Isolation type air-cooling heat dissipation reinforced electronic case

Abstract

The utility model relates to the technical field of heat dissipation of electronic equipment, in particular to an isolated air-cooled heat dissipation reinforced electronic case. Comprising a case shell defined by a front panel assembly, a rear panel assembly, a lower cover plate, an upper cover plate, a left side plate and a right side plate, and a heat exchanger assembly fixedly arranged in the case shell and used for conducting heat of board card modules. The front panel assembly is provided with a board card module plugging window at a position corresponding to the board card module. A cooling channel is arranged in the heat exchanger assembly; according to the isolation type air cooling heat dissipation design, the heat dissipation efficiency is greatly improved, the durability of the case is enhanced through the reinforced structural design, heat dissipation is more uniform through the optimized air duct design and fan layout, and equipment damage caused by local overheating is reduced. And the service life of the equipment in a severe environment is also remarkably prolonged by an isolation measure.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation of electronic equipment, in particular to an isolated air-cooled heat dissipation design and a reinforced electronic chassis for electronic equipment, and more particularly to an isolated air-cooled heat dissipation reinforced electronic chassis. Background Art

[0002] Existing electronic equipment chassis generally use direct fan convection or heat sinks for heat dissipation design. These methods can lead to insufficient heat dissipation under high heat loads, affecting device performance and stability. Furthermore, electronic equipment often faces extreme environmental challenges such as high temperature, vibration, shock, and electromagnetic interference.

[0003] In existing technology, reinforced chassis are typically constructed from sturdy materials to protect internal components from physical damage. However, these chassis often neglect heat dissipation, leading to overheating and impacting performance and reliability. Existing cooling solutions include fans, heat sinks, and heat pipes, but these solutions remain insufficient in high power densities and extreme environments.

[0004] Furthermore, traditional cooling solutions are inefficient in enclosed or confined environments and are prone to dust accumulation, further reducing heat dissipation performance. Furthermore, conventional chassis have limited shock and vibration resistance, insufficient to protect sensitive internal components. The lack of effective isolation also allows dust and moisture to easily intrude, impacting the performance and lifespan of electronic equipment. Utility Model Content

[0005] In order to solve the above problems, the utility model aims to provide an isolated air-cooled and reinforced electronic chassis, which can effectively isolate external environmental factors to solve the heat dissipation problem of high-power electronic equipment in extreme environments, ensure the stability and long-term reliable operation of the equipment, improve the heat dissipation efficiency and structural strength, and ensure the long-term stable operation of internal electronic equipment.

[0006] The utility model discloses an isolated air-cooled and reinforced electronic chassis, comprising a chassis shell surrounded by a front panel assembly, a rear panel assembly, a lower cover plate, an upper cover plate, a left side plate, and a right side plate, and a heat exchanger assembly fixedly arranged in the chassis shell for conducting heat from a board module. A plurality of board modules are plugged into the heat exchanger assembly, and board module plug-in windows are provided on the front panel assembly at positions corresponding to the board modules.

[0007] A cooling channel is provided in the heat exchanger assembly, an air inlet is provided on the front panel assembly, and an air outlet is provided on the rear panel assembly. One end of the cooling channel is connected to the air inlet through a first flow guide device, and the other end of the cooling channel is connected to the air outlet through a second flow guide device. A first fan for introducing airflow is provided at the air inlet;

[0008] The board module is isolated from the cooling channel and is in contact with the heat exchanger assembly.

[0009] Preferably, the heat exchanger assembly includes a heat exchanger, which includes a hollow heat exchange shell, support ribs arranged along the cooling channel in the heat exchange shell, and the two sides of the support ribs are connected to the corresponding two sides of the heat exchange shell. The support ribs divide the internal area of ​​the heat exchange shell into at least two parallel areas, and each area is fixed with a heat sink arranged along the cooling channel.

[0010] Preferably, a heat exchanger is provided between adjacent board modules, one end of the heat exchanger is connected by welding and sealing through the same lower slot plate, and the other end of the heat exchanger is connected by welding and sealing through the same upper slot plate;

[0011] The upper slot plate is provided with a plurality of upper through holes in parallel, and the lower slot plate is provided with a plurality of lower through holes in parallel, and the lower through holes on the lower slot plate are respectively connected to the upper through holes corresponding to the positions on the upper slot plate through the cooling channels in the heat exchanger;

[0012] The upper slot plate and the lower slot plate are both connected to the chassis shell.

[0013] Preferably, the first air guide device includes a lower cover plate, a left side plate, a right side plate, a heat exchanger assembly and a rear panel assembly to form a sealed air inlet duct, one end of the air inlet duct is connected to the air inlet, and the other end is sealed to the lower slot plate, and the lower through holes on the lower slot plate are all connected to the air inlet duct.

[0014] Preferably, a lower air guide plate is fixedly provided in the air inlet duct along the length direction of the air inlet duct.

[0015] Preferably, multiple lower air guide plates are arranged in parallel, the planes where the lower air guide plates are located are parallel to the left side plates, and each lower air guide plate is set to two sections fixedly connected, the lower air guide plate at the end close to the air inlet is the first section of the air guide plate, and the lower air guide plate at the section close to the lower slot plate is the second section of the air guide plate, the end of the first section of the air guide plate away from the air inlet extends in a direction parallel to the lower cover plate and is connected to the second section of the air guide plate, and the end of the second section of the air guide plate away from the first section of the air guide plate extends obliquely toward the lower slot plate and is welded to the lower slot plate.

[0016] Preferably, the second air guide device includes an upper air guide cover body sealed and welded on the upper slot plate to form a sealed air outlet duct, the upper air guide cover body is connected to the air outlet at one end away from the upper slot plate, and the upper through holes on the upper slot plate are all connected to the air outlet duct.

[0017] Preferably, a second fan for drawing out airflow is provided at the air outlet.

[0018] Preferably, the front panel assembly, the rear panel assembly, the heat exchanger assembly, the lower cover plate, the upper cover plate, the left side plate, the right side plate, and the heat exchanger assembly are made of aluminum alloy 6063-T6 with good comprehensive electrical conductivity and heat dissipation properties.

[0019] Preferably, the air inlet is arranged at the lower part of the front panel assembly, the air outlet is arranged at the upper part of the rear panel assembly, and waveguide ventilation windows are provided at both the air inlet and the air outlet.

[0020] This new isolated air-cooling design not only significantly improves heat dissipation efficiency but also enhances chassis durability through a reinforced structural design. Furthermore, the optimized air duct design and fan layout ensure more uniform heat dissipation, reducing damage to the equipment caused by localized overheating. This isolation measure also significantly extends the service life of the equipment in harsh environments.

[0021] The board module of the utility model is in contact with the heat exchanger assembly, which has the advantage of a short thermal path between the chassis radiator and the heat module, and can quickly and efficiently transfer the heat generated by the board module to the heat exchanger assembly. The heat dissipation system adopts an isolated air cooling design, which includes independent air inlet and exhaust ducts, and high-efficiency fans arranged at the air inlet and outlet. The unique air path layered pressure-dividing turbulence design allows the cold air from the fan and the air duct to flow smoothly through each heat-generating component and discharge the hot air, thereby improving the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is an explosion diagram of the utility model.

[0023] Figure 2 This is an overall schematic diagram of the utility model after the upper cover is hidden.

[0024] Figure 3 This is a cross-sectional view of the utility model.

[0025] Figure 4 Includes heat exchanger installation schematics.

[0026] Figure 5 Includes schematic diagram of heat exchanger assembly.

[0027] Figure markings: 1-front panel assembly, 2-board module, 3-lower cover, 4-first fan, 5-heat exchanger assembly, 6-lower air guide plate, 7-upper air guide cover, 8-right side panel, 9-back panel, 10-rear panel assembly, 11-upper cover, 12-left side panel, 13-lower slot plate, 14-heat exchanger, 15-upper slot plate, 16-support ribs, 17-heat sink. DETAILED DESCRIPTION

[0028] The utility model relates to an isolated air -cooled heat dissipation reinforced electronic machine case, including the case shell and the heat exchanger 14 component 5 for conducting board card module 2 heat fixedly arranged in the case shell which are enclosed by front panel assembly 1, rear panel assembly 10, lower cover plate 3, upper cover plate 11, left side plate 12, right side plate 8, a plurality of board card modules 2 are inserted in the heat exchanger 14 component 5, and the position of board card module 2 on the front panel assembly 1 is provided with board card module 2 plug -in window,

[0029] The heat exchanger 14 component 5 is provided with a cooling channel, the front panel assembly 1 is provided with an air inlet, and the rear panel assembly 10 is provided with an air outlet, one end of the cooling channel is connected with the air inlet through a first flow guide device, the other end of the cooling channel is connected with the air outlet through a second flow guide device, and the air inlet is provided with a first fan 4 for introducing airflow.

[0030] The board card module 2 is isolated from the cooling channel, and the board card module 2 is in contact with the heat exchanger 14 component 5.

[0031] In one embodiment, the heat exchanger 14 component 5 includes a heat exchanger 14, the heat exchanger 14 includes a hollow heat exchange shell, support ribs 16 arranged along the cooling channel in the heat exchange shell, the two sides of the support ribs 16 are connected with the corresponding two sides of the heat exchange shell, the support ribs 16 divide the internal area of the heat exchange shell into at least two parallel areas, and a plurality of heat dissipation fins 17 arranged along the cooling channel are fixedly arranged in each area.

[0032] In one embodiment, the heat exchanger 14 is arranged between adjacent board card modules 2, one end of the heat exchanger 14 is connected by welding and sealing with the same lower slot plate 13, and the other end of the heat exchanger 14 component 5 is connected by welding and sealing with the same upper slot plate 15.

[0033] A plurality of upper through holes are arranged on the upper slot plate 15, and a plurality of lower through holes are arranged on the lower slot plate 13, and the lower through holes on the lower slot plate 13 are connected with the upper through holes corresponding in position on the upper slot plate 15 through the cooling channels in the heat exchanger 14 component 5.

[0034] The upper slot plate 15 and the lower slot plate 13 are connected with the case shell by welding.

[0035] The first flow guide device includes a lower cover plate 3, a left side plate 12, a right side plate 8 and a rear panel assembly 10 to form a sealed air inlet duct, one end of the air inlet duct is connected with the air inlet, the other end is sealingly connected with the lower slot plate 13, and the lower through holes on the lower slot plate 13 are connected with the air inlet duct.

[0036] A lower air deflector 6 is fixedly arranged in the air inlet duct along the length direction of the air inlet duct.

[0037] The plurality of lower air guide plates 6 are arranged side by side, the planes where the lower air guide plates 6 are located are parallel to the left side plate 12, and each lower air guide plate 6 is arranged as two fixedly connected sections, the end of the lower air guide plate 6 close to the air inlet is a first section air guide plate, the end of the lower air guide plate 6 close to the lower slot plate 13 is a second section air guide plate, the end of the first section air guide plate away from the air inlet extends in a direction parallel to the lower cover plate 3 and is connected with the second section air guide plate, and the end of the second section air guide plate away from the first section air guide plate extends obliquely towards the lower slot plate 13 and is welded with the lower slot plate 13.

[0038] In an embodiment, the second flow guide device comprises an upper air guide cover body 7 sealedly welded on the upper slot plate 15 to form an air outlet channel, the end of the upper air guide cover body 7 away from the upper slot plate 15 is connected with the air outlet, and the upper through holes on the upper slot plate 15 are connected with the air outlet channel.

[0039] The air outlet is provided with a second fan for guiding air flow.

[0040] The front panel assembly 1, the rear panel assembly 10, the heat exchanger 14 assembly 5, the lower cover plate 3, the upper cover plate 11, the left side plate 12, the right side plate 8, the heat exchanger 14 assembly 5 are made of aluminum alloy 6063-T6 with good electric conductivity and heat dissipation performance.

[0041] In an embodiment, the air inlet is arranged at the lower part of the front panel assembly 1, the air outlet is arranged at the upper part of the rear panel assembly 10, and the air inlet and the air outlet are both provided with waveguide air windows.

[0042] In specific use, the heat exchanger 14 is welded and arranged between the lower slot plate 13 and the upper slot plate 15 to form an inner box body, the channel between the heat exchangers 14 is a channel for plugging and unplugging the board card module 2, the board card module 2 is inserted into the corresponding interface on the back plate 9, the inner box body is designed with the back plate 9 from inside to outside at the rear side, and the back plate 9 is connected to the rear panel assembly 10; the front panel assembly 1 is designed with an air inlet, waveguide windows, indicator lights, a navigation plug and a board card module 2 plugging window; the rear panel assembly 10 is designed with a navigation plug, an air outlet, waveguide windows and a second fan; the heat of the chip on the PCB in the board card module 2 is transferred to the shell of the board card module 2 and then to the heat exchanger 14, and the heat is taken away from the cabinet through the cold air passing through the internal cooling channel.

[0043] The cooling channel formed by the utility model isolates the board card module 2 and the back plate 9 from the cooling channel, improves the environmental adaptability of the system, reduces the vortex through the upper air guide cover body 7 and the lower air guide plate 6, accelerates the gas flow rate, improves the heat dissipation capacity of the system, and meets the high-power heat dissipation demand of the board card.

[0044] The front panel assembly 1 is designed with a vent, and the vent is located on the lower side of the front panel assembly 1, and an isolated air duct is formed by the first fan 4, the lower air guide plate 6, the inner box, the upper air guide cover 7 and the second fan on the rear panel assembly 10;

[0045] The upper slot plate 15, the heat exchange plate and the lower slot plate 13 in the inner box are welded to form a whole; a ground terminal is designed on the rear panel assembly 10;

[0046] The heat exchanger 14, the front panel assembly 1 and the rear panel assembly 10 are made of aluminum alloy, and the gaps are designed with stoppers and composite conductive rubber strips;

[0047] The heat exchanger 14 is designed with a heat sink 17 and a reinforcing support rib 16 in the middle. The flatness of the two sides of the heat exchanger 14 is 0.1mm and the surface roughness is 1.6μm.

[0048] The lower air guide plate 6 is composed of two air guide plates, which guide the air in layers; the upper air guide cover 7 is welded by five pieces to form a bell-shaped cavity;

[0049] The card module 2 is squeezed by the locking strip to reduce the air thermal resistance between the card module 2 housing and the heat exchanger 14;

[0050] The utility model isolates the air duct from the board module 2, accelerates the gas flow rate, improves the system's heat dissipation capacity, and meets the cooling requirements of the board module 2 for forced convection. At the same time, through the locking assembly and the module shell, the strength and environmental adaptability of the board module 2 are improved to meet the requirements for use in a vibration environment.

[0051] The utility model can be applied to outdoor mobile electronic test equipment such as vehicles and ships, as well as indoor electronic equipment. The device has good heat dissipation, electromagnetic shielding, shock resistance and environmental adaptability. It is designed according to the VITA 48.2 standard and uses existing VPX module boards to control system development risks, shorten system development cycles, and reduce development costs.

[0052] The utility model is described in detail below.

[0053] like Figure 1 and Figure 2 As shown, the utility model is composed of a front panel assembly 1, a rear panel assembly 10, an upper cover 11, a lower cover 3, a left side panel 12, and a right side panel 8 to form an outer box body, and an inner box body, a board module 2, a first fan 4, a lower air guide plate 6, an upper air guide cover 7, and a back plate 9 to form the interior of the chassis. The standard CPCI / VPX board module 2 is installed in the inner box body.

[0054] The chassis in the embodiment of the present utility model complies with the requirements of GB / T 19520.2-2007 / IEC 60297-1:1986 "Mechanical Structure Dimensions of Electronic Equipment 482.6mm (19 in) Series";

[0055] The inner chassis in the embodiment of the present invention complies with the requirements of ANSI / VITA 48.2 "Mechanical Specifications for Microcomputers Using REDI Conduction Cooling Applied to VITA VPX";

[0056] The board module 2 in the embodiment of the present invention complies with the requirements of VITA 48.2 "Mechanical Specifications for Microcomputers Using REDI Conduction Cooling Applied to VITA VPX";

[0057] like Figure 3 As shown, air enters the front of the chassis and exits the back, and is exhausted through the first fan 4. The lower air guide plate 6 layers and guides the wind, allowing the wind to pass directly through the heat exchanger 14 and the upper air guide cover 7. The second fan on the rear panel assembly 10 increases the wind pressure and takes the wind away from the chassis.

[0058] The heat exchanger 14, the front panel assembly 1, the inner case, the upper air guide cover 7, the lower air guide plate 6, the rear panel assembly 10, the upper cover plate 11, the lower cover plate 3, the left side plate 12 and the right side plate 8 are all made of aluminum alloy 6063-T6 which has good electric conduction and heat dissipation performance; the inner case is welded by the upper groove position plate 15, the heat exchanger 14 and the lower groove position plate 13, so as to improve the heat dissipation efficiency; the joint of the front panel assembly 1, the rear panel assembly 10, the upper cover plate 11, the lower cover plate 3, the left side plate 12, the right side plate 8 and the upper air guide cover 7 is designed with a stop opening and a composite electric conduction rubber strip, so as to improve the integrity of the shielding; the front panel assembly 1 and the rear panel assembly 10 are provided with waveguide air vents, so as to shield the electromagnetic interference formed by a small amount of fans; the rear panel assembly 10 is provided with a grounding terminal which connects the system to the installation carrier, so as to ensure that the electronic equipment and the installation carrier are in good electric contact and form equipotential, prevent the signal ground and the power ground from forming a cross loop, provide effective shielding for the key signals and effectively inhibit the interference of external electromagnetic; the outer surface of the case is first subjected to fine sand blasting, then subjected to electric conduction oxidation treatment and then subjected to paint spraying treatment, and the information of the aviation plug and the front panel assembly 1 is printed, so as to improve the corrosion resistance and wear resistance of the aluminum alloy, the electromagnetic shielding performance of the case and the surface finishing effect, and the external cable connection is convenient. The case is installed on a standard 19-inch cabinet through the riveted loose screw of the front panel assembly 1.

[0059] The front panel assembly 1 is designed with a handle, so as to facilitate the disassembly and transportation.

[0060] The heat exchanger 14 adopts an inner rib structure, so as to increase the contact area of the gas in a unit volume with the heat exchanger 14, ensure sufficient contact area and improve the heat exchange capacity of the heat exchanger 14; the thickness of the support rib 16 of the heat exchanger 14 is designed as 0.9mm-2mm, and the height is designed as 9.5mm-15.5mm; two support ribs 16 are designed in the inner cavity, so as to improve the mechanical strength and heat exchange capacity of the heat exchanger 14. The heat exchanger 14 is designed with a mechanical limiting position, so as to control the dimensional accuracy when the heat exchanger 14 is welded with the upper groove position plate 15 and the lower groove position plate 13 to form an inner case; laser welding is adopted to reduce the deformation amount during welding. The upper air guide cover 7 and the lower air guide plate 6 are installed on the upper and lower sides of the inner case, so as to form an isolated air duct, the lower air guide plate divides the airflow into layers, ensures that the airflow fully contacts the heat exchanger 14, avoids airflow short circuit, physically separates the cooling channel from the board card module 2 and improves the system environmental adaptability. The inner cavity rib of the heat exchanger 14 adopts a wire cutting machining process, so as to realize the simultaneous machining of multiple heat exchangers 14, improve the machining efficiency and reduce the production cost.

Claims

1. An isolated, air-cooled, reinforced electronic chassis, comprising a chassis housing formed by a front panel assembly, a rear panel assembly, a lower cover, an upper cover, a left panel, and a right panel; and a heat exchanger assembly fixed within the chassis housing for transferring heat from the board modules. The heat exchanger assembly is plugged into a plurality of board modules, and board module insertion windows are provided on the front panel assembly at positions corresponding to the board modules. It is characterized in that A cooling channel is provided in the heat exchanger assembly, an air inlet is provided on the front panel assembly, and an air outlet is provided on the rear panel assembly. One end of the cooling channel is connected to the air inlet through a first flow guide device, and the other end of the cooling channel is connected to the air outlet through a second flow guide device. A first fan for introducing airflow is provided at the air inlet; The board module is isolated from the cooling channel and is in contact with the heat exchanger assembly.

2. The isolated air-cooled reinforced electronic chassis according to claim 1, characterized in that: The heat exchanger assembly includes a heat exchanger, which includes a hollow heat exchange shell, support ribs arranged along the cooling channel in the heat exchange shell, and two sides of the support ribs are connected to the corresponding two sides of the heat exchange shell. The support ribs divide the internal area of ​​the heat exchange shell into at least two parallel areas, and each area is fixed with a heat sink arranged along the cooling channel.

3. The isolated air-cooled reinforced electronic chassis according to claim 2, characterized in that: A heat exchanger is provided between adjacent board modules, one end of the heat exchanger is connected by welding and sealing through the same lower slot plate, and the other end of the heat exchanger is connected by welding and sealing through the same upper slot plate; The upper slot plate is provided with a plurality of upper through holes in parallel, and the lower slot plate is provided with a plurality of lower through holes in parallel, and the lower through holes on the lower slot plate are respectively connected to the upper through holes corresponding to the positions on the upper slot plate through the cooling channels in the heat exchanger; The upper slot plate and the lower slot plate are both connected to the chassis shell.

4. The isolated air-cooled and reinforced electronic chassis according to claim 3, characterized in that: The first air guide device includes a lower cover plate, a left side plate, a right side plate, a heat exchanger assembly and a rear panel assembly to form a sealed air inlet duct, one end of the air inlet duct is connected to the air inlet, and the other end is sealed to the lower slot plate, and the lower through holes on the lower slot plate are all connected to the air inlet duct.

5. The isolated air-cooled and reinforced electronic chassis according to claim 4, characterized in that: A lower air guide plate is fixedly arranged in the air inlet duct along the length direction of the air inlet duct.

6. The isolated air-cooled and reinforced electronic chassis according to claim 5, characterized in that: There are multiple lower air guide plates arranged in parallel, and the planes where the lower air guide plates are located are parallel to the left side plates, and each lower air guide plate is set to two sections fixedly connected, the lower air guide plate at the end close to the air inlet is the first section of the air guide plate, and the lower air guide plate at the section close to the lower slot plate is the second section of the air guide plate, the end of the first section of the air guide plate away from the air inlet extends in a direction parallel to the lower cover plate and is connected to the second section of the air guide plate, and the end of the second section of the air guide plate away from the first section of the air guide plate extends obliquely toward the lower slot plate and is welded to the lower slot plate.

7. The isolated air-cooled and reinforced electronic chassis according to claim 3, characterized in that: The second air guide device includes an upper air guide cover body that is sealed and welded on the upper slot plate to form a sealed air outlet duct. The end of the upper air guide cover body away from the upper slot plate is connected to the air outlet, and the upper through holes on the upper slot plate are all connected to the air outlet duct.

8. The isolated air-cooled reinforced electronic chassis according to claim 1, characterized in that: The air outlet is provided with a second fan for drawing out air flow.

9. The isolated air-cooled and reinforced electronic chassis according to claim 1, characterized in that: The front panel assembly, rear panel assembly, heat exchanger assembly, lower cover plate, upper cover plate, left side plate and right side plate are made of aluminum alloy 6063-T6 with good comprehensive electrical conductivity and heat dissipation performance.

10. The isolated air-cooled and reinforced electronic chassis according to claim 1, characterized in that: The air inlet is arranged at the lower part of the front panel assembly, the air outlet is arranged at the upper part of the rear panel assembly, and waveguide ventilation windows are arranged at both the air inlet and the air outlet.

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