Temperature control device and edge server
The heater and the radiator are automatically adjusted by the thermal expansion element and the elastic member in the temperature control device, thereby solving the problem of high energy consumption in the prior art and realizing low-energy temperature control.
Patent Information
- Application Number
- CN202423134906.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-18
- Publication Date
- 2025-10-10
- Estimated Expiration
- 2034-12-18
AI Technical Summary
The adjustment of cooling fans and heaters on existing circuit boards mainly relies on real-time logic judgment of the main control chip, resulting in increased energy consumption.
A temperature control device is used, which uses a thermal expansion element and an elastic part to automatically adjust the working state of the heater and radiator through heat conduction, avoiding real-time temperature monitoring.
This eliminates the need for real-time temperature monitoring, reduces energy consumption of circuit boards, and quickly adjusts the temperature of electronic components to the normal operating range.
Smart Images

Figure CN223427055U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of heat dissipation of electronic components, and in particular to a temperature control device and an edge server. Background Art
[0002] The electronic components on a circuit board need to operate at the right temperature to function properly. If the temperature is too high, they will burn out, and if the temperature is too low, they will not start properly. To this end, the circuit board is generally equipped with a cooling fan and heater. The cooling fan and heater will turn on and off according to the detected temperature of the electronic components to ensure that the electronic components are kept at the appropriate temperature.
[0003] For existing circuit boards, the adjustment of cooling fans and heaters is mainly controlled by programs, which requires the main control chip to perform corresponding logical judgments in real time, which increases the energy consumption of the circuit board. Utility Model Content
[0004] Based on this, it is necessary to provide a temperature control device and an edge server to address the problem of high energy consumption of circuit boards.
[0005] A temperature control device includes a first circuit board, a second circuit board, an elastic member, a thermal expansion element, a heater, and a radiator;
[0006] The first circuit board and the second circuit board are arranged opposite to each other, the two ends of the elastic member are respectively arranged on the first circuit board and the second circuit board, the two ends of the thermal expansion element are respectively arranged on the first circuit board and the second circuit board, the heater is installed on the first circuit board or the second circuit board, and the heat sink is installed on the first circuit board or the second circuit board;
[0007] A first electrical connector and a second electrical connector are provided on the first circuit board at intervals, and a third electrical connector and a fourth electrical connector are provided on the second circuit board at intervals;
[0008] The temperature control device has at least a heating state and a heat dissipation state;
[0009] When the temperature control device is in a heating state, the first electrical connector and the third electrical connector are electrically connected to enable the heater to operate, and the second electrical connector and the fourth electrical connector are spaced apart to disable the radiator;
[0010] When the temperature control device is in a heat dissipation state, the first electrical connector and the third electrical connector are spaced apart to stop the heater from working, and the second electrical connector and the fourth electrical connector are electrically connected to enable the radiator to work.
[0011] The temperature control device also has a normal temperature state, when the temperature control device is in the normal temperature state, the first electric connector and the third electric connector are arranged at intervals, so that the heater stops working, and the second electric connector and the fourth electric connector are arranged at intervals, so that the radiator stops working.
[0012] The temperature-controlled component is arranged on one side of the first circuit board away from the second circuit board, and the radiator is a fan and is located on the side of the first circuit board away from the second circuit board.
[0013] The first circuit board is provided with a temperature-controlled component, and the temperature-controlled component and the heater are oppositely arranged and located on two sides of the first circuit board.
[0014] The temperature-controlled component is provided with a heat dissipation fin.
[0015] The elastic member is in a stretched state.
[0016] The second electric connector includes a first conductive plate and a first conductive rod, one end of the first conductive plate is fixed on the first conductive rod, and the other end of the first conductive rod is arranged on the side of the first circuit board facing the second circuit board, so that the first conductive plate and the first circuit board are opposite and arranged at intervals.
[0017] The fourth electric connector includes a second conductive plate and a second conductive rod, one end of the second conductive plate is fixed on the second conductive rod, and the other end of the second conductive rod is arranged on the side of the second circuit board facing the first circuit board, so that the second conductive plate and the second circuit board are opposite and arranged at intervals.
[0018] The first conductive plate and the second conductive plate are oppositely arranged, and the second conductive plate is located between the first conductive plate and the first circuit board.
[0019] When the temperature control device is in the heat dissipation state, the second conductive plate and the first conductive plate are attached.
[0020] The first electric connector is located on the side of the first circuit board facing the second circuit board, and the third electric connector is located on the side of the second circuit board facing the first circuit board.
[0021] The first electric connector and the third electric connector are both conductors, when the temperature control device is in the heating state, the first electric connector and the third electric connector are in surface contact.
[0022] An edge server includes the temperature control device.
[0023] The beneficial effects of the utility model are:
[0024] When the temperature of the temperature-controlled component is low, heat conduction causes the thermal expansion element to contract. This, in conjunction with the elastic member, reduces the distance between the first and second circuit boards. This allows electrical connection between the first and third electrical connectors, while disconnecting the second and fourth electrical connectors. Consequently, the heater automatically activates and the radiator automatically deactivates, allowing the temperature of the temperature-controlled component to quickly rise and return to its normal operating temperature.
[0025] When the temperature of the temperature-controlled component reaches a high level, heat conduction causes the thermal expansion element to expand. This, in conjunction with the elastic member, increases the distance between the first and second circuit boards. This disconnects the first and third electrical connectors, while simultaneously connecting the second and fourth electrical connectors. Consequently, the heater automatically stops and the heat sink automatically starts, rapidly cooling the temperature of the temperature-controlled component back to its normal operating temperature.
[0026] The above-mentioned control of the working status of the heater and the radiator does not involve program judgment, but is automatically achieved through the heat conduction of the temperature-controlled components to the thermal expansion elements. Therefore, there is no need to monitor the temperature of the temperature-controlled components in real time. Compared with the existing technology, the energy consumption of the temperature control device of the utility model is lower. BRIEF DESCRIPTION OF THE DRAWINGS
[0027] Figure 1 This is a schematic diagram of the main structure of the temperature control device in the embodiment of the utility model in the heating state;
[0028] Figure 2 This is a schematic diagram of the main structure of the temperature control device in the embodiment of the utility model in a normal temperature state;
[0029] Figure 3 This is a schematic diagram of the main structure of the temperature control device in the embodiment of the present utility model in a heat dissipation state.
[0030] Reference numerals:
[0031] 1. First circuit board; 11. First electrical connector; 12. Second electrical connector; 121. First conductive plate; 122. First conductive rod; 2. Second circuit board; 21. Third electrical connector; 22. Fourth electrical connector; 221. Second conductive plate; 222. Second conductive rod; 3. Elastic member; 4. Thermal expansion element; 5. Heater; 6. Radiator; 7. Temperature-controlled component; 71. Heat sink. DETAILED DESCRIPTION
[0032] To make the above-mentioned objects, features, and advantages of the present invention more clearly understood, the following detailed description of specific embodiments of the present invention is provided in conjunction with the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways than those described herein, and those skilled in the art may make similar modifications without departing from the scope of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.
[0033] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation to the present invention.
[0034] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of this utility model, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.
[0035] In this utility model, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, or indirect connection through an intermediate medium; internal communication between two components, or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.
[0036] In the present invention, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.
[0037] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only implementation methods.
[0038] Example:
[0039] See also Figure 1-Figure 3 This embodiment provides an edge server, including a temperature control device. The temperature control device specifically includes a first circuit board 1, a second circuit board 2, an elastic member 3, a thermal expansion element 4, a heater 5 and a radiator 6.
[0040] The first circuit board 1 and the second circuit board 2 are arranged opposite each other. In this embodiment, the elastic member 3 is a spring and is located between the first circuit board 1 and the second circuit board 2, with its two ends respectively disposed on the first circuit board 1 and the second circuit board 2. The thermal expansion element 4 is also located between the first circuit board 1 and the second circuit board 2, with its two ends respectively disposed on the first circuit board 1 and the second circuit board 2.
[0041] When the temperature of the first circuit board 1 and / or the second circuit board 2 is high, the heat on the first circuit board 1 and / or the second circuit board 2 is transferred to the thermal expansion element 4, causing the thermal expansion element 4 to expand, thereby increasing the distance between the first circuit board 1 and the second circuit board 2. When the temperature of the first circuit board 1 and / or the second circuit board 2 is low, the thermal expansion element 4 contracts, and the distance between the first circuit board 1 and the second circuit board 2 can be reduced.
[0042] The thermal expansion element 4 will also deform the elastic member 3 during the expansion and contraction process.
[0043] In some embodiments, the first circuit board 1 can compress the elastic member 3 by gravity, causing the elastic member 3 to remain in a compressed state. The elastic member 3 and the thermal expansion element 4 cooperate to support the first circuit board 1. In these embodiments, the thermal expansion element 4 can lift the first circuit board 1 through thermal expansion, thereby allowing the elastic member 3 to partially recover and reducing the amount of compression of the elastic member 3. The thermal expansion element 4 can also contract, causing the first circuit board 1 to further compress the elastic member 3.
[0044] In this embodiment, the elastic member 3 is always in a stretched state, so its two ends need to be fixed to the first circuit board 1 and the second circuit board 2, respectively. In this embodiment, when the thermal expansion element 4 expands, the elastic member 3 further increases its stretched deformation. When the thermal expansion element 4 contracts, the elastic member 3 is allowed to partially recover and reduce its stretched deformation, thereby allowing the first circuit board 1 and the second circuit board 2 to approach each other, and the thermal expansion element 4 to be consistently clamped between the first circuit board 1 and the second circuit board 2. Therefore, in this embodiment, the coordination between the elastic member 3 and the thermal expansion element 4 does not restrict the installation orientation of the first circuit board 1 and the second circuit board 2.
[0045] In this embodiment, the temperature-controlled component 7 that needs to be temperature-controlled is disposed on the first circuit board 1. The temperature-controlled component 7 operates on the first circuit board 1, so that the temperature-controlled component 7 can directly conduct heat to the first circuit board 1. On this basis, the heater 5 and the radiator 6 are both installed on the first circuit board 1. The heater 5 can increase the temperature of the temperature-controlled component 7 by heating the first circuit board 1. If the radiator 6 is a fan, it can directly blow air onto the temperature-controlled component 7 to lower the temperature of the temperature-controlled component 7. If the radiator 6 is a cooling plate, the radiator 6 can lower the temperature of the temperature-controlled component 7 by lowering the temperature of the first circuit board 1.
[0046] A first electrical connector 11 and a second electrical connector 12 are spaced apart on the first circuit board 1, and a third electrical connector 21 and a fourth electrical connector 22 are spaced apart on the second circuit board 2. In this embodiment, the first electrical connector 11 and the second electrical connector 12 are located on the side of the first circuit board 1 facing the second circuit board 2, and the third electrical connector 21 and the fourth electrical connector 22 are located on the side of the second circuit board 2 facing the first circuit board 1.
[0047] As one optional structure, in this embodiment, the first electrical connector 11 and the third electrical connector 21 are both conductors, and the second electrical connector 12 and the fourth electrical connector 22 are both L-shaped.
[0048] Specifically, the second electrical connector 12 includes a first conductive plate 121 and a first conductive rod 122. The first conductive plate 121 and the first conductive rod 122 are both conductors. The first conductive plate 121 is fixed at one end of the first conductive rod 122, and the other end of the first conductive rod 122 is arranged on the side of the first circuit board 1 facing the second circuit board 2, so that the first conductive plate 121 and the first circuit board 1 can be arranged relative to each other and spaced apart.
[0049] The fourth electrical connector 22 includes a second conductive plate 221 and a second conductive rod 222. The second conductive plate 221 and the second conductive rod 222 are both conductors. The second conductive plate 221 is fixed at one end of the second conductive rod 222, and the other end of the second conductive rod 222 is arranged on the side of the second circuit board 2 facing the first circuit board 1, so that the second conductive plate 221 and the second circuit board 2 can be arranged relative to each other and spaced apart.
[0050] The first conductive plate 121 and the second conductive plate 221 are arranged opposite to each other, and the second conductive plate 221 is located between the first conductive plate 121 and the first circuit board 1 .
[0051] Based on the above structure, when the first circuit board 1 and the second circuit board 2 are brought closer to each other, the first electrical connector 11 and the second electrical connector 12 are brought closer to each other, while the first conductive plate 121 and the second conductive plate 221 are moved away from each other. When the first circuit board 1 and the second circuit board 2 are moved away from each other, the first electrical connector 11 and the second electrical connector 12 are moved away from each other, while the first conductive plate 121 and the second conductive plate 221 are brought closer to each other.
[0052] Therefore, the temperature control device of this embodiment has a heating state, a normal temperature state and a heat dissipation state.
[0053] See also Figure 1 When the temperature of the temperature-controlled component 7 is low, the thermal expansion element 4 can be contracted, the distance between the first circuit board 1 and the second circuit board 2 is small, the first electrical connector 11 and the third electrical connector 21 can be electrically connected through contact, and the heater 5 can automatically start heating to increase the temperature of the temperature-controlled component 7. At this time, the temperature control device is in the heating state.
[0054] As a preference, the temperature-controlled component 7 and the heater 5 are arranged opposite to each other and are respectively located on two sides of the first circuit board 1 , so as to shorten the heat conduction path between the temperature-controlled component 7 and the heater 5 .
[0055] In addition, when the temperature control device is in the heating state, the first electrical connector 11 and the third electrical connector 21 are in surface contact, so as to improve the electrical connection stability between the first electrical connector 11 and the third electrical connector 21 .
[0056] When the temperature control device is in the heating state, the first conductive plate 121 and the second conductive plate 221 are spaced apart from each other, and the second electrical connector 12 and the fourth electrical connector 22 remain spaced apart and disconnected, thereby causing the radiator 6 to stop working to allow the temperature-controlled component 7 to increase in temperature more quickly.
[0057] See also Figure 2 When the temperature control device is at room temperature, the spacing between the first circuit board 1 and the second circuit board 2 is moderate, and the first electrical connector 11 and the third electrical connector 21 are spaced closely apart, thereby deactivating the heater 5 and preventing it from heating the temperature-controlled component 7. At the same time, the first conductive plate 121 and the second conductive plate 221 remain spaced closely apart, allowing the second electrical connector 12 and the fourth electrical connector 22 to remain disconnected and deactivate the heat sink 6. At this point, neither the heater 5 nor the temperature-controlled component 7 is required to operate, allowing the temperature control device to maintain a low power consumption level.
[0058] When the temperature control device is at room temperature, the temperature-controlled component 7 can operate normally, and thus the temperature-controlled component 7 can also generate heat. Based on this, heat dissipation fins 71 can be provided on the temperature-controlled component 7 to enhance the natural heat dissipation capacity of the temperature-controlled component 7, so that the temperature-controlled component 7 can reach thermal equilibrium through the heat dissipation fins 71 as much as possible, so that the temperature control device can be kept at room temperature for as long as possible, thereby reducing the energy consumption of the temperature control device.
[0059] See also Figure 3 When the temperature of the temperature-controlled component 7 is high, the temperature control device is in a heat dissipation state. At this time, the distance between the first circuit board 1 and the second circuit board 2 is large, and the first electrical connector 11 and the third electrical connector 21 are separated and disconnected, thereby stopping the operation of the heater 5. Simultaneously, the first conductive plate 121 and the second conductive plate 221 come into contact, electrically connecting the second electrical connector 12 and the fourth electrical connector 22. The heat sink 6 automatically begins to operate, cooling the temperature-controlled component 7.
[0060] Preferably, when the temperature control device is in the heat dissipation state, the second conductive plate 221 and the first conductive plate 121 are in contact with each other to improve the electrical connection stability between the second electrical connector 12 and the fourth electrical connector 22 .
[0061] In this embodiment, the radiator 6 is a fan, and the radiator 6 and the temperature-controlled component 7 are both located on the side of the first circuit board 1 facing away from the second circuit board 2. On the one hand, this allows the temperature-controlled component 7 to have more sufficient space to dissipate heat. On the other hand, the radiator 6 can directly blow the temperature-controlled component 7 and the cooling fins 71 to maximize the heat dissipation effect on the temperature-controlled component 7.
[0062] In summary, in this embodiment, when the actual temperature of the temperature-controlled component 7 deviates from the normal operating temperature, the expansion state of the thermal expansion element 4 can be changed through heat exchange with the first circuit board 1. The thermal expansion element 4 then cooperates with the elastic member 3 to automatically adjust the distance between the first circuit board 1 and the second circuit board 2, thereby changing the operating state of the heater 5 and the heat sink 6. Furthermore, the changed operating state of the heater 5 and the heat sink 6 can match the current actual temperature of the temperature-controlled component 7, allowing the actual temperature of the temperature-controlled component 7 to return to the normal operating temperature as quickly as possible.
[0063] In some other embodiments, the temperature-controlled component 7, the heater 5 and the radiator 6 may also be arranged on the second circuit board 2. The working principles thereof are similar to those of this embodiment and will not be further described.
[0064] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0065] The above-described embodiments merely represent several implementations of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that a person skilled in the art would be able to make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements fall within the scope of protection of the present invention. Therefore, the scope of protection of the present utility model patent shall be determined by the appended claims.
Claims
1. A temperature control device, characterized in that: It comprises a first circuit board (1), a second circuit board (2), an elastic member (3), a thermal expansion element (4), a heater (5) and a heat sink (6); The first circuit board (1) and the second circuit board (2) are arranged opposite to each other, the two ends of the elastic member (3) are respectively arranged on the first circuit board (1) and the second circuit board (2), the two ends of the thermal expansion element (4) are respectively arranged on the first circuit board (1) and the second circuit board (2), the heater (5) is installed on the first circuit board (1) or the second circuit board (2), and the heat sink (6) is installed on the first circuit board (1) or the second circuit board (2); A first electrical connector (11) and a second electrical connector (12) are arranged at intervals on the first circuit board (1), and a third electrical connector (21) and a fourth electrical connector (22) are arranged at intervals on the second circuit board (2); The temperature control device has at least a heating state and a heat dissipation state; When the temperature control device is in a heating state, the first electrical connector (11) and the third electrical connector (21) are electrically connected to enable the heater (5) to operate, and the second electrical connector (12) and the fourth electrical connector (22) are spaced apart to enable the radiator (6) to stop operating; When the temperature control device is in a heat dissipation state, the first electrical connector (11) and the third electrical connector (21) are spaced apart to stop the heater (5) from working, and the second electrical connector (12) and the fourth electrical connector (22) are electrically connected to enable the radiator (6) to work.
2. The temperature control device according to claim 1, characterized in that The temperature control device also has a normal temperature state. When the temperature control device is in the normal temperature state, the first electrical connector (11) and the third electrical connector (21) are spaced apart so that the heater (5) stops working, and the second electrical connector (12) and the fourth electrical connector (22) are spaced apart so that the radiator (6) stops working.
3. The temperature control device according to claim 1, characterized in that The temperature-controlled component (7) is arranged on a side of the first circuit board (1) facing away from the second circuit board (2), and the heat sink (6) is a fan and is located on a side of the first circuit board (1) facing away from the second circuit board (2).
4. The temperature control device according to claim 1, characterized in that A temperature-controlled component (7) is provided on the first circuit board (1); the temperature-controlled component (7) and the heater (5) are arranged opposite to each other and are respectively located on two sides of the first circuit board (1).
5. The temperature control device according to claim 4, characterized in that: The temperature-controlled component (7) is provided with heat dissipation fins (71).
6. The temperature control device according to claim 1, characterized in that: The second electrical connector (12) comprises a first conductive plate (121) and a first conductive rod (122), wherein the first conductive plate (121) is fixed to one end of the first conductive rod (122), and the other end of the first conductive rod (122) is arranged on a side of the first circuit board (1) facing the second circuit board (2), so that the first conductive plate (121) and the first circuit board (1) are opposite to each other and spaced apart. The fourth electrical connector (22) comprises a second conductive plate (221) and a second conductive rod (222), wherein the second conductive plate (221) is fixed to one end of the second conductive rod (222), and the other end of the second conductive rod (222) is arranged on a side of the second circuit board (2) facing the first circuit board (1), so that the second conductive plate (221) and the second circuit board (2) are opposite to each other and spaced apart. The first conductive plate (121) and the second conductive plate (221) are arranged opposite to each other, and the second conductive plate (221) is located between the first conductive plate (121) and the first circuit board (1).
7. The temperature control device according to claim 6, characterized in that: When the temperature control device is in a heat dissipation state, the second conductive plate (221) and the first conductive plate (121) are in contact with each other.
8. The temperature control device according to claim 1, characterized in that: The first electrical connector (11) is located on a side of the first circuit board (1) facing the second circuit board (2), and the third electrical connector (21) is located on a side of the second circuit board (2) facing the first circuit board (1).
9. The temperature control device according to claim 1, characterized in that: The first electrical connector (11) and the third electrical connector (21) are both conductors. When the temperature control device is in a heating state, the first electrical connector (11) and the third electrical connector (21) are in surface contact.
10. An edge server, characterized in that: The temperature control device comprises the temperature control device according to any one of claims 1 to 9.