Real-time vibration monitoring circuit
By designing a real-time vibration monitoring circuit, the convenient collection and transmission of vibration signals is achieved, which solves the problem of large size and difficult transmission of existing equipment and achieves the effect of miniaturization and convenient transmission.
Patent Information
- Application Number
- CN202422583006.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-25
- Publication Date
- 2025-10-10
- Estimated Expiration
- 2034-10-25
AI Technical Summary
Existing vibration monitoring equipment is large in size and has difficulty in data transmission, making it impossible to achieve miniaturization and convenient transmission.
A real-time vibration monitoring circuit was designed, which included a signal acquisition module, a timing module, a microcontroller module, a wireless transceiver module and a power switch module to realize the collection and transmission of vibration signals.
The miniaturization of vibration monitoring equipment and the convenience of data transmission are achieved, solving the problems of large size and difficult transmission.
Smart Images
Figure CN223426874U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of cultural relics protection, in particular to a real-time vibration monitoring circuit. Background Art
[0002] Earthquakes are a major cause of damage to cultural relics. Strong earthquakes such as the 2008 Wenchuan earthquake in China, the 2011 Fukushima earthquake in Japan, and the February 2023 earthquake in Turkey have all severely damaged cultural relics. Over 60% of my country's more than 6,500 museums are located in areas with a seismic intensity rating of 7 or higher, and the majority of immovable cultural relics are also located in high-intensity areas. Therefore, earthquakes are a primary cause of damage to cultural relics.
[0003] Existing vibration monitoring equipment is large and requires a separate mains power supply. Separate vibration monitoring probes must be installed near cultural relics, and some wireless devices require a gateway to transmit data. This makes it difficult to create a vibration monitoring device that is compact and has simple data transmission. Utility Model Content
[0004] The embodiments of the present application provide a real-time vibration monitoring circuit, which solves the technical problems of large size and difficult data transmission of vibration monitoring equipment in the prior art, and achieves the technical effects of small size and convenient transmission.
[0005] The present invention provides a real-time vibration monitoring circuit, comprising:
[0006] Power switch module, used to turn the power on and off;
[0007] A signal acquisition module, used to convert the collected vibration signal into a digital signal, and used to control the on and off of the power switch module;
[0008] A timing module, used to record the standard time of collecting the vibration signal and generate a time signal;
[0009] A microcontroller module, configured to receive and transmit the digital signal and the time signal;
[0010] The wireless transceiver module is used to receive and send the digital signal and the time signal transmitted by the microcontroller module.
[0011] In some embodiments, the signal acquisition module includes a signal acquisition unit, and the signal acquisition unit includes: a preprocessing circuit, used to collect the vibration signal, filter and amplify the vibration signal, and generate a preprocessed signal; a primary processing circuit, used to filter and reduce noise on the preprocessed signal, and generate a primary processed signal; and a secondary processing circuit, used to amplify the primary processed signal, and generate a secondary processed signal.
[0012] In some embodiments, the signal acquisition module further includes a digital-to-analog conversion unit, and the digital-to-analog conversion unit is used to convert the reprocessed signal into the digital signal.
[0013] In some embodiments, the digital-to-analog conversion unit includes a digital-to-analog conversion chip U5.
[0014] In some embodiments, the timing module includes a power supply unit and a timing unit, the power supply unit includes a power supply BAT1, a diode D1, a diode D2 and a resistor R63; the two ends of the power supply BAT1 are respectively connected to the ground end and the positive electrode of the diode D1; the cathodes of the diode D1 and the diode D2 are respectively connected to the first end of the resistor R63, the positive electrode of the diode D2 is connected to the power supply end, and the third end of the resistor R63 is connected to the output end of the power supply unit.
[0015] In some embodiments, the timing unit includes a real-time clock and calendar chip U8, capacitors C31-C33, resistors R60-R62, and an oscillator Y3; the VDD pin of the real-time clock and calendar chip U8 is connected to the output end of the power supply unit and is connected to the ground end through the resistor C33; the CLKOUT pin of the real-time clock and calendar chip U8 is connected to the power supply end through the resistor R60, the GND pin is grounded, the OSCI pin is connected to the ground end through the capacitor C31, and the OSCO pin is connected to the oscillator Y3, the capacitor C31 and the ground end in sequence; the capacitor C32 is connected to the common end of the oscillator Y3 and the OSCO pin of the real-time clock and calendar chip U8; the power supply end is connected to the SCL pin and SDA pin of the real-time clock and calendar chip U8 through the resistor R61 and the resistor R62 respectively.
[0016] In some embodiments, the power switch module includes field effect transistors Q2-Q3, resistors R5, R7, R11, R12, R54, and capacitor C7; the first pin of the field effect transistor Q2 is connected to the power supply BAT1 through the capacitor C7, the second pin is connected to the power supply BAT1, and the third pin serves as the output end of the power switch module; the first pin of the field effect transistor Q3 is connected to the digital-to-analog conversion chip U5 through the resistor R11, the second pin is grounded, and the third pin is connected to the power supply BAT1 through the resistor R7 and the resistor R5 in sequence; the resistor R54 is connected in parallel to the first and third pins of the field effect transistor Q3, and the resistor R12 is connected in parallel to the first and second pins of the field effect transistor Q3.
[0017] In some embodiments, the wireless transceiver module includes a wireless communication chip U7, and the wireless communication chip U7 is respectively connected to the electrical connector J7 and the real-time clock and calendar chip U8.
[0018] In some embodiments, the microcontrol module includes a microcontroller U6.
[0019] One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages: the embodiments of the present application realize the collection and transmission of vibration signals by setting a signal acquisition module, a timing module, a micro-control module, a wireless transceiver module and a power switch module, thereby solving the technical problems of large size and difficult data transmission of vibration monitoring equipment in the prior art, and achieving the technical effect of small size and convenient transmission. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] Figure 1 A connection diagram of a real-time vibration monitoring circuit provided in an embodiment of the present application;
[0021] Figure 2 A circuit connection diagram of a preprocessing circuit provided in an embodiment of the present application;
[0022] Figure 3 A circuit connection diagram of a primary processing circuit provided in an embodiment of the present application;
[0023] Figure 4 A circuit connection diagram of a reprocessing circuit provided in an embodiment of the present application;
[0024] Figure 5 A circuit connection diagram of a digital-to-analog conversion unit provided in an embodiment of the present application;
[0025] Figure 6 A circuit connection diagram of a power supply unit provided in an embodiment of the present application;
[0026] Figure 7 A circuit connection diagram of a timing unit provided in an embodiment of the present application;
[0027] Figure 8 A circuit connection diagram of the power switch module provided in an embodiment of the present application;
[0028] Figure 9 A circuit connection diagram of the wireless transceiver module provided in an embodiment of the present application;
[0029] Figure 10 A circuit connection diagram of the microcontroller module provided in an embodiment of the present application;
[0030] In the figure, 100, power switch module; 200, signal acquisition module; 210, signal acquisition unit; 211, pre-processing circuit; 212, primary processing circuit; 213, secondary processing circuit; 220, digital-to-analog conversion unit; 300, timing module; 310, power supply unit; 320, timing unit; 400, micro-control module; 500, wireless transceiver module. DETAILED DESCRIPTION
[0031] The embodiments of the present application provide a real-time vibration monitoring circuit, which solves the technical problems of large size and difficult data transmission of vibration monitoring equipment in the prior art, and achieves the technical effects of small size and convenient transmission.
[0032] To make the purpose, technical solutions, and advantages of the embodiments of the present disclosure more clear, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.
[0033] Unless otherwise defined, the technical or scientific terms used in this disclosure should have the usual meanings understood by people with ordinary skills in the field to which this disclosure belongs. The words "first", "second" and similar words used in this disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Words such as "include" or "comprise" mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.
[0034] See also Figure 1 The present invention provides a real-time vibration monitoring circuit, including: a power switch module 100, used to realize the conduction and shutdown of the power supply; a signal acquisition module 200, used to convert the collected vibration signal into a digital signal, and used to control the conduction and cutoff of the power switch module 100; a timing module 300, used to record the standard time of collecting the vibration signal and generate a time signal; a micro-control module 400, used to receive and transmit digital signals and time signals; a wireless transceiver module 500, used to receive and send digital signals and time signals transmitted by the micro-control module 400.
[0035] In this embodiment, the signal acquisition module 200 is connected to the vibration sensor, and is used to convert the vibration signal into a digital signal, transmit the digital signal to the microcontroller module 400, and control the on and off of the power switch module 100; the timing module 300 is used to achieve synchronization with the standard time and transmit it to the microcontroller module 400 in real time. Preferably, the standard time can be Beijing time; the microcontroller module 400 is used to receive digital signals and time signals, and transmit the data through the wireless transceiver module 500; the power switch module 100 is used to achieve the on and off of the power supply, and control the conduction of the wireless transceiver module 500 and the microcontroller module 400.
[0036] The technical solutions in the above embodiments of the present application have at least the following technical effects or advantages:
[0037] The embodiment of the present application realizes the collection and transmission of vibration signals by setting a signal acquisition module 200, a timing module 300, a micro-control module 400, a wireless transceiver module 500 and a power switch module 100, thereby solving the technical problems of large size and difficult data transmission of vibration monitoring equipment in the prior art, and achieving the technical effect of small size and convenient transmission.
[0038] See also Figure 2-Figure 4 The embodiment of the present application further provides a signal acquisition module 200 including a signal acquisition unit 210. The signal acquisition unit 210 includes: a preprocessing circuit 211 for collecting a vibration signal, filtering and amplifying the vibration signal, and generating a preprocessed signal; a primary processing circuit 212 for filtering and denoising the preprocessed signal, and generating a primary processed signal; and a secondary processing circuit 213 for amplifying the primary processed signal and generating a secondary processed signal.
[0039] In this embodiment, the signal acquisition unit 210 is used to collect vibration signals and process the vibration signals; the preprocessing circuit 211 is used to increase the input impedance, and filter and amplify the vibration signals once to generate a preprocessed signal; the primary processing circuit 212 performs a secondary filtering on the preprocessed signal, and improves the clarity and stability of the preprocessed signal by improving the common-mode rejection ratio, thereby generating a primary processing signal; the secondary processing circuit 213 reduces the influence of interference signals and improves the stability of the signal by amplifying the primary processing signal and improving the common-mode rejection ratio.
[0040] Specifically, such as Figure 2-Figure 4As shown, the pre-processing circuit 211 mainly realizes the pre-processing of the vibration signal through the operational amplifier U40A, the primary processing circuit 212 mainly realizes the processing of the pre-processed signal through the operational amplifier U41A and the operational amplifier U41B, and the secondary processing circuit 213 mainly realizes the processing of the primary processed signal through U39. In the embodiment, the vibration signal is input through two ports A_ADCIN+ and A_ADCIN-, and the secondary processed signal is output through OP_OUT.
[0041] In some embodiments, the signal acquisition module 200 further comprises a digital-analog conversion unit 220, which is configured to convert the secondary processed signal into a digital signal.
[0042] Please refer to Figure 5 The digital-analog conversion unit 220 comprises a digital-analog conversion chip U5.
[0043] In the embodiment, on the one hand, the secondary processed signal is input to the digital-analog conversion unit 220 through the OP_OUT port, and the secondary processed signal is converted into a digital signal; on the other hand, the 22 pin of the digital-analog conversion chip U5 is configured to control the conduction and cutoff of the power switch module 100, thereby reducing power consumption. When the vibration signal is input to the U5, the 22 pin of the digital-analog conversion chip U5 outputs a high level to control the conduction of the power switch module 100, and when there is no vibration signal, the 22 pin of the digital-analog conversion chip U5 outputs a low level to control the cutoff of the power switch module 100. The micro control module 400 and the wireless transceiver module 500 can be conducted or cut off through the power switch module 100. Specifically, the digital-analog conversion chip U5 transmits the digital signal to the micro control module 400 through the ADC_RESETn, ADC_START, ADC_DOUT, ADC_DIN, ADC_SCLK and ADC_CSn ports.
[0044] Please refer to Figure 6 The timing module 300 comprises a power supply unit 310 and a timing unit 320. The power supply unit 310 comprises a power supply BAT1, diodes D1 and D2, and a resistor R63. The two ends of the power supply BAT1 are respectively connected to a ground end and a positive electrode of the diode D1. The negative electrodes of the diodes D1 and D2 are respectively connected to a first end of the resistor R63, the positive electrode of the diode D2 is connected to a power supply end, and a third end of the resistor R63 is connected to an output end of the power supply unit 310.
[0045] In the embodiment, the power supply BAT1 is configured to provide a stable voltage for the timing unit 320.
[0046] Please refer to Figure 7The timing unit 320 includes a real-time clock and calendar chip U8, capacitors C31-C33, resistors R60-R62, and an oscillator Y3; the VDD pin of the real-time clock and calendar chip U8 is connected to the output end of the power supply unit 310, and is connected to the ground end through the resistor C33; the CLKOUT pin of the real-time clock and calendar chip U8 is connected to the power supply end through the resistor R60, the GND pin is grounded, the OSCI pin is connected to the ground end through the capacitor C31, and the OSCO pin is connected to the oscillator Y3, the capacitor C31 and the ground end in sequence; the capacitor C32 is connected to the common end of the oscillator Y3 and the OSCO pin of the real-time clock and calendar chip U8; the power supply end is connected to the SCL pin and the SDA pin of the real-time clock and calendar chip U8 through the resistor R61 and the resistor R62 respectively.
[0047] In this embodiment, the real-time clock and calendar chip U8 cooperates with the oscillator Y3 to realize rolling timing by seconds and synchronize with the standard time. Specifically, the standard time can be Beijing time. The real-time clock and calendar chip transmits data to the microcontroller module 400 through the SCL pin and the SDA pin.
[0048] See also Figure 8 The power switch module 100 includes field-effect transistors Q2-Q3, resistors R5, R7, R11, R12, R54, and capacitor C7. The first pin of the field-effect transistor Q2 is connected to the power supply BAT1 through the capacitor C7, the second pin is connected to the power supply BAT1, and the third pin serves as the output end of the power switch module 100. The first pin of the field-effect transistor Q3 is connected to the digital-to-analog conversion chip U5 through the resistor R11, the second pin is grounded, and the third pin is connected to the power supply BAT1 through the resistor R7 and the resistor R5 in sequence. The resistor R54 is connected in parallel to the first and third pins of the field-effect transistor Q3, and the resistor R12 is connected in parallel to the first and second pins of the field-effect transistor Q3.
[0049] In this embodiment, after the first pin of the field effect transistor Q3 receives the high level output by the 22nd pin of the digital-to-analog conversion chip U5, the second pin and the third pin of the field effect transistor Q3 are both turned on, thereby turning on the field effect transistor Q2 and thus turning on the power supply.
[0050] See also Figure 9 The wireless transceiver module 500 includes a wireless communication chip U7, which is respectively connected to the electrical connector J7 and the real-time clock and calendar chip U8.
[0051] See also Figure 10 The microcontroller module 400 includes a microcontroller U6. Data is transmitted to the wireless communication chip U7 through pins 42 and 43 of the microcontroller U6.
[0052] It should be noted that the components among the various embodiments of the present disclosure can be interchangeable as long as they can play the corresponding roles.
[0053] There are a few points to note:
[0054] (1) Unless otherwise defined, in the embodiments of the present disclosure and the accompanying drawings, the same reference numerals represent the same meanings.
[0055] (2) In the drawings of the embodiments of the present disclosure, only the structures related to the embodiments of the present disclosure are involved, and other structures can refer to the general design.
[0056] (3) For the sake of clarity, components or regions are exaggerated in the drawings used to describe embodiments of the present disclosure. It is understood that when an element is referred to as being “on” or “under” another element, the element may be “directly on” or “under” the other element, or intervening elements may be present.
[0057] The above description is merely a specific embodiment of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this disclosure should be included in the scope of protection of the present disclosure. Therefore, the scope of protection of the present disclosure should be based on the scope of protection of the claims.
Claims
1. A real-time vibration monitoring circuit, characterized in that: include: A power switch module (100) is used to turn the power on and off; A signal acquisition module (200) is used to convert the collected vibration signal into a digital signal, and to control the on and off of the power switch module (100); A timing module (300) is used to record the standard time of collecting the vibration signal and generate a time signal; A microcontroller module (400) configured to receive and transmit the digital signal and the time signal; The wireless transceiver module (500) is used to receive and send the digital signal and the time signal transmitted by the microcontroller module (400).
2. The real-time vibration monitoring circuit according to claim 1, characterized in that: The signal acquisition module (200) comprises a signal acquisition unit (210), and the signal acquisition unit (210) comprises: A preprocessing circuit (211) is used to collect the vibration signal, filter and amplify the vibration signal, and generate a preprocessing signal; A primary processing circuit (212) is used to filter and reduce noise on the pre-processed signal to generate a primary processed signal; The reprocessing circuit (213) is used to amplify the primary processed signal to generate a reprocessed signal.
3. The real-time vibration monitoring circuit according to claim 2, characterized in that: The signal acquisition module (200) further comprises a digital-to-analog conversion unit (220), and the digital-to-analog conversion unit (220) is used to convert the reprocessed signal into the digital signal.
4. The real-time vibration monitoring circuit according to claim 3, characterized in that: The digital-to-analog conversion unit (220) includes a digital-to-analog conversion chip U5.
5. The real-time vibration monitoring circuit according to claim 4, characterized in that: The timing module (300) comprises a power supply unit (310) and a timing unit (320), wherein the power supply unit (310) comprises a power supply BAT1, a diode D1, a diode D2, and a resistor R63; Two ends of the power supply BAT1 are connected to the ground and the anode of the diode D1 respectively; The cathodes of the diode D1 and the diode D2 are respectively connected to the first end of the resistor R63, the anode of the diode D2 is connected to the power supply end, and the third end of the resistor R63 is connected to the output end of the power supply unit (310).
6. The real-time vibration monitoring circuit according to claim 5, characterized in that: The timing unit (320) includes a real-time clock and calendar chip U8, capacitors C31-C33, resistors R60-R62, and an oscillator Y3; The VDD pin of the real-time clock and calendar chip U8 is connected to the output end of the power supply unit (310), and is connected to the ground end through the resistor C33; The CLKOUT pin of the real-time clock and calendar chip U8 is connected to the power supply terminal through the resistor R60, the GND pin is grounded, the OSCI pin is connected to the ground terminal through the capacitor C31, and the OSCO pin is connected to the oscillator Y3, the capacitor C31 and the ground terminal in sequence; The capacitor C32 is connected to the common end of the oscillator Y3 and the OSCO pin of the real-time clock and calendar chip U8; The power supply end is connected to the SCL pin and the SDA pin of the real-time clock and calendar chip U8 through the resistor R61 and the resistor R62 respectively.
7. The real-time vibration monitoring circuit according to claim 6, characterized in that: The power switch module (100) comprises field effect transistors Q2-Q3, resistors R5, R7, R11, R12, R54 and capacitor C7; The first pin of the field effect tube Q2 is connected to the power supply BAT1 via the capacitor C7, the second pin is connected to the power supply BAT1, and the third pin serves as the output end of the power switch module (100); The first pin of the field effect transistor Q3 is connected to the digital-to-analog conversion chip U5 through the resistor R11, the second pin is grounded, and the third pin is connected to the power supply BAT1 through the resistor R7 and the resistor R5 in sequence; The resistor R54 is connected in parallel to the first pin and the third pin of the field effect transistor Q3 , and the resistor R12 is connected in parallel to the first pin and the second pin of the field effect transistor Q3 .
8. The real-time vibration monitoring circuit according to claim 7, characterized in that: The wireless transceiver module (500) comprises a wireless communication chip U7, and the wireless communication chip U7 is respectively connected to the electrical connector J7 and the real-time clock and calendar chip U8.
9. The real-time vibration monitoring circuit according to any one of claims 6 to 8, characterized in that: The micro-control module (400) includes a micro-controller U6.