode with a carrier plate structure. Background Art

[0002] Electrodes are the most important sensitive components in electrochemical sensors. Sensors generally require two or more electrodes, and three-electrode systems are currently the most widely used. These three electrodes consist of a working electrode, a reference electrode, and a counter electrode. However, the three electrodes in a traditional three-electrode system are not integrated on a single plane, and the electrodes are spaced far apart. During electrochemical testing, concentration polarization is prone to occur between the working and counter electrodes, affecting test accuracy. Furthermore, the large size of traditional three-electrode systems makes them inconvenient for the design and processing of microsensors, limiting their application.

[0003] Patent CN201920553197.X discloses a portable three-electrode structure, which specifically integrates the working electrode, counter electrode and reference electrode on the same plane, greatly reducing the size of the three electrodes and facilitating the design and processing of microsensors.

[0004] However, the working electrode modification layer of the above-mentioned electrode is fixed and cannot be replaced according to the detection target, which may cause waste during use and cause some inconvenience in the specific use of the electrode. At the same time, different modification layers are modified on the surfaces of the three electrodes on the basis of the coplanarity of the three electrodes, which also brings difficulties to the electrode repair and processing. The electrode processing cost is relatively high and there are also some inconveniences in use.

[0005] Patent CN218938192U discloses a graphene three-electrode coplanar standard electrode, which specifically involves digging a hole on the electrode substrate to form an electrode modification hole, and providing an electrode modification ring structure concentrically around the electrode modification hole on the back side. An electrode modification layer is installed at the position of the electrode modification ring. The electrode modification layer conducts electricity and transmits signals by contacting the electrode modification ring, and the electrode modification layer is fixed by glue sealing.

[0006] However, although the above-mentioned electrode proposes to separate the key working electrode modification layer and perform subsequent installation and fixation according to the requirements of the detection molecules, there are still tiny gaps in the structure installed later. When the detection liquid droplet is added to the electrode modification hole position and contacts the electrode modification layer to react, the tiny gap between the electrode modification layer and the back of the substrate causes the electrode detection area to change and cannot be fixed, which greatly affects the stability and accuracy of the detection data; in order to transmit the electrical signal generated by the electrode patch, a ring-shaped conductive structure is set in the contact area between the electrode patch and the electrode substrate, and the electrical signal is transmitted to the electrode pin by the ring structure. The effect of this ring structure in conducting electricity and transmitting signals is not good, which affects the sensitivity of the electrode; in addition, the electrode modification layer installed later is small in size and not suitable for storage and maintenance. It is inconvenient to perform manual installation operations, which is not conducive to the convenient use of the electrode.

[0007] In order to further overcome the above problems, this patent aims to provide an ion-selective electrode including a carrier structure, which can be freely assembled according to the requirements of the detection object, and the working electrode modified on the carrier structure can be independently designed, and the area of ​​the electrode detection area is fixed, so that its detection accuracy and stability can reach the performance level of a normal three-electrode coplanar electrode. While ensuring the electrode detection performance, it is more flexible, reduces processing and use costs, and opens up broader application prospects for microelectrodes. Utility Model Content

[0008] In summary, the present invention provides an ion-selective electrode including a carrier plate structure.

[0009] The utility model aims to provide an ion-selective electrode including a carrier plate structure, comprising a base electrode and a carrier plate structure, wherein the carrier plate structure can be mounted on the back of the base electrode, and the front of the carrier plate is in contact with the back of the base electrode; a front conductive circuit (2) and an electrode loading area (1) are provided on the front of the base electrode, one or more conducting holes (24) are provided on the front conductive circuit (2), and the electrode loading area (1) comprises an electrode detection layer and a hollow hole (13) penetrating the base.

[0010] The carrier structure comprises a working electrode layer (41) and a carrier conductive circuit (42); the carrier conductive circuit (42) contacts and fits with the area where the front conductive circuit (2) corresponds to the back side of the substrate; the front conductive circuit (2) and the carrier conductive circuit (42) are interconnected through the conductive hole (24); the working electrode layer (41) completely covers the position of the hollow hole (13), and the working electrode layer (41) and the carrier conductive circuit (42) are connected and conductive.

[0011] The electrode detection layer comprises a first electrode layer (11) and a second electrode layer (12) which are coplanarly arranged and not interconnected, a hollow hole (13) is provided adjacent to the first electrode layer (11) and the second electrode layer (12), and the first electrode layer (11) and the second electrode layer (12) are respectively connected to the front conductive circuit (2).

[0012] The front conductive circuit (2) includes a first circuit (21), a second circuit (22), and a third circuit (23) that are not connected to each other. The first circuit (21) is connected to the first electrode layer (11), the second circuit (22) is connected to the second electrode layer (12), and the third circuit (23) is not directly connected to the hollow hole (13). One or more conductive holes (24) are provided on the third circuit (23).

[0013] Electrode pins are also provided on the front side of the substrate, including a first pin (31), a second pin (32) and a third pin (33) that are coplanar and equidistant, and are respectively connected to the first circuit (21), the second circuit (22) and the third circuit (23).

[0014] The above three electrode pins are arranged in parallel and equidistantly according to the conventional three-electrode coplanar electrode, and the entire electrode size is set to match the USB size. The metal area size and distance of the three pins can also be adjusted as needed to facilitate the transmission of electrical signals.

[0015] As attached Figure 1 , which is a front schematic diagram of an ion selective electrode including a carrier plate structure.

[0016] The positions of the first electrode layer (11), the second electrode layer (12), and the hollow holes (13) can refer to the arrangement of three electrodes on a conventional three-electrode coplanar electrode surface, and the distance between the three electrodes is shortened as much as possible to eliminate concentration polarization and improve electrode sensitivity.

[0017] In the embodiment of the present invention, the first electrode layer (11) is partially annular, and the hollow hole (13) is arranged on the inner side of the ring, and the second electrode layer (12) is located on the other side where the ring shape is missing, wherein the first electrode layer (11) corresponds to the counter electrode, the second electrode layer (12) corresponds to the reference electrode, and the hollow hole (13) corresponds to the working electrode. Such an arrangement greatly reduces the distance between the working electrode and the counter electrode, promotes the miniaturization of the coplanar electrode and improves the sensitivity; the electrode position arrangement of the present invention can also symmetrically arrange the first electrode layer (11) and the second electrode layer (12) on both sides of the hollow hole (13), and the three-electrode position arrangement can be adjusted according to actual needs.

[0018] The hollow holes (13) may be regular shapes including circular and rectangular, and the hole area may be adjusted according to the required electrode detection area.

[0019] The conductive holes and the conductive circuits are generally decorated with a metal layer, which can conduct the conductive circuit metal layers attached to the front and back sides of the substrate. The number of conductive holes is set to one or more, usually three, to ensure that the front and back sides of the substrate are conductively connected and the electrical signal transmission is normal.

[0020] In addition, a metal conductive circuit may be provided in the area where the conductive hole (24) is located on the back of the substrate electrode, and is interconnected with the third circuit (23) through the conductive hole (24). This is to prevent the conductive circuit (42) of the carrier board installed in a laminated manner from being connected to the third circuit (23) through the conductive hole (24) and transmitting unstable signals.

[0021] A back conductive circuit (25) may also be provided on the back of the substrate electrode, a conductive hole (24) is provided in the area where the back conductive circuit (25) is located, and the area where the back conductive circuit (25) is located is in contact with and adhered to the carrier conductive circuit (42).

[0022] As attached Figure 2 FIG. 4 is a schematic diagram of the back side of an ion selective electrode including a carrier plate structure.

[0023] The conductive hole (24) of the substrate electrode passes through the front and back surfaces, and the third circuit (23) on the front surface of the substrate is connected and conducted with the back conductive circuit (25) on the back surface of the substrate through the conductive hole (24). The back conductive circuit (25) is provided to increase the contact area with the carrier conductive circuit (42) to ensure the transmission of the working electrode electrical signal.

[0024] Furthermore, the surfaces of the front conductive circuit (2), the electrode pins, the electrode detection layer and the carrier conductive circuit (42) are modified with a metal layer as a base metal, and the metal types include silver and copper.

[0025] Furthermore, a modification layer is provided on the surface of the first electrode layer (11) of the electrode detection layer, and the modification layer is made of carbon and platinum.

[0026] Furthermore, a modification layer is provided on the surface of the second electrode layer (12) of the electrode detection layer, and the modification layer includes a silver-silver chloride layer.

[0027] Furthermore, the working electrode layer (41) may be made of carbon and metals, and the metal materials include gold, silver, platinum, bismuth, chromium, copper, and nickel.

[0028] Furthermore, the surface of the working electrode layer (41) is modified with an ion selective modification layer, and the specific material of the ion selective modification layer can be arbitrarily changed according to the detection requirements, including metal film, enzyme, porous metal.

[0029] The modification layer of the working electrode layer (41) can be selected from carbon, gold, silver, platinum, bismuth, chromium, copper, etc., and different types of metal ions can be detected according to the different materials of the working electrode modification layer. A metal sheet can also be used as a substrate and a metal can be modified on its surface. A modification layer is set on the surface of the working electrode layer (41), such as an active enzyme or nanoporous gold, nanoporous silver or other ion-selective substances, which can selectively detect specific biochemical molecules and be applied to the detection of specific substances such as biochemical molecules and heavy metals. That is, a carrier plate structure of a specific working electrode layer material can be selected according to the target detection object, and it can be assembled into an ion-selective electrode that can detect the target detection object.

[0030] As attached Figure 3 and attached Figure 4 The figure shows the front view of the carrier structure of the ion selective electrode including the carrier structure. Figure 1 and hints Figure 2 .

[0031] Conventional three-electrode coplanar electrodes require modification of different metals or modified layers in the working electrode, counter electrode and reference electrode areas respectively, but this is difficult to achieve in actual processing. The different orders and processes of the three-electrode processing may affect the processing of other electrodes, especially for the working electrode modified with the core detection layer. The process effect may be affected by the other two electrodes or more cumbersome processes may be required to avoid influencing factors. This patent separates the working electrode into a separate component, and the working electrode modification layer can be processed or selected separately. The process is simpler and more convenient, and more types of modification processing can be performed, more targets can be detected, and more targeted selections can be made according to different targets, which greatly expands the electrode detection range and detection methods.

[0032] The utility model integrates and packages the separately componentized working electrodes into a carrier plate structure, and only modifies the reference electrode, the counter electrode and the electrode pins on the base electrode, thereby avoiding the influence caused by modifying different metals or modification layers when modifying the working electrode, the reference electrode and the counter electrode on the same plane, simplifying the three-electrode modification process, and modifying the most important working electrode separately on the carrier plate structure, thereby avoiding the influence of the modification of other electrodes on the working electrode.

[0033] The utility model avoids installing the working electrode as a separate metal sheet on the back of the base electrode. Considering that the working electrode generally uses pure gold, modifying pure gold on a metal sheet with a smaller area or using a pure gold metal sheet has certain defects in process and cost, and the electrode sheet with a smaller volume is not easy to store and install. Considering this, modifying the working electrode layer (41) on a separate carrier plate structure is simpler in process and greatly reduces the cost. The size of the carrier plate structure fits the base electrode, which can better plan the conductive circuit and the fitting area. At the same time, compared with the electrode patch, the carrier plate structure can provide a larger fitting area, which can greatly reduce the tiny gap between the base electrode and the carrier plate, and avoid the detection liquid from overflowing from the edge of the hollow hole of the base electrode, affecting the accuracy of the electrode.

[0034] The third line (23) of the electrode is not connected to the hollow hole (13), that is, the third line (23) on the front surface of the base electrode is not directly connected to the working electrode position, but is connected to the carrier conductive line (42) in the carrier structure attached to the back surface of the base electrode through the conductive hole (24) set in the third line (23), and then connected to the working electrode layer (41) attached to the hollow hole (13) position in the carrier structure and transmits electrical signals. This not only reduces the volume of the electrode and makes the line arrangement on the electrode surface more concise, but also makes the transmission of electrical signals smoother. It is also in line with the design concept of the present invention to load the working electrode as a separate component, avoiding the disadvantage that the loading structure affects the transmission of electrical signals due to poor contact and other reasons.

[0035] The working electrode layer (41) modified by the carrier structure is connected to the carrier conductive circuit (42), and the detection electric signal is transmitted to the front third circuit on the surface of the base electrode through the conductive hole (24) in contact with the carrier conductive circuit (42), and then to the third electrode pin. This greatly simplifies the electric signal transmission process, avoids the use of materials such as conductive tape, ensures the stability and accuracy of signal transmission, and also simplifies the installation and bonding method of the base electrode and the carrier structure, making it easier for industrial mass production, easier to manually bond or install, and more convenient to store the carrier structure separately.

[0036] The carrier structure can select a variety of materials as the base material according to actual needs, such as selecting a copper sheet as the carrier base, and then modifying the working electrode layer (41) at a specific position. The working electrode layer (41) can be selected into a specific shape according to needs, and its coverage area must be greater than or equal to the hollow holes of the base electrode. When the carrier is installed on the back of the base electrode, the working electrode layer (41) should cover the hollow hole area from the bottom to ensure that it is tightly fitted to the back of the base electrode, and try to reduce the tiny gaps by bonding, gluing or mechanical means.

[0037] In order to save costs, PET, PI, epoxy resin and other materials can also be selected as the base material of the carrier structure, and then the metal layer can be modified on its surface as needed.

[0038] Furthermore, the carrier structure also includes a carrier fixing area (43), and the carrier fixing area (43) and / or the corresponding bonding area on the back of the base electrode are provided with insulating double-sided tape, and the carrier structure is tightly bonded to the back of the base electrode through the carrier fixing area (43).

[0039] Furthermore, an insulating tape is provided on the back of the carrier structure to tightly fix the carrier structure to the back of the base electrode.

[0040] The portion of the front surface of the carrier structure other than the working electrode layer (41) and the carrier conductive circuit (42) is the carrier fixing area (43), which can be selectively coated with ink, or an insulating double-sided tape can be set in a specific area to tightly fit the carrier structure to the back surface of the base electrode. The back surface of the base electrode can also be set with an insulating double-sided tape according to actual needs to avoid the use of a multi-layer structure, which makes the installation process complicated and cumbersome.

[0041] There is no fixed method for fixing the carrier structure to the back of the base electrode. The above-mentioned insulating double-sided tape can be used to adhere the front of the carrier structure and the back of the base electrode to each other, or the insulating tape or similar means can be directly used to directly stick the carrier structure on the base electrode from the back.

[0042] As attached Figure 5 FIG. 1 shows an installation structure diagram of an ion selective electrode including a carrier plate structure.

[0043] The carrier plate structure is fixed on the back of the base electrode. When in use, the liquid to be tested is dripped into the hollow hole position on the front side. That is, the portion of the working electrode layer (41) of the carrier plate structure that corresponds to the hollow hole position is the electrode detection area, and the electrochemical reaction area is calculated based on this. Insulating tape is provided in the carrier plate fixing area (43) to fix the carrier plate structure to the greatest extent, fill the gaps, and prevent the liquid to be tested from overflowing from the tiny gaps, changing the electrochemical reaction area, affecting the electrode detection results, and enhancing accuracy.

[0044] A metal portion can be appropriately provided in the area where the conductive hole (24) on the back side of the substrate electrode is located, so that the contact area with the carrier conductive circuit (42) can be increased as much as possible, thereby increasing the conductive area, resulting in better conductive effect and better electrical signal transmission effect.

[0045] Furthermore, an anti-overflow structure is provided outside the electrode loading area (1), and the structure may be a dam (14). The height of the dam (14) is 0.2 to 0.8 mm, preferably 0.5 mm.

[0046] A protruding dam (14) structure is provided outside the electrode loading area (1), that is, outside the area where the first electrode layer (11), the second electrode layer (12) and the hollow hole (13) are located. A process method such as ink coating can be used to prevent the liquid to be tested from overflowing outside the electrode or the electrode loading area (1) when dripping at the location of the hollow hole (13), thereby contaminating the front conductive circuit (2) and other structures, thereby affecting the detection results.

[0047] The beneficial effects of the utility model are:

[0048] (1) The utility model sets up a three-electrode coplanar structure on the same plane, digs a hole in the detection core area to make a hollow hole, and splits the working electrode into components, which are installed later as an independent carrier structure. In order to avoid the carrier structure directly contacting the back substrate to produce a tiny gap, which in turn causes the detection liquid to overflow and the electrode reaction area to change and affect the detection accuracy, an insulating double-sided tape is used to fix the bonding surface and fill the gap, which greatly increases the bonding area and ensures the bonding stability and tightness. At the same time, the working electrode and the conductive circuit structure on the carrier structure are used to directly realize the electrical signal transmission, which ensures the electrode sensitivity and accuracy and solves the stability problem of the patch electrode.

[0049] (2) The utility model connects the conductive circuit of the carrier board and the conductive circuit of the front side through the conductive hole of the base electrode, and transmits the electrochemical reaction signal generated by the carrier board structure in the hollow hole area to the electrode pin through this path, and then transmits it out, thereby ensuring the sensitivity and accuracy of the electrode while greatly reducing the area of ​​the three-electrode coplanar electrode, providing more conductive circuit layout solutions and space, greatly reducing the difficulty and cost of electroplating processing of multi-electrode coplanar electrodes, avoiding secondary processing, optimizing the function and structural design of standard electrodes, and expanding the application field of electrodes.

[0050] (3) The present invention achieves the purpose of selecting different electrode modification layers according to the characteristics of the detection target by setting the core detection area of ​​the working electrode as an independent carrier structure that can be freely replaced and selected. At the same time, the material and modification layer of the working electrode layer serving as the core detection layer can be freely replaced and used immediately after replacement, making the selection of working electrode components more diverse and achieving the purpose of detecting a variety of different biochemical molecules by replacing the carrier structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] The utility model is further described with reference to the accompanying drawings, but the embodiments in the accompanying drawings do not constitute any limitation to the utility model. A person skilled in the art can obtain other drawings based on the following drawings without creative work.

[0052] Figure 1 This is a schematic diagram of the front side of the base electrode of the ion selective electrode including the carrier structure.Figure Two

[0053] Figure 2 The back side of the substrate electrode of the ion selective electrode including the carrier structure is shown in FIG. Figure Two

[0054] Figure 3 This is a front view of the carrier structure of the ion selective electrode including the carrier structure Figure 1 ;

[0055] Figure 4 This is a front view of the carrier structure of the ion selective electrode including the carrier structure Figure 2 ;

[0056] Figure 5 This is a diagram of the installation structure of an ion selective electrode including a carrier plate structure.

[0057] Legend:

[0058] 1. Electrode loading area; 11. First electrode layer; 12. Second electrode layer; 13. Hollow hole; 14. Dam; 2. Front conductive circuit; 21. First circuit; 22. Second circuit; 23. Third circuit; 24. Through hole; 25. Back conductive circuit; 31. First pin; 32. Second pin; 33. Third pin; 41. Working electrode layer; 42. Carrier conductive circuit; 43. Carrier fixing area. DETAILED DESCRIPTION

[0059] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail with reference to the following specific embodiments and the accompanying drawings.

[0060] Example 1

[0061] As attached Figure 1 and attached Figure 2 The figure shows an ion-selective electrode with a carrier structure provided by the present invention, comprising a base electrode and a carrier structure. The base electrode is made of a PET plate, and the carrier structure is made of a copper plate of the same size. The base electrode measures 12 x 35 mm and is 0.35 mm thick. The base can be made of a flexible polymer material, or conventional electrode materials such as epoxy resin, ceramic, silicon, and glass.

[0062] The front surface of the substrate electrode is provided with a front conductive trace 2 and an electrode loading area 1. The front conductive trace 2 is provided with three conductive vias 24. The electrode loading area 1 includes an electrode detection layer and a hollow hole 13 extending through the substrate. The radius of the hollow hole 13 is set to 1 mm. A back conductive trace 25 is provided in the area through which the conductive vias penetrate the back surface of the substrate electrode. The specific shape and area of ​​the trace can be customized as needed.

[0063] As attached Figure 3 and attached Figure 4 As shown, the carrier structure includes a working electrode layer 41, a carrier conductive circuit 42 and a carrier fixing area 43. Part of the carrier fixing area 43 is provided with insulating double-sided tape. The carrier structure is tightly attached to the back of the base electrode through the carrier fixing area 43. The carrier conductive circuit 42 is in contact with and overlaps with the area where the back conductive circuit 25 on the back of the base electrode is located, and is conductively interconnected with the front conductive circuit 2 through the conductive hole 24; the working electrode layer 41 completely covers the position of the hollow hole 13, and the working electrode layer 41 is connected and conductive to the carrier conductive circuit 42.

[0064] The electrode detection layer includes a first electrode layer 11 and a second electrode layer 12 that are coplanar and not interconnected. A hollow hole 13 is provided adjacent to the first electrode layer 11 and the second electrode layer 12. The first electrode layer 11 and the second electrode layer 12 are respectively connected to the front conductive circuit 2.

[0065] The front conductive circuit 2 includes a first circuit 21 , a second circuit 22 and a third circuit 23 that are not connected to each other. The first circuit 21 is connected to the first electrode layer 11 , the second circuit 22 is connected to the second electrode layer 12 , and the third circuit 23 is not directly connected to the hollow hole 13 .

[0066] Electrode pins are also provided on the front surface of the substrate, including a first pin 31, a second pin 32 and a third pin 33 that are coplanar and equidistant, and are connected to the first circuit 21, the second circuit 22 and the third circuit 23 respectively.

[0067] The surface of the front conductive circuit 2, electrode pins and the first electrode layer 11 of the electrode detection layer is coated with silver paste. The first electrode layer 11 is modified with carbon paste on the silver paste base, and the second electrode layer 12 is modified with silver-silver chloride paste with a thickness greater than 5μm.

[0068] The working electrode layer 41 is a pure gold-decorated layer with an overall thickness of 100-200 μm and an overall radius of 1 mm. Its shape can be circular or rectangular, or can be freely set. Its area is equal to or greater than the area of ​​the hollow holes 13, and it can completely cover them. The gold layer can be modified as needed, such as with a nanoporous metal layer or enzyme substances.

[0069] The surface of the carrier conductive circuit 42 is coated with silver paste and connected to the working electrode layer 41. To avoid affecting the detection of the working electrode layer 41, ink can be coated on the area of ​​the carrier conductive circuit 42 outside the conductive hole 24 on the front side of the carrier structure.

[0070] For ease of use, the conductive circuit 2 on the front side of the substrate can be partially coated with ink, and then a second layer of ink can be coated on the periphery of the electrode loading area 1, leaving only the electrode detection layer and the hollow holes 13 and the area where the electrode pins are located exposed. The thickness of each layer of ink is 10 to 20 μm.

[0071] In order to prevent the liquid to be tested dripped into the electrode loading area 1 from overflowing, a protruding dam structure may be provided outside the electrode loading area 1 , using an ink coating process, with a dam height of 0.5 mm.

[0072] Example 2

[0073] The utility model provides an ion-selective electrode with a carrier plate structure, comprising a base electrode and a carrier plate structure. The base electrode is a ceramic plate, and the carrier plate structure is a PET plate of the same size. The base electrode measures 12x35mm and is 0.35mm thick. The base electrode can be made of a flexible polymer material, or conventional electrode materials such as epoxy resin, ceramic, silicon-based, and glass.

[0074] The front surface of the substrate electrode is provided with a front conductive trace 2 and an electrode loading area 1. The front conductive trace 2 is provided with three conductive vias 24. The electrode loading area 1 includes an electrode detection layer and a hollow hole 13 extending through the substrate. The radius of the hollow hole 13 is set to 1 mm. A back conductive trace 25 is provided in the area through which the conductive vias penetrate the back surface of the substrate electrode. The specific shape and area of ​​the trace can be customized as needed.

[0075] The carrier structure includes a working electrode layer 41, a carrier conductive circuit 42 and a carrier fixing area 43. Part of the carrier fixing area 43 is provided with insulating double-sided tape. The carrier structure is tightly attached to the back of the base electrode through the carrier fixing area 43. The carrier conductive circuit 42 is in contact and overlapped with the area where the back conductive circuit 25 is located on the back of the base electrode, and is conductively interconnected with the front conductive circuit 2 through the conductive hole 24; the working electrode layer 41 completely covers the position of the hollow hole 13, and the working electrode layer 41 is connected and conductive to the carrier conductive circuit 42.

[0076] The electrode detection layer includes a first electrode layer 11 and a second electrode layer 12 that are coplanar and not interconnected. A hollow hole 13 is provided adjacent to the first electrode layer 11 and the second electrode layer 12. The first electrode layer 11 and the second electrode layer 12 are respectively connected to the front conductive circuit 2.

[0077] The front conductive circuit 2 includes a first circuit 21 , a second circuit 22 and a third circuit 23 that are not connected to each other. The first circuit 21 is connected to the first electrode layer 11 , the second circuit 22 is connected to the second electrode layer 12 , and the third circuit 23 is not directly connected to the hollow hole 13 .

[0078] Electrode pins are also provided on the front surface of the substrate, including a first pin 31, a second pin 32 and a third pin 33 that are coplanar and equidistant, and are connected to the first circuit 21, the second circuit 22 and the third circuit 23 respectively.

[0079] The surface of the front conductive circuit 2, electrode pins and the first electrode layer 11 of the electrode detection layer is coated with silver paste. The first electrode layer 11 is modified with a platinum layer on the silver paste base, and the second electrode layer 12 is modified with silver-silver chloride paste with a thickness greater than 5μm.

[0080] The working electrode layer 41 is a pure gold-decorated layer with an overall thickness of 100-200 μm and an overall radius of 1 mm. Its shape can be circular or rectangular, or can be freely set. Its area is equal to or greater than the area of ​​the hollow hole 13, completely covering it. The surface of the substrate conductive trace 42 is coated with silver paste and connected to the working electrode layer 41. To avoid affecting the detection of the working electrode layer 41, ink can be applied to the conductive trace 42 area on the front of the substrate structure, outside the conductive hole 24.

[0081] For ease of use, the conductive circuit 2 on the front side of the substrate can be partially coated with ink, and then a second layer of ink can be coated on the periphery of the electrode loading area 1, leaving only the electrode detection layer and the hollow holes 13 and the area where the electrode pins are located exposed. The thickness of each layer of ink is 10 to 20 μm.

[0082] In order to prevent the liquid to be tested dripped into the electrode loading area 1 from overflowing, a protruding dam structure may be provided outside the electrode loading area 1 , using an ink coating process, with a dam height of 0.5 mm.

[0083] Example 3

[0084] The utility model provides an ion-selective electrode with a carrier plate structure, comprising a base electrode and a carrier plate structure. The base electrode is made of an epoxy resin plate, and the carrier plate structure is made of an epoxy resin plate of the same size. The base electrode measures 12x35mm and is 0.35mm thick. The base can be made of a flexible polymer material, or conventional electrode materials such as epoxy resin, ceramic, silicon-based, and glass.

[0085] The front surface of the substrate electrode is provided with a front conductive trace 2 and an electrode loading area 1. The front conductive trace 2 is provided with three conductive vias 24. The electrode loading area 1 includes an electrode detection layer and a hollow hole 13 extending through the substrate. The radius of the hollow hole 13 is set to 2mm. A back conductive trace 25 is provided in the area through which the conductive vias penetrate the back surface of the substrate electrode. The specific shape and area of ​​the trace can be customized as needed.

[0086] The carrier structure includes a working electrode layer 41, a carrier conductive circuit 42 and a carrier fixing area 43. Part of the carrier fixing area 43 is provided with insulating double-sided tape. The carrier structure is tightly attached to the back of the base electrode through the carrier fixing area 43. The carrier conductive circuit 42 is in contact and overlapped with the area where the back conductive circuit 25 is located on the back of the base electrode, and is conductively interconnected with the front conductive circuit 2 through the conductive hole 24; the working electrode layer 41 completely covers the position of the hollow hole 13, and the working electrode layer 41 is connected and conductive to the carrier conductive circuit 42.

[0087] The electrode detection layer comprises a first electrode layer 11 and a second electrode layer 12 arranged in the same plane and not interconnected, and a hollow hole 13 is arranged adjacent to the first electrode layer 11 and the second electrode layer 12, and the first electrode layer 11 and the second electrode layer 12 are connected with the front conductive circuit 2 respectively.

[0088] The front conductive circuit 2 comprises a first circuit 21, a second circuit 22 and a third circuit 23 which are not connected with each other, the first circuit 21 is connected with the first electrode layer 11, the second circuit 22 is connected with the second electrode layer 12, and the third circuit 23 is not directly connected with the hollow hole 13.

[0089] The front surface of the substrate is further provided with electrode pins comprising a first pin 31, a second pin 32 and a third pin 33 arranged in the same plane and equidistantly, and the first pin 31, the second pin 32 and the third pin 33 are connected with the first circuit 21, the second circuit 22 and the third circuit 23 respectively.

[0090] The front conductive circuit 2, the electrode pins and the first electrode layer 11 of the electrode detection layer are coated with silver paste, the first electrode layer 11 is decorated with carbon paste on the silver paste substrate, and the second electrode layer 12 is decorated with silver-silver chloride paste with a thickness greater than 5 μm.

[0091] The working electrode layer 41 is selected to be a metal platinum layer with a whole thickness of 100-200 μm and a whole radius of 2 mm, and the shape can be circular or rectangular, and can also be freely set, and the area is greater than or equal to the area of the hollow hole 13 and can completely cover the hollow hole 13. The surface of the carrier plate conductive circuit 42 is coated with a metal copper layer connected with the working electrode layer 41, and in order to avoid affecting the detection of the working electrode layer 41, ink can be coated on the part of the carrier plate conductive circuit 42 outside the through hole 24 on the front surface of the carrier structure.

[0092] In order to be used in subsequent aspects, the front surface of the substrate can be coated with ink on the front surface conductive circuit 2, and a second layer of ink can be coated on the periphery of the electrode loading area 1, and only the areas where the electrode detection layer, the hollow hole 13 and the electrode pins are located are exposed, and the thickness of each layer of ink is 10-20 μm.

[0093] In order to prevent the measured liquid dropped on the electrode loading area 1 from overflowing, a convex dam structure can also be arranged outside the electrode loading area 1, and the dam height is 0.5 mm.

[0094] Embodiment 4

[0095] The utility model provides a kind of ion selective electrode comprising carrier plate type structure, including substrate electrode and carrier plate structure, wherein substrate electrode selects silicon substrate, carrier plate structure selects same size PI board, substrate electrode size is 12x35mm, thickness is 0.35mm. Substrate can use flexible polymer material, also can use epoxy resin, ceramic, silicon base, glass and other conventional electrode materials.

[0096] The front surface of the substrate electrode is provided with a front conductive trace 2 and an electrode loading area 1. The front conductive trace 2 is provided with three conductive vias 24. The electrode loading area 1 includes an electrode detection layer and a hollow hole 13 extending through the substrate. The radius of the hollow hole 13 is set to 1 mm. A back conductive trace 25 is provided in the area through which the conductive vias penetrate the back surface of the substrate electrode. The specific shape and area of ​​the trace can be customized as needed.

[0097] The carrier structure includes a working electrode layer 41, a carrier conductive circuit 42 and a carrier fixing area 43. Part of the carrier fixing area 43 is provided with insulating double-sided tape. The carrier structure is tightly attached to the back of the base electrode through the carrier fixing area 43. The carrier conductive circuit 42 is in contact and overlapped with the area where the back conductive circuit 25 is located on the back of the base electrode, and is conductively interconnected with the front conductive circuit 2 through the conductive hole 24; the working electrode layer 41 completely covers the position of the hollow hole 13, and the working electrode layer 41 is connected and conductive to the carrier conductive circuit 42.

[0098] The electrode detection layer includes a first electrode layer 11 and a second electrode layer 12 that are coplanar and not interconnected. A hollow hole 13 is provided adjacent to the first electrode layer 11 and the second electrode layer 12. The first electrode layer 11 and the second electrode layer 12 are respectively connected to the front conductive circuit 2.

[0099] The front conductive circuit 2 includes a first circuit 21 , a second circuit 22 and a third circuit 23 that are not connected to each other. The first circuit 21 is connected to the first electrode layer 11 , the second circuit 22 is connected to the second electrode layer 12 , and the third circuit 23 is not directly connected to the hollow hole 13 .

[0100] Electrode pins are also provided on the front surface of the substrate, including a first pin 31, a second pin 32 and a third pin 33 that are coplanar and equidistant, and are connected to the first circuit 21, the second circuit 22 and the third circuit 23 respectively.

[0101] The surface of the front conductive circuit 2, electrode pins and the first electrode layer 11 of the electrode detection layer is coated with silver paste. The first electrode layer 11 is modified with carbon paste on the silver paste base, and the second electrode layer 12 is modified with silver-silver chloride paste with a thickness greater than 5μm.

[0102] The working electrode layer 41 is a metallic bismuth layer with an overall thickness of 100-200 μm and an overall radius of 2 mm. Its shape can be circular or rectangular, or can be freely set. Its area is equal to or greater than the area of ​​the hollow hole 13, completely covering it. The surface of the substrate conductive trace 42 is coated with a metallic silver layer and connected to the working electrode layer 41. To avoid affecting the detection of the working electrode layer 41, ink can be applied to the conductive trace 42 area on the front of the substrate structure, outside the conductive hole 24.

[0103] For ease of use, the conductive circuit 2 on the front side of the substrate can be partially coated with ink, and then a second layer of ink can be coated on the periphery of the electrode loading area 1, leaving only the electrode detection layer and the hollow holes 13 and the area where the electrode pins are located exposed. The thickness of each layer of ink is 10 to 20 μm.

[0104] In order to prevent the liquid to be tested dripped into the electrode loading area 1 from overflowing, a protruding dam structure may be provided outside the electrode loading area 1 , using an ink coating process, with a dam height of 0.5 mm.

[0105] Example 5

[0106] The utility model provides an ion-selective electrode with a carrier plate structure, comprising a base electrode and a carrier plate structure. The base electrode is made of a PI plate, and the carrier plate structure is made of a PI plate of the same size. The base electrode measures 12x35mm and is 0.35mm thick. The base electrode can be made of a flexible polymer material, or conventional electrode materials such as epoxy resin, ceramic, silicon-based, and glass.

[0107] The front surface of the substrate electrode is provided with a front conductive trace 2 and an electrode loading area 1. The front conductive trace 2 is provided with three conductive vias 24. The electrode loading area 1 includes an electrode detection layer and a hollow hole 13 extending through the substrate. The radius of the hollow hole 13 is set to 1 mm. A back conductive trace 25 is provided in the area through which the conductive vias penetrate the back surface of the substrate electrode. The specific shape and area of ​​the trace can be customized as needed.

[0108] The carrier structure includes a working electrode layer 41, a carrier conductive circuit 42 and a carrier fixing area 43. Part of the carrier fixing area 43 is provided with insulating double-sided tape. The carrier structure is tightly attached to the back of the base electrode through the carrier fixing area 43. The carrier conductive circuit 42 is in contact and overlapped with the area where the back conductive circuit 25 is located on the back of the base electrode, and is conductively interconnected with the front conductive circuit 2 through the conductive hole 24; the working electrode layer 41 completely covers the position of the hollow hole 13, and the working electrode layer 41 is connected and conductive to the carrier conductive circuit 42.

[0109] The electrode detection layer includes a first electrode layer 11 and a second electrode layer 12 that are coplanar and not interconnected. A hollow hole 13 is provided adjacent to the first electrode layer 11 and the second electrode layer 12. The first electrode layer 11 and the second electrode layer 12 are respectively connected to the front conductive circuit 2.

[0110] The front conductive circuit 2 includes a first circuit 21 , a second circuit 22 and a third circuit 23 that are not connected to each other. The first circuit 21 is connected to the first electrode layer 11 , the second circuit 22 is connected to the second electrode layer 12 , and the third circuit 23 is not directly connected to the hollow hole 13 .

[0111] Electrode pins are also provided on the front surface of the substrate, including a first pin 31, a second pin 32 and a third pin 33 that are coplanar and equidistant, and are connected to the first circuit 21, the second circuit 22 and the third circuit 23 respectively.

[0112] The surface of the front conductive circuit 2, electrode pins and the first electrode layer 11 of the electrode detection layer is coated with silver paste. The first electrode layer 11 is modified with a platinum layer on the silver paste base, and the second electrode layer 12 is modified with silver-silver chloride paste with a thickness greater than 5μm.

[0113] The working electrode layer 41 is a graphene-modified layer with an overall thickness of 100-500 μm and an overall radius of 1 mm. Its shape can be circular or rectangular, or can be freely set. Its area is equal to or greater than the area of ​​the hollow holes 13, completely covering them. The surface of the substrate conductive trace 42 is coated with a metallic silver layer and connected to the working electrode layer 41. To avoid affecting the detection of the working electrode layer 41, ink can be applied to the conductive trace 42 area on the front of the substrate structure, outside the conductive holes 24.

[0114] For ease of use, the conductive circuit 2 on the front side of the substrate can be partially coated with ink, and then a second layer of ink can be coated on the periphery of the electrode loading area 1, leaving only the electrode detection layer and the hollow holes 13 and the area where the electrode pins are located exposed. The thickness of each layer of ink is 10 to 20 μm.

[0115] In order to prevent the liquid to be tested dropped into the electrode loading area 1 from overflowing, a protruding dam structure may be provided outside the electrode loading area 1 , using an ink coating process, with a dam height of 0.3 mm.

[0116] Example 6

[0117] The utility model provides an ion-selective electrode with a carrier plate structure, comprising a base electrode and a carrier plate structure. The base electrode is made of a PET plate, and the carrier plate structure is made of a PET plate of the same size. The base electrode measures 12x35mm and is 0.35mm thick. The base electrode can be made of a flexible polymer material, or conventional electrode materials such as epoxy resin, ceramic, silicon-based, and glass.

[0118] The front surface of the substrate electrode is provided with a front conductive trace 2 and an electrode loading area 1. The front conductive trace 2 is provided with three conductive vias 24. The electrode loading area 1 includes an electrode detection layer and a hollow hole 13 extending through the substrate. The radius of the hollow hole 13 is set to 1 mm. A back conductive trace 25 is provided in the area through which the conductive vias penetrate the back surface of the substrate electrode. The specific shape and area of ​​the trace can be customized as needed.

[0119] The carrier structure includes a working electrode layer 41, a carrier conductive circuit 42 and a carrier fixing area 43. Part of the carrier fixing area 43 is provided with insulating double-sided tape. The carrier structure is tightly attached to the back of the base electrode through the carrier fixing area 43. The carrier conductive circuit 42 is in contact and overlapped with the area where the back conductive circuit 25 is located on the back of the base electrode, and is conductively interconnected with the front conductive circuit 2 through the conductive hole 24; the working electrode layer 41 completely covers the position of the hollow hole 13, and the working electrode layer 41 is connected and conductive to the carrier conductive circuit 42.

[0120] The electrode detection layer includes a first electrode layer 11 and a second electrode layer 12 that are coplanar and not interconnected. A hollow hole 13 is provided adjacent to the first electrode layer 11 and the second electrode layer 12. The first electrode layer 11 and the second electrode layer 12 are respectively connected to the front conductive circuit 2.

[0121] The front conductive circuit 2 includes a first circuit 21 , a second circuit 22 and a third circuit 23 that are not connected to each other. The first circuit 21 is connected to the first electrode layer 11 , the second circuit 22 is connected to the second electrode layer 12 , and the third circuit 23 is not directly connected to the hollow hole 13 .

[0122] Electrode pins are also provided on the front surface of the substrate, including a first pin 31, a second pin 32 and a third pin 33 that are coplanar and equidistant, and are connected to the first circuit 21, the second circuit 22 and the third circuit 23 respectively.

[0123] The surface of the front conductive circuit 2, electrode pins and the first electrode layer 11 of the electrode detection layer is coated with silver paste. The first electrode layer 11 is modified with carbon paste on the silver paste base, and the second electrode layer 12 is modified with silver-silver chloride paste with a thickness greater than 5μm.

[0124] The working electrode layer 41 is a metallic chromium layer with an overall thickness of 100-500μm and an overall radius of 1mm. Its shape can be circular or rectangular, or can be freely set. Its area is equal to or greater than the area of ​​the hollow hole 13, completely covering it. The surface of the substrate conductive trace 42 is coated with a metallic silver layer and connected to the working electrode layer 41. To avoid affecting the detection of the working electrode layer 41, ink can be applied to the conductive trace 42 area on the front of the substrate structure, outside the conductive hole 24.

[0125] For ease of use, the conductive circuit 2 on the front side of the substrate can be partially coated with ink, and then a second layer of ink can be coated on the periphery of the electrode loading area 1, leaving only the electrode detection layer and the hollow holes 13 and the area where the electrode pins are located exposed. The thickness of each layer of ink is 10 to 20 μm.

[0126] In order to prevent the liquid to be tested dripped into the electrode loading area 1 from overflowing, a protruding dam structure may be provided outside the electrode loading area 1 , using an ink coating process, with a dam height of 0.8 mm.

[0127] Example 7

[0128] The utility model provides an ion-selective electrode with a carrier plate structure, comprising a base electrode and a carrier plate structure. The base electrode is made of a PET plate, and the carrier plate structure is made of a metal copper plate. The base electrode measures 12x35mm and is 0.35mm thick, while the carrier plate structure measures 12x20mm. The base electrode can be made of a flexible polymer material, or conventional electrode materials such as epoxy resin, ceramic, silicon-based, and glass.

[0129] The front surface of the substrate electrode is provided with a front conductive trace 2 and an electrode loading area 1. The front conductive trace 2 is provided with three conductive vias 24. The electrode loading area 1 includes an electrode detection layer and a hollow hole 13 extending through the substrate. The radius of the hollow hole 13 is set to 1 mm. A back conductive trace 25 is provided in the area through which the conductive vias penetrate the back surface of the substrate electrode. The specific shape and area of ​​the trace can be customized as needed.

[0130] The carrier structure includes a working electrode layer 41 and a carrier conductive circuit 42. A piece of insulating tape is taken to cover the back of the carrier structure, and the other end is pasted on the back of the base electrode. The carrier structure is fixed to the back of the base electrode with the insulating tape. The carrier conductive circuit 42 contacts and overlaps with the area where the back conductive circuit 25 on the back of the base electrode is located, and is interconnected with the front conductive circuit 2 through the conductive hole 24; the working electrode layer 41 completely covers the position of the hollow hole 13, and the working electrode layer 41 is connected and conductive to the carrier conductive circuit 42.

[0131] The electrode detection layer includes a first electrode layer 11 and a second electrode layer 12 that are coplanar and not interconnected. A hollow hole 13 is provided adjacent to the first electrode layer 11 and the second electrode layer 12. The first electrode layer 11 and the second electrode layer 12 are respectively connected to the front conductive circuit 2.

[0132] The front conductive circuit 2 includes a first circuit 21 , a second circuit 22 and a third circuit 23 that are not connected to each other. The first circuit 21 is connected to the first electrode layer 11 , the second circuit 22 is connected to the second electrode layer 12 , and the third circuit 23 is not directly connected to the hollow hole 13 .

[0133] Electrode pins are also provided on the front surface of the substrate, including a first pin 31, a second pin 32 and a third pin 33 that are coplanar and equidistant, and are connected to the first circuit 21, the second circuit 22 and the third circuit 23 respectively.

[0134] The surface of the front conductive circuit 2, electrode pins and the first electrode layer 11 of the electrode detection layer is coated with silver paste. The first electrode layer 11 is modified with carbon paste on the silver paste base, and the second electrode layer 12 is modified with silver-silver chloride paste with a thickness greater than 5μm.

[0135] The working electrode layer 41 is a nickel layer with an overall thickness of 100-500μm and an overall radius of 1mm. Its shape can be circular or rectangular, or can be freely set. Its area is equal to or greater than the area of ​​the hollow hole 13, completely covering it. The surface of the substrate conductive trace 42 is coated with a metallic silver layer and connected to the working electrode layer 41. To avoid affecting the detection of the working electrode layer 41, ink can be applied to the conductive trace 42 area on the front of the substrate structure, outside the conductive hole 24.

[0136] For ease of use, the conductive circuit 2 on the front side of the substrate can be partially coated with ink, and then a second layer of ink can be coated on the periphery of the electrode loading area 1, leaving only the electrode detection layer and the hollow holes 13 and the area where the electrode pins are located exposed. The thickness of each layer of ink is 10 to 20 μm.

[0137] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations that come within the meaning and range of equivalents of the claims be embraced within the present invention.

[0138] In addition, it should be understood that although this specification describes the embodiments, not each embodiment contains only one independent technical solution. This description is for clarity only. Those skilled in the art should consider the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art. Technical details not described in detail in this utility model can be implemented by any existing technology in the art. In particular, all technical features not described in detail in this utility model can be implemented by any existing technology.

Claims

1. An ion-selective electrode comprising a carrier plate structure, characterized in that: The invention comprises a base electrode and a carrier plate structure, wherein the carrier plate structure can be installed on the back of the base electrode, and the front of the carrier plate is tightly fitted with the back of the base electrode; a front conductive circuit (2) and an electrode loading area (1) are provided on the front of the base electrode, one or more through holes (24) are provided on the front conductive circuit (2), and the electrode loading area (1) comprises an electrode detection layer and a hollow hole (13) penetrating the base electrode; the carrier plate structure comprises a working electrode layer (41) and a carrier plate conductive circuit (42), wherein the carrier plate conductive circuit (42) contacts and fits with the area where the front conductive circuit (2) is located corresponding to the back of the base, and the front conductive circuit (2) and the carrier plate conductive circuit (42) are conductively connected and interconnected through the through hole (24); the working electrode layer (41) completely covers the position of the hollow hole (13), and the working electrode layer (41) is connected and conductively connected with the carrier plate conductive circuit (42).

2. The ion selective electrode comprising a carrier plate structure according to claim 1, characterized in that: The electrode detection layer comprises a first electrode layer (11) and a second electrode layer (12) which are coplanarly arranged and not interconnected, the hollow hole (13) being arranged adjacent to the first electrode layer (11) and the second electrode layer (12), and the first electrode layer (11) and the second electrode layer (12) being respectively connected to the front conductive circuit (2).

3. The ion selective electrode comprising a carrier plate structure according to claim 2, characterized in that: The front conductive circuit (2) comprises a first circuit (21), a second circuit (22) and a third circuit (23) which are not connected to each other, wherein the first circuit (21) is connected to the first electrode layer (11), the second circuit (22) is connected to the second electrode layer (12), the third circuit (23) is not directly connected to the hollow hole (13), and one or more conducting holes (24) are provided on the third circuit (23).

4. The ion selective electrode comprising a carrier plate structure according to claim 3, characterized in that: The front surface of the substrate is also provided with electrode pins, including a first pin (31), a second pin (32) and a third pin (33) that are coplanar and equidistant, and are respectively connected to the first circuit (21), the second circuit (22) and the third circuit (23).

5. The ion selective electrode comprising a carrier plate structure according to claim 1, characterized in that: A back conductive circuit (25) may also be provided on the back side of the substrate electrode, a conductive hole (24) is provided in the area where the back conductive circuit (25) is located, and the area where the back conductive circuit (25) is located is in contact with and adhered to the carrier conductive circuit (42).

6. The ion selective electrode comprising a carrier plate structure according to claim 1, characterized in that: The surfaces of the front conductive circuit (2), electrode pins, electrode detection layer and carrier conductive circuit (42) are modified with a metal layer as a base metal.

7. The ion selective electrode comprising a carrier plate structure according to claim 1, characterized in that: The surface of the first electrode layer (11) of the electrode detection layer is further provided with a modification layer, and the material of the modification layer includes carbon and platinum; the surface of the second electrode layer (12) of the electrode detection layer is also provided with a modification layer.

8. The ion selective electrode comprising a carrier plate structure according to claim 1, characterized in that: The surface of the working electrode layer (41) is modified with an ion selective modification layer, and the specific material of the ion selective modification layer can be arbitrarily replaced according to detection requirements.

9. The ion selective electrode comprising a carrier plate structure according to claim 1, characterized in that: The carrier structure further includes a carrier fixing area (43), and the carrier fixing area (43) and / or the corresponding bonding area on the back of the base electrode are provided with insulating double-sided tape, and the carrier structure is tightly bonded to the back of the base electrode through the carrier fixing area (43).

10. The ion selective electrode comprising a carrier plate structure according to claim 1, characterized in that: An insulating tape is provided on the back of the carrier structure to tightly fix the carrier structure to the back of the base electrode.

11. The ion selective electrode comprising a carrier plate structure according to claim 1, characterized in that: An anti-overflow structure is provided outside the electrode loading area (1), and the structure may be a dam (14). The height of the dam (14) is 0.2-0.8 mm.

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